CN111987055B - Semiconductor refrigeration graphene chip - Google Patents
Semiconductor refrigeration graphene chip Download PDFInfo
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- CN111987055B CN111987055B CN202010686659.2A CN202010686659A CN111987055B CN 111987055 B CN111987055 B CN 111987055B CN 202010686659 A CN202010686659 A CN 202010686659A CN 111987055 B CN111987055 B CN 111987055B
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- body layer
- graphene
- semiconductor refrigeration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a semiconductor refrigeration graphene chip which comprises a heat conduction metal layer, wherein heat dissipation holes are uniformly formed in the middle position of the top of the heat conduction metal layer, a chip main body layer is arranged at the bottom of the heat conduction metal layer, a base is arranged at the bottom of the chip main body layer, connecting pins are uniformly arranged at the bottom of the base, a circuit board is arranged in the middle position of the inner part of the chip main body layer, an installation groove is formed in the middle position of one side of the back of the chip main body layer, an electromagnet A is arranged at one end of the inner side of the installation groove, and an electromagnet B is arranged at one end, far away from the installation groove, of the electromagnet A; the device realizes the separation of the chips through electromagnetic control connection by combining the two chip sets during low data operation processing, so that a single chip is operated, and the other chip is in a finishing standby state, thereby prolonging the service life of the chips and reducing the heat generation.
Description
Technical Field
The invention relates to the technical field of graphene chips, in particular to a semiconductor refrigeration graphene chip.
Background
Graphene has excellent optical, electrical and mechanical properties, has important application prospects in the aspects of materials science, micro-nano processing, energy, biomedicine, drug delivery and the like, is considered to be a future revolutionary material, and has the carrier mobility of about 15000cm 2/(V.s) at room temperature, which is 10 times higher than that of a silicon material and is more than twice as high as that of indium antimonide (InSb) which is a known substance with the highest carrier mobility. Under certain specific conditions, such as low temperature, the carrier mobility of graphene can even be as high as 250000cm 2/(V · s). Unlike many materials, the electron mobility of graphene is less affected by temperature change, and the electron mobility of single-layer graphene is about 15000cm 2/(V · s) at any temperature between 50 and 500K.
Graphene has been widely used in the field of integrated circuits, and particularly provides beneficial properties in the use of semiconductor chips, but the existing graphene chips still have significant problems: 1. the existing chip structure is basically an integrated structure, a large amount of heat is generated in the using process, and particularly the heat at the center of the chip structure is not easy to dissipate; 2. the requirements of the existing chip on the chip are different due to different operation requirements in the using process, and redundant modules cannot stop running in the low data processing process; 3. the existing heat dissipation metal sheet is only in a heat conduction mode, and the heat dissipation efficiency is not high.
Disclosure of Invention
The invention aims to provide a semiconductor refrigeration graphene chip, which is used for solving the problem that the existing graphene chip in the background technology still has obvious problems: the existing chip structure is basically an integrated structure, a large amount of heat is generated in the using process, and particularly the heat at the center of the chip structure is not easy to dissipate; the requirements of the existing chip on the chip are different due to different operation requirements in the using process, and redundant modules cannot stop running in the low data processing process; the existing heat dissipation metal sheet is only in a heat conduction mode, and the heat dissipation efficiency is not high.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor refrigeration graphene chip comprises a heat conduction metal layer, wherein heat dissipation holes are uniformly formed in the middle of the top of the heat conduction metal layer, a chip main body layer is arranged at the bottom of the heat-conducting metal layer, a base is arranged at the bottom of the chip main body layer, the bottom of the base is uniformly provided with connecting pins, the middle position inside the chip main body layer is provided with a circuit board, an installation groove is arranged in the middle of one side of the back surface of the chip main body layer, an electromagnet A is arranged at one end of the inner side of the installation groove, an electromagnet B is arranged at one end of the electromagnet A far away from the mounting groove, a metal terminal B is arranged inside the electromagnet B, the middle position department that mounting groove one side was kept away from to chip main part layer back one end is provided with the stopper, the inside middle position department of stopper is provided with metal terminal A.
Preferably, insulating materials are coated among the heat-conducting metal layer, the chip main body layer and the base.
Preferably, the surface of the circuit board is coated with a graphene coating.
Preferably, the metal terminal a is a concave structure, and the metal terminal B is a convex structure.
Preferably, the heat-conducting metal layer is made of copper.
Preferably, the circuit board is made of a copper-clad plate.
Compared with the prior art, the invention has the beneficial effects that: the semiconductor refrigeration graphene chip can realize separated operation, so that the chip can be maintained for standby, and the service life of the chip is better prolonged;
1. through the separated combination design, the middle position of the chip cannot influence the operation efficiency of the chip due to the heat dissipation problem;
2. through the combination of the two chip sets, when low data operation is processed, the chip separation can be realized through electromagnetic control connection, so that a single chip is operated, and the other chip is in a trimming standby state, thereby prolonging the service life of the chip and reducing the heat generation;
3. the radiating holes are formed in the surfaces of the metal radiating plates, so that heat generated by the chip set can be rapidly radiated, and the stability of the chip is guaranteed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top cross-sectional view of the present invention;
fig. 3 is an enlarged view of the structure at a in fig. 2 according to the present invention.
In the figure: 1. a heat-conducting metal layer; 2. a chip body layer; 3. a base; 4. connecting pins; 5. heat dissipation holes; 6. a circuit board; 7. an electromagnet A; 8. mounting grooves; 9. an electromagnet B; 10. a metal terminal A; 11. a metal terminal B; 12. and a limiting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a semiconductor refrigeration graphite alkene chip, including heat conduction metal layer 1, the intermediate position department at 1 top of heat conduction metal layer evenly is provided with louvre 5, the bottom of heat conduction metal layer 1 is provided with chip main part layer 2, the bottom of chip main part layer 2 is provided with base 3, the bottom of base 3 evenly is provided with connecting stitch 4, the inside intermediate position department of chip main part layer 2 is provided with circuit board 6, the intermediate position department of 2 back one end sides of chip main part layer is provided with mounting groove 8, the inboard one end of mounting groove 8 is provided with electro-magnet A7, the one end that mounting groove 8 was kept away from to electro-magnet A7 is provided with electro-magnet B9, electro-magnet B9's inside is provided with metal terminal B11, the intermediate position department that mounting groove 8 one side was kept away from to 2 back one end of chip main part layer is provided with stopper 12, stopper 12 inside intermediate position department is provided with metal terminal A10.
Furthermore, insulating materials are coated among the heat conduction metal layer 1, the chip main body layer 2 and the base 3, so that the chip structure is higher in safety.
Furthermore, the surface of the circuit board 6 is coated with a graphene coating, so that the service performance of the chip is enhanced.
Further, the metal terminal a10 is a concave structure, and the metal terminal B11 is a convex structure, so that the structure of the chip is more stable when the chip is combined.
Furthermore, the heat-conducting metal layer 1 is made of copper, so that the heat dissipation performance of the chip is higher.
Furthermore, the circuit board 6 is made of a copper-clad plate, so that the main structure of the chip is more stable.
The working principle is as follows: when the device switch on, with electro-magnet A7 and electro-magnet B9 circular telegram in the mounting groove 8, this moment because of the repulsion of electro-magnet, make electro-magnet B9 remove, thereby drive metal terminal B11 and metal terminal A10 and agree with the installation, form the connecting circuit, when the chip is in low data operation, with electro-magnet A7 and electro-magnet B9 outage, thereby make metal terminal B11 and metal terminal A10 disconnection, make the chip separation, realize the maintenance standby of independent operation of data and chipset, thereby the life of chip has been prolonged, the chip is in the use, produce a large amount of heats, dispel the heat through heat conduction metal level 1, and the inside of heat conduction metal level 1 is provided with louvre 5 and has increased radiating efficiency, the graphite alkene coating has been scribbled on the surface of circuit board 6, the operating efficiency of chip has been strengthened.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
Claims (6)
1. The utility model provides a semiconductor refrigeration graphite alkene chip, includes heat conduction metal level (1), its characterized in that: the heat dissipation holes (5) are uniformly formed in the middle of the top of the heat conduction metal layer (1), the chip main body layer (2) is arranged at the bottom of the heat conduction metal layer (1), the base (3) is arranged at the bottom of the chip main body layer (2), the connecting pins (4) are uniformly arranged at the bottom of the base (3), the circuit board (6) is arranged at the middle of the inner portion of the chip main body layer (2), the back of the chip main body layer (2) is of an L-shaped structure, the mounting groove (8) is formed in the middle of one side of one end of the back of the chip main body layer (2), the electromagnet A (7) is arranged at one end of the inner side of the mounting groove (8), the electromagnet B (9) is arranged at one end, far away from the mounting groove (8), of the electromagnet A (7), the metal terminal B (11) is arranged in the electromagnet B (9), the chip is characterized in that a limiting block (12) is arranged at the middle position of one side, away from the mounting groove (8), of one end of the back of the chip main body layer (2), and a metal terminal A (10) is arranged at the middle position inside the limiting block (12).
2. The semiconductor refrigeration graphene chip according to claim 1, wherein: insulating materials are coated among the heat-conducting metal layer (1), the chip main body layer (2) and the base (3).
3. The semiconductor refrigeration graphene chip according to claim 1, wherein: and graphene coatings are coated on the surfaces of the circuit boards (6).
4. The semiconductor refrigeration graphene chip according to claim 1, wherein: the metal terminal A (10) is of a concave structure, and the metal terminal B (11) is of a convex structure.
5. The semiconductor refrigeration graphene chip according to claim 1, wherein: the heat-conducting metal layer (1) is made of copper.
6. The semiconductor refrigeration graphene chip of claim 1, wherein: the circuit board (6) is made of a copper-clad plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010686659.2A CN111987055B (en) | 2020-07-16 | 2020-07-16 | Semiconductor refrigeration graphene chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010686659.2A CN111987055B (en) | 2020-07-16 | 2020-07-16 | Semiconductor refrigeration graphene chip |
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| Publication Number | Publication Date |
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| CN111987055A CN111987055A (en) | 2020-11-24 |
| CN111987055B true CN111987055B (en) | 2022-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010686659.2A Active CN111987055B (en) | 2020-07-16 | 2020-07-16 | Semiconductor refrigeration graphene chip |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113691268B (en) * | 2021-08-16 | 2023-03-10 | 合肥水泥研究设计院有限公司 | Data transmission and receiving device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003001572A2 (en) * | 2001-06-26 | 2003-01-03 | Datacon Semiconductor Equipment Gmbh | Positioning device |
| CN206877317U (en) * | 2017-06-02 | 2018-01-12 | 深圳市展恒电子有限公司 | A kind of low-power consumption has 485 communication chips of polarity identification function |
| CN108882508A (en) * | 2018-08-22 | 2018-11-23 | 汪洁 | A kind of circuit board mounting plate with heat sinking function |
| CN210897330U (en) * | 2019-08-22 | 2020-06-30 | 广州欧森精密制造有限公司 | Packaging device capable of arbitrarily controlling luminous intensity |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207720511U (en) * | 2017-12-22 | 2018-08-10 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| CN110729260B (en) * | 2019-10-18 | 2021-01-15 | 长兴璟柏电子科技有限公司 | Metal packaging shell with heat dissipation function |
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2020
- 2020-07-16 CN CN202010686659.2A patent/CN111987055B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003001572A2 (en) * | 2001-06-26 | 2003-01-03 | Datacon Semiconductor Equipment Gmbh | Positioning device |
| CN206877317U (en) * | 2017-06-02 | 2018-01-12 | 深圳市展恒电子有限公司 | A kind of low-power consumption has 485 communication chips of polarity identification function |
| CN108882508A (en) * | 2018-08-22 | 2018-11-23 | 汪洁 | A kind of circuit board mounting plate with heat sinking function |
| CN210897330U (en) * | 2019-08-22 | 2020-06-30 | 广州欧森精密制造有限公司 | Packaging device capable of arbitrarily controlling luminous intensity |
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| CN111987055A (en) | 2020-11-24 |
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