CN210840224U

CN210840224U - Electric control assembly and air conditioner

Info

Publication number: CN210840224U
Application number: CN201921695143.3U
Authority: CN
Inventors: 刘东子; 冯宇翔
Original assignee: Midea Group Co Ltd; GD Midea Air Conditioning Equipment Co Ltd
Current assignee: Midea Group Co Ltd; GD Midea Air Conditioning Equipment Co Ltd
Priority date: 2019-10-10
Filing date: 2019-10-10
Publication date: 2020-06-23
Anticipated expiration: 2029-10-10

Abstract

The utility model discloses an automatically controlled subassembly and air conditioner, this automatically controlled subassembly includes: the electric control board is provided with an accommodating groove; the intelligent power module is at least partially embedded in the accommodating groove of the electric control board in the thickness direction. The utility model discloses be favorable to improving the fastening nature of intelligent power module and automatically controlled board.

Description

Electric control assembly and air conditioner

Technical Field

The utility model relates to an electronic circuit technical field, in particular to automatically controlled subassembly and air conditioner.

Background

In the electrical equipment provided with the frequency converter, such as an air conditioner, a refrigerator and the like, a compressor, a fan and an electric control board for controlling the components to work are generally arranged, an intelligent power module is usually arranged on the electric control board and is fixed on the electric control board through pins, and in the carrying or falling process, the intelligent power module and the electric control board move relatively to cause the intelligent power module and the circuit wiring on the electric control board to have poor contact.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an automatically controlled subassembly and air conditioner, aim at improving the fastening nature of intelligent power module and automatically controlled board.

In order to achieve the above object, the utility model provides an automatically controlled subassembly, automatically controlled subassembly includes:

the electric control board is provided with an accommodating groove;

the intelligent power module is at least partially embedded in the accommodating groove of the electric control board in the thickness direction.

Optionally, the smart power module comprises:

the mounting device comprises a mounting substrate, wherein a mounting position is arranged on one side surface of the mounting substrate;

the power assembly is arranged on the mounting position corresponding to the mounting substrate;

and the packaging shell covers the mounting substrate and is used for packaging the power assembly.

Optionally, the package housing is embedded in the accommodating groove of the electric control board.

Optionally, the mounting substrate includes:

a heat-dissipating substrate;

the circuit wiring layer is arranged on one side surface of the heat dissipation substrate and is provided with a mounting position for mounting the power switch tube; and the number of the first and second groups,

and the insulating layer is clamped between the circuit wiring layer and the heat dissipation substrate.

Optionally, the power assembly comprises:

the power switch tubes are arranged on the mounting positions corresponding to the mounting substrate;

a plurality of driving chips, each driving chip is stacked on one power switch tube

Optionally, the smart power module further includes a pin, one end of the pin is formed from the mounting substrate, the other end of the pin extends in a direction away from the mounting substrate, and the extending direction of the pin is parallel to the plane where the mounting substrate is located.

Optionally, the extending portion of the pin is attached to the electric control board.

Optionally, the electronic control assembly further includes a heat sink, and the heat sink is disposed on one side of the intelligent power module, which is far away from the electronic control board.

Optionally, the electronic control assembly further includes a main controller, a rectifier bridge, a PFC circuit, and a dc bus capacitor, the rectifier bridge, the PFC circuit, and the intelligent voltage power module are sequentially connected, the dc bus capacitor is connected in parallel to an output end of the PFC circuit, and the main controller is connected to the PFC circuit and the intelligent voltage power module, respectively.

The utility model discloses still provide an air conditioner, include as above automatically controlled subassembly.

The utility model discloses automatically controlled subassembly is through setting up the recess on automatically controlled board, make intelligent power module can partially inlay and locate automatically controlled board, intelligent power module inlays the part and the laminating of automatically controlled board of locating the recess, thereby make intelligent power module better with the fastening nature of automatically controlled board, and then prevent intelligent power module and automatically controlled board at the in-process that carries or fall, intelligent power module takes place relative motion with automatically controlled board and makes circuit wiring on intelligent power module and the automatically controlled board appear contact failure, unable normal work, perhaps lead to intelligent power module to drop from automatically controlled board, the fall loss appears, the fracture damages intelligent power module.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the electric control assembly of the present invention;

fig. 2 is a schematic structural diagram of an embodiment of the intelligent power module of the present invention;

fig. 3 is a schematic diagram of a circuit structure of an embodiment of the electronic control assembly of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Electric control board	211	Heat radiation substrate
200	Intelligent power module	212	Circuit wiring layer
				300	Main controller	213	Insulating layer
400	Rectifier bridge	220	Power assembly
				500	PFC circuit	230	Packaging shell
210	Mounting substrate	240	Pin

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The utility model provides an automatically controlled subassembly.

The electric control assembly can be used in air conditioners, refrigerators and other devices, and for convenience of understanding, the electric control assembly is described by taking the electric control assembly applied to an air conditioner as an example. In the automatically controlled subassembly of fan, compressor, can generally set up intelligent power module on automatically controlled board, intelligent power module's pin is gull wing formula pin or cut-in type pin usually, and the pin passes through soldering tin, conducting resin etc. and fixes on the pad on automatically controlled board, and nevertheless the process of this kind of pin handling and maintenance use in automatically controlled subassembly is easy for breaking. And the intelligent power module is fixed on the electric control board through pins, and in the process of carrying or falling, the intelligent power module and the electric control board move relatively to cause poor contact between the intelligent power module and the circuit wiring on the electric control board.

Referring to fig. 1, in an embodiment of the present invention, the electronic control assembly includes:

the electronic control board 100 is provided with a containing groove;

the intelligent power module 200 is arranged in the accommodating groove of the electric control board 100, and at least part of the intelligent power module 200 is embedded in the thickness direction.

In this embodiment, the receiving slot of the electronic control board 100 is used for installing the intelligent power module 200, and at least a portion of the intelligent power module 200 is embedded in the electronic control board 100, and a portion of the receiving slot embedded in the electronic control board 100 of the intelligent power module 200 may be attached to the receiving slot, or the area of the receiving slot is larger than the area of the intelligent power module 200. It can be understood that the intelligent power module 200 may be partially or completely embedded in the electronic control board 100, and may be specifically configured according to actual requirements, when the intelligent power module 200 is partially disposed in the electronic control board 100, the non-embedded portion is convexly disposed on the electronic control board 100, and the pins of the intelligent power module 200 may be attached to the electronic control board 100 and electrically connected to the circuit wiring on the surface of the electronic control board 100. When the intelligent power module 200 is completely disposed in the electronic control board 100, the electronic control board 100 may be provided with a conductive hole, a multilayer wiring, and the like, and the pins of the intelligent power module 200 may be electrically connected to the circuit wiring on the surface of the electronic control board 100 through the conductive hole, the multilayer wiring, and the like.

The intelligent power module 200 may be configured to drive loads such as a compressor motor and a fan motor, and the intelligent power module 200 integrates a plurality of power switching tubes, and the plurality of power switching tubes form a driving inverter circuit, for example, six power switching tubes form a three-phase inverter bridge circuit, or four power switching tubes form a two-phase inverter bridge circuit. Each power switch tube can be realized by adopting an MOS tube or an IGBT. The intelligent power module 200 can be used for driving frequency converters of other motors and various inverter power supplies, and can be applied to the fields of variable frequency speed regulation, metallurgical machinery, electric traction, servo drive, air conditioning and other variable frequency household appliances and the like.

Referring to fig. 3, the electronic control assembly is further provided with a main controller 300, a rectifier bridge 400, a PFC circuit 500, and a dc bus capacitor C10, the rectifier bridge 400, the PFC circuit 500, and the intelligent power module 200 are sequentially connected, the dc bus capacitor C10 is connected in parallel to an output end of the PFC circuit 500, and the main controller 300 is connected with the PFC circuit 500 and the intelligent power module 200, respectively. The electric control board is provided with circuit wiring, and the main controller 300, the rectifier bridge 400, the PFC circuit 500 and the direct current bus capacitor C10 are arranged on the corresponding bonding pads of the circuit side line and are electrically connected through the circuit wiring.

The number of the dc bus capacitors C10 may be one or more, and may be specifically set according to the number of power devices, for example, in an air conditioner with 1 or 2 pairs, the number of the dc bus capacitors C10 is generally set to one, and in an air conditioner with 3 or more than 3 pairs, the number of the dc bus capacitors C10 is generally set to two or more. Of course, in other embodiments, the number of the dc bus capacitor C10 may be set according to the energy storage requirement of the power device, and is not limited herein.

In this embodiment, the PFC circuit 500 may further include a PFC power switch, a diode (not shown), a PFC inductor, and other components, so as to correct a power factor of the dc power supply. PFC circuit 500 may be implemented using a passive PFC circuit 500 to form a boost PFC circuit 500, or a buck PFC circuit 500, or a boost PFC circuit 500. In practical applications, the positions and the connection relationship between the PFC power switch and the rectifier bridge 400 may be adaptively adjusted according to the setting type of the PFC circuit 500, and the boost PFC circuit 500 is used for the embodiment, but not limited to the boost PFC circuit 500. The PFC power switch is controlled by the main controller 300, and adjusts the power factor of the dc power input by the rectifier bridge 400, for example, the dc voltage output by the rectifier bridge 400 is increased and stabilized at 380V, so that the input current follows the input voltage, and the power factor of the dc power supply is ensured to be above 0.9. The regulated direct current is transmitted to a direct current bus capacitor C10, filtered by a direct current bus capacitor C10 and then output to a compressor IPM module, so as to serve as the compressor IPM module. The regulated dc power can also be used to generate driving voltages of various values, such as 5V and 15V, through the switching power supply circuit, so as to supply power to the main controller 300 on the electronic control board 100 and the components on the electronic control board 100. It is understood that, in order to improve the integration level of the smart power module 200 and reduce the size of the circuit board, the PFC power switch may be integrated in the smart power module 200 in the present embodiment.

The electric control board 100 is further provided with a real-time detection circuit capable of detecting parameters such as current, temperature and voltage of each element in the rectifier bridge 400, the PFC power switch and the compressor IPM module, and when faults such as serious overload, direct short circuit, overheating temperature, overvoltage of driving voltage and the like occur, the power device in the IPM module can be controlled to be in soft turn-off, and meanwhile, a fault signal is sent to the control circuit unit, so that the control circuit unit controls other circuit modules to work, and the other circuit modules are prevented from being damaged due to the faults.

The utility model discloses a set up the recess on automatically controlled board 100, make intelligent power module 200 can partially inlay and locate in automatically controlled board 100, intelligent power module 200 inlays the part of locating the recess and laminates with automatically controlled board 100, thereby make intelligent power module 200 better with automatically controlled board 100's fastening nature, and then prevent intelligent power module 200 and automatically controlled board 100 at the in-process that carries or fall, intelligent power module 200 takes place relative motion with automatically controlled board 100 and makes circuit wiring on intelligent power module 200 and the automatically controlled board 100 appear contact failure, unable normal work, or lead to intelligent power module 200 to drop from automatically controlled board 100, fall the loss appears, the fracture damages intelligent power module 200.

Referring to fig. 1 or 2, in an embodiment, the smart power module 200 includes:

a mounting substrate 210, wherein a mounting position is arranged on one side surface of the mounting substrate 210;

a power module 220 disposed on the mounting position corresponding to the mounting substrate 210;

a package casing 230, wherein the package casing 230 covers the mounting substrate 210, and the package casing 230 is used for packaging the power component 220; the package housing 230 is embedded in the receiving groove of the electronic control board 100.

In this embodiment, the power module 220 includes a power switch (not shown) and a driving chip (not shown); the power switch tube may be a gallium nitride (GaN) power switch tube, a Si-based power switch tube, or a SiC-based power switch tube, and the gallium nitride (GaN) power switch tube is preferably used in this embodiment. The number of the power switch tubes can be one or more, when the number of the power switch tubes is multiple, the power switch tubes can comprise four power switch tubes or six power switch tubes, and the six power switch tubes form an inverter circuit, so that the power switch tubes are applied to electrical equipment such as an inverter power supply, a frequency converter, refrigeration equipment, metallurgical mechanical equipment, electric traction equipment and the like, in particular to variable frequency household appliances. When the intelligent power module 200 works, the driving chip outputs a corresponding PWM control signal to drive and control the corresponding power switching tube to be turned on/off, so as to output driving power to drive the motor and other loads to work. In the embodiment, six power switching tubes can be selected to form a three-phase inverter bridge circuit, and the three-phase inverter bridge circuit comprises a three-phase upper bridge arm power switching tube and a three-phase lower bridge arm power switching tube. The power switch tube can form one or a plurality of combinations of a PFC power switch module, a compressor power module and a fan power module.

The driving chip is used for outputting corresponding control signals when the power module works so as to control the corresponding power switch tube to be conducted, and then outputting driving electric energy to drive the motor and other loads to work. When the power switch tube is driven to be conducted, the charging current is provided for the power switch tube, so that the gate-source electrode voltage of the power switch tube rapidly rises to a required value, and the power switch tube can be ensured to be rapidly conducted. And the grid-source voltage of the power switch tube is ensured to be maintained stably during the conduction period of the power switch tube, so that the power switch tube is reliably conducted. The power module 220 may be provided with one driving chip or a plurality of driving chips, where when one driving chip is provided, the driving chip outputs multiple driving signals to drive each power switching tube to operate, and when a plurality of driving chips are provided, the driving chip may be divided into an upper bridge arm driving chip and a lower bridge arm driving chip, or may be set according to the number of the power switching tubes, that is, each driving chip drives one power switching tube, respectively.

This embodiment can also be folded the driver chip and locate a power switch tube, so set up for drive power switch tube and driver chip form in an organic whole, can make intelligent power module 200's overall structure compact, and drive power switch tube and driver chip when folding in proper order and locating thinner flexible mounting base plate 210, flexible mounting base plate 210 also can be stable bear each electronic component, guarantee that intelligent power module 200 can reliably work. The space distance between the power switch tube and the driving chip can be shortened, and the physical connection between the bonding wire and the lead wire is shortened, so that the parasitic inductance introduced by the bonding wire and the lead wire is reduced. In addition, the physical connection distance between the bonding wire and the lead wire between the power switch tube and the driving chip can be shortened, and parasitic inductance introduced by the bonding wire and the lead wire is reduced. Therefore, the problems of switching loss and ringing caused by parasitic inductance introduced by the added bonding wires and the lead wires due to the fact that the power switch tube and the driving chip are in a tiled layout mode are solved. The utility model discloses intelligent power module 200 volume is less, and the interference killing feature is strong, is applicable to among driving motor's converter and various inverter to realize functions such as variable frequency speed governing, metallurgical machinery, electric traction, servo drive, be particularly useful for the motor work of compressor and fan such as drive air conditioner, refrigerator.

The package housing 230 may be made of epoxy resin, aluminum oxide, and a heat conductive filling material, wherein the heat conductive filling material may be boron nitride or aluminum nitride, and the insulation property of aluminum nitride and boron nitride is better, and the heat conductivity is higher, and the heat resistance and the heat conductivity are better, so that the aluminum nitride and the boron nitride have higher heat transfer capability. When the package case 230 is manufactured, materials such as epoxy resin, aluminum oxide, boron nitride, aluminum nitride or the like may be mixed, and then the mixed package material is heated; after cooling, the packaging material is crushed, and then the packaging shell 230 material is roll-formed by an ingot forming process to form the packaging shell 230. Or the mounting substrate 210 with the chip mounted thereon is placed in a mold through an injection molding process and a packaging mold, and then a packaging material is injected into the mold to package the chip and the mounting substrate 210 in the package housing 230, so as to form the package housing 230 after molding. Thus, the chip can be insulated and the EMI performance of the smart power module 200 can be improved. The smart power module 200 may employ a full-envelope package and a half-envelope package. When the semi-encapsulation package is adopted, a portion of the mounting substrate 210 of the smart power module 200 may be exposed outside the package casing 230, that is, the package casing 230 is covered on the mounting substrate 210, so that the lower surface of the mounting substrate 210 is exposed outside the package, and the heat dissipation of the power element is accelerated.

Referring to fig. 1 or 2, in an embodiment, an orthographic projection of the package housing 230 on the mounting substrate 210 is located within an edge of the mounting substrate 210.

In this embodiment, the area of the package casing 230 is smaller than the area of the mounting substrate 210, that is, the side of the package casing 230 attached to the electronic control board 100 is protruded outward from the mounting substrate 210. So set up, make encapsulation casing 230 can inlay in locating the automatically controlled board 100 in the air conditioner, encapsulation casing 230 and automatically controlled board 100 laminating, thereby make the fastening nature of intelligent power module 200 and automatically controlled board 100 better, and then prevent that intelligent power module 200 and automatically controlled board 100 from being at the in-process that carries or fall, intelligent power module 200 takes place relative motion with automatically controlled board 100 and makes automatically controlled board 100 normally work, perhaps lead to intelligent power module 200 fracture and damage intelligent power module 200. It will be appreciated that the shape of the package housing 230 fits into a recess in the electronic control board 100. Moreover, the thickness direction of the package casing 230 may be flush with the surface of the electronic control board 100, or the package casing 230 is partially embedded in the electronic control board 100 and partially protrudes from the electronic control board 100. The length direction and the width direction of the package housing 230 may be adapted to the groove of the electronic control board 100, the area of the package housing 230 may also be smaller than the area of the groove, and when the package housing 230 is placed in the groove, the package housing may be fixed to the groove by a material having viscosity such as glue.

Referring to fig. 1 or 2, in an embodiment, the mounting substrate 210 includes the mounting substrate 210 including:

a heat dissipation substrate 211;

a circuit wiring layer 212 disposed on one side surface of the heat dissipation substrate 211, wherein a mounting position for mounting the power switch tube is formed on the circuit wiring layer 212; and the number of the first and second groups,

an insulating layer 213, the insulating layer 213 being interposed between the circuit wiring layer 212 and the heat dissipation substrate 211.

In this embodiment, the circuit wiring layer 212 may be a flexible copper-clad layer, and mounting locations for mounting electronic components of the smart power module 200 are formed on the flexible copper-clad layer, and specifically, corresponding circuit traces and mounting locations, i.e., pads, for mounting electronic components in the power assembly 220 are formed on the mounting substrate 210 according to the circuit design of the smart power module 200. The power switch tube is correspondingly arranged on the installation position of the flexible copper-clad layer, and is electrically connected with the circuit wiring layer 212 through conductive materials such as soldering tin, metal binding wires and the like to form a current loop. The insulating layer 213 may be formed using an insulating material such as a PI film or epoxy resin. In manufacturing the mounting substrate 210, a copper foil may be laid on the insulating layer 213 and etched in accordance with a predetermined circuit design to form the circuit wiring layer 212. After the electronic components of each circuit module in the power switch tube are integrated in the circuit wiring layer 212 on the heat dissipation substrate 211, the electrical connection between the circuit modules can also be realized through metal binding wires. Alternatively, the circuit and the mounting portion may be formed by directly rolling copper or copper alloy, and then the circuit and the mounting portion are pressed on the insulating layer 213 by a hot pressing process. In the case of manufacturing the heat dissipation layer, the mounting substrate 210 may be manufactured by using a discrete metal substrate or a ceramic substrate, and by integrally bonding the metal substrate and the insulating layer 213 to each other through a hot pressing process or by using a heat conductive adhesive, or the like, the insulating layer 213 on which the circuit wiring layer 212 is formed. Alternatively, the heat dissipation layer is formed directly on the flexible insulating layer 213 using copper or a copper alloy.

Referring to fig. 1 or 2, in an embodiment, the smart power module 200 further includes a pin 240, one end of the pin 240 is formed from the mounting substrate 210, the other end of the pin 240 extends in a direction away from the mounting substrate 210, and the extending direction of the pin 240 is parallel to a plane where the mounting substrate 210 is located.

In this embodiment, the pins 240 may be integrally formed with the flexible copper-clad layer of the mounting substrate 210, that is, the pins 240 are formed by extending from the flexible copper-clad layer of the mounting substrate 210, and when the flexible copper-clad layer is manufactured, the flexible copper-clad layer forms the circuit wiring layer 212, the pads, and the pins 240 of the smart power module 200 through an etching process. The pins 240 are arranged in parallel with the mounting substrate 210, that is, the pins 240 are in a tiled structure, so that when the package housing 230 of the mounting substrate 210 is embedded in the electric control board 100 in the air conditioner, when the package housing 230 is attached to the electric control board 100, the pins 240 of the intelligent power module 200 are fixed on the electric control board 100 through soldering tin and conductive adhesive, the part of the pins 240 extending out of the mounting substrate 210 is attached to the electric control board 100, and the welding surface is on the same plane, so that the extending sections of the pins 240 are attached to the electric control board 100, and the pins 240 can be prevented from being broken when the electric control board 100 falls. Or, one end of the pin 240 may be fixed on the circuit wiring layer 212 of the mounting substrate 210, and the other end extends from the circuit wiring layer 212, which may be specifically implemented by a fixing frame, where the fixing frame fixes a plurality of conductive bars extending inwards, and free ends of the conductive bars are welded on the mounting position of the flexible copper-clad layer, and after the intelligent power module 200 is packaged, the fixing frame is cut off by a pin cutting process to form the pin 240 of the intelligent power module 200. Before the intelligent power module 200 is packaged, the free end of the first conductive strip of the fixing frame is soldered to the mounting position of the flexible mounting substrate 210, so that the fixing of the fixing frame and the flexible mounting substrate 210 can be realized.

Referring to fig. 1 or 2, in an embodiment, the electronic control assembly further includes a heat sink (not shown) disposed on a side of the smart power module 200 away from the electronic control board 100.

In this embodiment, the heat sink may be made of high thermal conductive materials with good heat dissipation effects such as aluminum and aluminum alloy, so that the heat generated by the power component 220 is conducted to the heat sink through the mounting substrate 210, thereby further increasing the contact area between the heat generated by the power switch tube and the air and improving the heat dissipation rate. The radiator can also be provided with a radiator body and a plurality of radiating blades, and the plurality of radiating blades are arranged on one side of the radiator body at intervals. So set up, can increase the area of contact of radiator and air, also be when the radiator during operation, increase the area of contact of heat on the radiator and air to accelerate the radiating rate of radiator. Meanwhile, materials of the radiator can be reduced, and the problem that the cost is too high due to too much material application of the radiating fins is avoided.

The utility model discloses still provide an air conditioner, the air conditioner includes as above automatically controlled subassembly. The detailed structure of the electronic control assembly can refer to the above embodiments, and is not described herein again; it can be understood that, because the utility model discloses above-mentioned automatically controlled subassembly has been used in the air conditioner, consequently, the utility model discloses the embodiment of air conditioner includes all technical scheme of the whole embodiments of above-mentioned automatically controlled subassembly, and the technological effect that reaches is also identical, no longer gives unnecessary details here.

The above is only the optional embodiment of the present invention, and not therefore the limit of the patent scope of the present invention, all of which are in the concept of the present invention, the equivalent structure transformation of the content of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.

Claims

1. An electronic control assembly, comprising:

the electric control board is provided with an accommodating groove;

2. An electronic control assembly according to claim 1, wherein the smart power module comprises:

3. The electrical control assembly of claim 2, wherein the package housing is embedded in a receiving slot of the electrical control board.

4. An electrical control assembly according to claim 2, wherein the mounting substrate comprises:

a heat-dissipating substrate;

the circuit wiring layer is arranged on one side surface of the heat dissipation substrate, and a mounting position for mounting the power assembly is formed on the circuit wiring layer; and the number of the first and second groups,

5. An electronic control assembly according to claim 2, wherein the power assembly comprises:

and each driving chip is stacked on one power switch tube.

6. The electrical control assembly of claim 2, wherein the smart power module further comprises a pin, one end of the pin is formed from the mounting substrate, the other end of the pin extends in a direction away from the mounting substrate, and the extending direction of the pin is parallel to a plane of the mounting substrate.

7. An electrical control assembly according to claim 6, wherein the extended portion of the pin is attached to the electrical control board.

8. The electronic control assembly of claim 1, further comprising a heat sink disposed on a side of the smart power module remote from the electronic control board.

9. The electrical control assembly according to any one of claims 1 to 8, further comprising a main controller, a rectifier bridge, a PFC circuit, and a DC bus capacitor, wherein the rectifier bridge, the PFC circuit, and the voltage smart power module are sequentially connected, the DC bus capacitor is connected in parallel to an output terminal of the PFC circuit, and the main controller is respectively connected to the PFC circuit and the smart power module.

10. An air conditioner characterized by comprising an electric control assembly as claimed in any one of claims 1 to 9.