CN112240971A - Test fixture - Google Patents
Test fixture Download PDFInfo
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- CN112240971A CN112240971A CN201910646754.7A CN201910646754A CN112240971A CN 112240971 A CN112240971 A CN 112240971A CN 201910646754 A CN201910646754 A CN 201910646754A CN 112240971 A CN112240971 A CN 112240971A
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- heat sink
- hole
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- probe
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- 230000000694 effects Effects 0.000 abstract description 5
- 238000004377 microelectronic Methods 0.000 abstract description 2
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a test fixture, which relates to the technical field of microelectronic test and comprises a probe card, a heat sink table, a bearing piece and a positioning device, wherein the positioning device is arranged on the bearing piece, a limiting through hole for accommodating a device to be tested is arranged on the positioning device, and the probe card is pressed between the positioning device and the bearing piece and is used for being electrically connected with the device to be tested; the probe card is provided with a heat sink through hole, the top of the heat sink table is provided with a heat sink convex block, and the heat sink convex block penetrates through the heat sink through hole and is arranged opposite to the limiting through hole and used for bearing a device to be tested. Compared with the prior art, the test fixture provided by the invention has good conductive capability and good heat dissipation effect.
Description
Technical Field
The invention relates to the technical field of microelectronic testing, in particular to a testing jig.
Background
At present, in the semiconductor industry, the test of plastic package devices is mainly realized in a socket (socket) test mode, and a plurality of manufacturers at home and abroad can provide a socket solution. For direct current test, a device to be tested is loaded in a socket, and the device to be tested is connected with a peripheral circuit through a Pin needle at the bottom of the socket.
In the existing solution, for a high-power device to be tested, the heat dissipation of the device to be tested is negatively affected by socket test. If a hard-contact connection mode is used instead of using a Pin needle, the conductive capability of the Pin needle is adversely affected.
In view of this, it is important to design and manufacture a testing fixture with good conductive capability and good heat dissipation effect.
Disclosure of Invention
The invention aims to provide a test fixture which has good conductive capability and good heat dissipation capability.
The invention is realized by adopting the following technical scheme.
A test fixture comprises a probe card, a heat sink table, a bearing piece and a positioning device, wherein the bearing piece is arranged on the heat sink table, the positioning device is arranged on the bearing piece, a limiting through hole for accommodating a device to be tested is formed in the positioning device, and the probe card is pressed between the positioning device and the bearing piece and is used for being electrically connected with the device to be tested; the probe card is provided with a heat sink through hole, the top of the heat sink table is provided with a heat sink convex block, and the heat sink convex block penetrates through the heat sink through hole and is arranged opposite to the limiting through hole and used for bearing a device to be tested.
Furthermore, the probe card comprises a circuit board, a suspension type probe and a fixed seat, wherein the circuit board is provided with a heat sink through hole, the fixed seat is arranged on the circuit board, and the suspension type probe is fixed on the fixed seat and extends to the position below the limiting through hole and is used for being electrically connected with a device to be tested.
Furthermore, a probe groove is further formed in the circuit board between the fixing seat and the heat sink through hole, the probe groove extends to the heat sink through hole, and the suspended probe is suspended on the probe groove.
Furthermore, the positioning device is further provided with a first abdicating hole and a second abdicating hole which are communicated with each other, the first abdicating hole corresponds to the fixing seat and is used for abdicating the fixing seat, and the second abdicating hole extends to the limiting through hole and corresponds to the suspended probe and is used for abdicating the suspended probe.
Further, the heat sink table is provided with at least 1 drill hole, at least one probe is arranged in each drill hole, and the probe is used for being electrically connected with the device to be tested and is contracted to be flush with the surface of the heat sink table under the extrusion of the device to be tested.
Furthermore, the test fixture further comprises a pressing block assembly, wherein the pressing block assembly is connected with the heat sink, arranged above the limiting through hole and used for applying downward pressure to the device to be tested.
Further, the briquetting subassembly includes briquetting, pressure head and regulating part, and the briquetting is connected with the heat sink, pressure head and briquetting swing joint to set up on spacing through-hole for pressfitting awaits measuring the device, be provided with the regulation screw on the briquetting, the regulating part passes the regulation screw and supports and hold at the top of pressure head.
Furthermore, the bearing piece is detachably arranged on the heat sink table, the bearing piece is provided with a positioning through hole, the positioning through hole is positioned below the heat sink through hole and matched with the heat sink convex block, and the positioning device and the probe card are arranged on the bearing piece.
Furthermore, a positioning pin is arranged in the bearing piece and penetrates through the positioning device and the probe card so as to enable the positioning device and the probe card to be kept relatively fixed.
Furthermore, a positioning groove is formed in the bottom side of the bearing piece, a positioning bulge is arranged on the heat sink table, and the positioning bulge is matched with the positioning groove.
The invention has the following beneficial effects:
the invention provides a test fixture, wherein a positioning device is arranged on a bearing piece, a probe card is pressed between the positioning device and the bearing piece, a heat sink convex block arranged at the top of a heat sink platform penetrates through a heat sink through hole on the probe card and is arranged opposite to a limit through hole on the positioning device, so as to bear a device to be tested in the limit through hole, the probe card is electrically connected with the device to be tested and is used for electrically testing the device to be tested, and meanwhile, the device to be tested is contacted with the heat sink convex block, so that heat generated during testing can be transferred to the heat sink platform, and the heat dissipation effect is. Compared with the prior art, the test fixture provided by the invention has good conductive capability and good heat dissipation effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is an exploded view of a test fixture under a first viewing angle;
FIG. 2 is an exploded view of a test fixture at a second viewing angle;
FIG. 3 is a schematic view of an assembly structure of the test fixture according to the present invention;
FIG. 4 is a schematic structural view of the heat sink table of FIG. 1;
FIG. 5 is a schematic structural diagram of the heat sink bump in FIG. 4;
FIG. 6 is an exploded view of a testing fixture at a third viewing angle;
FIG. 7 is a schematic structural view of the carrier of FIG. 1;
FIG. 8 is a schematic view of the probe card of FIG. 1 shown in a first view;
FIG. 9 is a schematic view of the probe card of FIG. 1 shown in a second view;
FIG. 10 is a schematic view of the probe card of FIG. 1 shown in a third view;
FIG. 11 is a schematic view of the positioning device of FIG. 1;
fig. 12 is a schematic view of a connection structure of the press block assembly in fig. 1.
Icon: 100-testing the fixture; 110-a probe card; 111-heat sink vias; 113-a circuit board; 115-suspended probe; 117-fixing seat; 119-probe recess; 130-heat sinking platform; 131-heat sink bumps; 1311-drilling; 1313-double ended needle; 133-a base; 135-boss; 137-installing a counter bore; 139-positioning projections; 150-a positioning device; 151-limiting through holes; 153-first relief hole; 155-a second abdicating hole; 170-a carrier; 171-a locating pin; 173-positioning grooves; 175-positioning vias; 190-a briquetting assembly; 191-briquetting; 193-pressure head; 195-an adjuster.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships conventionally put on the products of the present invention when used, and are only used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. Features in the embodiments described below may be combined with each other without conflict.
First embodiment
Referring to fig. 1 to 7, the present embodiment provides a testing apparatus 100 for testing the working life of a device under test. The device to be tested in this embodiment is a double-sided flat lead-free package Device (DFN), and of course, the device to be tested here may also be a square flat lead-free package device (QFN), a ceramic package device, a metal package device, or the like, and the DFN package is merely taken as an example in this embodiment for description. The test fixture 100 provided in this embodiment may also be applied to various package tests, such as package tests of radio frequency devices, power electronic devices, and the like.
The test fixture 100 provided by the embodiment includes a probe card 110, a heat sink 130, a positioning device 150, a carrier and a press block assembly 190, wherein the carrier is the carrier 170, and plays dual roles of carrying and conducting electricity. The bearing member 170 is detachably disposed on the heat sink table 130, the positioning device 150 is detachably connected with the bearing member 170 and disposed on the heat sink table 130, the positioning device 150 is provided with a limiting through hole 151 for accommodating a device to be tested, and the pressing block assembly 190 is connected with the heat sink table 130 and disposed above the limiting through hole 151 for applying downward pressure to the device to be tested. The probe card 110 is disposed on the carrier 170, and the probe card 110 is pressed between the positioning device 150 and the carrier 170 for electrical connection with a device to be tested. The probe card 110 has a heat sink through hole 111, the top of the heat sink 130 is provided with a heat sink bump 131, and the heat sink bump 131 passes through the heat sink through hole 111 and is disposed opposite to the limiting through hole 151 for bearing a device to be tested. And the carrier 170 is provided with a positioning through hole 175, and the positioning through hole 175 is located below the heat sink through hole 111 and is matched with the heat sink bump 131.
It should be noted that the bearing member may be made of other materials, such as copper or molybdenum-titanium alloy, and is not limited in this regard.
In this embodiment, the heat sink table 130 includes a base 133 and a boss 135 integrally formed, and the boss 135 has a plurality of screw holes, so that the bearing member 170 is detachably fixed on the heat sink table 130 by bolts. Specifically, the bottom of the boss 135 is further provided with a mounting counterbore 137, the mounting counterbores 137 correspond to the screw holes one by one and are communicated with the screw holes, when in actual mounting, the bolt penetrates through the bearing member 170 and the heat sink table 130 from top to bottom and then enters the mounting counterbores 137, and the bearing member 170 and the heat sink table 130 are fixed by mounting a nut in the mounting counterbores 137. Of course, the mounting direction of the bolt can also be from bottom to top, with the nut mounted inside the carrier 170.
It should be noted that, in this embodiment, a positioning screw hole is also formed on the pressure block assembly 190, and a bolt provided on the positioning screw hole passes through the positioning device 150, the probe card 110 and the carrier 170 in sequence, so that the pressure block assembly 190 and the carrier 170 are relatively fixed. In other preferred embodiments of the present invention, the pressing block assembly 190 may be fixed on the heat sink 130 or fixed on an external device by bolts, but any fixing method that can fix the pressing block assembly 190 and simultaneously arrange the pressing block assembly 190 above the limiting through hole 151 is within the scope of the present invention.
In the test fixture 100 provided by this embodiment, during operation, after the heat sink 130, the carrier 170, the positioning device 150 and the probe card 110 are assembled in place, the device to be tested is placed in the limiting through hole 151 and placed on the heat sink bump 131, and then the press block assembly 190 is installed, so that the press block assembly 190 applies downward pressure to the device to be tested, thereby ensuring good contact between the device to be tested and the probe card and the heat sink bump 131, and further ensuring good electrical contact and heat dissipation.
In the present embodiment, the heat sink 130 is made of red copper, and has good electrical and thermal conductivity. The heat sink 130 is grounded with external equipment and has controllable temperature. The heat sink bump 131 is integrally arranged on the top of the heat sink table 130 and is a placement area for the device to be tested, and the heat sink bump 131 is rectangular block-shaped and is convenient to abut against and bear the device to be tested. Of course, the material of the heat sink 130 is not limited to red copper, but may be tungsten copper material, molybdenum copper material, or the like, and is not limited to the specific material. In addition, the shape of the heat sink bump 131 is not limited to a rectangular block, and may be other shapes, such as a cylindrical shape or a special-shaped cylindrical shape, and the like, and is not limited in particular.
In the present embodiment, the distance of the top surface of the heat sink bump 131 with respect to the top surface of the heat sink 130 is less than or equal to 5 mm. I.e., the protruding thickness of the heat sink bump 131 is less than or equal to 5 mm. Since the red copper is soft and there is a certain difficulty in machining, the thickness of the heat sink bump 131 is preferably 1-3 mm. The heat sink bump 131 is electrically and thermally connected to the dut, and performs dual functions of electrical connection and heat dissipation. Wherein the size of the heat sink bump 131 is related to the size of the bottom of the device to be tested, the size of the heat sink bump 131 is slightly larger than the size of the bottom of the device to be tested, and when the device to be tested is placed on the heat sink bump 131, the geometric center of the device to be tested coincides with the geometric center of the heat sink bump 131.
In this embodiment, the heatsink bump 131 has at least one bore 1311 formed therein, and a probe is disposed in each bore 1311. For example, the probe in this embodiment is exemplified by a double-ended needle 1313, and the double-ended needle 1313 is used for electrically connecting with the device under test and is shrunk to be flush with the surface of the heat sink bump 131 under the extrusion of the device under test. Specifically, the heat sink bump 131 is provided with 4 drilled holes 1311, the 4 drilled holes 1311 are respectively disposed near 4 vertex angles of the heat sink bump 131, and a double-ended needle 1313 is disposed in each drilled hole 1311. The double-ended needle 1313 mentioned in this embodiment is retractable in needle point, when the device under test is not placed, the top needle point of the double-ended needle 1313 is higher than the upper surface of the heat sink bump 131, when the device under test is placed on the heat sink bump 131, the bottom surface of the device under test abuts against the tops of the 4 double-ended needles 1313, the double-ended needles 1313 are pressed downward, and the double-ended needle 1313 is retracted to be coplanar with the upper surface of the heat sink bump 131 under the extrusion of the device under test.
It should be noted that the bore of the bore 1311 is matched with the diameter of the double-ended needle 1313, and the smaller the bore of the bore 1311 is, the better the bore 1311 is under the condition that the double-ended needle 1313 can be placed in the bore 1311, and the depth of the bore 1311 is the working height of the double-ended needle 1313.
In this embodiment, the tip of the double-ended needle 1313 is crown-shaped, so as to ensure good electrical contact with the sample and improve the stability of electrical connection between the heat sink bump 131 and the device under test. Of course, the shape of the tip of the double-ended needle 1313 may be other shapes such as a cone or a sphere, and is not particularly limited.
The carrier 170 is detachably disposed on the heat sink 130, the carrier 170 is provided with a positioning through hole 175, the positioning through hole 175 is located below the heat sink through hole 111 and is matched with the heat sink bump 131, and the positioning device 150 and the probe card 110 are disposed on the carrier 170. Specifically, the bearing member 170 is fixed on the heat sink 130 by bolts, the positioning through hole 175 is also rectangular, the heat sink protrusion 131 penetrates through the positioning through hole 175, the positioning through hole 175 and the heat sink protrusion 131 are in close fit, and the geometric center of the positioning through hole 175 coincides with the geometric center of the heat sink protrusion 131.
In the present embodiment, the carrier 170 has positioning pins 171 disposed therein, and the positioning pins 171 penetrate through the positioning device 150 and the probe card 110, so that the positioning device 150 and the probe card 110 are relatively fixed. Specifically, the number of the positioning pins 171 is two, and the two positioning pins 171 are disposed at both sides of the positioning through hole 175 and are disposed diagonally, so as to ensure the relative fixation of the probe card 110 and the positioning device 150 in a horizontal position. Of course, the number of the positioning pins 171 may be increased as appropriate, for example, 3 or 4, and is not limited in particular. In other preferred embodiments of the present invention, the positioning pins 171 are further sleeved with pin caps, and the pin caps are arranged to ensure that the probe card 110 and the positioning device 150 are relatively fixed in a vertical position, which is not described in detail herein.
In the present embodiment, the bottom side of the carrier 170 is formed with a positioning groove 173, and the heat sink 130 is formed with a positioning protrusion 139, and the positioning protrusion 139 is engaged with the positioning groove 173. Specifically, the upper portion of the boss 135 of the heat sink stage 130 is provided with a positioning protrusion 139, so as to form a step-shaped structure, and the positioning protrusion 139 is clamped in the positioning groove 173, so as to play a positioning role for the bearing 170, thereby facilitating the alignment and installation of the bearing 170. The bearing 170 in this embodiment is preferably an aluminum box, but may be other bearings that perform the same function.
In other preferred embodiments of the present invention, the width of the upper portion of the positioning protrusion 139 is greater than that of the lower portion, so that the cross section of the positioning protrusion 139 has an inverted trapezoidal shape. In contrast, the width of the upper part of the positioning recess 173 is greater than the width of the lower part, so that the positioning protrusion 139 can be easily snapped in, and by this arrangement, the positioning protrusion 139 can also be kept relatively fixed with the carrier 170 in the vertical direction, which is more favorable for the alignment installation of the carrier 170. It is to be noted that, when fitting the positioning projection 139 into the positioning recess 173, fitting is required in the front-rear direction.
Referring to fig. 8 to 10, the probe card 110 includes a circuit board 113, a suspension probe 115, and a fixing base 117, the circuit board 113 has a heat sink through hole 111, the fixing base 117 is disposed on the circuit board 113, and the suspension probe 115 is fixed on the fixing base 117 and extends to a position below the limiting through hole 151 for electrical connection with a device to be tested. Specifically, the heat sink through-holes 111 are rectangular to facilitate the penetration of the heat sink bumps 131. The suspended probes 115 are welded on the circuit board 113, fixing seats 117 are formed at the welding positions, the circuit board 113 on two sides of the heat sink through hole 111 is provided with the fixing seats 117, and at least one suspended probe 115 is fixed on each fixing seat 117. The suspension probes extend from both sides toward the heat sink through holes 111, so as to correspond to the pin positions on the device to be tested.
In the present embodiment, a probe groove 119 is further disposed on the circuit board 113 between the fixing base 117 and the heat sink through hole 111, the probe groove 119 extends to the heat sink through hole 111, and the suspended probe 115 is suspended on the probe groove 119. And the suspended probe 115 does not extend into the heat sink via 111 to affect the travel of the heat sink bump 131.
In the present embodiment, the number of the suspended probes 115 is 6, and the 6 suspended probes 115 are disposed two by two opposite to each other on both sides of the heat sink through hole 111. The fixing seats 117 are respectively arranged at two sides of the heat sink through hole 111, the fixing seat 117 at one side is divided into 3, and 3 fixing seats 117 are respectively connected with 3 suspended probes 115; the fixed seat 117 on the other side is simultaneously connected with 3 suspended probes 115. One end of the suspended probe 115 is electrically connected to the device to be tested, and the other end is used for being connected to an external trace, so as to perform a test function on the device to be tested.
During actual test, the device to be tested is placed in the limiting through hole 151 and above the heat sink boss 135, under the action of the pressing block assembly 190, the 6 suspended probes 115 are respectively contacted with the 6 pins at the two sides of the bottom of the device to be tested, and the heat sink bump 131 is contacted with the source pin at the center of the bottom of the device to be tested. After the alignment is accurate, under the action of the pressing block assembly 190, the suspended probe 115 is bent downwards, so that good electrical contact between the suspended probe 115 and the corresponding pin is ensured, good electrical contact and thermal contact between the heat sink bump 131 and the device to be tested are also ensured, the heat sink boss 135 plays a dual role of electrical connection and heat dissipation, the double-ended needle 1313 arranged on the heat sink boss 135 can ensure good electrical contact of the source electrode, and the defect of unstable contact possibly caused by hard contact between the device to be tested and the heat sink bump 131 is overcome.
It should be noted that the arrangement position and the number of the suspension probes 115 in this embodiment may be determined according to the pin position and the number of the device under test, so as to ensure that the test pins of the device under test can be arranged in one-to-one correspondence with the suspension probes 115. In actual operation, the device to be tested is pressed on the heat sink bump 131, the suspended probe 115 is contacted with the test pin on the device to be tested and pressed down into the probe groove 119, and the pressing stroke of the suspended probe 115 is smaller than the depth of the probe groove 119, so that the suspended probe 115 can be prevented from contacting the circuit board 113 when pressed down.
In the embodiment, the circuit board 113 is a printed circuit board 113(PCB), the circuit board 113 is made of a high temperature resistant material, and the circuit board 113 is provided with a pin hole matching with the positioning pin 171 for the positioning pin 171 to pass through and accurately position the probe card 110. The probe card 110 is placed in the carrier 170 and connected to the carrier 170 through bolts, and after connection, the positioning pins 171 can ensure that the heat sink through holes 111 coincide with the geometric centers of the heat sink protrusions 131 in the horizontal direction.
The probe groove 119 may have other shapes such as a rectangular shape or an L-shape, and is not particularly limited herein. In this embodiment, preferably, the probe groove 119 is T-shaped, and the wider side of the probe groove 119 is close to the heat sink through hole 111, and the narrower side is close to the fixing base 117, so that the part of the device to be tested falls into the wider side of the probe groove 119 when being pressed down, and the groove structure can effectively prevent the device to be tested from sliding, and improve the testing precision.
In the embodiment, the suspended probe 115 has a double-pin structure, which ensures good contact between the pins of the device under test and the suspended probe 115. Of course, the present invention may be of a single-needle structure or a three-needle structure, and the like, and is not particularly limited herein. It should be noted that the single-pin, double-pin, and three-pin structures mentioned herein refer to a single suspended probe 115 having a single, two, or 3 sub-probes, and the multiple sub-probes can improve the stability of electrical contact.
Referring to fig. 11, the positioning device 150 is further provided with a first abdicating hole 153 and a second abdicating hole 155, which are communicated with each other, the first abdicating hole 153 corresponds to the fixing seat 117 and is used for abdicating the fixing seat 117, and the second abdicating hole 155 extends to the limiting through hole 151 and corresponds to the suspended probe 115 and is used for abdicating the suspended probe 115. Specifically, the positioning device 150 is a positioning pad structure, and the first yielding hole 153 and the second yielding hole 155 are both two, the two second yielding holes 155 are respectively disposed on two sides of the limiting through hole 151, and the two first yielding holes 153 are respectively disposed on the outer sides of the two second yielding holes 155.
It should be noted that in this embodiment, the width of the first yielding hole 153 is greater than the width of the second yielding hole 155, the width of the second yielding hole 155 is less than the width of the limiting through hole 151, and the first yielding hole 153, the second yielding hole 155 and the limiting through hole 151 are communicated with each other, so that the two second yielding holes 155, the two first yielding holes 153 and the limiting through hole 151 form an overall through hole with a horizontal wane-shaped structure, thereby corresponding to the structure on the probe card 110. The positioning device 150 is also provided with two pin holes matching with the positioning pins 171 for the positioning pins 171 to pass through and accurately position the positioning device 150. The positioning device 150 is further provided with a screw hole for a bolt to pass through, the positioning device 150 is arranged above the pin card and is connected with the pin card and the bearing piece 170, the positioning pin 171 can ensure that the geometric center of the limiting through hole 151 on the positioning device 150 coincides with the geometric center of the heat sink convex block 131 in the horizontal direction, and therefore the geometric center of the device to be tested coincides with the geometric center of the heat sink convex block 131 in the horizontal direction.
In the present embodiment, the positioning device 150 is made of polyetheretherketone (peek), and has a plate shape, high hardness, and strong pressure resistance. Of course, the positioning device 150 may be made of other materials, such as polyimide or butadiene-acrylonitrile rubber, and is not limited herein.
In the embodiment, the probe card 110 is disposed below the positioning device 150, and since the probe card 110 does not cover the positioning device 150 enough in the width direction, a metal gasket is further disposed below the positioning device 150, and the metal gasket can fill up the area below the positioning device 150 where there is no probe card 110, so as to ensure that the positioning device 150 is horizontal.
Referring to fig. 12, the pressing block assembly 190 includes a pressing block 191, a pressing head 193 and an adjusting member 195, the pressing block 191 is connected to the heat sink 130, the pressing head 193 is movably connected to the pressing block 191 and disposed on the limiting through hole 151 for pressing the device to be tested, the pressing block 191 is provided with an adjusting screw hole, and the adjusting member 195 passes through the adjusting screw hole and abuts against the top of the pressing head 193. Specifically, the adjusting part 195 is an adjusting bolt, the bottom surface of the pressure head 193 is attached to the surface of the device to be tested, and the pressing depth of the pressure head 193 can be adjusted by rotating the adjusting part 195, so that the device to be tested can move downwards until the device to be tested abuts against the surface of the heat sink convex block 131.
It should be noted that, in other preferred embodiments of the present invention, the positioning device 150 is further provided with a fastening structure for fastening the device under test, which can fix the device under test in the limiting through hole 151, so that the pressing block assembly 190 is not required to additionally press the device under test. Of course, other types of pressing structures may be used herein to press the dut, such as a pressing structure that presses by its own weight.
In summary, in the test fixture 100 provided in this embodiment, the probe card 110 is used to implement a package-level test, and the probe card 110 is provided with the suspended probes 115, so that the heights of the heat sink bumps 131 under the device to be tested can be reduced to a great extent due to the small needle depths of the suspended probes 115, thereby achieving a good heat dissipation effect. In addition, the probe card 110 also ensures good electrical contact performance of the device to be tested, and meanwhile, the double-ended needle 1313 arranged on the heat sink boss 135 can improve poor contact caused by hard contact between the device to be tested and the heat sink bump 131. The positioning device 150 ensures that the device to be tested does not displace in the horizontal direction in the pressing process and the testing process, thereby ensuring the testing precision.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The test fixture is characterized by comprising a probe card (110), a heat sink table (130), a bearing piece and a positioning device (150), wherein the bearing piece (170) is arranged on the heat sink table (130), the positioning device (150) is arranged on the bearing piece (170), a limiting through hole (151) for accommodating a device to be tested is formed in the positioning device (150), and the probe card (110) is pressed between the positioning device (150) and the bearing piece (170) and is used for being electrically connected with the device to be tested; the probe card (110) is provided with a heat sink through hole (111), the top of the heat sink table (130) is provided with a heat sink bump (131), and the heat sink bump (131) penetrates through the heat sink through hole (111) and is arranged opposite to the limiting through hole (151) and used for bearing the device to be tested.
2. The test fixture according to claim 1, wherein the probe card (110) comprises a circuit board (113), a suspended probe (115) and a fixing base (117), the circuit board (113) has the heat sink through hole (111), the fixing base (117) is disposed on the circuit board (113), and the suspended probe (115) is fixed on the fixing base (117) and extends to below the limiting through hole (151) for electrically connecting with the device under test.
3. The test fixture according to claim 2, wherein a probe groove (119) is further disposed on the circuit board (113) between the fixing seat (117) and the heat sink through hole (111), the probe groove (119) extends to the heat sink through hole (111), and the suspended probe (115) is suspended on the probe groove (119).
4. The test fixture according to claim 2, wherein the positioning device (150) is further provided with a first abdicating hole (153) and a second abdicating hole (155) which are communicated with each other, the first abdicating hole (153) corresponds to the fixing seat (117) and is used for abdicating the fixing seat (117), and the second abdicating hole (155) extends to the limiting through hole (151) and corresponds to the suspended probe (115) and is used for abdicating the suspended probe (115).
5. The test fixture according to claim 1, wherein the heat sink bump (131) has at least 1 bore (1311), and at least one probe is disposed in each bore (1311), and the probe is used for electrically connecting with the device under test and shrinking to be flush with the surface of the heat sink bump (131) under the extrusion of the device under test.
6. The test fixture according to claim 1, further comprising a press block assembly (190), wherein the press block assembly (190) is connected to the heat sink (130) and disposed above the limiting through hole (151) for applying a downward pressure to the device under test.
7. The test fixture according to claim 6, wherein the pressing block assembly (190) comprises a pressing block (191), a pressing head (193) and an adjusting piece (195), the pressing block (191) is connected with the heat sink (130), the pressing head (193) is movably connected with the pressing block (191) and arranged on the limiting through hole (151) for pressing the device to be tested, an adjusting screw hole is formed in the pressing block (191), and the adjusting piece (195) penetrates through the adjusting screw hole and abuts against the top of the pressing head (193).
8. The test fixture according to claim 1, wherein the carrier (170) is detachably disposed on the heat sink (130), and a positioning through hole (175) is disposed on the carrier (170), the positioning through hole (175) is located below the heat sink through hole (111) and is matched with the heat sink bump (131), and the positioning device (150) and the probe card (110) are disposed on the carrier (170).
9. The test fixture of claim 8, wherein positioning pins (171) are disposed in the carrier (170), and the positioning pins (171) extend through the positioning device (150) and the probe card (110) to keep the positioning device (150) and the probe card (110) relatively fixed.
10. The testing fixture according to claim 9, wherein the bottom side of the carrier (170) is formed with a positioning groove (173), the heat sink table (130) is formed with a positioning protrusion (139), and the positioning protrusion (139) is engaged with the positioning groove (173).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910646754.7A CN112240971A (en) | 2019-07-17 | 2019-07-17 | Test fixture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910646754.7A CN112240971A (en) | 2019-07-17 | 2019-07-17 | Test fixture |
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| CN112240971A true CN112240971A (en) | 2021-01-19 |
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