CN105491807A - Printed circuit board with high current carrying ability, sand-dust box controller, and preparation method thereof - Google Patents
Printed circuit board with high current carrying ability, sand-dust box controller, and preparation method thereof Download PDFInfo
- Publication number
- CN105491807A CN105491807A CN201610069965.5A CN201610069965A CN105491807A CN 105491807 A CN105491807 A CN 105491807A CN 201610069965 A CN201610069965 A CN 201610069965A CN 105491807 A CN105491807 A CN 105491807A
- Authority
- CN
- China
- Prior art keywords
- high current
- wiring board
- current carrying
- preparation
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
Abstract
The invention discloses a printed circuit board with high current carrying ability, and a preparation method thereof. The preparation method includes following steps: (1) performing front-process manufacture according to the conventional method: internal layer pattern manufacture, pressing, external layer pattern manufacture, and electroplating nickel and gold; (2) performing green-oil screen printing, exposure, and developing operation of a circuit board obtained by step (1), wherein the step of green-oil screen printing including windowing operation of a high-current area; (3) performing tinning operation, and covering the high-current area with a layer of tin; and (4) performing post-process manufacture according to the conventional method, and obtaining the printed circuit board with high current carrying ability. The preparation method is simple, the process is simple, the current carrying ability of lines is improved from several mA to dozens of A, the carrying ability of the lines is improved, enough space is provided for the PCB, and the design difficulty of the circuit board is reduced.
Description
Technical field
The present invention relates to printed wiring board technical field, particularly relate to a kind of printed wiring board, sand and dust case controller and preparation method thereof with high current carrying capacity.
Background technology
Along with making rapid progress of electronic product, increasing electronic product all requires that pcb board has high current carrying capacity.Hardware Engineer knows, the current capacity of PCB depends on and following factor: live width, line thick (copper thickness), rated temperature-rise.The copper thickness of current most of pcb board is 35um (also having 50um's and 70um), therefore during pcb board design, the thickness of Copper Foil has substantially just been decided, to increase the subregional current carrying capacity of plate Middle face, existing method is that the copper cash of respective regions is designed wider.
In addition, the method of current enhancing pcb board current carrying capacity is all arrange Copper Foil two-sided for pcb board in addition, and offer multiple plated-through hole, plated-through hole hole wall area is greater than two ends, hole area sum, increased the width of Copper Foil by such arranging, thus reach enhancing copper foil current bearing capacity.
There is following shortcoming in these methods above-mentioned:
1) space of putting element on pcb board is decreased;
2) difficulty that pcb board is produced is added;
3) reduce the intensity of pcb board, PCB is easily out of shape or ruptures;
4) difficulty of welding procedure is added.
Summary of the invention
Based on this, the object of this invention is to provide a kind of preparation method with the printed wiring board of high current carrying capacity.
Concrete technical scheme is as follows:
There is a preparation method for the printed wiring board of high current carrying capacity, comprise the steps:
Described printed wiring board is provided with high current zone and low current region, and the electric current of described high current zone is greater than 2A and is less than 30A, and the electric current in described low current region is less than 10mA;
(1) front operation making is carried out according to a conventional method: inner figure making, pressing, outer graphics making, electronickelling gold;
(2) silk-screen green oil, exposure, development operation are carried out to the wiring board that step (1) obtains, wherein in silk-screen green oil step, fenestration procedure is carried out to described high current zone;
(3) carry out upper tin operation, described wire covers one deck tin layers;
(4) carry out rear operation making routinely, there is described in obtaining the printed wiring board of high current carrying capacity.
Wherein in some embodiments, in step (3), after described upper tin operation, cover in described high current zone the tin layers that a layer thickness is 50-750 μm.
Another object of the present invention is to provide a kind of printed wiring board with high current carrying capacity.
Concrete technical scheme is as follows:
The printed wiring board of what above-mentioned preparation method prepared have high current carrying capacity.
Another object of the present invention is to provide the above-mentioned application with the printed wiring board of high current carrying capacity.
Concrete technical scheme is as follows:
The above-mentioned application of printed wiring board in sand and dust case controller with high current carrying capacity.
Another object of the present invention is to provide a kind of sand and dust case controller.
Concrete technical scheme is as follows:
A kind of sand and dust case controller, comprises the above-mentioned printed wiring board with high current carrying capacity.
Principle of the present invention and advantage as follows:
In the actual design of pcb board, circuit can be subject to the impact of pad and via hole, such as, for the region that the pad on wiring board is more, crossing after tin, the current load value of pad will considerably increase, but the current carrying capacity not corresponding increase of circuit between pad to pad, therefore, when circuit transient fluctuation, this section of circuit is just easy to blow.The solution of prior art is normally by increasing conductor width or thickness, but for the wiring board set, the thickness of its Copper Foil is certain, and increase width can reduce the space that wiring board element is put.
The present invention by need increase bearing capacity circuit on carry out on tin operation, change the thickness of Copper Foil, according to the electric current that actual wire will carry, tin uniform and enough thick in mistake, just can greatly improve current in wire bearing capacity, meet current in wire load bearing requirements.
Preparation method of the present invention is simple, simple flow, makes the current carrying capacity of circuit be increased to tens peaces from several milliamperes, has both improve the bearing capacity of circuit, can provide enough spaces again, reduce the design difficulty of wiring board for pcb board.
The printed wiring board of what preparation method of the present invention prepared have high current carrying capacity is particularly suitable for sand and dust case controller.
Embodiment
By the following examples the application is further elaborated.
A kind of preparation method with the printed wiring board of high current carrying capacity of the present embodiment, comprises the steps:
Described printed wiring board is provided with high current zone and low current region, and the current density of described high current zone is 15A, and the current density in described low current region is 5mA;
(1) front operation making is carried out according to a conventional method: inner figure making, pressing, outer graphics making, electronickelling gold;
(2) silk-screen green oil, exposure, development operation are carried out to the wiring board that step (1) obtains, wherein in silk-screen green oil step, fenestration procedure is carried out to described high current zone;
(3) carry out upper tin operation, cover in described high current zone the tin layers that a layer thickness is 400 μm;
(4) carry out rear operation making routinely, there is described in obtaining the printed wiring board of high current carrying capacity.
The current carrying capacity of the circuit on the printed wiring board obtained by above-mentioned preparation method is increased to 15A from 5mA.
The printed wiring board of what above-mentioned preparation method obtained have high current carrying capacity can be applicable to sand and dust case controller.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (5)
1. there is a preparation method for the printed wiring board of high current carrying capacity, it is characterized in that, comprise the steps:
Described printed wiring board is provided with high current zone and low current region, and the electric current of described high current zone is greater than 2A and is less than 30A, and the electric current in described low current region is less than 10mA;
(1) front operation making is carried out according to a conventional method: inner figure making, pressing, outer graphics making, electronickelling gold;
(2) silk-screen green oil, exposure, development operation are carried out to the wiring board that step (1) obtains, wherein in silk-screen green oil step, fenestration procedure is carried out to described high current zone;
(3) carry out upper tin operation, described wire covers one deck tin layers;
(4) carry out rear operation making routinely, there is described in obtaining the printed wiring board of high current carrying capacity.
2. preparation method according to claim 1, is characterized in that, in step (3), covering a layer thickness in described high current zone after described upper tin operation is 50-750 μm of tin layers.
3. the printed wiring board of what the preparation method described in any one of claim 1-2 prepared have high current carrying capacity.
4. the application of printed wiring board in sand and dust case controller with high current carrying capacity according to claim 3.
5. a sand and dust case controller, is characterized in that, comprises the printed wiring board with high current carrying capacity according to claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610069965.5A CN105491807A (en) | 2016-01-29 | 2016-01-29 | Printed circuit board with high current carrying ability, sand-dust box controller, and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610069965.5A CN105491807A (en) | 2016-01-29 | 2016-01-29 | Printed circuit board with high current carrying ability, sand-dust box controller, and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105491807A true CN105491807A (en) | 2016-04-13 |
Family
ID=55678407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610069965.5A Pending CN105491807A (en) | 2016-01-29 | 2016-01-29 | Printed circuit board with high current carrying ability, sand-dust box controller, and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105491807A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS515868A (en) * | 1974-07-02 | 1976-01-19 | Torao Tobisu | Ekitaino seidenjokasochi |
| JP3515868B2 (en) * | 1997-01-09 | 2004-04-05 | 株式会社東芝 | Printed circuit board for large current |
| CN201219327Y (en) * | 2008-06-06 | 2009-04-08 | 保锐科技股份有限公司 | Modular structure of circuit board great current area |
| CN202841682U (en) * | 2012-08-22 | 2013-03-27 | 广州华凌空调设备有限公司 | Printed circuit board |
-
2016
- 2016-01-29 CN CN201610069965.5A patent/CN105491807A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS515868A (en) * | 1974-07-02 | 1976-01-19 | Torao Tobisu | Ekitaino seidenjokasochi |
| JP3515868B2 (en) * | 1997-01-09 | 2004-04-05 | 株式会社東芝 | Printed circuit board for large current |
| CN201219327Y (en) * | 2008-06-06 | 2009-04-08 | 保锐科技股份有限公司 | Modular structure of circuit board great current area |
| CN202841682U (en) * | 2012-08-22 | 2013-03-27 | 广州华凌空调设备有限公司 | Printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160413 |