CN112017994A - 基板处理装置以及基板处理方法 - Google Patents

基板处理装置以及基板处理方法 Download PDF

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Publication number
CN112017994A
CN112017994A CN202010457046.1A CN202010457046A CN112017994A CN 112017994 A CN112017994 A CN 112017994A CN 202010457046 A CN202010457046 A CN 202010457046A CN 112017994 A CN112017994 A CN 112017994A
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CN
China
Prior art keywords
liquid
pipe
substrate processing
chemical
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010457046.1A
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English (en)
Chinese (zh)
Inventor
东克荣
森隆
滩和成
上前昭司
新庄淳一
秀浦伸二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN112017994A publication Critical patent/CN112017994A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
CN202010457046.1A 2019-05-31 2020-05-26 基板处理装置以及基板处理方法 Pending CN112017994A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019103290A JP7264729B2 (ja) 2019-05-31 2019-05-31 基板処理装置および基板処理方法
JP2019-103290 2019-05-31

Publications (1)

Publication Number Publication Date
CN112017994A true CN112017994A (zh) 2020-12-01

Family

ID=73507059

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010457046.1A Pending CN112017994A (zh) 2019-05-31 2020-05-26 基板处理装置以及基板处理方法

Country Status (4)

Country Link
JP (1) JP7264729B2 (ko)
KR (1) KR102384077B1 (ko)
CN (1) CN112017994A (ko)
TW (1) TWI747286B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023142445A (ja) * 2022-03-25 2023-10-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103895A (ja) * 2005-09-06 2007-04-19 Tokyo Ohka Kogyo Co Ltd レジスト液供給装置及び当該レジスト液供給装置を得るための改造キット
JP2010232520A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 処理液供給装置および処理液供給方法
CN104637841A (zh) * 2013-11-13 2015-05-20 东京毅力科创株式会社 基板液处理装置和基板液处理方法
CN106024615A (zh) * 2015-03-26 2016-10-12 东京毅力科创株式会社 基板液体处理装置和基板液体处理方法
CN107924832A (zh) * 2015-08-18 2018-04-17 株式会社斯库林集团 基板处理方法及基板处理装置
JP2018117032A (ja) * 2017-01-18 2018-07-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN108630571A (zh) * 2017-03-16 2018-10-09 株式会社斯库林集团 处理液供给装置、基板处理装置以及处理液供给方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021838A (ja) * 1998-06-29 2000-01-21 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2012074552A (ja) * 2010-09-29 2012-04-12 Dainippon Screen Mfg Co Ltd 基板処理方法
JP6074338B2 (ja) 2013-08-27 2017-02-01 東京エレクトロン株式会社 液処理装置、濃度補正方法及び記憶媒体
JP6657306B2 (ja) * 2013-11-13 2020-03-04 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6918600B2 (ja) * 2016-07-29 2021-08-11 芝浦メカトロニクス株式会社 処理液生成装置及びそれを用いた基板処理装置
JP6909620B2 (ja) * 2017-04-20 2021-07-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
US20180335879A1 (en) * 2017-05-17 2018-11-22 Himax Technologies Limited In-cell touch and display apparatus, common voltage provider, and providing method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103895A (ja) * 2005-09-06 2007-04-19 Tokyo Ohka Kogyo Co Ltd レジスト液供給装置及び当該レジスト液供給装置を得るための改造キット
JP2010232520A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 処理液供給装置および処理液供給方法
CN104637841A (zh) * 2013-11-13 2015-05-20 东京毅力科创株式会社 基板液处理装置和基板液处理方法
CN106024615A (zh) * 2015-03-26 2016-10-12 东京毅力科创株式会社 基板液体处理装置和基板液体处理方法
CN107924832A (zh) * 2015-08-18 2018-04-17 株式会社斯库林集团 基板处理方法及基板处理装置
JP2018117032A (ja) * 2017-01-18 2018-07-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN108630571A (zh) * 2017-03-16 2018-10-09 株式会社斯库林集团 处理液供给装置、基板处理装置以及处理液供给方法

Also Published As

Publication number Publication date
JP2020198357A (ja) 2020-12-10
KR20200138041A (ko) 2020-12-09
TW202101567A (zh) 2021-01-01
TWI747286B (zh) 2021-11-21
KR102384077B1 (ko) 2022-04-07
JP7264729B2 (ja) 2023-04-25

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