CN1119073C

CN1119073C - Printed circuit board for large current

Info

Publication number: CN1119073C
Application number: CN97122259A
Authority: CN
Inventors: 前岛章宏; 小林壮宽
Original assignee: Toshiba Corp
Current assignee: Toshiba Corp
Priority date: 1997-01-09
Filing date: 1997-11-12
Publication date: 2003-08-20
Anticipated expiration: 2017-11-12
Also published as: CN1187751A; TW388186B; JPH10200221A; JP3515868B2; KR19980070081A; KR100270637B1

Abstract

To maintain reliability of a printed board itself by, relating to a current concentration suppressing method using a jumper line, preventing degradation of efficiency in board manufacture, and suppressing rise of the board manufacturing cost. Conductive patterns 3A and 3B are formed on front and rear surfaces of an insulation substrate 2 of a large current substrate 1, while plural through holes 5a1 -5c2 penetrating the conductive patterns 3A and 3B on front and rear surfaces provided, and jumper lines 6a, 6b, 6c are, being close among others, inserted/provided for each adjoining through hole pairs (5a1 , 5a2 ), (5b1 , 5b2 ), and (5c1 , 5c2 ) among plural through holes 5a1 -5c2 . Solder 11a and 11b are provided on the conductive pattern between proximate jumper lines 6a and 6b, and, 6b and 6c, and the proximate jumper lines 6a and 6b, and, 6b and 6c are jointed through the solder 11a and 11b.

Description

The printed circuit board (PCB) that big electric current is used

The printed circuit board (PCB) that the big electric current that the present invention relates to use on the surface of electric insulating substrate etc. when big electric current flows in the formed conductor fig is used.

In recent years, generally electronic components such as IC, transistor, capacitor are installed on the printed circuit board (PCB).

When making printed circuit board (PCB), use the glued board that posts Copper Foil from the teeth outwards, by etching unwanted part in this Copper Foil is removed, generate the printed circuit board (PCB) that has required copper clad patterns (conductor fig) from the teeth outwards.

, the additional processing owing to crossing after etching and substrate are made in the part of above-mentioned printed circuit board (PCB) upper conductor figure, might produce trichoid be full of cracks defectives such as (microcracks) sometimes.

When existing the printed circuit board (PCB) of such be full of cracks on the part of using at wire pattern, the be full of cracks that produces the conductor fig of that part of be full of cracks makes the narrowed width of figure, and current concentration is easy to heating in the narrow slit part.

Particularly used big electric current is used in the printed circuit board (PCB) in the sort of electric product that the big electric current more than 1A flows in conductor fig, because big electric current is in above-mentioned narrow slit segment set, caloric value is increased, as considering influence to other control unit, be unfavorable then, wish to improve as printed circuit board (PCB).

According to such background, use in the printed circuit board (PCB) at existing big electric current, adopted various inhibition to the current concentration of this conductor fig and the mode of heating (current concentration suppressor mode),, also can prevent electric current concentrating on conductor fig conductor fig even when a part of be full of cracks has taken place.

The mode of consideration so far has, for example, the diplopore mode is promptly implemented perforation processing on flat conductive plates such as brass sheet, the part patchhole in addition of this conductive plate by the convection current super-high-current punches and soldering, the method that big electric current is flowed by the conductive plate of having beaten the hole; And part surface conductive plate mode, soldering face conductive plate mode, promptly by on the conductive pattern between the part lead-in wire that flows through big electric current that conductive plates such as brass sheet is configured to the printed circuit board surface part surface of electronic component (install) and the back side (the soldering face of electronic component) and carry out soldering, make big electric current by this conductive plate and mobile method.

But, in the diplopore mode, pass through the brass sheet of perforation processing in advance, so exist following point: in the design of change size and size etc., the degree of freedom is less and be difficult to adapt to multiple electronic component or the like because use.

In the conductive plate mode, particularly in part surface conductive plate mode, exist following shortcoming: might be because scolding tin does not reach on the conductive plate of part surface, so cause bad connection; And the position of conductive plate is uncertain on the part surface.So reduced the reliability of the printed circuit board (PCB) that big electric current uses.Moreover in solder side conductive plate mode, also produce following problems: when welding during this conductive plate, conductive plate strips down, and scolding tin is sagging to the solder side below, produces so-called scolding tin slide etc., so be difficult to keep the high reliability of the printed circuit board (PCB) that big electric current uses.

In the variety of way of above-mentioned use conductive plate, because the price comparison height of conductive plate, versatility is also relatively poor, so, wish to have the mode of the use material high than cheapness and versatility.

, supposing that the permission current value of conductive pattern for example is 1A (ampere), is the temperature rise that 0.5mm just can control Copper Foil by the width that makes figure then.On the other hand, under the situation of common lead-in wire (copper cash), the permission current value of may command temperature rise is 10A/mm ²

Promptly, because the permission current value of lead-in wire is big and itself be cheap, so,, proposed not use conductive plate and used the mode of the inhibition current concentration of the high and cheap wire jumper (jumper) of versatility as the mode of the inhibition current concentration of this advantage that makes full use of lead-in wire.

Fig. 8 is (electronic component soldering face from the back side, abbreviate " solder side " below as) employing seen use the big electric current of mode of inhibition current concentration of wire jumper with the conductive pattern part of printed circuit board (PCB), Fig. 9 be among Fig. 8 AA to pseudosection (profile of seeing as surface (part surface of electronic component being installed, below abbreviation " part surface ") with top in scheming).

According to Fig. 8 and Fig. 9, on the conductive pattern 50 between the mobile part of the big electric current of printed circuit board (PCB) goes between, a plurality of Long Circles (signet shape) through

hole

51a and 51b are set, in each through

hole

51a and 51b, insert many (2)

wire jumper

52a, 52b and 52b, 52c.

Promptly, for example, utilize automatic insertion machine (certainly plug in machine) 52b1 of one leg portion of the 52a2 of one leg portion of wire jumper 52a and the wire jumper 52b adjacent with wire jumper 52a automatically to be inserted in the end 51a1 and 51a2 of long axis direction of Long Circle through hole 51a, fix by soldering; Also have, the 52c1 of one leg portion of the 52b2 of one leg portion of wire jumper 52b and the wire jumper 52c adjacent with wire jumper 52b is inserted in the end 51b1 and 51b2 of long axis direction of Long Circle through hole 51b, fix by soldering.

That is, be inserted into

wire jumper

52a and 52b in the same Long Circle through hole 51a, couple together by the scolding tin in this Long Circle through hole 51a and this Long Circle through hole 51a; Be inserted into

wire jumper

52b and 52c in the same Long Circle through hole 51b, couple together by the scolding tin in this Long Circle through hole 51b and this Long Circle through hole 51b.

, the current value of the permission in wire jumper itself and little.For example, (sectional area is about 0.28mm to diameter (φ) for 0.6mm ²) time, according to electric current permissible value (every 1mm of above-mentioned general lead ²Be 10A (10A/mm ²)) convert the electric current of about 2.8A that can only flow in the wire jumper.

But, because the conductor fig that usually big electric current is used is designed to have the area of dissipation (with reference to expression Figure 10 for the difference of the electric current caloric value of wire jumper and conductor fig) that can allow the 20A current value in advance, concerning wire jumper, there is no need to require the permission current value of 20A, if the current concentration in the time of can being suppressed at defectives such as producing microcrack in the conductor fig then avoids the caused abnormal heating of this current concentration to get final product.

Promptly, as adopt the big electric current printed circuit board (PCB) of Fig. 8 and wire jumper 52a～52c shown in Figure 9, because the big electric current that flows in conductor fig 50 not only flows in conductor fig 50 and also flows by wire jumper 52a～52c, so, can avoid and suppress current concentration to conductor fig 50.

But, in the current concentration suppressor mode that adopts existing wire jumper, because many wire jumpers are inserted in the same Long Circle through hole, by this Long Circle through hole these many wire jumpers are coupled together, so as shown in figure 11, must on direction, be provided with under the situations such as through hole 56 and 56 perpendicular to wire jumper 55a～55c axis direction, the following situation of frequent generation: the position of inserting good wire jumper 55a～55c certainly as shown in figure 12, long axis direction along through hole 56 and 56 moves, so for example be positioned on the same straight line, the insertion position of each wire jumper 55a～55c just be can not determine.As a result, insert the certainly slotting error of generation in the operation (wire jumper is from the error of the machine of inserting in automatic insertion), cause the time-out of substrate manufacturing process, make the manufacturing efficient reduction of substrate at the wire jumper of plugging in machine certainly.

In order to do one's utmost to prevent the above-mentioned error of inserting certainly, though also design has considered not form the Long Circle through hole, but the mode of the spectacle through hole 60 shown in formation Figure 13, but, in order to form this spectacle through hole 60, must carry out milling machine processing and the processing of Long Circle hole etc. to printed circuit board (PCB), the manufacturing cost of base stage is improved.

Compare with circular through hole, the Long Circle through hole is bigger in the danger that its through hole itself cracks; Have the printed circuit board (PCB) of circular through hole to compare with it, the reliability of printed circuit board (PCB) with Long Circle through hole is low.

The present invention In view of the foregoing proposes, its purpose is, in having adopted the current concentration suppressor mode of wire jumper, prevent the reduction of substrate manufacturing efficient and the raising of inhibition substrate manufacturing costs, and then can keep the reliability of printed circuit board (PCB) itself well.

In order to achieve the above object, in the printed circuit board (PCB) that the described big electric current in the present invention the 1st aspect is used, on the surface of the substrate that constitutes by insulating material and the back side, form conductive pattern, a plurality of through holes that run through this surface and back side conductive pattern are set, make wire jumper near each other and insert be configured at least a portion in these a plurality of through holes each in the adjacent through hole; On the conductive pattern between above-mentioned approaching wire jumper, scolding tin is being set on the substrate that this big electric current is used; By above-mentioned scolding tin this each approaching wire jumper is coupled together.

Particularly described big electric current is used in the printed circuit board (PCB) aspect the present invention the 2nd, above-mentioned scolding tin is provided with like this, make its width on this wire jumper line footpath direction wideer than the line footpath of above-mentioned each wire jumper, also have, described big electric current is with in the printed circuit board (PCB) aspect the present invention the 3rd, and above-mentioned a plurality of through holes are respectively the hole in piece part that forms with circular port.

Also have, particularly described big electric current is used in the printed circuit board (PCB) aspect the present invention the 4th, form the weld zone on the conductive pattern between above-mentioned approaching wire jumper, make its width on this wire jumper line footpath direction wideer than the line footpath of above-mentioned each wire jumper, above-mentioned scolding tin automatically is full of above-mentioned weld zone when flowing soldering.

And then described big electric current is with in the printed circuit board (PCB) aspect the present invention the 5th, and the back side of aforesaid substrate is the solder side that the part that inserts from that side of this substrate surface is carried out soldering, and above-mentioned wire jumper inserts from that side of this solder side and is configured in the aforesaid substrate.Also have, described big electric current is with in the printed circuit board (PCB) aspect the present invention the 6th, for inserting the lead-in wire of the electronic component of installing and having fixed from that side of aforesaid substrate surface by above-mentioned through hole and approaching between the wire jumper of this lead-in wire by scolding tin, and at least one side that instinct scolding tin is full of portion on the conductive pattern between the above-mentioned approaching wire jumper implements to append scolding tin, so that reduce between above-mentioned lead-in wire and the wire jumper, and above-mentioned scolding tin is full of at least one side's of portion resistivity.

The described big electric current printed circuit board (PCB) in the 7th aspect according to the present invention on the conductor fig of the axis direction central portion of at least one wire jumper in approaching above-mentioned approaching wire jumper, is provided with the heat transmission weld zone; The scolding tin that connects above-mentioned at least one wire jumper and above-mentioned conductor fig is set on this heat transmission weld zone.Also have, the described big electric current printed circuit board (PCB) in the 8th aspect is placed in insulating trip on the aforesaid substrate surface according to the present invention, so that insert the above-mentioned electronic component of installation from this that side of insulating trip surface.

The printed circuit board (PCB) that the described big electric current in the 1st to the 7th aspect is used according to the present invention, insert near each otherly be configured to adjacent each that formed with circular port to the conductive pattern between the wire jumper in the through hole on, be arranged on width on this wire jumper line footpath direction than the wide weld zone, line footpath of wire jumper; Scolding tin (scolding tin is full of portion) is set respectively on this weld zone; By this scolding tin (scolding tin is full of portion), each approaching wire jumper is coupled together.

That is not approaching wire jumper is inserted in the same Long Circle through hole such in the prior art and to couple together; Couple together but be full of portion by scolding tin.

As a result, big electric current is not to concentrate in the conductor fig to flow, but by near the wire jumper of configuration and between scolding tin be full of part and loose and flow.

Particularly described big electric current is used in the printed circuit board (PCB) aspect the present invention the 6th, because for going between at electronic component and approaching between the wire jumper of this lead-in wire, perhaps at least one side that instinct scolding tin is full of portion on the conductive pattern between approaching wire jumper implements to append scolding tin, so, reduced between above-mentioned lead-in wire and the wire jumper, and above-mentioned scolding tin is full of at least one side's of portion resistivity, makes the big current lead-through that flows in printed circuit board (PCB) become better.

Also have, particularly in the printed circuit board (PCB) that described big electric current is used aspect the present invention the 7th, on the conductor fig of the axis direction central portion that approaches a certain wire jumper, the heat radiation weld zone is set, this wire jumper and conductor fig are coupled together by the scolding tin that is arranged on this heat transmission weld zone because be, so, because the heat that big current lead-through produced of this wire jumper can be distributed on the conductor fig by scolding tin and heat transmission weld zone, so can avoid being accompanied by the abnormal heating of conducting in wire jumper of big electric current.

Particularly described big electric current is used in the printed circuit board (PCB) aspect the present invention the 8th, insulating trip is placed on the substrate surface, because insert the installation electronic component from this that side of insulating trip surface, so, strengthened the insulating properties of wire jumper, improved the reliability of the printed circuit board (PCB) that big electric current uses at the projection and the electronic component of that side of part surface.

Fig. 1 is the oblique view of a part that the structure of the printed circuit board (PCB) that the big electric current relevant with the present invention the 1st embodiment use is shown;

The figure of Fig. 2 for illustrating after the part of that side conductor figure of solder side among Fig. 1 is enlarged;

Fig. 3 is that III-III among Fig. 2 is to pseudosection;

The figure that illustrates after the part expansion of that side conductor figure of solder side of the printed circuit board (PCB) that Fig. 4 uses for the big electric current relevant with the variation of the 1st embodiment;

Fig. 5 is that V-V among Fig. 4 is to pseudosection;

The figure that illustrates after the part expansion of that side conductor figure of solder side of the printed circuit board (PCB) that Fig. 6 uses for the big electric current relevant with the 2nd embodiment;

Fig. 7 is that VII-VII among Fig. 6 is to pseudosection;

Fig. 8 for the employing seen from that side of solder side use the figure of the conductive pattern part of the printed circuit board (PCB) that the big electric current of the current concentration suppressor mode of existing wire jumper uses;

Fig. 9 is that A-A among Fig. 8 is to pseudosection;

Figure 10 is the different figure of expression for the caloric value of conductor fig and wire jumper electric current;

Be included in the figure that with wire jumper axis direction vertical direction be provided with the conductive pattern part of printed circuit board (PCB) that the big electric current of the wire jumper situation of through hole under use of Figure 11 for seeing from that side of solder side;

Figure 12 illustrates the figure that the wire jumper insertion position changes among Figure 11;

Figure 13 is the figure that the spectacle through hole is shown.

Below, with reference to accompanying drawing, embodiments of the invention are described.

(the 1st embodiment)

Fig. 1 is the oblique view that the part of the printed circuit board (PCB) that big electric current is used in the present embodiment is shown.

Among Fig. 1, the printed circuit board (PCB) that big electric current is used (below, abbreviate " printed circuit board (PCB) " as) 1 comprises the insulated substrate 2 that is made of insulating material, on two surfaces of this insulated substrate 2, for example utilize conductive materials such as Copper Foil, handle, utilize printing to form conductor fig by resist.Particularly on this printed circuit board (PCB) 1, between the part lead-in wire that big electric current flows, (among Fig. 1, the through hole 4A and the 4B that insert this part lead-in wire only are shown), in the conductor fig that on two surfaces, has formed, form conductor fig 3A and 3B shown in Figure 1.

Electricity design by for example CAD etc. is designed to same substantially circuitous pattern on two faces to conductor fig 3A and 3B.And in the present embodiment, conductor fig 3A and 3B extend setting along a side (among Fig. 1, that side of one side in the front) of printed circuit board (PCB).In extending the way along with about 90 ° of the side bent face of this lateral vertical after, extend along this side again and be provided with; This conductor fig 3A and 3B are along the stepped on the whole formation in the surface of printed circuit board (PCB) 1.

In the present embodiment, when printed circuit board (PCB) 1 is used as the single face installation base plate on the side that electronic device and electronic component is installed to a surface, conductor fig 3A (among Fig. 1, illustrating) in the last formation of surface (part surface) A that electronic device and electronic component are installed one side with solid line; Conductor fig 3B (among Fig. 1, shown in broken lines) at the face relative, the last formation of the back side (solder side) the B opposite side that promptly electronic device and electronic component soldering got up with part surface.

Fig. 2 is the figure that illustrates after the conductor fig 3B that forms on the B side of the back side of printed circuit board (PCB) 1 (solder side) partly enlarges among Fig. 1; Fig. 3 is that III-III among Fig. 2 is to pseudosection.Among Fig. 1, because composed component shown in Figure 2 is very tiny, so with its omission.

According to Fig. 2 and Fig. 3, along conductor fig 3A and 3B configuration hole in piece part (through hole) 5, hole in piece part 5 arrives conductor fig 3A from conductor fig 3B by insulated substrate 2, runs through this conductor fig 3B and conductor fig 3A.

Promptly, as shown in Figure 2, through hole 5 (..., 5a1,5a2,5b1,5b2,5c1,5c2 ...) in, through hole 5a1,5a2,5b1,5b2 are a configuration point-blank substantially along the long side direction of figure, also have, through hole 5c1,5c2 also are a configuration point-blank substantially along the long side direction of figure.And through hole 5b2,5c1 are configured on the sweep of conductor fig 3A and 3B along the short side direction of this conductor fig 3A and 3B; Through hole 5a1～5c2 is along the surface of figure, stepped on the whole configuration.

Many be suitable for each to through hole U font at interval (when being upside with solder side B, be reverse U shape) wire jumper 6a, 6b, 6c ... from that side of solder side B be inserted into respectively adjacent paired through hole (5a1,5a2) the through hole 5, (5b1,5b2), (5c1,5c2) ... in, so as this to through hole respectively cross-over connection get up.

That is, utilize from the machine of inserting the part of extending abreast along wire jumper 6a (below, be called " shank ") 6a1 and 6a2 are inserted in the through hole (5a1,5a2) from that side of solder side B.Similarly, the shank 6b1 of wire jumper 6b and 6b2 are inserted in the through hole (5b1,5b2) from that side of solder side B; The shank 6c1 of wire jumper 6c and 6c2 are inserted in the through hole (5c1,5c2) from that side of solder side B.

As a result, (its overlap is that 6a3～6c3) along the configuration near each other of conductive pattern 3B long side direction, in addition, through hole 5b2 and 5c1 are perpendicular to the axis direction configuration of wire jumper 6a～6c to each wire jumper 6a～6c.Dispose each through hole 5a1,5a2～5c1,5c2, make the interval figure of wire jumper 6a～6c near each other equal substantially respectively at the interval on long side direction.

After being inserted in each through hole (5a1,5a2)～(5c1, the 5c2), each leading section (clinching portion) that reaches that side of part surface A is roughly curved the right angle to its inboard respectively to each shank 6a1,6a2～6c1, the 6c2 of wire jumper 6a～6c.

On the other hand, the wire jumper 6a of configuration near each other and the conductive pattern 3B between the 6b and on the conductive pattern 3B around through hole 5a2 and the through hole 5b1, form for each wire jumper 6a and 6b be common, for example its profile is the weld zone 10a of signet shape.Similarly, the wire jumper 6b of configuration near each other and the conductive pattern 3B between the 6c and on the conductive pattern 3B around through hole 5b2 and the through hole 5c1, form for each wire jumper 6b and 6c be common, for example its profile is the weld zone 10b of signet shape.

Weld zone 10a and 10b have than this wideer width in wire jumper line footpath on the line footpath direction of each wire jumper 6a～6c, on this weld zone 10a and 10b, be full of respectively scolding tin 11a and 11b (below, this scolding tin is called " scolding tin is full of portion ") and, by this scolding tin 11a and 11b wire jumper 6a near each other and 6b and wire jumper 6b and 6c are coupled together.

When in the lump the mobile soldering of each shank 6a1,6a2～6c1 of comprising above-mentioned wire jumper 6a～6c, 6c2, scolding tin 11a and 11b automatically are full of among weld zone 10a and the 10b.

The user hole 12 and 12 that conducts (its diameter is less than through hole 5) that is used to run through conductor fig 3B and conductor fig 3A, be set to respectively on the given position near the conductor fig 3B of each wire jumper 6a～6c.Among Fig. 2 and Fig. 3, show about being inserted into adjacent paired through hole 5a1,5a2～5c1, wire jumper 6a～6c among the 5c2 and the structure that is full of scolding tin between the approaching mutually wire jumper, but, between other wire jumper, also formed the same structure that is full of scolding tin, among Fig. 2, be illustrated in wire jumper 6a and be full of portion at the scolding tin that is provided with between the adjacent not shown wire jumper of that side of through hole 4A (with reference to Fig. 1) with respect to this wire jumper 6a with symbol 11a1; Be illustrated in wire jumper 6c and be full of portion at the scolding tin that is being provided with between the adjacent not shown wire jumper of that side of through hole 4B with symbol 11c with respect to this wire jumper 6c.

Secondly, the effect of this structure is described.

Among Fig. 1 to Fig. 3, for example the part lead-in wire when the above big electric current a certain part from be inserted into through hole 4A of 1A goes between by being inserted into part not shown among the through hole 4B, when printed circuit board (PCB) 1 flows, this big electric current is not only to concentrate among the conductor fig 3B to flow, but by each wire jumper and be configured to scolding tin between the wire jumper and be full of part and loose and flow.

For example, in conductor fig 3B shown in Figure 2, not shown part lead-in wire from be inserted into through hole 4A is full of the big electric current that portion flows out by other not shown wire jumper and scolding tin, be full of the 11a1 of portion by scolding tin and flow through wire jumper 6a, be full of the 11a of portion → wire jumper 6b → scolding tin along wire jumper 6a → scolding tin successively later on and be full of the 11b of portion → wire jumper 6c and flow.And the big electric current that flows through wire jumper 6c is full of the 11c of portion by scolding tin, after flowing through other not shown wire jumper and scolding tin and being full of portion, flows to the part lead-in wire that inserts among the through hole 4B.

Promptly, according to present embodiment, because big electric current is not to concentrate among the conductor fig 3B, but be wire jumper 6a～6c dispersion flows by other path, so, even in conductor fig 3B, produced be full of cracks such as microcrack, also can suppress significantly this chap caused current concentration in the narrow slit of figure 3B part phenomenon and be accompanied by this current concentration from narrow slit heating partly etc.As a result, the reliability of the printed circuit board (PCB) 1 that big electric current uses can be improved, and the reliability of the various electric equipments that the printed circuit board (PCB) 1 that big electric current uses is housed can be improved.

Particularly according to present embodiment, form each through hole with circular port, insert respectively and be set to each adjacent through hole 5a1,5a2～5c1, the connection of wire jumper 6a～6c among the 5c2 is passed through at approaching wire jumper 6a and 6b, the scolding tin that forms on the conductor fig between wire jumper 6b and the 6c is full of the 11a of portion, 11b carries out, because do not use the Long Circle through hole that approaching wire jumper is coupled together not needing to resemble in the prior art, so, even the part in the through hole 5 (through hole 5b2 and 5c1) is configured to vertical with the axis direction of wire jumper 6a～6c, also move hardly the position of wire jumper 6a～6c.

Thereby, even use wire jumper 6a～6c is inserted in the corresponding through hole 5 from the machine of inserting, can not take place from inserting error yet, the result, owing to can not cause because of the stopping of the substrate manufacturing process that causes from slotting error, so, can keep the manufacturing efficient of substrate well.Also have, increased the configuration degree of freedom of each through hole 5, can insert and the configuration wire jumper with higher efficient.

According to present embodiment, because be to be full of the 11a of portion and 11b couples together wire jumper 6a～6c by scolding tin, so, do not need to use Long Circle through hole such in the prior art, can use general circular through hole 5.Thereby, to compare with the printed circuit board (PCB) that the big electric current that uses existing Long Circle through hole is used, the danger that the printed circuit board (PCB) 1 that the big electric current of present embodiment is used does not almost crack on this through hole part can improve the reliability of substrate.

And, just can not form circular through hole 5 because do not carry out special processing such as milling machine processing and the processing of Long Circle hole, so, used the manufacturing cost of the printed circuit board (PCB) that the big electric current of wire jumper uses not improve.

According to present embodiment, between wire jumper adjacent each other (for example, between wire jumper 6a and 6b) weld zone 10a be common each other, because when flowing soldering, being full of the 11a of portion by scolding tin couples together wire jumper 6a and 6b with respect to therebetween conductor fig 3B, so, be not full of the situation of the 11a of portion, promptly have only the situation of conductor fig 3B to compare with having wire jumper 6a, 6b and scolding tin, can reduce near the conductor resistance of wire jumper 6a and 6b, make the big current lead-through that in printed circuit board (PCB) 1, flows become better.

And then, can also be to (for example, between wire jumper 6a and the 6b scolding tin on) the weld zone 10a is full of the 11a of portion and implements to append scolding tin, can further reduce the resistivity that this weldering thing is full of the 11a of portion between the adjacent wire jumper.

In this structure, as Fig. 4 and shown in Figure 5, on the conductor fig 3B of the central portion of the axis direction that approaches wire jumper 6a, be provided with along have on the direction of the line of wire jumper 6a footpath than the wideer width in this wire jumper line footpath and for example its profile be the heat transmission weld zone 20 of signet shape, the scolding tin 21 that wire jumper 6a and this conductor fig 3B are coupled together can also be set on this heat transmission weld zone 20.When flowing soldering, scolding tin 21 automatically is full of in the weld zone 20.

According to Fig. 4 and structure shown in Figure 5, because by scolding tin 21 and heat transmission weld zone 20 the spread heat that in wire jumper 6a, produce because big electric current flows in wire jumper 6a in conductor fig 3B, so, can avoid being accompanied by the abnormal heating of big current lead-through in wire jumper 6a.

(the 2nd embodiment)

Fig. 6 is a figure who illustrates after a part of conductor fig that forms on that side of the printed circuit board (PCB) back side (solder side) relevant with present embodiment enlarges; Fig. 7 is that VII-VII Fig. 6 under the state that electronic component is inserted from surface that side of (part surface) A after installing is to pseudosection.

According to Fig. 6 and Fig. 7, the printed circuit board (PCB) 30 that big electric current is used comprises the insulated substrate 32 that is made of insulating material, on two surfaces of this insulated substrate 32, for example similarly utilizes conductive materials such as Copper Foil with the 1st embodiment, handle by resist, utilize print process to form.Particularly for example on printed circuit board (PCB) 30, flow at big electric current, insert between the lead-in wire 34A of the electronic component 34 that usefulness is installed and the through hole 35A and 35B that 34B is inserted into, form conductor fig 33A and 33B shown in Figure 6 in the conductor fig that on two surfaces, has formed.

In addition, identical according to present embodiment with the 1st embodiment, be arranged to right through hole (36a1,36a2), (36b1,36b2) on the through hole 35A of B and the conductor fig 33B between the 35B overleaf; Wire jumper 37a and 37b are inserted from solder side B, so as this paired through hole (36a1,36a2), (36b1,36b2) respectively cross-over connection get up.And, after being inserted in each through hole (36a1,36a2), (36b1, the 36b2), each leading section (clinching portion) that reaches that side of part surface A is roughly curved the right angle to its inboard respectively to each shank 37a1,37a2 of wire jumper 37a and 37b and 37b1,37b2.

Identical with the 1st embodiment, form weld zone 38 at the conductive pattern 33B between wire jumper 37a and the 37b and on the conductive pattern 33B around through hole 36a2 and the through hole 36b1; By flowing scolding tin and append scolding tin etc., scolding tin (scolding tin is full of portion) 39 is filled on this weld zone 38.And, by this scolding tin 39 wire jumper 37a and 37b are coupled together.

In the present embodiment, between lead-in wire 34A of electronic component 34 (and through hole 35A) and the wire jumper 37a and between lead-in wire 34B of electronic component 34 (and through hole 35B) and wire jumper 37b, for example forming respectively, its profile is the weld zone 40a and the 40b of signet shape.

Weld zone 40a and 40b have than this wideer width in wire jumper line footpath on the line footpath direction of each wire jumper 37a and 37b; By flowing scolding tin and append scolding tin etc., scolding tin (scolding tin is full of portion) 41a and 41b are filled on this weld zone 40a and the 40b respectively.

Like this, be provided with on the part surface A of printed circuit board (PCB) 30 that wire jumper 37a, 37b and scolding tin is full of portion 39,41a, 41b etc., A lays insulating trip 42 along this part surface, insert by means of the lead-in wire 34A of

electronic component

34 and 34B are passed this insulating trip 42 from that side of part surface A, and this part 34 is installed on the printed circuit board (PCB) 30.Other structure and the 1st embodiment are basic identical, omit its explanation.

Promptly, according to this structure, because between the part surface A of electronic component 34 and printed circuit board (PCB) 30 (and the wire jumper 37a on this part surface A and the clinching portion of 37b), be provided with insulating trip 42, so, by insulating trip 42, further strengthened the insulating properties of the clinching portion and the electronic component 34 that under the situation of having used wire jumper 37a and 37b, reach that side of part surface.As a result, be full of portion 39,41a, 41b, except the effect described in the 1st embodiment, can also further improve the relevant reliability of electric insulating quality of the printed circuit board (PCB) of using with big electric current 30 based on wire jumper 37a, 37b and scolding tin.

In the 1st and the 2nd embodiment, wire jumper is inserted from that side of solder side dispose, still, the present invention is not limited thereto, also can be inserted into from that side of part surface and dispose.

Printed circuit board (PCB) among the 1st and the 2nd embodiment is as the explanation of single face installation base plate, and still, the present invention is not limited thereto, also can be two-sided installation base plate, perhaps, is the multilayer installation base plate.

In the 1st and the 2nd embodiment, the weld zone and be arranged at that scolding tin on this weld zone is full of portion be shaped as signet shape, but, the present invention is not limited thereto, if it is directly wideer than the line of this wire jumper at the width on the direction of wire jumper line footpath that weld zone and scolding tin are full of portion, that is full of portion with regard to the weld zone of what shape and scolding tin and all can.

According to the present invention, be configured to adjacent each each wire jumper in the circular through hole is for example coupled together insert near each otherly by being arranged at the scolding tin on the conductive pattern (scolding tin is full of portion) between wire jumper because be, so, the structure that approaching wire jumper couples together is compared by the Long Circle through hole with existing, can correctly determine the insertion position of each wire jumper, can also be easily and correctly use from the wire jumper of plugging in machine and insert operation.As a result, under the situation of using wire jumper, also can keep the manufacturing efficient of big electric current printed circuit board (PCB) well.

Also have, according to the present invention, because need be not above-mentioned from slotting error and to through hole embodiment such as milling machine is processed and special processing such as slotted hole processing in order to prevent, so, can reduce the manufacturing cost of printed circuit board (PCB).

Claims

1. printed circuit board (PCB) that big electric current is used, in the printed circuit board (PCB) that this big electric current is used, on the surface of the substrate that constitutes by insulating material and the back side, form conductive pattern, a plurality of through holes between conduction this surface of connection and the back side conductive pattern are set, the two ends of wire jumper are inserted in these a plurality of through holes each in the adjacent through hole, with these through holes between be electrically connected and it is characterized in that:

On the substrate between approaching wire jumper, soldering-tin layer is set; By described soldering-tin layer respectively be electrically connected between this approaching wire jumper.

2. the printed circuit board (PCB) of using according to the big electric current described in the claim 1 is characterized in that: form described soldering-tin layer, make its width on this wire jumper line footpath direction respectively wideer than the line footpath of described each wire jumper.

3. the printed circuit board (PCB) of using according to the big electric current described in the claim 2, it is characterized in that: on the substrate between described approaching wire jumper, form the weld zone, its width on this wire jumper line footpath direction respectively is wideer than the line footpath of described each wire jumper, and described soldering-tin layer is formed on the described weld zone when flowing soldering.

4. the printed circuit board (PCB) of using according to the big electric current described in the claim 2, it is characterized in that: insert described through hole and be welded in described through hole electronic component lead-in wire and near between the wire jumper of this lead-in wire and at least one side of the soldering-tin layer that on the substrate between the described approaching wire jumper, forms implement to append scolding tin, to reduce between described lead-in wire and the wire jumper and at least one side's of described soldering-tin layer resistivity.

5. the printed circuit board (PCB) of using according to the big electric current described in the claim 1 is characterized in that: on the substrate of the axis direction central portion of at least one wire jumper in described approaching wire jumper, the heat transmission weld zone is set; On this heat transmission weld zone, the soldering-tin layer that described at least one wire jumper and this heat transmission weld zone conduction is coupled together is set.

6. the printed circuit board (PCB) of using according to the big electric current described in the claim 4 is characterized in that: insulating trip is placed on the described substrate surface, so that insert the described electronic component of installation from this insulating trip surface one side.