CN112020296A - Manufacturing method of high-frequency microwave circuit board - Google Patents
Manufacturing method of high-frequency microwave circuit board Download PDFInfo
- Publication number
- CN112020296A CN112020296A CN202010917361.8A CN202010917361A CN112020296A CN 112020296 A CN112020296 A CN 112020296A CN 202010917361 A CN202010917361 A CN 202010917361A CN 112020296 A CN112020296 A CN 112020296A
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- circuit board
- wall surface
- frequency microwave
- seat
- microwave circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for manufacturing a high-frequency microwave circuit board, which comprises the following operation steps: step S1, powering on the equipment; step S2, adjusting the trial operation; step S3, adjusting equipment; step S4, transporting the circuit board; step S5, transferring the circuit board; step S6, detecting the circuit board; step S7, collecting the circuit board; step S1: electrifying the high-frequency microwave circuit board manufacturing equipment; the transfer structure is arranged, the etched circuit board is automatically transferred to the optical detection station by the transfer structure, the number of times of manual transfer is reduced, the probability of damage to the circuit board is reduced, the quality of the circuit board is guaranteed, the inspection structure and the bearing structure are arranged, the circuit board is not required to be manually taken by a worker, the workload of the operator is reduced, the fatigue of the operator is reduced, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a manufacturing method of a high-frequency microwave circuit board.
Background
The manufacturing method of the high-frequency microwave circuit board of the circuit board comprises the following steps: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
At present, in the process of manufacturing a circuit board, the circuit board after etching needs to be manually transported to an optical detection station, then the circuit board after detection needs to be manually transported to the next station, multiple times of manual transportation are performed, the probability of damage of the circuit board is increased, the quality of the circuit board cannot be guaranteed, and in the process of optical detection of the circuit board, an operator needs to manually take the circuit board, the workload of the operator is large, the fatigue of the operator is accelerated, the production efficiency is influenced, therefore, deep research is performed on the problems, and the scheme is generated.
Disclosure of Invention
The invention aims to solve the problems, designs a high-frequency microwave circuit board manufacturing method, and solves the problems that in the current circuit board manufacturing process, an etched circuit board needs to be manually transported to an optical detection station, then the detected circuit board is manually transported to the next station, and the circuit board is manually transported for multiple times, so that the damage probability of the circuit board is increased, the quality of the circuit board cannot be ensured, and in the circuit board optical detection process, an operator needs to manually take the circuit board, the workload of the operator is large, the fatigue of the operator is accelerated, and the production efficiency is influenced.
The technical scheme of the invention for realizing the aim is as follows: a manufacturing method of a high-frequency microwave circuit board comprises the following operation steps: step S1, powering on the equipment; step S2, adjusting the trial operation; step S3, adjusting equipment; step S4, transporting the circuit board; step S5, transferring the circuit board; step S6, detecting the circuit board; step S7, collecting the circuit board;
step S1: electrifying the high-frequency microwave circuit board manufacturing equipment;
step S2: placing the circuit board on equipment, and operating the high-frequency microwave circuit board manufacturing equipment to perform one-time work;
step S3: adjusting the equipment according to the working state of the high-frequency microwave circuit board manufacturing equipment in one working process;
step S4, the conveyer transports the etched circuit board;
step S5: the transfer structure transfers the conveyed circuit board to the optical detector;
step S6: the inspection structure detects the circuit board and moves the detected circuit board;
step S7: the receiving structure collects the detected circuit board.
The circuit board in the step S2 is an unprocessed circuit board.
A high-frequency microwave circuit board manufacturing device comprises a base, wherein a conveyor is arranged on the base, a transfer structure is arranged on the base and at one end of the conveyor, an inspection structure is arranged on the base and at one end of the transfer structure, and a bearing structure is arranged on the base and at one side of the inspection structure;
the transfer structure comprises: the vacuum chuck comprises a fixed seat, a first motor, a driving gear, a rotating shaft, a driven gear, a supporting rod, two first air cylinders, two first mounting plates and four pairs of first vacuum chucks;
the fixing base is installed on the wall on the base, first motor is installed on the inboard bottom surface of fixing base, first motor drive end cartridge is in the inboard wall of going up of fixing base, the driving gear suit is on first motor drive end, the pivot cartridge is on the fixing base, driven gear suit is in the pivot, just driven gear and driving gear intermeshing, the bracing piece is installed in pivot one end, two first cylinder is installed wall under the bracing piece, two first mounting panel is installed in two the flexible end of first cylinder, four right first vacuum chuck install in two wall under the first mounting panel.
The inspection structure includes: the device comprises an optical detector, a support plate, a mounting seat, a second motor, a screw rod, two sliding blocks, two supporting rods, two second cylinders, two second mounting plates and two pairs of second vacuum chucks;
the optical detector is installed on the upper wall surface of the base, the support plate is installed on the upper wall surface of the base, the installation seat is installed on the support plate, the second motor is installed inside the installation seat, the lead screw is installed at the driving end of the second motor, one end of the lead screw is inserted into the inner side wall surface of the installation seat, the two sliding blocks are sleeved on the lead screw, the two support rods are installed on the two sliding blocks, the two second air cylinders are installed on the lower wall surfaces of the two support rods, and the two pairs of second vacuum suction cups are installed at the telescopic ends of the two second air cylinders.
The receiving structure includes: the device comprises a fixed plate, a hydraulic cylinder and a bearing plate;
the fixed plate is installed on the upper wall surface of the base, the hydraulic cylinder is installed on the upper wall surface of the fixed plate, and the bearing plate is installed at the telescopic end of the hydraulic cylinder.
The lower wall surface of the supporting rod is provided with two protection rods, the upper wall surface of the fixing seat is provided with an annular seat, the upper wall surface of the annular seat is provided with an annular groove, and one end of each protection rod is installed on the annular groove.
And balls are embedded in the lower wall surfaces of the two protection rods.
And a transverse rod is inserted on the sliding block and inserted on the inner side wall surface of the mounting seat.
And a reinforcing rib is arranged between the mounting seat and the support plate.
Four telescopic links are arranged on the upper wall surface of the fixing plate, and one ends of the four telescopic links are arranged on the lower wall surface of the bearing plate.
The method for manufacturing the high-frequency microwave circuit board by utilizing the technical scheme of the invention is provided with the transferring structure, the etched circuit board is not required to be manually transported by an operator, the transferring structure automatically transports the etched circuit board to the optical detection station, the times of manual transportation are reduced, the probability of damage to the circuit board is reduced, the quality of the circuit board is ensured, the checking structure and the bearing structure are arranged, the circuit board is not required to be manually taken by the operator, the workload of the operator is reduced, the fatigue of the operator is reduced, the production efficiency is improved, the problem that the circuit board which is finished by etching needs to be manually transported to the optical detection station in the current manufacturing process of the circuit board is effectively solved, the detected circuit board is then manually transported to the next station for multiple times of manual transportation, and the probability of damage to the circuit board is increased, the quality of the circuit board can not be guaranteed, and in the process of optical detection of the circuit board, an operator needs to manually take the circuit board, so that the workload of the operator is large, the fatigue of the operator is accelerated, and the production efficiency is influenced.
Drawings
Fig. 1 is a schematic structural diagram of a front view of a high-frequency microwave circuit board manufacturing apparatus according to the present invention.
Fig. 2 is a schematic top view of the high-frequency microwave circuit board manufacturing apparatus according to the present invention.
Fig. 3 is a schematic diagram of a right-view structure of a mounting base of the high-frequency microwave circuit board manufacturing device according to the present invention.
Fig. 4 is a schematic diagram of a partial enlarged structure of the position of the protection rod of the device for manufacturing the high-frequency microwave circuit board according to the invention shown in fig. 1.
Fig. 5 is a schematic diagram of a partially enlarged structure of the position of the mounting seat of the high-frequency microwave circuit board manufacturing apparatus shown in fig. 1 according to the present invention.
In the figure: 1. a base; 2. a conveyor; 3. a fixed seat; 4. a first motor; 5. a driving gear; 6. a rotating shaft; 7. a driven gear; 8. a support bar; 9. a first cylinder; 10. a first mounting plate; 11. a first vacuum chuck; 12. an optical detector; 13. a support plate; 14. a mounting seat; 15. a second motor; 16. a screw rod; 17. a slider; 18. a strut; 19. a second cylinder; 20. a second mounting plate; 21. a second vacuum chuck; 22. a fixing plate; 23. a hydraulic cylinder; 24. a bearing plate; 25. a guard bar; 26. an annular seat; 27. a ball bearing; 28. a transverse bar; 29. reinforcing ribs; 30. a telescopic rod.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings, and as shown in fig. 1 to 5, a method for manufacturing a high frequency microwave circuit board includes the following steps: step S1, powering on the equipment; step S2, adjusting the trial operation; step S3, adjusting equipment; step S4, transporting the circuit board; step S5, transferring the circuit board; step S6, detecting the circuit board; step S7, collecting the circuit board; step S1: electrifying the high-frequency microwave circuit board manufacturing equipment; step S2: placing the circuit board on equipment, and operating the high-frequency microwave circuit board manufacturing equipment to perform one-time work; step S3: adjusting the equipment according to the working state of the high-frequency microwave circuit board manufacturing equipment in one working process; step S4, the conveyer 2 transports the etched circuit board; step S5: the transfer structure transfers the conveyed circuit board to the optical detector 12; step S6: the inspection structure detects the circuit board and moves the detected circuit board; step S7: the carrying structure collects the detected circuit board; the circuit board in the step S2 is an unprocessed circuit board.
A high-frequency microwave circuit board manufacturing device comprises a base 1, wherein a conveyor 2 is arranged on the base 1, a transfer structure is arranged on the base 1 and at one end of the conveyor 2, an inspection structure is arranged on the base 1 and at one end of the transfer structure, and a bearing structure is arranged on the base 1 and at one side of the inspection structure; the transfer structure comprises: the device comprises a fixed seat 3, a first motor 4, a driving gear 5, a rotating shaft 6, a driven gear 7, a supporting rod 8, two first air cylinders 9, two first mounting plates 10 and four pairs of first vacuum chucks 11; the fixed seat 3 is installed on the upper wall surface of the base 1, the first motor 4 is installed on the bottom surface of the inner side of the fixed seat 3, the driving end of the first motor 4 is inserted into the upper wall surface of the inner side of the fixed seat 3, the driving gear 5 is sleeved on the driving end of the first motor 4, the rotating shaft 6 is inserted into the fixed seat 3, the driven gear 7 is sleeved on the rotating shaft 6, the driven gear 7 and the driving gear 5 are meshed with each other, the supporting rod 8 is installed at one end of the rotating shaft 6, the two first air cylinders 9 are installed on the lower wall surface of the supporting rod 8, the two first installation plates 10 are installed at the telescopic ends of the two first air cylinders 9, and four pairs of first vacuum suction cups 11 are installed on the; the inspection structure includes: the device comprises an optical detector 12, a support plate 13, a mounting seat 14, a second motor 15, a screw rod 16, two sliding blocks 17, two support rods 18, two second air cylinders 19, two second mounting plates 20 and two pairs of second vacuum chucks 21; the optical detector 12 is mounted on the upper wall surface of the base 1, the support plate 13 is mounted on the upper wall surface of the base 1, the mounting seat 14 is mounted on the support plate 13, the second motor 15 is mounted inside the mounting seat 14, the lead screw 16 is mounted at the driving end of the second motor 15, one end of the lead screw 16 is inserted into the inner side wall surface of the mounting seat 14, the two sliders 17 are sleeved on the lead screw 16, the two support rods 18 are mounted on the two sliders 17, the two second air cylinders 19 are mounted on the lower wall surfaces of the two support rods 18, and the two pairs of second vacuum suction cups 21 are mounted at the telescopic ends of the two second air cylinders 19; the receiving structure includes: a fixed plate 22, a hydraulic cylinder 23, and a receiving plate 24; the fixed plate 22 is arranged on the upper wall surface of the base 1, the hydraulic cylinder 23 is arranged on the upper wall surface of the fixed plate 22, and the bearing plate 24 is arranged at the telescopic end of the hydraulic cylinder 23; two protection rods 25 are arranged on the lower wall surface of the support rod 8, an annular seat 26 is arranged on the upper wall surface of the fixed seat 3, an annular groove is formed in the upper wall surface of the annular seat 26, and one end of each of the two protection rods 25 is arranged on the annular groove; the lower wall surfaces of the two protection rods 25 are embedded with balls 27; a transverse rod 28 is inserted on the sliding block 17, and the transverse rod 28 is inserted on the inner side wall surface of the mounting seat 14; a reinforcing rib 29 is arranged between the mounting seat 14 and the support plate 13; four telescopic rods 30 are arranged on the upper wall surface of the fixing plate 22, and one ends of the four telescopic rods 30 are installed on the lower wall surface of the bearing plate 24.
The implementation scheme is characterized by comprising the following operation steps: step S1, powering on the equipment; step S2, adjusting the trial operation; step S3, adjusting equipment; step S4, transporting the circuit board; step S5, transferring the circuit board; step S6, detecting the circuit board; step S7, collecting the circuit board; step S1: electrifying the high-frequency microwave circuit board manufacturing equipment; step S2: placing the circuit board on equipment, and operating the high-frequency microwave circuit board manufacturing equipment to perform one-time work; step S3: adjusting the equipment according to the working state of the high-frequency microwave circuit board manufacturing equipment in one working process; step S4, the conveyer 2 transports the etched circuit board; step S5: the transfer structure transfers the conveyed circuit board to the optical detector 12; step S6: the inspection structure detects the circuit board and moves the detected circuit board; step S7: the carrying structure collects the detected circuit board; the transfer structure is arranged, the circuit board after etching is automatically transferred to the optical detection station by the transfer structure without manual operation of an operator, the times of manual transfer are reduced, the probability of damage of the circuit board is reduced, the quality of the circuit board is ensured, the inspection structure and the bearing structure are arranged, the circuit board after etching is not required to be manually taken by the operator, the workload of the operator is reduced, the fatigue of the operator is reduced, the production efficiency is improved, the problem that the circuit board after etching needs to be manually transferred to the optical detection station in the process of manufacturing the circuit board at present is effectively solved, then the circuit board after detection is manually transferred to the next station for multiple times of manual transfer, the probability of damage of the circuit board is increased, the quality of the circuit board cannot be ensured, and in the process of optical detection of the circuit board, the circuit board is manually taken by operators, the workload of the operators is large, the fatigue of the operators is accelerated, and the production efficiency is influenced.
All the electrical components in the present application are connected with the power supply adapted to the electrical components through the wires, and an appropriate controller should be selected according to actual conditions to meet the control requirements, and specific connection and control sequences should be obtained.
Example (b): firstly electrifying equipment, then placing an unprocessed circuit board on a conveyor 2, starting the equipment to work once, adjusting the equipment according to the working state of the working equipment and the running position of the circuit board, then conveying the etched circuit board by the conveyor 2, working a first motor 4, rotating a rotating shaft 6 through the meshing of a driving gear 5 and a driven gear 7, rotating a support rod 8 accordingly, preferably, further, two protection rods 25 are arranged on the lower wall surface of the support rod 8, an annular seat 26 is arranged on the upper wall surface of a fixed seat 3, an annular groove is arranged on the upper wall surface of the annular seat 26, one end of each protection rod 25 is arranged on the annular groove and used for supporting the support rod 8, preferably, balls 27 are embedded on the lower wall surfaces of the two protection rods 25 and used for assisting the movement of the protection rods 25, when the first mounting plate 10 is rotated to the upper part of the conveyor 2, the motor stops working, the first air cylinder 9 extends, the four first vacuum chucks 11 arranged below the first mounting plate 10 work to fix the circuit board, then the first air cylinder 9 contracts, the first motor 4 rotates to convey the etched circuit board to the upper part of the optical detector 12, the first air cylinder 9 extends, the four vacuum chucks stop working, the etched circuit board is placed on the optical detector 12, meanwhile, the other four first vacuum chucks 11 fix a new circuit board to be detected, the optical detector 12 detects the circuit board, an operator monitors the instrument, when finding that the circuit board is unqualified, the operator takes down the circuit board, if the circuit board is qualified, the second motor 15 is controlled to work, preferably, further, a reinforcing rib 29 is arranged between the mounting seat 14 and the support plate 13, the fixing plate is used for supporting the fixing seat 3, the screw rod 16 rotates to drive the two sliding blocks 17 to move transversely, preferably, further, the sliding blocks 17 are inserted with transverse rods 28, the transverse rods 28 are inserted on the inner side wall surface of the mounting seat 14 and used for protecting the screw rod 16, so that the two pairs of second vacuum chucks 21 move to the position above the optical detector 12, then the two second air cylinders 19 extend, the two pairs of second vacuum chucks 21 suck the detected circuit board, then the second motor 15 rotates reversely, the detected circuit board is moved to the position above the bearing plate 24, as the circuit board is gradually placed on the bearing plate 24, the hydraulic cylinders 23 gradually contract, so that the uppermost circuit board is close to the plane of the optical detector 12, preferably, further, the upper wall surface of the fixing plate 22 is provided with four telescopic rods 30, one ends of the four telescopic rods 30 are installed on the lower wall surface of the bearing plate 24, for supporting the adaptor plate 24.
The technical solutions described above only represent the preferred technical solutions of the present invention, and some possible modifications to some parts of the technical solutions by those skilled in the art all represent the principles of the present invention, and fall within the protection scope of the present invention.
Claims (10)
1. A manufacturing method of a high-frequency microwave circuit board is characterized by comprising the following operation steps:
step S1, powering on the equipment; step S2, adjusting the trial operation; step S3, adjusting equipment; step S4, transporting the circuit board; step S5, transferring the circuit board; step S6, detecting the circuit board; step S7, collecting the circuit board;
step S1: electrifying the high-frequency microwave circuit board manufacturing equipment;
step S2: placing the circuit board on equipment, and operating the high-frequency microwave circuit board manufacturing equipment to perform one-time work;
step S3: adjusting the equipment according to the working state of the high-frequency microwave circuit board manufacturing equipment in one working process;
step S4, the conveyer (2) transports the etched circuit board;
step S5: the transfer structure transfers the conveyed circuit board to an optical detector (12);
step S6: the inspection structure detects the circuit board and moves the detected circuit board;
step S7: the receiving structure collects the detected circuit board.
2. The method as claimed in claim 1, wherein the circuit board in step S2 is a raw circuit board.
3. The high-frequency microwave circuit board manufacturing equipment comprises a base (1) and is characterized in that a conveyor (2) is arranged on the base (1), a transfer structure is arranged on the base (1) and at one end of the conveyor (2), an inspection structure is arranged on the base (1) and at one end of the transfer structure, and a bearing structure is arranged on the base (1) and at one side of the inspection structure;
the transfer structure comprises: the vacuum suction device comprises a fixed seat (3), a first motor (4), a driving gear (5), a rotating shaft (6), a driven gear (7), a supporting rod (8), two first air cylinders (9), two first mounting plates (10) and four pairs of first vacuum suction cups (11);
the fixed seat (3) is arranged on the upper wall surface of the base (1), the first motor (4) is arranged on the bottom surface of the inner side of the fixed seat (3), the driving end of the first motor (4) is inserted into the upper wall surface of the inner side of the fixed seat (3), the driving gear (5) is sleeved on the driving end of the first motor (4), the rotating shaft (6) is inserted on the fixed seat (3), the driven gear (7) is sleeved on the rotating shaft (6), and driven gear (7) and driving gear (5) intermeshing, install in pivot (6) one end bracing piece (8), two first cylinder (9) are installed wall under bracing piece (8), two first mounting panel (10) are installed in two the flexible end of first cylinder (9), four are right first vacuum chuck (11) are installed in two wall under first mounting panel (10).
4. A high-frequency microwave circuit board manufacturing apparatus according to claim 3, wherein said inspection structure comprises: the device comprises an optical detector (12), a support plate (13), a mounting seat (14), a second motor (15), a screw rod (16), two sliding blocks (17), two support rods (18), two second air cylinders (19), two second mounting plates (20) and two pairs of second vacuum chucks (21);
the optical detection instrument (12) is installed on the upper wall surface of the base (1), the support plate (13) is installed on the upper wall surface of the base (1), the installation seat (14) is installed on the support plate (13), the second motor (15) is installed inside the installation seat (14), the screw rod (16) is installed at the driving end of the second motor (15), one end of the screw rod (16) is inserted into the inner side wall surface of the installation seat (14), the two sliding blocks (17) are sleeved on the screw rod (16), the two supporting rods (18) are installed on the two sliding blocks (17), the two second air cylinders (19) are installed on the lower wall surface of the two supporting rods (18), and the two pairs of second vacuum suction cups (21) are installed at the two telescopic ends of the second air cylinders (19).
5. A high-frequency microwave circuit board manufacturing apparatus according to claim 3, wherein the receiving structure includes: a fixed plate (22), a hydraulic cylinder (23), and a receiving plate (24);
the fixed plate (22) is installed on the upper wall surface of the base (1), the hydraulic cylinder (23) is installed on the upper wall surface of the fixed plate (22), and the bearing plate (24) is installed at the telescopic end of the hydraulic cylinder (23).
6. A high frequency microwave circuit board manufacturing apparatus according to claim 3, characterized in that two protection rods (25) are arranged on the lower wall surface of the support rod (8), an annular seat (26) is arranged on the upper wall surface of the fixing seat (3), an annular groove is arranged on the upper wall surface of the annular seat (26), and one end of each of the two protection rods (25) is installed on the annular groove.
7. The manufacturing equipment of the high-frequency microwave circuit board according to claim 6, characterized in that the balls (27) are embedded in the lower wall surfaces of the two protection rods (25).
8. A high-frequency microwave circuit board manufacturing device according to claim 4, characterized in that a transverse rod (28) is inserted on the sliding block (17), and the transverse rod (28) is inserted on the inner side wall surface of the mounting seat (14).
9. A high-frequency microwave circuit board manufacturing device according to claim 4, characterized in that a reinforcing rib (29) is arranged between the mounting seat (14) and the support plate (13).
10. The manufacturing equipment of the high-frequency microwave circuit board as claimed in claim 5, wherein four telescopic rods (30) are arranged on the upper wall surface of the fixing plate (22), and one end of each of the four telescopic rods (30) is installed on the lower wall surface of the bearing plate (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010917361.8A CN112020296A (en) | 2020-09-03 | 2020-09-03 | Manufacturing method of high-frequency microwave circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010917361.8A CN112020296A (en) | 2020-09-03 | 2020-09-03 | Manufacturing method of high-frequency microwave circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN112020296A true CN112020296A (en) | 2020-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010917361.8A Pending CN112020296A (en) | 2020-09-03 | 2020-09-03 | Manufacturing method of high-frequency microwave circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130257471A1 (en) * | 2012-04-02 | 2013-10-03 | Youngchul Lee | Apparatus and method for manufacturing substrates |
| CN105158676A (en) * | 2015-09-21 | 2015-12-16 | 大西电子仪器（昆山）有限公司 | Automatic precise electronic product substrate function detection device |
| CN204912105U (en) * | 2015-08-03 | 2015-12-30 | 奥蒂玛光学科技（深圳）有限公司 | Online circuit board automated inspection judges shunting device |
| CN108990288A (en) * | 2018-08-14 | 2018-12-11 | 珠海锐翔智能科技有限公司 | A kind of process for manufacturing circuit board and its device |
| CN109219261A (en) * | 2018-10-23 | 2019-01-15 | 奥蒂玛光学科技（深圳）有限公司 | The restorative procedure of circuit board automatic repariring equipment and circuit board |
| CN211197844U (en) * | 2019-08-30 | 2020-08-07 | 南安市好运来雨具有限公司 | Automatic transfer equipment is used in electronic equipment production |
| CN211267574U (en) * | 2019-12-20 | 2020-08-14 | 青岛科荣达电器科技有限公司 | Feeding device of chip mounter |
| CN211321667U (en) * | 2020-03-13 | 2020-08-21 | 天津威佳美甫电子有限公司 | SMT chip mounter |
-
2020
- 2020-09-03 CN CN202010917361.8A patent/CN112020296A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130257471A1 (en) * | 2012-04-02 | 2013-10-03 | Youngchul Lee | Apparatus and method for manufacturing substrates |
| CN204912105U (en) * | 2015-08-03 | 2015-12-30 | 奥蒂玛光学科技（深圳）有限公司 | Online circuit board automated inspection judges shunting device |
| CN105158676A (en) * | 2015-09-21 | 2015-12-16 | 大西电子仪器（昆山）有限公司 | Automatic precise electronic product substrate function detection device |
| CN108990288A (en) * | 2018-08-14 | 2018-12-11 | 珠海锐翔智能科技有限公司 | A kind of process for manufacturing circuit board and its device |
| CN109219261A (en) * | 2018-10-23 | 2019-01-15 | 奥蒂玛光学科技（深圳）有限公司 | The restorative procedure of circuit board automatic repariring equipment and circuit board |
| CN211197844U (en) * | 2019-08-30 | 2020-08-07 | 南安市好运来雨具有限公司 | Automatic transfer equipment is used in electronic equipment production |
| CN211267574U (en) * | 2019-12-20 | 2020-08-14 | 青岛科荣达电器科技有限公司 | Feeding device of chip mounter |
| CN211321667U (en) * | 2020-03-13 | 2020-08-21 | 天津威佳美甫电子有限公司 | SMT chip mounter |
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Application publication date: 20201201 |