CN111971411A - 蒸镀装置及有机电子器件的生产方法 - Google Patents

蒸镀装置及有机电子器件的生产方法 Download PDF

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Publication number
CN111971411A
CN111971411A CN201980023277.7A CN201980023277A CN111971411A CN 111971411 A CN111971411 A CN 111971411A CN 201980023277 A CN201980023277 A CN 201980023277A CN 111971411 A CN111971411 A CN 111971411A
Authority
CN
China
Prior art keywords
coil
vapor deposition
deposition apparatus
transistor
inverter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980023277.7A
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English (en)
Chinese (zh)
Inventor
小林慎一郎
藤本弘
宫崎浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Institute of Science and Technology KIST
Original Assignee
Korea Institute of Science and Technology KIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Institute of Science and Technology KIST filed Critical Korea Institute of Science and Technology KIST
Priority claimed from PCT/JP2019/007301 external-priority patent/WO2019187902A1/ja
Publication of CN111971411A publication Critical patent/CN111971411A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/04—Sources of current
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Inverter Devices (AREA)
  • General Induction Heating (AREA)
CN201980023277.7A 2018-03-28 2019-02-26 蒸镀装置及有机电子器件的生产方法 Pending CN111971411A (zh)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2018063368 2018-03-28
JP2018-063368 2018-03-28
JP2018225361A JP6709271B2 (ja) 2018-03-28 2018-11-30 蒸着装置及び有機電子デバイスの生産方法
JP2018225364A JP6709273B2 (ja) 2018-03-28 2018-11-30 蒸着装置
JP2018225362A JP6709272B2 (ja) 2018-03-28 2018-11-30 蒸着装置及び有機電子デバイスの生産方法
JP2018-225364 2018-11-30
JP2018-225363 2018-11-30
JP2018225363A JP6734909B2 (ja) 2018-03-28 2018-11-30 蒸着装置及び有機電子デバイスの生産方法
JP2018-225361 2018-11-30
JP2018-225362 2018-11-30
PCT/JP2019/007301 WO2019187902A1 (ja) 2018-03-28 2019-02-26 蒸着装置及び有機電子デバイスの生産方法

Publications (1)

Publication Number Publication Date
CN111971411A true CN111971411A (zh) 2020-11-20

Family

ID=68166510

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980023277.7A Pending CN111971411A (zh) 2018-03-28 2019-02-26 蒸镀装置及有机电子器件的生产方法

Country Status (3)

Country Link
US (1) US20210013457A1 (https=)
JP (4) JP6709273B2 (https=)
CN (1) CN111971411A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114945702A (zh) * 2019-12-02 2022-08-26 公益财团法人福冈县产业·科学技术振兴财团 蒸镀装置、升华纯化装置、有机电子器件的生产方法及升华纯化方法
JP2024022701A (ja) * 2020-12-24 2024-02-21 公益財団法人福岡県産業・科学技術振興財団 誘導加熱装置、真空蒸着装置、局所加熱装置、局所計測装置、誘導加熱方法及び局所計測方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320751A (ja) * 1996-05-27 1997-12-12 Fuji Electric Co Ltd 底穴出湯式浮揚溶解装置
JP2002343542A (ja) * 2001-05-21 2002-11-29 Fuji Xerox Co Ltd 電磁誘導加熱用制御装置、電磁誘導加熱装置および画像形成装置
CN1446268A (zh) * 2000-08-10 2003-10-01 新日铁化学株式会社 有机el元件的制造方法及装置
JP2004059992A (ja) * 2002-07-29 2004-02-26 Sony Corp 有機薄膜形成装置
CN1950536A (zh) * 2004-05-17 2007-04-18 株式会社爱发科 有机材料用蒸发源及有机蒸镀装置
WO2007057925A1 (en) * 2005-11-15 2007-05-24 Galileo Vacuum Systems S.P.A. Device and method for controlling the power supplied to vacuum vaporization sources of metals and other
CN201144277Y (zh) * 2007-12-29 2008-11-05 杭州晶鑫镀膜包装有限公司 一种真空镀铝膜设备
CN101658066A (zh) * 2007-04-07 2010-02-24 应达公司 用于电感应加热、熔化和搅拌的具有脉冲调节器的电流反馈逆变器
CN105392224A (zh) * 2014-08-29 2016-03-09 肖特股份有限公司 用于加热熔体的装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005307354A (ja) * 2000-08-10 2005-11-04 Nippon Steel Chem Co Ltd 有機ｅｌ素子の製造方法及び装置
GB0213186D0 (en) * 2002-06-08 2002-07-17 Univ Dundee Methods
JP4476019B2 (ja) * 2004-05-20 2010-06-09 東北パイオニア株式会社 成膜源、真空成膜装置、有機ｅｌ素子の製造方法
JP4001296B2 (ja) * 2005-08-25 2007-10-31 トッキ株式会社 有機材料の真空蒸着方法およびその装置
TWI352494B (en) * 2007-04-07 2011-11-11 Inductotherm Corp Current fed inverter with pulse regulator for elec
US20130106374A1 (en) * 2011-11-02 2013-05-02 Alan R. Ball Power supply controller and method therefor
JP2013182966A (ja) * 2012-03-01 2013-09-12 Hitachi High-Technologies Corp プラズマ処理装置及びプラズマ処理方法
ZA201305605B (en) * 2012-07-26 2014-05-28 Oss Man Services (Pty) Ltd Reactor vessel,system and method for removing and recovering volatilizing contaminants from contaminated materials
WO2015015973A1 (ja) * 2013-07-31 2015-02-05 富士電機株式会社 半導体装置の製造方法および半導体装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320751A (ja) * 1996-05-27 1997-12-12 Fuji Electric Co Ltd 底穴出湯式浮揚溶解装置
CN1446268A (zh) * 2000-08-10 2003-10-01 新日铁化学株式会社 有机el元件的制造方法及装置
JP2002343542A (ja) * 2001-05-21 2002-11-29 Fuji Xerox Co Ltd 電磁誘導加熱用制御装置、電磁誘導加熱装置および画像形成装置
JP2004059992A (ja) * 2002-07-29 2004-02-26 Sony Corp 有機薄膜形成装置
CN1950536A (zh) * 2004-05-17 2007-04-18 株式会社爱发科 有机材料用蒸发源及有机蒸镀装置
WO2007057925A1 (en) * 2005-11-15 2007-05-24 Galileo Vacuum Systems S.P.A. Device and method for controlling the power supplied to vacuum vaporization sources of metals and other
CN101658066A (zh) * 2007-04-07 2010-02-24 应达公司 用于电感应加热、熔化和搅拌的具有脉冲调节器的电流反馈逆变器
CN201144277Y (zh) * 2007-12-29 2008-11-05 杭州晶鑫镀膜包装有限公司 一种真空镀铝膜设备
CN105392224A (zh) * 2014-08-29 2016-03-09 肖特股份有限公司 用于加热熔体的装置

Also Published As

Publication number Publication date
JP2019173154A (ja) 2019-10-10
JP2019173153A (ja) 2019-10-10
JP2019173152A (ja) 2019-10-10
JP6709271B2 (ja) 2020-06-10
JP2019173151A (ja) 2019-10-10
JP6709273B2 (ja) 2020-06-10
US20210013457A1 (en) 2021-01-14
JP6709272B2 (ja) 2020-06-10
JP6734909B2 (ja) 2020-08-05

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