CN111987150A - Semiconductor structure, manufacturing method thereof and memory - Google Patents
Semiconductor structure, manufacturing method thereof and memory Download PDFInfo
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- CN111987150A CN111987150A CN201910433749.8A CN201910433749A CN111987150A CN 111987150 A CN111987150 A CN 111987150A CN 201910433749 A CN201910433749 A CN 201910433749A CN 111987150 A CN111987150 A CN 111987150A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
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Abstract
The embodiment of the invention relates to a semiconductor structure, a manufacturing method thereof and a memory, wherein the semiconductor structure comprises: the semiconductor device comprises a substrate, a grid structure positioned in the substrate, a first source drain doped region and a second source drain doped region; the anti-fuse capacitor is positioned in the substrate, the first source-drain doped region is used as an electrode plate of the anti-fuse capacitor, and the anti-fuse capacitor further comprises: the capacitor comprises a capacitor dielectric layer positioned on the surface of the side wall of the first source-drain doped region and a capacitor conducting layer positioned on the surface of the capacitor dielectric layer. In the embodiment of the invention, the anti-fuse capacitor and the gate structure are arranged in the substrate, and the source electrode or the drain electrode in the control gate transistor is used as the lower electrode plate of the anti-fuse capacitor, so that the semiconductor structure with a brand-new structure is provided.
Description
Technical Field
The embodiment of the invention relates to the technical field of semiconductors, in particular to a semiconductor structure, a manufacturing method thereof and a memory.
Background
In the semiconductor industry, fuse elements are widely used in integrated circuits due to their multiple uses. For example, a plurality of circuit blocks having the same function are designed in an integrated circuit as backups, and when one of the circuit blocks is found to be defective, the circuit block and other functional circuits in the integrated circuit are blown by fuse elements, while the defective circuit block is replaced with another circuit block having the same function.
Anti-fuse (Anti-fuse) technology has the characteristics of small area, low cost and compatibility with semiconductor processes. An antifuse structure is a structure that can change conductive state, and is non-conductive when inactive and conductive when active. The working principle of the antifuse structure is to store data 1 or 0 according to whether the capacitor dielectric layer is broken down, so that the antifuse structure can selectively electrically connect two originally electrically isolated devices or chips.
Disclosure of Invention
Embodiments of the present invention provide a semiconductor structure, a method for manufacturing the same, and a memory, and provide a semiconductor structure with a novel structure, which is beneficial to reducing the space occupied by an antifuse capacitor.
To solve the above technical problem, an embodiment of the present invention provides a semiconductor structure, including: the gate structure comprises a substrate and a gate structure positioned in the substrate, wherein the substrate exposes the top of the gate structure; the first source-drain doped region is positioned in the substrate on one side of the grid structure, and the doping type of the first source-drain doped region is N-type doping or P-type doping; the second source-drain doped region and the first source-drain doped region are respectively positioned at two opposite sides of the gate structure, and the doping type of the second source-drain doped region is the same as that of the first source-drain doped region; the anti-fuse capacitor is positioned in the substrate, the first source-drain doped region is used as an electrode plate of the anti-fuse capacitor, and the anti-fuse capacitor further comprises: the substrate comprises a capacitor dielectric layer and a capacitor conducting layer, wherein the capacitor dielectric layer is positioned on the surface of the side wall of the first source-drain doped region, the capacitor conducting layer is positioned on the surface of the capacitor dielectric layer, and the substrate is exposed out of the surface of the capacitor conducting layer.
The embodiment of the invention also provides a manufacturing method of the semiconductor structure, which comprises the following steps: providing a substrate; forming a gate structure in the substrate, wherein the substrate is exposed out of the top of the gate structure, a first source-drain doped region is formed in the substrate on one side of the gate structure, the doping type of the first source-drain doped region is N-type doping or P-type doping, a second source-drain doped region is formed in the substrate on the other side of the gate structure, the second source-drain doped region and the first source-drain doped region are respectively positioned on two opposite sides of the gate structure, and the doping type of the second source-drain doped region is the same as that of the first source-drain doped region; forming a groove in the substrate with partial thickness, wherein the substrate exposes the top of the groove; forming a capacitance dielectric layer on the side wall of the groove; forming a capacitor conducting layer filling the groove on the surface of the capacitor dielectric layer; and the capacitance dielectric layer covers the side wall of the first source-drain doped region.
The embodiment of the invention also provides a memory, which comprises the semiconductor structure.
Compared with the prior art, the technical scheme provided by the embodiment of the invention has the following advantages:
The embodiment of the invention provides a semiconductor structure with excellent structural performance, wherein a gate structure, a first source-drain doped region and a second source-drain doped region form a control transistor, an anti-fuse capacitor is positioned in a substrate, and a capacitor conducting layer, a capacitor dielectric layer and the first source-drain doped region form the anti-fuse capacitor, namely the first source-drain doped region is used as a source electrode or a drain electrode of the control transistor and also used as an electrode plate of the anti-fuse capacitor. The anti-fuse capacitor and the gate structure are both located in the substrate, so that the size of the semiconductor in the direction vertical to the surface of the substrate is reduced. The semiconductor structure provided by the embodiment of the invention is beneficial to reducing the space positions occupied by the anti-fuse capacitor and the grid structure, thereby reducing the volume of the semiconductor structure.
In addition, the capacitance medium layer is positioned at the bottom of the groove and on the surface of the whole side wall; and the cross-sectional shape of the trench is U-shaped in a direction perpendicular to the substrate surface. Therefore, a sharp corner area in the groove can be avoided, and the problem of point discharge is avoided; and when the capacitor dielectric layer needs to be punctured, the capacitor dielectric layer area with the puncturing area being centrally located between the first source-drain doped area and the capacitor conducting layer is guaranteed, and the puncturing efficiency is improved.
In addition, in the direction vertical to the surface of the substrate, the cross section of the gate structure is in a U shape, which is beneficial to increasing the length of the channel region, and can also avoid the problem of point discharge, thereby further improving the electrical performance of the semiconductor structure.
In addition, the material of the capacitor dielectric layer is the same as that of the gate dielectric layer, and the thickness of the capacitor dielectric layer is smaller than or equal to that of the gate dielectric layer, so that the situation that the gate dielectric layer is not broken down before the capacitor dielectric layer is broken down is favorably ensured, and the performance of the semiconductor structure is further improved.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings which correspond to figures in the drawings and not by way of limitation, in which elements having the same reference numeral designations represent like elements and the figures are not to scale unless otherwise specified.
Fig. 1 to 4 are schematic cross-sectional views of four exemplary semiconductor structures provided in an embodiment of the present invention;
fig. 5 to 8 are schematic cross-sectional views corresponding to steps of a method for manufacturing a semiconductor structure according to an embodiment of the invention;
fig. 9 to 12 are schematic cross-sectional views corresponding to steps of a method for manufacturing a semiconductor structure according to another embodiment of the invention.
Detailed Description
The embodiment of the invention provides a semiconductor structure, wherein an anti-fuse capacitor is designed to be positioned in a substrate, so that the space occupied by the anti-fuse capacitor is reduced while the storage function is ensured.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
Fig. 1 to 4 are schematic cross-sectional views of four exemplary semiconductor structures according to an embodiment of the present invention.
Referring to fig. 1, the present embodiment provides a semiconductor structure including: a substrate 100 and a gate structure 102 located in the substrate 100, wherein the substrate 100 exposes the top of the gate structure 102; a first source-drain doped region 103 located in the substrate 100 at one side of the gate structure 102, wherein the doping type of the first source-drain doped region 103 is N-type doping or P-type doping; a second source-drain doped region 113 located in the substrate 100 on the other side of the gate structure 103, wherein the second source-drain doped region 113 and the first source-drain doped region 103 are respectively located on two opposite sides of the gate structure 102, and the doping type of the second source-drain doped region 113 is the same as that of the first source-drain doped region 103; the antifuse capacitor located in the substrate 100, the first source-drain doped region 103 serving as an electrode plate of the antifuse capacitor, the antifuse capacitor further includes: a capacitor dielectric layer 105 located on the sidewall surface of the first source-drain doped region 103, and a capacitor conductive layer 106 located on the surface of the capacitor dielectric layer 105.
The present embodiment provides a semiconductor structure with a novel structure, which can be applied to a memory circuit. The semiconductor structure includes an antifuse structure having a control transistor and an antifuse capacitor located in a substrate 200, and the antifuse capacitor is located in a substrate 100. Specifically, the gate structure 102, the first source-drain doped region 103 and the second source-drain doped region 113 form a control transistor, the capacitor conductive layer 106, the capacitor dielectric layer 105 and the first source-drain doped region 103 form an antifuse capacitor, and the control transistor controls on and off of the antifuse capacitor. Since the antifuse capacitor is located within the substrate 100, it is advantageous to reduce the spatial location occupied by the antifuse capacitor.
The semiconductor structure provided by the embodiment of the invention will be described in detail with reference to the accompanying drawings.
The substrate 100 may be a semiconductor substrate such as a silicon substrate, a germanium substrate, a silicon carbide substrate, a III-V substrate, or a sapphire substrate, and the substrate 100 may also be a silicon-on-insulator substrate.
When the semiconductor structure is used in a memory circuit, the gate structure 102 is used to electrically connect to a word line WL (word line), and a control voltage is applied to the gate structure 102 through the word line WL. The gate structure 102 includes a gate dielectric layer 112 and a gate conductive layer 122 on a top surface of the gate dielectric layer 112.
The material of the gate dielectric layer 112 includes one or more of a high-k dielectric material, silicon oxide, silicon nitride or silicon oxynitride, wherein the high-k dielectric material refers to a material having a relative dielectric constant greater than that of silicon oxide, such as HfO2、Al2O3And the like. The gate dielectric layer 112 may be a single-layer structure or a stacked structure; the number of layers of the gate dielectric layer 112 may be set according to the manufacturing process and the thickness requirement of the gate dielectric layer 112. The material of the gate conductive layer 122 includes polysilicon, copper, aluminum, or tungsten. In this embodiment, the gate dielectric layer 112 is made of silicon oxide, and the gate conductive layer 122 is made of polysilicon.
The top of the gate conductive layer 122 may be flush with the surface of the substrate 100, the top of the gate conductive layer 122 may be higher than the surface of the substrate 100, or the top of the gate conductive layer 122 may be lower than the surface of the substrate 100.
The gate dielectric layer 112 is in contact with the sidewall of the first source-drain doped region 103 and the sidewall of the second source-drain doped region 113, and the region of the substrate 100 under the gate dielectric layer 112 forms a channel region of the transistor.
In the present embodiment, the gate structure 102 has a U-shaped cross-section in a direction perpendicular to the surface of the substrate 100. By such an arrangement, a tip region is prevented from being generated between the control gate and the channel region, so that the control capability of the gate structure 102 on the channel region is improved, the problem of tip discharge generated by the tip region is avoided, and the transistor is ensured to have good electrical performance.
In addition, when the length of the sidewall of the gate structure 102 is kept constant, the cross-sectional shape of the gate structure 102 is U-shaped, which is beneficial to increase the total length of the bottom of the gate structure 102, so as to increase the actual length of the channel region of the transistor without increasing the length in the horizontal direction, and improve the controllability of the gate structure 102 on the channel region.
In other embodiments, the cross-sectional shape of the gate structure in the direction perpendicular to the substrate surface may also be square.
In this embodiment, the bottom of the sidewall of the gate structure 102 adjacent to the first source-drain doped region 103 is lower than the bottom of the first source-drain doped region 103, and the bottom of the sidewall of the gate structure 102 adjacent to the second source-drain doped region 113 is lower than the bottom of the second source-drain doped region 113, which is beneficial to increasing the length of the channel region and improving the control capability of the gate structure 102 on the channel region. It is understood that the gate structure 102 may be in contact with the sidewall of the adjacent first source/drain doped region 103, and the gate structure 102 may also be not in contact with the sidewall of the adjacent first source/drain doped region 103.
It should be noted that, in other embodiments, the bottom of the sidewall of the gate structure adjacent to the first source-drain doped region may also be higher than or flush with the bottom of the first source-drain doped region, and the bottom of the sidewall of the gate structure adjacent to the second source-drain doped region may also be higher than or flush with the bottom of the second source-drain doped region.
The first source drain doped region 103 and the second source drain doped region 113 are used to serve as a source and a drain of a transistor. Specifically, when the first source-drain doped region 103 serves as a source, the second source-drain doped region 113 serves as a drain; when the first source-drain doped region 103 serves as a drain, the second source-drain doped region 113 serves as a source.
In this embodiment, the doping type of the first source-drain doping region 103 is N-type doping, the doping type of the second source-drain doping region 113 is N-type doping, and the doping ion concentrations of the first source-drain doping region 103 and the second source-drain doping region 113 are the same. The N-type doped dopant ions include P, As or Sb.
When the semiconductor structure is used in a memory circuit, the second source-drain doped region 113 is electrically connected to a bit line bl (bit line) for applying a voltage to the second source-drain doped region 113.
It should be noted that, in other embodiments, the first source-drain doped region and the second source-drain doped region may also be formed by using an embedded stress technique. Specifically, the process for forming the first source-drain doped region and the second source-drain doped region comprises the following steps: removing the substrate with partial thickness at two sides of the gate structure to form a groove; forming a stress layer filling the groove; and doping the stress layer to correspondingly form a first source-drain doping region and a second source-drain doping region, wherein the doping treatment can be in-situ doping (in-situ doping) in the process step of forming the stress layer or doping after forming the stress layer. When the control transistor is a PMOS transistor, the stress layer material comprises SiGe; when the control transistor is an NMOS transistor, the material of the stress layer includes SiC.
The semiconductor structure may further include: an isolation structure 101 located within the substrate 100, adjacent isolation structures 101 for electrically isolating adjacent Active Areas (AA). In this embodiment, the transistor and the antifuse capacitor are both located between adjacent isolation structures 101. The semiconductor structure may further include: and a Well region (Well) located in the substrate 100 between the adjacent isolation structures 101, wherein the doping type of the Well region is N-type doping or P-type doping, and the doping type of the Well region is different from the doping types of the first source-drain doping region and the second source-drain doping region.
In this embodiment, the substrate 100 has a trench 104 therein, the trench 104 exposes the sidewall of the first source/drain doped region 103, correspondingly, the capacitor dielectric layer 103 covers the sidewall of the first source/drain doped region 103 exposed by the trench 104, and the capacitor conductive layer 106 fills the trench 104.
The trench 104 is located between the first source-drain doped region 103 and the isolation structure 101. The trench 104 exposes the sidewall of the first source-drain doped region 103, so as to ensure that the capacitor dielectric layer 105 located on the sidewall of the trench 104 is in contact with the sidewall of the first source-drain doped region 103, and therefore, the first source-drain doped region 103 can be used as a lower electrode plate of the antifuse capacitor, the capacitor conductive layer 106 is used as an upper electrode plate of the antifuse capacitor, and the capacitor dielectric layer 105 is used as a middle dielectric layer of the antifuse capacitor.
In this embodiment, the capacitor dielectric layer 105 is located on the bottom surface of the trench 104 and the sidewall surface of the trench 104 away from the first source-drain doped region 103, in addition to the sidewall surface of the trench 104 close to the first source-drain doped region 103, that is, the capacitor dielectric layer 105 is located on the bottom and the entire sidewall of the trench 104.
During the working period of the semiconductor structure, when the capacitor dielectric layer 105 is broken down, the anti-fuse capacitor is in a conducting state and can store data 1; when the capacitor dielectric layer 105 is not broken down, the anti-fuse capacitor is in a non-conductive state, and data 0 can be stored. It can also be arranged that: data 0 is stored when the antifuse capacitor is in a conductive state, and data 1 is stored when the antifuse capacitor is in a non-conductive state.
When the capacitor dielectric layer 105 is located at the bottom and the entire sidewall surface of the trench 104, in order to ensure that the region where the capacitor dielectric layer 105 is broken down occurs between the capacitor conductive layer 106 and the first source-drain doped region 103 as much as possible, and to improve the breakdown efficiency of the antifuse capacitor, in the embodiment, the cross-sectional shape of the trench 104 is U-shaped in a direction perpendicular to the surface of the substrate 100.
It should be noted that the cross-sectional shape of the trench 104 is U-shaped, which is also beneficial to avoid having a sharp corner region in the capacitor dielectric layer 105, thereby avoiding the problem of tip discharge caused by breakdown in the sharp corner region.
In this embodiment, the capacitor dielectric layer 105 is located at the bottom and on the entire sidewall surface of the trench 104, which is also beneficial to ensure the electrical insulation between the capacitor conductive layer 106 and the well region, and avoid the occurrence of unnecessary electrical connection between the capacitor conductive layer 106 and the well region.
It should be noted that, in other embodiments, when adverse effects caused by the electrical connection between the capacitor conductive layer and the well region are negligible, the capacitor dielectric layer may only cover the surface of the sidewall of the first source/drain doped region exposed by the trench, or the capacitor dielectric layer may cover the bottom of the trench or the sidewall of the rest of the trench except the surface of the sidewall of the first source/drain doped region exposed by the trench.
It should be noted that, in other embodiments, when the influence caused by the point discharge problem is negligible, the cross-sectional shape of the trench in the direction perpendicular to the substrate surface may also be square or trapezoidal; or, when the capacitor dielectric layer only covers the sidewall surface of the first source-drain doped region exposed by the trench, the cross-sectional shape of the trench may also be square or trapezoidal in the direction perpendicular to the substrate surface.
In this embodiment, as shown in fig. 1, in a direction perpendicular to the surface of the substrate 100, the capacitor dielectric layer 105 covers the entire sidewall surface of the first source-drain doped region 103, that is, in the direction perpendicular to the surface of the substrate 100, the length of the sidewall of the first source-drain doped region 103 covered by the capacitor dielectric layer 105 is equal to the length of the sidewall of the first source-drain doped region 103. In other embodiments, as shown in fig. 2, in a direction perpendicular to the surface of the substrate 100, the capacitor dielectric layer 105 may also cover a portion of the sidewall surface of the first source/drain doped region 103, that is, in a direction perpendicular to the surface of the substrate 100, the length of the sidewall of the first source/drain doped region 103 covered by the capacitor dielectric layer 105 is smaller than the length of the sidewall of the first source/drain doped region 103.
The contact area between the capacitor dielectric layer 105 and the first source-drain doped region 103 is related to the capacitance of the antifuse capacitor. On the premise that other factors influencing the capacitance value are not changed, the larger the contact area is, the larger the capacitance value of the antifuse capacitor is, and therefore the size of the contact area between the capacitor dielectric layer 105 and the first source drain doped region 103 can be set reasonably based on different requirements for the capacitance value of the antifuse capacitor. The contact area is related to the junction depth (junction) of the first source/drain doped region 103, and the larger the junction depth is, the larger the contact area between the capacitor dielectric layer 105 and the first source/drain doped region may be. In this embodiment, the junction depth of the first source/drain doped region 103 is 20nm to 30nm, for example, 24nm, 26nm, and 28nm, of the contact area of the source/drain doped region 103.
It is understood that, for the trench 104, as shown in fig. 1, the bottom of the trench 104 may be higher than, or, as shown in fig. 2, the bottom of the trench 104 may be lower than the bottom of the first source/drain doped region 103, or, as shown in fig. 3, the bottom of the trench 104 may be flush with the bottom of the first source/drain doped region 103. Referring to fig. 1 and 4 in combination, the width of the trench 104 in a direction parallel to the surface of the substrate 100 can also be flexibly adjusted. For example, when the thickness of the capacitor dielectric layer 105 needs to be set thicker, the width of the corresponding trench 104 is set wider, which is convenient to improve the formation quality of the capacitor dielectric layer 105 and improve the filling effect of the capacitor conductive layer 106; accordingly, when the thickness of the capacitor dielectric layer 105 is relatively thin, the width of the trench 104 can be set relatively narrow.
The material of the capacitor dielectric layer 105 includes one or more of a high-k dielectric material, silicon oxide, silicon nitride, or silicon oxynitride. The material of capacitor dielectric layer 105 may be the same as the material of gate dielectric layer 112, and the material of capacitor dielectric layer 105 may also be different from the material of gate dielectric layer 112. In this embodiment, the material of the capacitor dielectric layer 105 is the same as the material of the gate dielectric layer 112, and is silicon oxide.
The material of capacitor dielectric layer 105 is the same as the material of gate dielectric layer 112, and the thickness of capacitor dielectric layer 105 is less than or equal to the thickness of gate dielectric layer 112. Thus, it is effectively ensured that gate dielectric layer 112 is not broken down before capacitor dielectric layer 105 is not broken down, so that gate structure 105 can provide effective voltage to the antifuse capacitor, and the antifuse capacitor can be effectively broken down; if the thickness of the capacitor dielectric layer is greater than that of the gate dielectric layer, the gate dielectric layer is already broken down when the capacitor dielectric layer is not broken down, which may affect the breakdown effect of the antifuse capacitor.
It is understood that when gate dielectric layer 112 includes a first gate dielectric layer and a second gate dielectric layer on a top surface of the first gate dielectric layer, and the thickness of capacitor dielectric layer 105 is less than the thickness of gate dielectric layer 112, capacitor dielectric layer 105 and gate dielectric layer 112 may have the following relationship: the material of the capacitor dielectric layer 105 is the same as that of the first gate dielectric layer, and the thickness of the capacitor dielectric layer 105 is the same as that of the first gate dielectric layer; or, the material of the capacitor dielectric layer 105 is the same as that of the second gate dielectric layer, and the thickness of the capacitor dielectric layer 105 is the same as that of the second gate dielectric layer.
When different semiconductor structures are manufactured, the material and thickness relationship between the capacitor dielectric layer 105 and the gate dielectric layer 112 may be different.
It should be noted that the capacitor dielectric layer may have a single-layer structure or a stacked structure, and the number of layers of the capacitor dielectric layer may be the same as the number of layers of the gate dielectric layer.
It should be further noted that, on the premise that other factors affecting the capacitance value are not changed, the larger the thickness of the capacitor dielectric layer 105 is, the smaller the capacitance value of the antifuse capacitor is, and therefore, the thickness of the capacitor dielectric layer 105 can be set reasonably based on different requirements for the capacitance value of the antifuse capacitor. It should be noted that, the thickness of the capacitor dielectric layer 105 refers to the thickness of the capacitor dielectric layer 105 between the first source-drain doped region 103 and the capacitor conductive layer 106 along the direction parallel to the surface of the substrate 100.
The thickness of the capacitor dielectric layer 105 is not suitable to be too small, if the thickness of the capacitor dielectric layer 105 is too small, the voltage required for breakdown of the capacitor dielectric layer 105 is correspondingly small, and the anti-fuse capacitor is prone to premature breakdown; the thickness of the capacitor dielectric layer 105 should not be too large, and if the thickness of the capacitor dielectric layer 105 is too large, the difficulty of breaking down the capacitor dielectric layer 105 is large. Therefore, in the present embodiment, the thickness of the capacitor dielectric layer 105 is 2nm to 5nm, for example, 2.5nm, 3nm, and 4 nm.
The material of the capacitor conductive layer 106 includes polysilicon, copper, aluminum, or tungsten. In this embodiment, the material of the capacitive conductive layer 106 is the same as the material of the gate conductive layer 122. In other embodiments, the material of the capacitor conductive layer and the gate conductive layer may be different.
To facilitate electrical connection, substrate 100 exposes a surface of capacitive conductive layer 106. In this embodiment, the capacitor conductive layer 106 is located on the surface of the capacitor dielectric layer 105 and fills the trench 104, and the top of the capacitor conductive layer 106 is flush with the top of the capacitor dielectric layer 105. Thus, it is beneficial to avoid unnecessary electrical connection between the capacitor conductive layer 106 and other regions of the substrate 100; in addition, the capacitor conductive layer 106 fills the trench 104, and thus the capacitor conductive layer 105 has a relatively large volume, which is beneficial to reducing the resistance of the capacitor conductive layer 106, reducing the signal loss caused by the capacitor conductive layer 106, and further beneficial to improving the breakdown effect of the antifuse capacitor. It should be noted that, in other embodiments, the capacitor conductive layer may also fill a part of the volume of the trench, and it is ensured that the surface of the capacitor dielectric layer in the region corresponding to the sidewall of the first source-drain doped region is covered by the capacitor conductive layer; alternatively, the top surface of the capacitor conductive layer may be higher than the substrate surface.
Referring to fig. 1, in the semiconductor structure with a brand new structure provided in this embodiment, the antifuse capacitor is disposed in the substrate 100, the gate structure 102 is electrically connected to the word line WL, the second source/drain doped region 113 is electrically connected to the bit line BL, and the capacitor conductive layer 106 is electrically connected to the external power source VCP. A first voltage is applied to the gate structure 102 through the word line WL, a second voltage is applied to the second source-drain doped region 113 through the bit line BL, and a third voltage is applied to the capacitor conductive layer 106 through the external power source VCP. When the first voltage, the second voltage and the third voltage meet the condition of breaking down the capacitor dielectric layer 105, the capacitor dielectric layer 105 is broken down, and the anti-fuse capacitor is conducted; when the first voltage, the second voltage, and the third voltage do not satisfy the condition for breakdown of the capacitor dielectric layer 105, the capacitor dielectric layer 105 is not broken down, and the corresponding anti-fuse capacitor is not conducted.
Moreover, the anti-fuse capacitor is located in the substrate 100, and the source or the drain of the control transistor is also used as a lower electrode plate of the anti-fuse capacitor, which is beneficial to reducing the space occupied by the anti-fuse capacitor.
In addition, the gate structure 102 is also disposed in the substrate 100, so as to further reduce the dimension of the semiconductor structure in the direction perpendicular to the surface of the substrate 100; meanwhile, compared with the direction of the gate structure on the surface of the substrate, when the size of the gate structure 102 in the horizontal direction is the same, the gate structure 102 is arranged in the substrate 100, so that the length of the channel region can be increased, the control capability of the gate structure 102 on the channel region is improved, and the electrical performance of the semiconductor structure is improved.
The embodiment of the invention also provides a memory, which comprises the semiconductor structure.
Correspondingly, an embodiment of the present invention further provides a manufacturing method for manufacturing the semiconductor structure, including: providing a substrate; forming a gate structure in a substrate, wherein the top of the gate structure is exposed out of the substrate, a first source-drain doped region is formed in the substrate on one side of the gate structure, the doping type of the first source-drain doped region is N-type doping or P-type doping, a second source-drain doped region is formed in the substrate on the other side of the gate structure, the second source-drain doped region and the first source-drain doped region are respectively positioned on two opposite sides of the gate structure, and the doping type of the second source-drain doped region is the same as that of the first source-drain doped region; forming a groove in the substrate with partial thickness, wherein the top of the groove is exposed out of the substrate; forming a capacitance dielectric layer on the side wall of the groove; forming a capacitor conducting layer for filling the groove on the capacitor dielectric layer; and the capacitance dielectric layer covers the side wall of the first source-drain doped region.
It should be noted that the semiconductor structure provided in the previous embodiment is not limited to be manufactured by the respective manufacturing methods provided below, and the semiconductor structure described above may be manufactured by other manufacturing methods. The method for manufacturing a semiconductor structure according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 5 to 8 are schematic cross-sectional structures of the semiconductor structure according to the steps of the method for manufacturing the semiconductor structure according to an embodiment of the invention. In the embodiment, before the first source-drain doped region and the second source-drain doped region are formed, a groove and a groove for forming a gate structure are formed; in the process step of forming the gate dielectric layer in the gate structure, the capacitor dielectric layer is formed at the same time.
Referring to fig. 5, a substrate 100 is provided; forming a trench 104 in the partial thickness substrate 100, and exposing the top of the trench 104 in the substrate 100; a recess 114 is formed in the substrate 100 and the substrate 100 exposes the top of the recess 104.
The recess 114 provides a process foundation for the subsequent formation of a gate structure. In the present embodiment, the cross-sectional shape of the groove 114 is U-shaped in a direction perpendicular to the surface of the substrate 100.
In this embodiment, the depth of the recess 114 in the substrate 100 is deeper than the depth of the trench 104 in the substrate 100, that is, the bottom of the recess 114 is lower than the bottom of the trench 104. To save process steps, the process steps for forming the recess 114 and the trench 104 may include: etching part of the substrate 100 to form a pre-groove, wherein the pre-groove is used for providing a basis for forming the groove 114 subsequently; then, the substrate 100 under the pre-groove and the substrate 100 where the trench 104 is to be formed are etched simultaneously until the groove 114 and the trench 104 are formed.
It should be noted that, in other embodiments, the trench and the groove may be formed sequentially in different process steps.
It should also be noted that in other embodiments, the bottom of the groove may be higher than or flush with the bottom of the trench.
In other embodiments, the cross-sectional shape of the trench may be square in a direction perpendicular to the substrate surface, and the cross-sectional shape of the groove may be square.
Referring to fig. 6, a gate dielectric layer 112 is formed on the bottom and sidewalls of the recess 114; a capacitor dielectric layer 105 is formed on the sidewalls of the trench 104.
The gate dielectric layer 112 and a subsequently formed control gate conductive layer together form a gate structure. In this embodiment, in order to save the process steps, the capacitor dielectric layer 105 is formed simultaneously during the process step of forming the gate dielectric layer 112.
In this embodiment, the gate dielectric layer 112 is a single-layer structure. In the process step of forming the gate dielectric layer 112, the capacitor dielectric layer 105 is formed at the same time. Accordingly, the material of gate dielectric layer 112 is the same as the material of capacitor dielectric layer 105, and the thickness of gate dielectric layer 112 is the same as the thickness of capacitor dielectric layer 105.
In this embodiment, the capacitor dielectric layer 105 covers the bottom and the entire sidewall of the trench 104. In other embodiments, the capacitor dielectric layer may cover only the sidewall of the trench near the gate dielectric layer.
The process steps for forming the gate dielectric layer 112 and the capacitor dielectric layer 105 include: forming a gate dielectric film on the bottom and the side wall of the trench 104 and the surface of the substrate 100; the gate dielectric film is patterned to form a gate dielectric layer 112 and a capacitor dielectric layer 105. The process for forming the gate dielectric film can be chemical vapor deposition, physical vapor deposition or thermal oxidation process.
It should be noted that, in other embodiments, the gate dielectric layer may also be a stacked structure, and accordingly, the process step of forming the gate dielectric layer includes: forming a first gate dielectric layer; forming a second gate dielectric layer on the top surface of the first gate dielectric layer; correspondingly, in the process step of forming the first gate dielectric layer or the second gate dielectric layer, the capacitor dielectric layer is formed at the same time. Or, the capacitor dielectric layers may also be of a stacked structure, and in the process step of forming the first gate dielectric layer and the second gate dielectric layer, the capacitor dielectric layers are formed at the same time, and the number of layers of the corresponding capacitor dielectric layers is the same as the number of layers of the gate dielectric layers.
Before or after forming the gate dielectric layer 112, further comprising: isolation structures 101 are formed within substrate 100 with gate dielectric layer 112 and trenches 104 located between adjacent isolation structures 101.
Referring to fig. 7, a first source drain doped region 103 and a second source drain doped region 113 are formed.
Specifically, a first source-drain doped region 103 is formed in the substrate 100 on one side of the gate structure, and the doping type of the first source-drain doped region 103 is N-type doping or P-type doping; and forming a second source-drain doped region 113 in the substrate 100 on the other side of the gate structure, wherein the second source-drain doped region 113 and the first source-drain doped region 103 are respectively located on two opposite sides of the gate structure, and the doping type of the second source-drain doped region 113 is the same as that of the first source-drain doped region 103. It should be noted that the gate conductive layer in the gate structure is not formed yet, but the gate dielectric layer 112 plays a role in positioning the gate structure.
More specifically, the method for forming the first source-drain doped region 103 and the second source-drain doped region 113 may further include: forming a patterned photoresist layer on the surface of the substrate 100, wherein the patterned photoresist layer exposes the surface of the substrate 100 on which the first source-drain doped region 103 and the second source-drain doped region 113 are to be formed; doping the substrate 100 by using the patterned photoresist layer as a mask to form a first source-drain doped region 103 and a second source-drain doped region 113; and removing the patterned photoresist layer.
In this embodiment, in a direction perpendicular to the surface of the substrate 100, the length of the sidewall of the trench 104 exposing the first source-drain doped region 103 is equal to the length of the sidewall of the first source-drain doped region 103. In other embodiments, the length of the sidewall of the first source/drain doped region exposed by the trench in the direction perpendicular to the substrate surface may also be smaller than the length of the sidewall of the first source/drain doped region.
In this embodiment, the gate dielectric layer 112 and the capacitor dielectric layer 105 are formed before the first source-drain doped region 103 and the second source-drain doped region 113 are formed, so that process damage to the trench 104 or the groove 114 due to a process for forming the first source-drain doped region 103 and the second source-drain doped region 113 is avoided, the gate dielectric layer 112 and the capacitor dielectric layer 105 have a good process interface foundation, and the formed gate dielectric layer 112 and the formed capacitor conductive layer 105 have good performance. In other embodiments, the gate dielectric layer and the capacitor dielectric layer may also be formed after the first source-drain doped region and the second source-drain doped region are formed.
Referring to fig. 8, a gate conductive layer 122 filling the groove 114 (refer to fig. 7) is formed on the top surface of the gate dielectric layer 112, and the gate conductive layer 122 and the gate dielectric layer 112 together form a gate structure 102; and forming a capacitor conductive layer 106 on the surface of the capacitor dielectric layer 105 to fill the trench 104.
In the process step of forming the gate conductive layer 122, the capacitor conductive layer 106 is simultaneously formed.
In this embodiment, the gate conductive layer 122 fills the groove 114, and the top of the gate conductive layer 122 is flush with the surface of the substrate 100; the capacitor conductive layer 106 fills the trench 104, and the top of the capacitor conductive layer 106 is flush with the surface of the substrate 100.
The process steps for forming the gate conductive layer 122 and the capacitor conductive layer 106 include: forming a conductive film on the surface of the substrate 100, wherein the conductive film fills the trench 104 and the groove 114; the conductive film on the surface of the substrate 100 is removed, the conductive film in the trench 104 is remained as the capacitor conductive layer 106, and the conductive film in the groove 114 is remained as the gate conductive layer 122.
In other embodiments, the top surface of the capacitor conductive layer may be higher than the substrate surface, or the capacitor conductive layer may only fill part of the trench; the top surface of the gate conductive layer may be higher than the substrate surface, or the gate conductive layer may fill only a portion of the trench.
In this embodiment, before the gate conductive layer 122 is formed, the first source-drain doped region 103 and the second source-drain doped region 113 are formed, which is beneficial to avoiding process damage to the gate conductive layer 122 and the capacitor conductive layer 106 caused by the process of forming the first source-drain doped region 103 and the second source-drain doped region 113. In other embodiments, the gate conductive layer and the capacitor conductive layer may be formed first, and then the first source-drain doped region and the second source-drain doped region may be formed.
The method for manufacturing the semiconductor structure provided by the embodiment can manufacture a semiconductor structure with a brand-new structure, and the anti-fuse capacitor and the gate structure 102 are both positioned in the substrate 100, so that the size of the semiconductor structure can be effectively reduced, the length of a channel region of a control transistor can be increased, and the electrical performance of the formed semiconductor structure can be improved; moreover, the manufacturing process of the anti-fuse capacitor is compatible with the manufacturing process of the transistor, namely, the anti-fuse capacitor can be simultaneously manufactured by utilizing the CMOS manufacturing process, so that the manufacturing process of the semiconductor structure with the anti-fuse capacitor is simplified, and the manufacturing cost is reduced.
Fig. 9 to 12 are schematic cross-sectional views corresponding to steps of a method for manufacturing a semiconductor structure according to another embodiment of the invention. Different from the previous embodiment, in the manufacturing method provided in this embodiment, after the first source-drain doped region and the second source-drain doped region are formed, the trench is formed. The following detailed description will be made with reference to the accompanying drawings, and it should be noted that the same or corresponding parts as those of the foregoing embodiments will not be described in detail below.
Referring to fig. 9, a substrate 200 is provided; forming a pseudo gate structure 210 on the surface of the substrate 200; the second source-drain doped region 213 forms a first source-drain doped region 203 and a second source-drain doped region 213 in the substrate 200 at two opposite sides of the dummy gate structure 210.
After the first source-drain doped region 203 and the second source-drain doped region 213 are formed, the dummy gate structure 210 is removed.
Further comprising: isolation structures 201 are formed in the substrate 200, and the first gate dielectric layer 213, the first source-drain doped region 203 and the second source-drain doped region 213 are located between adjacent isolation structures 201.
Referring to fig. 10, a trench 204 is formed in a substrate 200 with a partial thickness, the substrate 200 exposes the top of the trench 204, and the trench 204 exposes the sidewall of the first source-drain doped region 203; a recess 214 is formed in the substrate 200 and the substrate 200 exposes the top of the recess 214.
The sequence of the formation processes for the trench 204 and the recess 214 may be performed simultaneously or sequentially.
In this embodiment, after the first source-drain doped region 203 and the second source-drain doped region 213 are formed, the trench 204 and the groove 214 are formed, which is beneficial to avoiding process damage to the surface of the trench 204 and the surface of the groove 214 caused by processes for forming the first source-drain doped region 203 and the second source-drain doped region 213, so as to ensure that a subsequently formed capacitor dielectric layer and a gate dielectric layer have a good process interface foundation, and further improve the quality of the formed capacitor dielectric layer and the gate dielectric layer.
Referring to fig. 11, a gate dielectric layer 212 is formed on the bottom and sidewalls of the recess 214; a capacitor dielectric layer 205 is formed on the sidewall of the trench 204, and the capacitor dielectric layer 205 covers the sidewall of the first source-drain doped region 203.
In this embodiment, the capacitor dielectric layer 205 is formed simultaneously during the process step of forming the gate dielectric layer 212.
Since the trench 204 is formed after the first source-drain doped region 203 and the second source-drain doped region 213 are formed, the surface of the trench 204 is prevented from being damaged, so that the surface performance of the trench 204 is good, the interface performance between the formed capacitor dielectric layer 205 and the trench 204 is good, and adverse effects caused by surface defects of the trench 204 are avoided. Similarly, the formed gate dielectric layer 212 and the groove 214 also have excellent interface performance, so that adverse effects caused by surface defects of the groove 214 are avoided.
Referring to fig. 12, a gate conductive layer 222 filling the recess 214 (refer to fig. 11) is formed on the surface of the gate dielectric layer 212; a capacitor conductive layer 206 filling the trench 204 is formed on the capacitor dielectric layer 205.
The gate dielectric layer 212 and the gate conductive layer 222 together form the gate structure 202.
Specifically, in order to save process steps, the capacitor conductive layer 206 is simultaneously formed in the process step of forming the gate conductive layer 222.
In the method for manufacturing the semiconductor structure provided by this embodiment, the first source-drain doped region 203 and the second source-drain doped region 213 are formed first, and then the trench 204 and the groove 214 are formed, which is beneficial to ensuring that the surface of the trench 204 and the surface of the groove 214 have few defects, and correspondingly improving the quality of the formed capacitor dielectric layer 205 and the gate dielectric layer 212, so that the interface performance between the capacitor dielectric layer 205 and the trench 204 is improved, and the interface performance between the gate dielectric layer 212 and the groove 214 is improved, thereby improving the electrical performance of the semiconductor structure.
It should be noted that the sequence of the steps in the above manufacturing method is not fixed, the sequence of the steps may be adjusted according to actual situations, and each step may also include at least two sub-steps.
It should be noted that the semiconductor structure provided by the embodiment of the present invention is not limited to be manufactured by the above-mentioned manufacturing method, and the semiconductor structure provided by the embodiment of the present invention may be manufactured by other suitable manufacturing methods.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (17)
1. A semiconductor structure, comprising:
the device comprises a substrate and a gate structure positioned in the substrate, wherein the substrate exposes the top of the gate structure;
the first source-drain doped region is positioned in the substrate on one side of the grid structure, and the doping type of the first source-drain doped region is N-type doping or P-type doping;
The second source-drain doped region and the first source-drain doped region are respectively positioned at two opposite sides of the grid structure, and the doping type of the second source-drain doped region is the same as that of the first source-drain doped region;
the anti-fuse capacitor is positioned in the substrate, the first source-drain doped region is used as an electrode plate of the anti-fuse capacitor, and the anti-fuse capacitor further comprises: the capacitor comprises a capacitor dielectric layer positioned on the surface of the side wall of the first source-drain doped region and a capacitor conducting layer positioned on the surface of the capacitor dielectric layer.
2. The semiconductor structure of claim 1, wherein a trench is formed in the substrate and exposes the first source drain doped region sidewall; the capacitor dielectric layer covers the side wall of the first source drain doped region exposed out of the groove; the capacitor conducting layer fills the groove; and in the direction vertical to the surface of the substrate, the cross section of the groove is square or U-shaped.
3. The semiconductor structure of claim 2, wherein said capacitor dielectric layer is located at the bottom of said trench and over the entire sidewall surface; the cross section of the groove is U-shaped in the direction vertical to the surface of the substrate.
4. The semiconductor structure of claim 2, wherein the capacitor conductive layer fills the trench.
5. The semiconductor structure of claim 1, wherein the length of the sidewall of the first source-drain doped region covered by the capacitor dielectric layer is less than or equal to the length of the sidewall of the first source-drain doped region in a direction perpendicular to the surface of the substrate.
6. The semiconductor structure of claim 1, wherein the gate structure comprises a gate dielectric layer and a gate conductive layer on a top surface of the gate dielectric layer; the material of the capacitor dielectric layer is the same as that of the gate dielectric layer; or the material of the capacitor dielectric layer is different from that of the gate dielectric layer.
7. The semiconductor structure of claim 6, wherein the gate dielectric layer comprises a first gate dielectric layer and a second gate dielectric layer on a top surface of the first gate dielectric layer; the material of the capacitor dielectric layer is the same as that of the first gate dielectric layer, and the thickness of the capacitor dielectric layer is the same as that of the first gate dielectric layer; or the material of the capacitor dielectric layer is the same as that of the second gate dielectric layer, and the thickness of the capacitor dielectric layer is the same as that of the second gate dielectric layer.
8. The semiconductor structure of claim 6, wherein the material of the capacitor dielectric layer is the same as the material of the gate dielectric layer, and the thickness of the capacitor dielectric layer is less than or equal to the thickness of the gate dielectric layer.
9. The semiconductor structure according to claim 6, wherein a material of the capacitor conductive layer is the same as a material of the gate conductive layer; alternatively, the material of the capacitor conductive layer is different from the material of the gate electrode layer.
10. The semiconductor structure of claim 1, wherein a cross-sectional shape of the gate structure in a direction perpendicular to the substrate surface is U-shaped.
11. The semiconductor structure according to claim 1 or 10, wherein the bottom of the sidewall of the gate structure adjacent to the first source-drain doped region is lower than the bottom of the first source-drain doped region in a direction perpendicular to the surface of the substrate; the bottom of the side wall of the grid structure, which is adjacent to the second source-drain doped region, is lower than the bottom of the second source-drain doped region.
12. A memory comprising the semiconductor structure of any one of claims 1-11.
13. A method of fabricating a semiconductor structure, comprising:
Providing a substrate;
forming a gate structure in the substrate, wherein the substrate is exposed out of the top of the gate structure, a first source-drain doped region is formed in the substrate on one side of the gate structure, the doping type of the first source-drain doped region is N-type doping or P-type doping, a second source-drain doped region is formed in the substrate on the other side of the gate structure, the second source-drain doped region and the first source-drain doped region are respectively located on two opposite sides of the gate structure, and the doping type of the second source-drain doped region is the same as that of the first source-drain doped region;
forming a groove in the substrate with partial thickness, wherein the substrate exposes the top of the groove;
forming a capacitance dielectric layer on the side wall of the groove;
forming a capacitor conducting layer filling the groove on the surface of the capacitor dielectric layer;
and the capacitance dielectric layer covers the side wall of the first source-drain doped region.
14. The method of fabricating a semiconductor structure of claim 13, wherein the process step of forming the gate structure comprises: forming a groove in a substrate, wherein the top of the groove is exposed out of the substrate;
forming a gate dielectric layer at the bottom and the side wall of the groove; and forming a gate conducting layer for filling the groove on the surface of the gate dielectric layer.
15. The method for manufacturing a semiconductor structure according to claim 14, wherein the trench and the groove are formed before the first source-drain doped region and the second source-drain doped region are formed; and in the process step of forming the gate dielectric layer, simultaneously forming the capacitor dielectric layer.
16. The method of manufacturing a semiconductor structure of claim 15, wherein the gate dielectric layer and the capacitor dielectric layer are formed before the first source drain doped region and the second source drain doped region are formed.
17. The method for manufacturing a semiconductor structure according to claim 14, wherein the trench and the recess are formed after the first source-drain doped region and the second source-drain doped region are formed.
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