CN210725495U

CN210725495U - Circuit board assembly

Info

Publication number: CN210725495U
Application number: CN201921560204.5U
Authority: CN
Inventors: 朱泽春; 张伟; 黎岩; 徐肇松; 颜振周
Original assignee: Joyoung Co Ltd
Current assignee: Shandong Jiuchuang Home Appliance Co ltd
Priority date: 2019-09-18
Filing date: 2019-09-18
Publication date: 2020-06-09
Anticipated expiration: 2029-09-18

Abstract

The utility model discloses a circuit board assembly belongs to electron technical field, the utility model provides a circuit board assembly, including first circuit board and second circuit board, first circuit board includes first base plate, be equipped with on the first base plate first circuit assembly and with first circuit assembly electric connection's welding hole, the second circuit board includes the second base plate and welds the connector on the second base plate, still be equipped with on the second base plate with connector electric connection's second circuit assembly and contact pin, the contact pin with weld hole cooperation and welded fastening. Adopt the utility model provides a circuit board assembly can effectively improve production efficiency, reduction in production cost.

Description

Circuit board assembly

[ technical field ] A method for producing a semiconductor device

The utility model relates to the field of electronic technology, especially, relate to a circuit board assembly.

[ background of the invention ]

In order to reduce the production cost, the design of the existing circuit board is generally designed according to a single panel, and the requirement for the line spacing is higher because the design requirement of the single panel is relatively high, and some circuit boards need to use a connector in order to match the requirement of a special structure or match some functional elements. For example, a connector is an FPC socket with a connector pin pitch of 0.35mm, and the conventional mounting process cannot meet the precision requirement, and adjacent pins are easily mistakenly soldered into a whole and discarded. In order to solve the above technical problems, one method is to use a fine mounting process together with a circuit board, which causes an increase in production cost; or the FPC seat is manually welded on a circuit board connected with other electrical elements, because the pin pitch of the FPC seat is very small, the difficulty and the welding reject ratio of manual welding can be greatly increased, and finally, the production cost is also increased.

In addition, the FPC seat also has two forms of a horizontal type paster and a straight type paster. The FPC holder using horizontal patches may also bring another problem: namely, the FPC flexible flat cable is very inconvenient to insert; if the FPC seat of straight paster is adopted, the FPC seat will be too much higher than the circuit board, and the FPC seat is easy to crash and transport.

In order to solve the technical problem that the connector is incompatible with the existing circuit board mounting process, it is necessary and urgent to improve the electrical connection structure, improve the electrical reliability and reduce the production cost.

[ Utility model ] content

The utility model aims to solve the technical problem that overcome prior art not enough and provide a circuit board assembly, can effectively improve production efficiency, reduction in production cost.

In order to solve the technical problem, the utility model adopts the following technical scheme:

the utility model provides a circuit board assembly, includes first circuit board and second circuit board, first circuit board includes first base plate, be equipped with first circuit assembly on the first base plate and with first circuit assembly electric connection's welding hole, the second circuit board includes second base plate and welding connector on the second base plate, still be equipped with on the second base plate with connector electric connection's second circuit assembly and contact pin, the contact pin with weld hole cooperation and welded fastening.

Furthermore, the height of the contact pin which penetrates through one end of the welding hole and protrudes out of the first substrate or the second substrate is 1.5 mm-8 mm.

Furthermore, a first through hole used for avoiding the connector is formed in the first substrate, and the connector is arranged corresponding to the first through hole.

Furthermore, the height of the part of the contact pin between the first substrate and the second substrate is H1, the height of the connector protruding out of the second substrate is H2, and H1< H2.

Furthermore, the height of the pin protruding out of the first substrate through the end of the solder hole is H3, the height of the connector protruding out of the first substrate through the end of the first through hole is H4, and H3 is not less than H4.

Furthermore, the connector is an FPC (flexible printed circuit) socket, the FPC socket is electrically connected with the second circuit assembly through pins, and the distance between the adjacent pins is 0.05-0.35 mm.

Furthermore, at least two rows of the pins are welded on the second substrate, and the connector is located between the two opposite rows of the pins.

Furthermore, the distance between two adjacent pins in each row of pins is between 1.5mm and 7.5 mm.

Further, the contact pin sleeve is provided with a support sleeve, and the support sleeve abuts between the first circuit board and the second circuit board.

Furthermore, the first circuit board is further provided with a processing module electrically connected with the first circuit assembly, the back of the processing module is provided with a detection end used for burning or testing, and the first substrate is provided with a second through hole used for exposing the detection end.

The utility model has the advantages that:

the utility model discloses in be equipped with first circuit subassembly on the first base plate and with first circuit subassembly electric connection's welding hole, the second circuit board includes the second base plate and welds the connector on the second base plate, be equipped with on the second base plate with connector electric connection's contact pin and second circuit subassembly, the contact pin with weld the hole cooperation and welded fastening. Because the contact pin is thicker and has larger clearance compared with the pin of the FPC seat, the contact pin and the welding hole can be welded and fixed by adopting a tin furnace, and compared with a manual welding mode, the welding speed is higher, the production efficiency is higher, and the production cost is lower; in addition, because the process requirement of the pin for welding on the second substrate is higher, and the first circuit board has lower production process requirement, before the pin and the welding hole are matched and welded, the circuit boards of two different production processes can be separately processed, namely the first circuit board with low production process requirement is produced by using a low-requirement process, and the second circuit board with high production process requirement and the connector are produced by using a high-requirement process, so that the production cost and different process requirements can be better considered at the same time.

The height of the contact pin which penetrates through one end of the welding hole and protrudes out of the first substrate or the second substrate is 1.5 mm-8 mm. The height of the contact pin which penetrates through one end of the welding hole and protrudes out of the first substrate is 1.5 mm-8 mm, so that the welding firmness of the contact pin and the welding hole can be ensured, and the material cost and the overall size of the circuit board assembly can be effectively reduced; the height that the one end protrusion that the contact pin passed the welding hole in the second base plate is 1.5mm ~ 8mm, so design can guarantee that contact pin and welding hole realize the cooperation so that later stage welding, can avoid the contact pin protrusion second base plate too high again and lead to the material cost to increase and circuit board assembly's overall dimension too big.

The first substrate is provided with a first through hole used for avoiding the connector, and the connector is arranged corresponding to the first through hole. By the design, the height of the whole circuit board assembly can be further reduced, and meanwhile, the connector can be exposed to the first substrate so as to be electrically connected with other structures.

The height of the part of the contact pin between the first substrate and the second substrate is H1, the height of the connector protruding out of the second substrate is H2, and H1< H2. By the design, the structural stability of the circuit board assembly can be improved.

The height of the pin protruding out of the first substrate through the end of the soldering hole is H3, the height of the connector protruding out of the first substrate through the end of the first through hole is H4, and H4 is not more than H3. By the design, the contact pin can effectively protect the connector and prevent the connector from being damaged.

At least two rows of contact pins are welded on the second substrate, and the connector is located between the two opposite rows of contact pins. Can promote the guard action of row needle to the connector, can keep apart two rows of contact pins through the connector again, tin liquid connects and takes place the short circuit when avoiding the welding.

The distance between two adjacent pins in each row of pins is between 1.5mm and 7.5 mm. By the design, the creepage distance between the two contact pins can be ensured, the phenomenon of sparking is avoided, the compactness of the structure can be improved, and the size of the first circuit board and the second circuit board is reduced.

The contact pin sleeve is provided with a support sleeve which is abutted between the first circuit board and the second circuit board. By the design, the pin can be guaranteed to penetrate through the supporting sleeve to protrude out of the height precision of the first base plate, multiple times of adjustment in the assembling process is omitted, and therefore production efficiency is improved.

The first circuit board is also provided with a processing module electrically connected with the first circuit component, the back of the processing module is provided with a detection end for burning or testing, and the first substrate is provided with a second through hole for exposing the detection end. By the design, the probe can conveniently detect the detection end, convenience is provided for subsequent program upgrading, firmware modification and the like, and the probe does not need to be detached and welded again after burning.

These features and advantages of the present invention will be disclosed in more detail in the following detailed description and the accompanying drawings.

[ description of the drawings ]

The invention will be further explained with reference to the drawings:

fig. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention;

fig. 2 is a side view of a second circuit board according to a first embodiment of the present invention;

fig. 3 is a front view of a circuit board assembly according to an embodiment of the present invention;

fig. 4 is a rear view of a circuit board assembly according to an embodiment of the present invention.

Reference numerals:

100. a first circuit board; 110. a first substrate; 111. a first through hole; 112. a second through hole; 120. a first circuit component; 130. a processing module; 131. a detection end; 200. a second circuit board; 210. a second substrate; 220. inserting a pin; 230. a connector; 240. and a support sleeve.

[ detailed description ] embodiments

The utility model provides a circuit board assembly, including first circuit board and second circuit board, first circuit board includes first base plate, be equipped with first circuit assembly on the first base plate and with first circuit assembly electric connection's welding hole, the second circuit board includes the second base plate and welds the connector on the second base plate, be equipped with on the second base plate with connector electric connection's second circuit assembly and contact pin, the contact pin with weld hole cooperation and welded fastening. Compared with the pin of the FPC seat, the contact pin is thicker and has larger clearance, so the contact pin and the welding hole can be welded and fixed by adopting a tin furnace, and compared with a manual welding mode, the welding speed is higher, the production efficiency is higher and the production cost is lower; in addition, because the process requirement of the pin for welding on the second substrate is higher, and the first circuit board has lower production process requirement, before the pin and the welding hole are matched and welded, the circuit boards of two different production processes can be separately processed, namely the first circuit board with low production process requirement is produced by using a low-requirement process, and the second circuit board with high production process requirement and the connector are produced by using a high-requirement process, so that the production cost and different process requirements can be better considered at the same time.

The technical solutions of the embodiments of the present invention are explained and explained below with reference to the drawings of the embodiments of the present invention, but the embodiments described below are only preferred embodiments of the present invention, and not all embodiments. Based on the embodiments in the embodiment, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The first embodiment,

Referring to fig. 1 to 4, the circuit board assembly in the present embodiment includes a first circuit board 100 and a second circuit board 200, the first circuit board 100 includes a first substrate 110, and the first substrate 110 is provided with a first circuit assembly 120 and a solder hole electrically connected to the first circuit assembly 120, wherein the first circuit assembly 120 includes electronic components such as a capacitor, a resistor, an indicator light, a key, and a copper foil printed on the first substrate 110, a conductive wire, and the like. The second circuit board 200 includes a second substrate 210 and a connector 230 soldered on the second substrate 210, a second circuit component and a pin 220 electrically connected to the connector 230 are disposed on the second substrate 210, and the second circuit component includes a capacitor, a resistor, an inductor, and a copper foil and a wire printed on the second substrate 210. Specifically, the connector is used as a socket for plugging a flat cable to realize functional electrical signal transmission, and the connector can be an FPC (flexible printed circuit) seat, an FFC (flexible flat cable) seat, a pin seat connector, even an IDC (internet data center) connector and the like. The circuit board assembly in the scheme is mainly used for cooking appliances such as induction cookers, electric ceramic cookers, electric cookers, pressure cookers, stewpots, heaters and the like, and can also be used as other kitchen appliances. The pins 220 are inserted into the solder holes and are soldered to the solder holes for electrical connection. Because the pins 220 are thicker and have larger gaps than the pins of the FPC seat, the pins 220 can be welded and fixed with the welding holes in a tin furnace passing mode, or the pins and the first circuit component of the first circuit board pass through the tin furnace together; compared with a manual welding mode, the welding speed is higher, the production efficiency is higher, and the production cost is lower; in addition, because the process requirement of soldering the pins 220 on the second substrate 210 is high, and the first circuit board 100 has low requirements on the production process, before the pins 220 are soldered to the solder holes in a matching manner, the circuit boards of two different production processes can be separately processed, that is, the first circuit board 100 with low requirements on the production process can be produced by using a low-standard process to save the process, and the second circuit board 200 with high requirements on the production process and the connector 230 can be produced by using a high-standard process to achieve better compatibility between the production cost and different process requirements.

In order to improve the horizontal flatness and stability of the second circuit board 200, the pins 220 are designed to penetrate through the second substrate 210 to realize two-end pin-out. In the embodiment, the height H3 of the end of the contact pin 220 penetrating through the solder hole and protruding out of the first substrate 110 is 1.5 mm-8 mm, when H3 is smaller than 1.5mm, due to processing and assembling errors, the axial matching length of the contact pin 220 and the solder hole is insufficient, so that the welding firmness of the contact pin 220 and the solder hole is reduced, and the contact pin 220 is easy to fall off; when H3 is larger than 8mm, the cost of the pin 220 material is increased and the overall size of the circuit board assembly is too large; height H3 is preferably 3mm for this embodiment, so the design, can guarantee the welding firmness of contact pin 220 and solder hole, can effectively reduce material cost and circuit board assembly's overall size again. Of course, alternatively, height H3 may also be, but is not limited to, 1.5mm, 2mm, 2.5mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, or the like.

In addition, the height h of the insertion pin 220 protruding from the second substrate 210 through the end of the solder hole is 1.5mm to 8 mm. When h is smaller than 1.5mm, one end of the contact pin cannot penetrate through the welding hole, so that later welding is not facilitated; when h is larger than 8mm, the material cost of the contact pin 220 is increased and the overall size of the circuit board assembly is too large; therefore, h in the embodiment is preferably 6mm, and the design can facilitate the welding and fixing of the pins 220 and the welding holes, and can effectively reduce the material cost and the overall size of the circuit board assembly. Of course, alternatively, the height h may also be, but is not limited to, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6.5mm, 7mm, 7.5mm, 8mm, or the like.

In this embodiment, the connector 230 on the second circuit board 200 is an FPC socket that is connected to a terminal by plugging so as to transmit an electrical signal, the FPC socket is electrically connected to the second circuit component by pins, and the distance between the adjacent pins is 0.05mm to 0.35 mm. When the pin pitch of the FPC socket is above 0.5mm, the FPC socket can be manufactured together with the first circuit board 100 by the same process, and when the pin pitch is below 0.35mm, because the pin pitch is too small, the FPC socket and the second circuit board 200 must be connected by another standard process, and the pin pitch is varied from 0.05mm to 0.35mm, which is determined according to different product requirements. The first substrate 110 is provided with a first through hole 111 for avoiding the connector 230. By such design, the height of the whole circuit board assembly can be further reduced, and the connector 230 can be exposed to the first substrate 110 for electrical connection with other structures.

In order to improve the structural stability of the circuit board assembly, the height of the portion of the interposer 220 between the first substrate 110 and the second substrate 210 is H1, the height of the connector 230 protruding from the second substrate 210 is H2, and H1< H2, so that the connector 230 can be inserted into and mated with the first through hole 111, thereby improving the connection reliability of the first circuit board 100 and the second circuit board 200.

In addition, in the embodiment, the connector 230 passes through one end of the first through hole 111 and protrudes out of the height H4 of the first substrate 110, and H4 is not less than H3. By such design, the pins 220 can effectively protect the connector 230 structurally, so as to prevent the connector 230 from being damaged by other structures.

In this embodiment, at least two parallel rows of pins 220 are soldered to the second substrate 210, preferably two rows of pins 220 arranged in parallel and oppositely are soldered to the second substrate, and the connector 230 is located between the two rows of pins 220. By the design, the protection effect of the pin header 220 on the connector 230 can be improved, the two rows of pins 220 can be isolated through the connector 230, and short circuit of tin liquid connection during welding is avoided.

It can be understood that four rows of pins can be welded on the second substrate, the four rows of pins are distributed in a rectangular shape, and the connector is arranged in an area surrounded by the four rows of pins.

Wherein, the distance L between two adjacent pins 220 in each row of pins 220 is between 1.5mm and 7.5 mm. When L is smaller than 1.5mm, the creepage distance between the two contact pins 220 is short, and the sparking phenomenon is easy to occur; when L is greater than 7.5mm, the sizes of the first circuit board 100 and the second circuit board 200 are increased; therefore, the L in this embodiment is preferably 2.5-4.5mm, and thus, the creepage distance between the two pins 220 can be ensured, the sparking phenomenon can be avoided, the structural compactness can be improved, and the sizes of the first circuit board 100 and the second circuit board 200 can be reduced. Of course, alternatively, L may also be, but is not limited to, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, or the like.

In order to further improve the production efficiency of the circuit board assembly, the support sleeve 240 is sleeved on the insertion pin 220 in this embodiment, the support sleeve 240 is an insulating resin, and the support sleeve 240 abuts against between the first circuit board 100 and the second circuit board 200. By the design, the height precision of the pin 220 penetrating through the welding hole and protruding out of the first substrate 110 can be ensured through the support sleeve 240, multiple times of adjustment in the assembling process is omitted, and therefore the production efficiency is improved.

Finally, in this embodiment, the first circuit board 100 is further provided with a processing module 130 electrically connected to the first circuit assembly 120, the processing module may be a control module such as a microprocessor, and may also include a WIFI module, a bluetooth module, and other communication modules, the back of the processing module is provided with a detection end 131 for burning or testing, and the first substrate 110 is provided with a second through hole 112 for exposing the detection end 131. By the design, the probe can conveniently detect the detection end 131, convenience is provided for subsequent program upgrading, firmware modification and the like, and the probe does not need to be detached and welded again after burning.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that the present invention includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification which does not depart from the functional and structural principles of the present invention is intended to be included within the scope of the claims.

Claims

1. The utility model provides a circuit board assembly, includes first circuit board and second circuit board, first circuit board includes first base plate, be equipped with first circuit assembly on the first base plate and with first circuit assembly electric connection's welding hole, its characterized in that, the second circuit board includes the second base plate and welds the connector on the second base plate, still be equipped with on the second base plate with connector electric connection's second circuit assembly and contact pin, the contact pin with welding hole cooperation and welded fastening.

2. The circuit board assembly of claim 1, wherein the height of the pin protruding from the first substrate or the second substrate through one end of the solder hole is 1.5mm to 8 mm.

3. The circuit board assembly of claim 1, wherein the first substrate has a first through hole for avoiding the connector, and the connector is disposed corresponding to the first through hole.

4. The circuit board assembly of claim 3, wherein the pins are positioned between the first substrate and the second substrate at a height H1, the connector protrudes from the second substrate at a height H2, H1< H2.

5. The circuit board assembly of claim 4, wherein the height of the pin protruding from the first substrate through the end of the solder hole is H3, the height of the connector protruding from the first substrate through the end of the first through hole is H4, and H4 ≦ H3.

6. The circuit board assembly of claim 3, wherein the connector is an FPC socket, the FPC socket is electrically connected to the second circuit assembly through pins, and a gap between adjacent pins is 0.05mm to 0.35 mm.

7. The circuit board assembly of claim 3, wherein said second substrate has at least two rows of said pins soldered thereto, said connector being positioned between two opposing rows of said pins.

8. The circuit board assembly of claim 6, wherein the distance between two adjacent pins in each row of pins is between 1.5mm and 7.5 mm.

9. A circuit board assembly according to any one of claims 1 to 7, wherein the pin housing is provided with a support sleeve which abuts between the first and second circuit boards.

10. The circuit board assembly according to one of claims 1 to 7, wherein the first circuit board further has a processing module electrically connected to the first circuit assembly, a detection terminal for recording or testing is disposed on a back surface of the processing module, and the first substrate has a second through hole for exposing the detection terminal.