CN110601552A - High-integration intelligent power module and electrical equipment - Google Patents
High-integration intelligent power module and electrical equipment Download PDFInfo
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- CN110601552A CN110601552A CN201810610942.XA CN201810610942A CN110601552A CN 110601552 A CN110601552 A CN 110601552A CN 201810610942 A CN201810610942 A CN 201810610942A CN 110601552 A CN110601552 A CN 110601552A
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
Abstract
The invention discloses a high-integration intelligent power module and electrical equipment, wherein the high-integration intelligent power module comprises: the circuit board comprises a circuit wiring substrate, a first board surface and a second board surface, wherein the first board surface and the second board surface are oppositely arranged, and a plurality of mounting positions are arranged on the first board surface and the second board surface; the control module is correspondingly arranged on the mounting position of the first board surface; the rectifier bridge, the PFC power switch module and the power modules are respectively and correspondingly arranged on the installation position of the second board surface; the control module is electrically connected with the PFC power switch module through respective installation positions and circuit wiring in the circuit wiring substrate; the control module is electrically connected to the plurality of power modules through the respective mounting positions and the circuit wiring inside the circuit wiring substrate. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the components are more, the assembly is complex, the power consumption of the electric control board is larger, the heating is serious, the heat efficiency of the air conditioner is low, and the energy conservation and emission reduction of the air conditioner are not facilitated.
Description
Technical Field
The invention relates to the technical field of electronic circuits, in particular to a high-integration intelligent power module and electrical equipment.
Background
With the development of scientific and technological progress and social productivity, the problems of resource excessive consumption, environmental pollution, ecological destruction, climate warming and the like are increasingly prominent, and the green development, energy conservation and emission reduction become the transformation development direction of various enterprises and industrial fields. Therefore, how to reduce energy consumption of refrigeration equipment with large energy consumption, such as air conditioners, refrigerators and the like, and energy conservation becomes an effort direction of researchers.
Disclosure of Invention
The invention mainly aims to provide a highly-integrated intelligent power module and electrical equipment, and aims to improve the integration level of the integrated intelligent power module, realize the integrated drive control of a fan and a compressor, reduce the volume of an electric control board, facilitate the installation, and realize energy conservation and emission reduction.
To achieve the above object, the present invention provides a highly integrated smart power module, which includes:
the circuit board comprises a circuit wiring substrate, a first circuit board and a second circuit board, wherein the circuit wiring substrate is provided with a first board surface and a second board surface which are oppositely arranged, and a plurality of mounting positions are arranged on the first board surface and the second board surface;
the control module is correspondingly arranged on the installation position of the first board surface;
the rectifier bridge, the PFC power switch module and the power modules are respectively and correspondingly arranged on the installation position of the second board surface;
the control module is electrically connected with the PFC power switch module through respective installation positions and circuit wiring inside the circuit wiring substrate; the control module and the plurality of power modules are electrically connected to each other through the respective mounting positions and the circuit wiring inside the circuit wiring substrate.
Optionally, the highly integrated smart power module further includes a first insulating layer covering the rectifier bridge, the PFC power switch module, and the plurality of power modules.
Optionally, the highly integrated smart power module further includes a first heat dissipation layer disposed on a side of the first insulating layer away from the circuit wiring substrate.
Optionally, the highly-integrated smart power module further includes a package housing that packages the circuit wiring substrate, the first heat dissipation layer, the first insulating layer, the control module, the rectifier bridge, the PFC power switch module, and the plurality of power modules.
Optionally, the first heat dissipation layer is located inside the package housing or at least partially exposed outside the package housing.
Optionally, the highly integrated smart power module further comprises a second insulating layer covering the control module.
Optionally, the highly integrated smart power module further includes a second heat dissipation layer disposed on a side of the second insulation layer away from the circuit wiring substrate.
Optionally, the second heat dissipation layer is located inside the package housing or at least partially exposed outside the package housing.
Optionally, the plurality of power modules includes at least a fan drive power module and a compressor drive power module.
The invention also provides electric equipment which comprises the high-integration intelligent power module; the highly integrated smart power module includes: the circuit board comprises a circuit wiring substrate, a first circuit board and a second circuit board, wherein the circuit wiring substrate is provided with a first board surface and a second board surface which are oppositely arranged, and a plurality of mounting positions are arranged on the first board surface and the second board surface;
the control module is correspondingly arranged on the installation position of the first board surface; the rectifier bridge, the PFC power switch module and the power modules are respectively and correspondingly arranged on the installation position of the second board surface; the control module is electrically connected with the PFC power switch module through respective installation positions and circuit wiring inside the circuit wiring substrate; the control module and the plurality of power modules are electrically connected to each other through the respective mounting positions and the circuit wiring inside the circuit wiring substrate.
Optionally, the electrical appliance is an air conditioner or a refrigerator.
The high-integration intelligent power module is characterized in that the control module, the rectifier bridge, the PFC power switch module and the power modules are respectively and integrally arranged on two sides of the circuit wiring substrate, no lead is required to be connected, the distances between the control module and the rectifier bridge, between the PFC power switch module and between the control module and the power modules can be shortened, electromagnetic interference caused by overlong jumper wires and excessive jumper wires can be reduced, in addition, the functional modules are integrated on one circuit wiring substrate, the integration level of the integrated intelligent power module can be improved, and the integrated drive control of a plurality of loads such as a fan and a compressor can be realized, so that the volume of an electric control board is reduced, and the installation is convenient. Meanwhile, the components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the number of components is large, so that the electric control board is difficult to assemble when being assembled to electric equipment, and the heat efficiency of the air conditioner is low, and the air conditioner is not beneficial to realizing energy conservation and emission reduction due to large power consumption, serious heating and the like of the air conditioner.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a highly integrated smart power module according to an embodiment of the present invention;
FIG. 2 is a schematic circuit diagram of an embodiment of a highly integrated smart power module according to the present invention;
fig. 3 is a schematic structural diagram of an embodiment of the control module in fig. 2.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Circuit wiring board | 12 | Fan power driving chip |
| 110 | The first plate surface | 13 | Compressor power driving chip |
| 120 | Second plate surface | 40 | Multiple power modules |
| 130 | Pin | 50 | A first insulating layer |
| 10 | Control module | 60 | First heat dissipation layer |
| 20 | Rectifier bridge | 70 | Packaging shell |
| 30 | PFC power switch module | 80 | A second insulating layer |
| 11 | PFC driving chip | 90 | Second heat dissipation layer |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a high-integration intelligent power module which is suitable for electrical equipment such as an air conditioner, a refrigerator and the like.
In many electrical appliances such as air conditioners, washing machines, refrigerators, and the like, motors are provided to drive other loads to operate. For example, a conventional air conditioner generally includes an indoor unit and an outdoor unit, wherein the outdoor unit and the indoor unit are both provided with a motor and an electric control board for driving the motor to operate. Regarding the electric control board of the outdoor unit, the electric control board of the outdoor unit is mostly provided with an intelligent power module for driving the compressor, an intelligent power module for driving the fan, a main control module, a power module and other functional modules. These functional modules adopt the circuit module of discrete or partial integration to realize mostly, and the scattered each part of arranging at automatically controlled PCB board, but because automatically controlled board self structure, strong and weak electric isolation, prevent signal interference, heat dissipation etc. requirement, require the interval between each functional module to guarantee in safe distance for the automatically controlled board of off-premises station's volume is great, is unfavorable for the installation. Or disperse these on polylith circuit board, adopt the mode of wire jumper again to realize between main control module and other functional modules to and mutual electrical connection between each functional module, but the dispersion sets up each functional module and can lead to the wire jumper more and long, leads to electrical apparatus EMC performance to descend. And the electric control board of these two kinds of structures all can appear the device of electric control board more, lead to the assembly of off-premises station complicated, still can increase the manufacturing cost of air conditioner simultaneously, and the maintenance rate also can increase, is unfavorable for the stable use of air conditioner. More importantly, when the electric control board is realized by adopting a plurality of components, the energy consumption of the components is large, the heating is serious, the heat efficiency of the air conditioner is low, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated.
In order to solve the above problem, referring to fig. 1, in an embodiment of the present invention, the circuit wiring substrate 100 of the highly integrated smart power module 40 includes:
a circuit wiring substrate 100, wherein the circuit wiring substrate 100 has a first plate surface 110 and a second plate surface 120 which are oppositely arranged, and a plurality of mounting positions (not shown) are arranged on both the first plate surface 110 and the second plate surface 120;
the control module 10 is correspondingly installed on the installation position of the first board surface 110;
the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 are respectively and correspondingly mounted on the mounting positions of the second board surface 120;
wherein, the control module 10 and the PFC power switch module 30 are electrically connected with the circuit wiring inside the circuit wiring substrate 100 through respective mounting positions; the control module 10 and the plurality of power modules 40 are electrically connected to each other through the circuit wiring in the circuit wiring board 100 by their respective mounting positions.
Referring to fig. 2, fig. 2 is a schematic circuit diagram of an embodiment of a highly integrated smart power module; the input end of the rectifier bridge 20 is used for accessing an alternating current power supply, and the output end of the rectifier bridge 20 is connected with the input end of the PFC power switch module 30; the output end of the PFC power switch module 30 is connected to the power input ends of the plurality of power modules 40; the control terminals of the control module 10 are connected to the controlled terminal of the PFC power switch module 30 and the controlled terminals of the power modules 40 in a one-to-one correspondence.
In this embodiment, the circuit wiring substrate 100 is a mounting substrate of a double-sided copper-clad plate, the first plate 110 is a top layer, the second plate 120 is a bottom layer, the top layer and the bottom layer are both provided with circuit wiring and mounting positions, i.e., pads, and the circuit wiring on the top layer and the circuit wiring on the bottom layer can be connected through vias through conductive processing. The circuit wiring is formed by forming corresponding lines and pads on the circuit wiring substrate 100 according to the circuit design of the highly integrated smart power module 40, and the circuit wiring may be specifically realized by copper foil laying, and etching the copper foil according to the preset circuit design, thereby forming a circuit wiring layer. When the circuit wiring substrate 100 is manufactured, a certain via hole may be formed in the circuit wiring, and a metal material or other conductive material is laid on the inner wall surface of the via hole to form a conductive via hole, so as to connect the top-layer and bottom-layer printed circuit wiring, so that the control module 10 and the PFC power switch module 30 are electrically connected through their respective mounting positions and the circuit wiring inside the circuit wiring substrate 100, that is, the conductive via hole; and the control module 10 and the plurality of power modules 40 are electrically connected to the circuit wiring inside the circuit wiring board 100 through the respective mounting positions. The shape of the circuit wiring substrate 100 may be determined according to the specific positions and sizes of the control module 10 and the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 respectively disposed on both sides of the circuit wiring substrate 100, and may be a square shape, but is not limited thereto.
It can be understood that, in fig. 1, the arrangement positions of the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 on the second board surface 120 are only exemplary and are not used for limiting the positional relationship of the three, that is, in the practical application process, a person skilled in the art may adaptively adjust the positions of the three according to the practical requirements, and the number of the elements in the control module 10, the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 may be 1 or more, and the number shown in fig. 1 is also not used for the number of the elements in the circuit modules.
In this embodiment, the rectifier bridge 20 may be implemented by combining four surface mount diodes, and the rectifier bridge 20 formed by the four surface mount diodes converts the input ac power into dc power and outputs the dc power.
In this embodiment, the PFC power switch module 30 may be implemented by only a PFC switch, or may further form a PFC circuit with other components such as a diode and an inductor to implement power factor correction on the dc power supply. The PFC circuit may be implemented by a passive PFC circuit to form a boost PFC circuit, a buck PFC circuit, or a boost PFC circuit. It is understood that, in practical applications, the positions and the connection relationship between the PFC power switch module 30 and the rectifier bridge 20 may be adaptively adjusted according to the setting type of the PFC circuit, and are not limited herein. The PFC power switch module 30 adjusts the power factor of the dc power input by the rectifier bridge 20 based on the control of the control module 10, and the adjusted dc power may generate driving voltages of various values, for example, voltages of 5V and 15V, through an external switching power circuit, and be respectively used for supplying power to the MCU and each IPM driver IC.
In this embodiment, the control module 10 may have a driving circuit unit and a control circuit unit, the driving circuit unit further integrates a real-time detection circuit capable of continuously detecting parameters such as current, temperature, and voltage of each element in the rectifier bridge 20, the PFC power switch module 30, and the power module 40, and when a fault such as a severe overload, a direct short circuit, or an overheating temperature, and an overvoltage of driving voltage occurs, the control circuit unit can control the soft turn-off of the power device in the power module 40, and simultaneously send a fault signal to the control circuit unit, so that the control circuit unit controls the other circuit modules to operate, thereby preventing the other circuit modules from being damaged due to the fault. In addition, a bridge arm pair tube interlocking circuit and a driving power supply under-voltage protection circuit can be further integrated in the control module 10, so that the power module 40 can be ensured to run safely and stably.
In this embodiment, each power module 40 is integrated with a plurality of power switching tubes, and the plurality of power switching tubes form a driving inverter circuit, for example, six power switching tubes form a three-phase inverter bridge circuit, or four power switching tubes form a two-phase inverter bridge circuit. Each power switch tube can be realized by adopting an MOS tube or an IGBT.
It should be noted that, the power devices in the power module 40 generally generate heat seriously, and the heat generated by the power devices is conducted to the control module 10 through the substrate, so that the temperature of the control module 10 is almost the same as the temperature of the control module 10. However, the ideal operating temperature of the control module 10 is mostly lower than that of the power device, so that the operating temperature of the chip in the control module 10 is too high to cause a failure, so that the chip in the control module 10 is prone to output an erroneous control signal, in order to avoid the above problem, the circuit wiring substrate 100 in this embodiment may be made of a material with a good heat insulation effect, such as a glass fiber board, and the control module 10 and the power module 40 are separately disposed on two sides of the circuit wiring substrate 100. By such arrangement, the distance between the control module 10 and the power module 40 can be shortened, the driving delay is small, the switching speed of each power switching tube in the power module 40 can be increased, the switching loss and the electromagnetic interference of the power module 40 can be reduced, and the power module 40 can be ensured to operate reliably for a long time.
In this embodiment, the highly integrated intelligent power module 40 is configured with the circuit wiring substrate 100, the control module 10 is correspondingly mounted on the mounting position of the first board surface 110, and the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 are respectively and correspondingly mounted on the mounting position of the second board surface 120, and the control module 10 and the PFC power switch module 30 are electrically connected with the circuit wiring inside the circuit wiring substrate 100 through the respective mounting positions; the control module 10 and the plurality of power modules 40 are electrically connected to each other through the circuit wiring inside the circuit wiring board 100 by the mounting positions thereof. And through the control module 10, the PFC power switch module 30 is driven to correct the dc voltage output by the rectifier bridge 20 and output the corrected dc voltage to the control module 10, so as to provide a stable working voltage for the control module 10, and at the same time, the dc power supply with the corrected power factor is output to each power module 40, and a corresponding control signal is output from the control module 10, so as to control the plurality of power modules 40 to drive corresponding loads to work.
In the invention, the control module 10, the rectifier bridge 20, the PFC power switch module 30 and the power modules 40 are respectively and integrally arranged at two sides of the circuit wiring substrate 100, no lead wire is required to be connected, the distances between the control module 10 and the rectifier bridge 20, between the PFC power switch module 30 and the power modules 40 can be shortened, and the electromagnetic interference caused by overlong jumper wires and excessive jumper wires can be reduced, in addition, the functional modules are integrated on one circuit wiring substrate 100, the integration level of the integrated intelligent power module 40 can be improved, the integrated drive control of a plurality of loads, such as a fan and a compressor, is realized, so the volume of an electric control board is reduced, and the installation is convenient. Meanwhile, the components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the number of components is large, so that the electric control board is difficult to assemble when being assembled to electric equipment, and the heat efficiency of the air conditioner is low, and the air conditioner is not beneficial to realizing energy conservation and emission reduction due to large power consumption, serious heating and the like of the air conditioner.
Referring to fig. 1 and 3, in an alternative embodiment, the number of the power modules 40 is two, and the power modules are a fan driving power module 41 and a compressor driving power module 42.
In this embodiment, the fan driving power module 41 integrated in the high-integration intelligent power module 40 is used for driving the wind wheel motor, and the compressor driving power module 42 is used for driving the compressor motor, but in other embodiments, the power module 40 may also be used for driving frequency converters and various inverter power supplies of other motors, and is applied to the fields of variable frequency speed regulation, metallurgical machinery, electric traction, servo driving, and variable frequency household appliances such as air conditioners. The fan driving power module 41 and the compressor driving power module 42 are respectively integrated with a plurality of power switching tubes such as IGBTs and MOS tubes, the number of the plurality of power switching tubes may be four or six, the specific number may be set according to the type of the motor, the driving power, and the like, and the present disclosure is not limited thereto.
Referring to fig. 1 to 3, in an alternative embodiment, the control module 10 includes an MCU, a PFC driver chip 11, a fan power driver chip 12, and a compressor power driver chip 13, where a first control end of the MCU is connected to a signal input end of the PFC driver chip 11; a plurality of second control ends of the MCU are correspondingly connected with a plurality of signal input ends of the fan power driving chip 12 one by one; a plurality of third control ends of the MCU are connected with a plurality of signal input ends of the compressor power driving chip 13 in a one-to-one correspondence manner; a plurality of output ends of the fan power driving chip 12 are connected with a plurality of controlled ends of the fan driving power module 40 in a one-to-one correspondence manner; a plurality of output terminals of the compressor power driving chip 13 are connected to a plurality of controlled terminals of the compressor driving power module 40 in a one-to-one correspondence.
In this embodiment, the MCU is integrated with a timing controller, a memory, a data processor, and a software program and/or module stored in the memory and operable on the data processor, and outputs a corresponding timing control signal to the PFC driver chip 11, the fan power driver chip 12, and the compressor power driver chip 13 by operating or executing the software program and/or module stored in the memory and calling the data stored in the memory, so that the PFC driver chip 11 converts the received timing control signal into a corresponding driving signal to drive the power switch tube in the PFC power switch module 30 to operate. The fan power driving chip 12 converts the received timing control signal into a corresponding driving signal to drive the corresponding power switching tube in the fan power driving chip 12 to turn on/off, thereby driving the fan to work. And the compressor power driving chip 13 converts the received timing control signal into a corresponding driving signal to drive the corresponding power switch tube in each power module 40 to turn on/off, so as to drive the compressor to work.
Referring to fig. 1 to 3, in an alternative embodiment, the highly integrated smart power module 40 further includes a first insulating layer 50 disposed to cover the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40.
In this embodiment, the first insulating layer 50 may be made of insulating materials such as insulating glue, silicon nitride, and organic insulating film, for example, when the insulating glue is used for implementation, the insulating glue may be covered on the rectifier bridge 20, the PFC power switch module 30, the power modules 40, and other elements to reflect external electromagnetic interference, so as to prevent external electromagnetic radiation from interfering with normal operation of the rectifier bridge 20, the PFC power switch module 30, and the power modules 40, and reduce interference influence of electromagnetic radiation in the surrounding environment on electronic elements in the highly integrated smart power module 40. Or to achieve electrical isolation of non-electrically connected portions between the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40.
Referring to fig. 1 to 3, in an alternative embodiment, the highly integrated smart power module 40 further includes a first heat dissipation layer 60, where the first heat dissipation layer 60 is disposed on a side of the first insulating layer 50 facing away from the circuit wiring substrate 100.
In this embodiment, the first heat dissipation layer 60 may be made of a material such as a copper or aluminum substrate or ceramic, or a heat dissipation layer formed by mixing the above materials. The first heat dissipation layer 60 can be in contact with the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 through the first insulation layer 50, so that heat generated by the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 can be conducted to the first heat dissipation layer 60 through the first insulation layer 50, and the power heat dissipation capability of the highly integrated intelligent power is improved. The first heat dissipation layer 60 and the first insulating layer 50 may be formed by integrally pressing ceramic and metal, and the heat dissipation capability of the highly integrated smart power module 40 is accelerated by the high insulation property and the high thermal conductivity of the ceramic.
Referring to fig. 1 to 3, in an alternative embodiment, the highly integrated smart power module 40 further includes a package housing 70 for packaging the circuit wiring substrate 100, the first heat dissipation layer 60, the first insulating layer 50, the control module 10, the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40.
In the present embodiment, the package housing 70 may be a resin holder of an epoxy resin molding compound, and the package housing 70 may be formed of any one of a thermosetting material and a thermoplastic material.
Specifically, the package housing 70 may be covered on the first heat dissipation layer 60, and the circuit wiring substrate 100, the first insulating layer 50, the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 are packaged in the package housing 70, and a surface of the first heat dissipation layer 60 is entirely or partially exposed outside the package housing 70, so as to accelerate heat dissipation of each component. Or the package housing 70 is wrapped around the circuit wiring substrate 100, the first heat dissipation layer 60, the first insulating layer 50, the control module 10, the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40, so that the package housing 70 is integrally formed with the circuit wiring substrate 100, the control module 10, the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40. When the package case 70 is integrally formed with the circuit wiring board 100, the first heat dissipation layer 60, the first insulating layer 50, the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40, the package case may be integrally formed by a plastic molding or potting process.
It is understood that, in the above alternative embodiment, the first heat dissipation layer 60 may be located inside the package housing 70, or at least partially exposed outside the package housing 70, and when the first heat dissipation layer 60 is located inside the package housing 70, after the heat generated by the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 is conducted to the first heat dissipation layer 60 through the first insulating layer 50, and then conducted to the package housing 70 through the first heat dissipation layer 60, the heat is conducted to the air through the package housing 70, so as to accelerate the heat dissipation rate of the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40. Or one side of the first heat dissipation layer 60 is partially or completely exposed outside the package housing 70, so that the heat generated by the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 is conducted to the first heat dissipation layer 60 through the first insulation layer 50, and then directly dissipated to the air through the first heat dissipation layer 60, thereby further increasing the contact area between the heat and the air and increasing the heat dissipation rate.
Referring to fig. 1-3, in an alternative embodiment, the highly integrated smart power module 40 further includes a second insulating layer 80 covering the control module 10.
In this embodiment, the second insulating layer 80 may be made of insulating materials such as insulating glue, silicon nitride, and organic insulating film, for example, when the insulating glue is used for implementation, the insulating glue may be covered on the rectifier bridge 20, the PFC power switch module 30, the power modules 40, and other elements to reflect external electromagnetic interference, so as to prevent external electromagnetic radiation from interfering with normal operation of the rectifier bridge 20, the PFC power switch module 30, and the power modules 40, and reduce interference influence of electromagnetic radiation in the surrounding environment on electronic elements in the highly integrated smart power module 40. Or to achieve electrical isolation of non-electrically connected portions between the control module 10 and other components.
Referring to fig. 1 to 3, in an alternative embodiment, the highly integrated smart power module 40 further includes a second heat dissipation layer 90, where the second heat dissipation layer 90 is disposed on a side of the second insulation layer 80 away from the circuit wiring substrate 100.
In this embodiment, the second heat dissipation layer 90 may be made of a material such as copper or aluminum substrate, or ceramic, or a mixture of the above materials. The second heat dissipation layer 90 can be in contact with the control module 10 through the second insulation layer 80, so that heat generated by the control module 10 is conducted from the second insulation layer 80 to the second heat dissipation layer 90, and the power heat dissipation capability of the high-integration intelligent power is improved. The second heat dissipation layer 90 and the second insulation layer 80 may be formed by integrally pressing ceramic and metal, and the heat dissipation capability of the highly integrated smart power module 40 is accelerated by the high insulation property and the high thermal conductivity of the ceramic.
It is understood that the material, thickness and position of the first heat dissipation layer 60 and the second heat dissipation layer 80 may be different or the same, and may be specifically set according to the amount of heat generated by the control module 10, the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40, which is not limited herein.
Referring to fig. 1 to 3, it can be understood that, in the above alternative embodiment, the second heat dissipation layer 90 may be located inside the package housing 70 or at least partially exposed outside the package housing 70, and when the second heat dissipation layer 90 is located inside the package housing 70, after the heat generated by the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 is conducted to the second heat dissipation layer 90 through the second insulation layer 80, and then conducted to the package housing 70 through the second heat dissipation layer 90, the heat is conducted to the air through the package housing 70, so as to accelerate the heat dissipation rate of the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40. Or one side of the second heat dissipation layer 90 is partially or completely exposed outside the package housing 70, so that the heat generated by the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 is conducted to the second heat dissipation layer 90 through the second insulation layer 80, and then directly dissipated to the air through the second heat dissipation layer 90, thereby further increasing the contact area between the heat and the air and improving the heat dissipation rate.
Referring to fig. 1 to 3, in a preferred embodiment, the highly integrated smart power module further includes a plurality of pins 130, and the plurality of pins 130 are disposed on the mounting positions corresponding to the first board surface 110 and electrically connected to the control module 10 through circuit wiring, or disposed on the mounting positions corresponding to the second board surface 120 and respectively connected to the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 through circuit wiring.
In this embodiment, the pins 130 may be gull-wing shaped or straight-through type, the plurality of pins 130 are soldered on the first board surface 110 or the second board surface 120 of the circuit wiring substrate 100, specifically, at the pad positions on the corresponding mounting positions, and are electrically connected to the control module 10, the rectifier bridge 20, the PFC power switch module 30, the plurality of power modules 40, and the like through circuit wiring.
The invention also provides electrical equipment which comprises the high-integration intelligent power module. The detailed structure of the highly integrated intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the air conditioner of the present invention uses the above-mentioned high-integration intelligent power module, the embodiments of the air conditioner of the present invention include all technical solutions of all embodiments of the above-mentioned high-integration intelligent power module, and the achieved technical effects are also completely the same, and are not described herein again.
In this embodiment, the electrical equipment may be refrigeration equipment such as an air conditioner and a refrigerator.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (11)
1. A highly integrated smart power module, comprising:
the circuit board comprises a circuit wiring substrate, a first circuit board and a second circuit board, wherein the circuit wiring substrate is provided with a first board surface and a second board surface which are oppositely arranged, and a plurality of mounting positions are arranged on the first board surface and the second board surface;
the control module is correspondingly arranged on the installation position of the first board surface;
the rectifier bridge, the PFC power switch module and the power modules are respectively and correspondingly arranged on the installation position of the second board surface;
the control module is electrically connected with the PFC power switch module through respective installation positions and circuit wiring inside the circuit wiring substrate; the control module and the plurality of power modules are electrically connected to each other through the respective mounting positions and the circuit wiring inside the circuit wiring substrate.
2. The highly integrated smart power module of claim 1 further comprising a first insulating layer disposed overlying the rectifier bridge, PFC power switch module, and plurality of power modules.
3. The highly integrated smart power module of claim 2 further comprising a first heat dissipation layer disposed on a side of the first insulating layer facing away from the circuit wiring substrate.
4. The highly integrated smart power module of claim 3 further comprising a package housing that encapsulates the circuit wiring substrate, first heat spreading layer, first insulating layer, control module, rectifier bridge, PFC power switch module, and plurality of power modules.
5. The highly integrated smart power module of claim 4, wherein the first heat spreading layer is inside the package housing or at least partially exposed outside the package housing.
6. The highly integrated smart power module of any of claims 1 to 5, further comprising a second insulating layer covering the control module.
7. The highly integrated smart power module of claim 6 further comprising a second heat dissipation layer disposed on a side of the second insulating layer facing away from the circuit wiring substrate.
8. The highly integrated smart power module of claim 7 wherein the second heat spreading layer is inside the package housing or at least partially exposed outside the package housing.
9. The highly integrated smart power module according to any one of claims 1 to 8, wherein the plurality of power modules includes at least a fan drive power module and a compressor drive power module.
10. An electrical device comprising a highly integrated smart power module according to any of claims 1 to 9.
11. The electrical apparatus of claim 10, wherein the electrical apparatus is an air conditioner or a refrigerator.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810610942.XA CN110601552A (en) | 2018-06-13 | 2018-06-13 | High-integration intelligent power module and electrical equipment |
| PCT/CN2018/112733 WO2019237637A1 (en) | 2018-06-13 | 2018-10-30 | Highly integrated intelligent power module and electrical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810610942.XA CN110601552A (en) | 2018-06-13 | 2018-06-13 | High-integration intelligent power module and electrical equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110601552A true CN110601552A (en) | 2019-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810610942.XA Pending CN110601552A (en) | 2018-06-13 | 2018-06-13 | High-integration intelligent power module and electrical equipment |
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| Country | Link |
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| CN (1) | CN110601552A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024045522A1 (en) * | 2022-08-31 | 2024-03-07 | 广东美的制冷设备有限公司 | Controller, air conditioner outdoor unit, and air conditioner |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07162120A (en) * | 1993-12-09 | 1995-06-23 | Japan Aviation Electron Ind Ltd | Circuit connection method for flexible printed wiring board and flexible printed wiring board |
| CN1187751A (en) * | 1997-01-09 | 1998-07-15 | 株式会社东芝 | Printed circuit board for large current |
| CN202111629U (en) * | 2011-06-30 | 2012-01-11 | 山东朗进科技股份有限公司 | Universal intelligent power module |
| CN103236422A (en) * | 2013-03-29 | 2013-08-07 | 广东美的制冷设备有限公司 | Intelligent power module and manufacturing method thereof |
| JP2015100223A (en) * | 2013-11-20 | 2015-05-28 | 日産自動車株式会社 | Electric power conversion system |
| CN104753338A (en) * | 2013-12-25 | 2015-07-01 | 台达电子企业管理（上海）有限公司 | Power electronic circuit and power module |
| WO2016147345A1 (en) * | 2015-03-18 | 2016-09-22 | 株式会社テーケィアール | Power supply module and air conditioner outdoor unit using same |
| US20160366780A1 (en) * | 2015-06-09 | 2016-12-15 | Delta Electronics, Inc. | Power modules and pin thereof |
| CN206314057U (en) * | 2016-12-13 | 2017-07-07 | 许昌学院 | A kind of pcb board for preventing EMI |
| CN208257677U (en) * | 2018-06-13 | 2018-12-18 | 重庆美的制冷设备有限公司 | Highly integrated intelligent power module and electrical equipment |
-
2018
- 2018-06-13 CN CN201810610942.XA patent/CN110601552A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07162120A (en) * | 1993-12-09 | 1995-06-23 | Japan Aviation Electron Ind Ltd | Circuit connection method for flexible printed wiring board and flexible printed wiring board |
| CN1187751A (en) * | 1997-01-09 | 1998-07-15 | 株式会社东芝 | Printed circuit board for large current |
| CN202111629U (en) * | 2011-06-30 | 2012-01-11 | 山东朗进科技股份有限公司 | Universal intelligent power module |
| CN103236422A (en) * | 2013-03-29 | 2013-08-07 | 广东美的制冷设备有限公司 | Intelligent power module and manufacturing method thereof |
| JP2015100223A (en) * | 2013-11-20 | 2015-05-28 | 日産自動車株式会社 | Electric power conversion system |
| CN104753338A (en) * | 2013-12-25 | 2015-07-01 | 台达电子企业管理（上海）有限公司 | Power electronic circuit and power module |
| WO2016147345A1 (en) * | 2015-03-18 | 2016-09-22 | 株式会社テーケィアール | Power supply module and air conditioner outdoor unit using same |
| US20160366780A1 (en) * | 2015-06-09 | 2016-12-15 | Delta Electronics, Inc. | Power modules and pin thereof |
| CN206314057U (en) * | 2016-12-13 | 2017-07-07 | 许昌学院 | A kind of pcb board for preventing EMI |
| CN208257677U (en) * | 2018-06-13 | 2018-12-18 | 重庆美的制冷设备有限公司 | Highly integrated intelligent power module and electrical equipment |
Non-Patent Citations (1)
| Title |
|---|
| 韩国栋: "《电子工艺技术基础与实训》", 31 March 2011, 国防工业出版社, pages: 257 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024045522A1 (en) * | 2022-08-31 | 2024-03-07 | 广东美的制冷设备有限公司 | Controller, air conditioner outdoor unit, and air conditioner |
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