JP2013030796A - Electronic controller - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic controller which can increase the conduction capacity of a printed wiring board by not using any special jumper conductor but using a versatile and inexpensive jumper lead wire, and can expand the heat dissipation performance of a printed board pattern through which a large current flows while enhancing the permissible current value.SOLUTION: The electronic controller having a current circuit formed in a printed wiring board 1, and an electronic component with a lead terminal solder joined to the printed wiring board 1 by using a flow soldering method comprises a copper foil flat pattern 28 with an exfoliated copper foil composing a solder surface current pattern through which the current of a current circuit in the printed wiring board 1 on the side of the solder surface being flow soldered flows, a through hole 29 formed in the copper foil flat pattern 28, and a jumper lead wire 30 soldered by the flow soldering method.

Description

  The present invention relates to an electronic control device in which measures are taken to increase the heat radiation performance of a printed circuit board pattern portion through which a large current flows and to improve the allowable current value.

  In the conventional electronic control device, a jumper conductor made of a conductive plate is soldered to a copper foil solid pattern that needs to increase the energization capacity by a reflow soldering method (for example, see Patent Document 1).

JP 2008-16582 A Japanese Utility Model Publication No. 56-16966

  Since the conventional electronic control device uses a special jumper conductor for the copper foil solid pattern that needs to increase the current-carrying capacity, there is a problem that the cost of the product increases.

  Further, since the conventional electronic control device uses a special jumper conductor, there is a problem that it cannot flexibly cope with a design change of the printed wiring board.

  In general, cream solder (solder paste) in the case of the reflow soldering method is applied to a printed wiring board at a height of about 0.15 μm, and then components are mounted. In the case of the flow soldering method, the printed wiring board on which the lead components (electronic components with lead terminals) are mounted is immersed in a soldering iron filled with molten solder. Although the volume can be increased, since the conventional electronic control device solders the jumper conductor by the reflow soldering method, the amount of solder and the volume of solder are smaller than the flow soldering method, and the heat radiation of the printed circuit board pattern is reduced. There was a problem that the safety and reliability of the printed wiring board deteriorated due to insufficient performance.

  The present invention has been made to solve the above-described problems. By using a general-purpose and inexpensive jumper lead wire without using a special jumper conductor, the current carrying capacity of the printed wiring board can be reduced. An object of the present invention is to provide an electronic control device capable of increasing the heat dissipation performance of a printed circuit board pattern portion through which a large current flows and improving the current allowable value.

An electronic control device according to the present invention includes:
A printed wiring board having a solder surface to be flow soldered and having a through hole formed in a predetermined area of the solder surface;
Electronic components with lead terminals flow soldered to the solder surface;
A current pattern that is formed in the predetermined area of the solder surface and is connected to the electronic component with a lead terminal to flow a current, and a copper foil solid pattern with a stripped copper foil,
Jumper leads inserted into the through-holes from the solder surface side and mounted on the copper foil solid pattern in a dust shape, and flow soldered to the copper foil solid pattern.

  The electronic control device according to the present invention comprises a solder surface current pattern in which a current of a current circuit on a solder surface side to be soldered on a printed wiring board flows, and a copper foil solid pattern in which the copper foil is stripped, Since it has a configuration with a through-hole formed in a solid foil pattern and a jumper lead wire mounted in the through-hole from the solder side and soldered by the flow soldering method, without using a special jumper conductor The use of general-purpose and inexpensive jumper leads can increase the current carrying capacity of the printed circuit board, increase the heat dissipation performance of the printed circuit board pattern part through which a large current flows, and improve the current tolerance. Play.

FIG. 3 is a diagram showing the first embodiment, and is a control circuit block diagram showing an electronic control device 100 of an outdoor unit of the air conditioner. FIG. 5 shows the first embodiment, and is an overall pattern diagram viewed from the lead component mounting side (component surface) of the noise filter circuit 8 in the electronic control device 100 of the outdoor unit of the air conditioner. FIG. 5 shows the first embodiment, and is an overall pattern diagram viewed from the flow soldering side (solder surface) of the noise filter circuit 8 in the electronic control device 100 of the outdoor unit of the air conditioner. FIG. 3 is a diagram illustrating the first embodiment, and is a diagram illustrating a solder surface large current pattern 27e on the flow soldering side (solder surface) ((a) is a diagram illustrating the soldering surface, and (b) is a diagram viewed from the side surface) (Before flow soldering), (c) is a side view (after flow soldering)). FIG. 5 shows the first embodiment, and is an enlarged view of a part A in FIG. 4. FIG. 5 is a diagram illustrating the second embodiment, and is a diagram illustrating solder surface large current patterns 27d and 27g of the printed wiring board 1 ((a) is a diagram illustrating a soldered surface, and (b) is a diagram viewed from a side surface (flow soldering). Before attachment), (c) is a side view (after flow soldering)). FIG. 9 shows the third embodiment, and shows a solder surface of the printed wiring board 1. FIG. 9 shows the third embodiment and is an enlarged view of a solder surface large current pattern 27e. FIG. 9 shows the fourth embodiment and shows the solder surface of the printed wiring board 1. FIG. 9 shows the fourth embodiment, and shows a state where a crack has occurred in the copper foil solid pattern 28. The figure shown for a comparison, and the figure which shows the state which the crack generate | occur | produced when arrangement | positioning of the jumper lead wire 30 is not dusty. FIG. 6 shows the fifth embodiment and shows the printed wiring board 1. FIG. 16 is a diagram illustrating the fifth embodiment and is a diagram illustrating a jumper lead wire 30 mounted on a copper foil solid pattern 28 of a solder surface large current pattern 27e. The figure which shows Embodiment 6 and the figure which looked at the clinch shape of 30 parts of jumper lead wires of printed wiring board 1 from the side ((a-1) looked at the general clinch shape of jumper lead wire 30 from the side. Figures (before flow soldering), (a-2) is a view of a general clinch shape of the jumper lead wire 30 viewed from the side (after flow soldering), (b-1) is a jumper lead with reduced clinch tension. The figure which looked at the clinch shape of the wire 30 from the side surface (before flow soldering), (b-2) the figure which looked at the clinch shape of the jumper lead wire 30 which weakened the clinch tension from the side surface (after flow soldering). FIG. 16 is a diagram showing the seventh embodiment, and is a pattern diagram on the surface side (component surface) on which a component with leads of the printed wiring board 1 of the electronic control device 100 is mounted.

Embodiment 1 FIG.
FIG. 1 to FIG. 5 are diagrams showing Embodiment 1, FIG. 1 is a control circuit block diagram showing an electronic control device 100 of an outdoor unit of an air conditioner, and FIG. 2 is an electronic control device 100 of an outdoor unit of the air conditioner. FIG. 3 is an overall view of the pattern viewed from the lead component mounting side (component surface) of the noise filter circuit 8 in FIG. 3, and FIG. 3 is from the flow soldering side (solder surface) of the noise filter circuit 8 in the electronic control device 100 of the outdoor unit of the air conditioner. FIG. 4 is a view showing the entire pattern of the solder, a solder surface large current pattern 27e on the flow soldering side (solder side) ((a) is a view of the soldering surface, and (b) is a view of the soldering side) (Before flow soldering), (c) is a side view (after flow soldering)), and FIG. 5 is an enlarged view of a portion A in FIG.

  In the present embodiment, an electronic control device 100 that controls operation of an outdoor unit of an air conditioner will be described as an example. The outdoor unit of the air conditioner is an example, and the device that is the target of the electronic control device 100 is not limited to the outdoor unit of the air conditioner.

  In the present embodiment, a large current pattern on the solder surface that requires a large current to flow is a copper foil solid pattern in which the copper foil is exposed. And the through-hole hole which inserts a jumper lead wire is formed on a copper foil solid pattern. A jumper lead wire is inserted into a through-hole hole, mounted on a copper foil solid pattern, and flow soldered with solder.

  Solder adheres to the jumper lead wire, the volume of the conductive part can be increased beyond the volume of the jumper lead wire, the heat dissipation performance of the large current pattern on the solder surface through which a large current flows, and the current tolerance is improved be able to.

  First, the electronic control device 100 is defined. The electronic control device 100 is a device in which a current circuit is formed in the printed wiring board 1 and electronic components with lead terminals are soldered to the printed wiring board 1 using a flow soldering method. In this embodiment, a small current circuit and a large current circuit are mixedly mounted in one printed wiring board 1.

  As shown in FIG. 1, an electronic control device 100 including a printed wiring board 1 on which various electronic components are mounted controls operation of an outdoor unit of an air conditioner. An AC commercial power supply 2 (50 Hz or 60 Hz) is connected to the electronic control device 100.

  An air conditioner cited as an example in the present embodiment is a separate type air conditioner having an indoor unit and an outdoor unit.

  A rectifier circuit 3 for converting AC of the AC commercial power supply 2 into DC is connected to the AC commercial power supply 2 via a power factor improving reactor 4.

  A DC smoothing capacitor 5 is connected to the rectifier circuit 3. The operation is performed by converting the DC voltage generated by the DC smoothing capacitor 5 into a desired AC voltage by the compressor inverter circuit 7 and applying it to the compressor 6.

  The compressor 6 is, for example, a hermetic compressor and includes a rotary type, a scroll type, and a reciprocating type.

  The compressor 6 includes a compression element that compresses the refrigerant and an electric element that drives the compression element (both not shown).

  As the electric element that drives the compression element, a brushless DC motor, an induction motor, or the like is used.

  The noise filter circuit 8 suppresses noise generated from the compressor inverter circuit 7. Further, external noise from the AC commercial power source 2 is suppressed.

  The outdoor unit electronic control device 100 is equipped with an outdoor control microcomputer 9 that controls the operation of various outdoor units. The outdoor control microcomputer 9 operates on the DC voltage generated by the DC smoothing capacitor 5 by the microcomputer driving power generated by the power circuit 10.

  In addition, the outdoor control microcomputer 9 supplies an operation (PWM) signal of the compressor 6 to the compressor inverter circuit 7 via the inverter control circuit 11. PWM stands for Pulse Width Modulation.

  The outdoor unit of the air conditioner is provided with an outdoor heat exchanger that forms a refrigeration cycle (not shown). An outdoor fan that blows air to the outdoor heat exchanger includes a fan and a fan motor 12 that drives the fan.

  The fan motor 12 is driven by a drive command transmitted from the outdoor control microcomputer 9 via the drive circuit 13.

  The outdoor unit of the air conditioner includes an electronic expansion valve 14 as a decompression device that constitutes a refrigeration cycle. The electronic expansion valve 14 is driven by a drive command transmitted from the outdoor control microcomputer 9 via the drive circuit 15.

  The outdoor unit of the air conditioner includes a refrigerant temperature detection sensor 16 that detects the temperature of the refrigerant in the refrigeration cycle. Information of the refrigerant temperature detection sensor 16 is taken into the outdoor control microcomputer 9 via the conversion circuit 17.

  The outdoor unit of the air conditioner includes a pressure open / close switch 18. Information of the pressure open / close switch 18 is taken into the outdoor control microcomputer 9 via the conversion circuit 19.

  Moreover, the changeover switch 21 which switches the various driving | operation operation | movement of the outdoor unit of an air conditioner is provided in the electronic control apparatus 100 of an outdoor unit. The setting contents of the changeover switch 21 are taken into the outdoor control microcomputer 9.

  In addition, the electronic control device 100 is provided with a non-volatile memory 20, and various information is written and read by the outdoor control microcomputer 9.

  The current circuit portion in the region surrounded by the broken line in FIG. 1 is a large current circuit portion 220 through which a large current flows when the outdoor unit of the air conditioner is operated. For example, a current of 20 A (ampere) or more may flow. . The current circuit portion in the other region of FIG. 1 is a small current circuit portion through which a small current flows. For example, a current smaller than 20 A (ampere) flows. The small current circuit unit is not labeled.

  2 and 3 show an example of the noise filter circuit 8 of the printed wiring board 1 of the electronic control device 100. FIG. FIG. 2 is a view of the noise filter circuit 8 as viewed from the lead component mounting side (component surface).

  The noise filter circuit 8 includes noise filter coils 22a to 22c for suppressing generated noise and external noise, noise filter capacitors 23a to 23g, and the like.

  Electronic components with lead terminals such as noise filter coils 22a to 22c and noise filter capacitors 23a to 23g for suppressing generated noise and external noise are defined as electronic components with lead terminals (lead components).

  A surface on which the electronic component with lead terminals (lead component) of the printed wiring board 1 is mounted is defined as a component surface.

  The lead component mounting side large current patterns 24a to 24h and the lead component mounting side small current patterns 25a to 25d of the noise filter circuit 8 are patterns for connecting various components.

  In FIG. 2, areas of the lead component mounting side large current patterns 24 a to 24 h indicated by diagonal lines are pattern portions through which a large current flows.

  FIG. 3 is a view of the noise filter circuit 8 as viewed from the flow soldering side (solder surface). The noise filter circuit 8 is provided with solder surface current patterns for connecting various components. The solder surface small current patterns 26a to 26j through which a small current flows and the solder surface large current of the large current circuit unit 220 through which a large current flows. Patterns 27a to 27i are provided.

  In FIG. 3, areas of the solder surface large current patterns 27 a to 27 i shown by diagonal lines are pattern portions through which a large current for operating the compressor 6 of the air conditioner flows. In this embodiment, for example, 20 A (ampere) or more Current may flow. In addition, a current smaller than 20 A flows through the solder surface small current patterns 26a to 26j.

  Next, the main configuration of this embodiment will be described. FIG. 4 is a diagram showing a solder surface large current pattern 27e, for example.

  In FIG. 4, among the solder surface current patterns, a solder surface large current pattern 27e for which a large current of, for example, 20 A or more needs to flow is a copper foil solid pattern 28 in which the copper foil is stripped.

  And it has the through hole 29 which inserts the jumper lead wire 30 on the copper foil solid pattern 28 (refer also FIG. 5). In this printed wiring board 1, jumper lead wires 30 are mounted on a copper foil solid pattern 28 and are soldered with solder 31 (flow soldering method).

  As described above, by configuring the electronic control device 100, the solder 31 is fixed to the jumper lead wire 30 during flow soldering, and the volume of the conductive portion is increased to be larger than the volume of the jumper lead wire 30. Therefore, the heat dissipation performance of the pattern through which a large current flows, for example, the solder surface large current pattern 27e, and the allowable current value can be improved.

Embodiment 2. FIG.
6A and 6B are diagrams showing the second embodiment, and are diagrams showing the solder surface high current patterns 27d and 27g of the printed wiring board 1. FIG. 6A is a diagram showing the soldering surface, and FIG. (Before flow soldering), (c) is a side view (after flow soldering)).

  In FIG. 6, among the solder surface current patterns, the solder surface large current patterns 27d and 27g that require a large current flow are assumed to be a copper foil solid pattern 28 obtained by stripping the copper foil.

  The solder surface large current patterns 27d and 27g have through holes 29 for inserting the jumper lead wires 30 on the copper foil solid pattern 28, respectively.

  Furthermore, after performing the process which forms the resist part 32 with a certain fixed width (predetermined width) on the outer periphery of each copper foil solid pattern 28, the jumper lead wire 30 is mounted on the copper foil solid pattern 28. , Flow soldering.

  The resist portion 32 is provided to ensure electrical insulation between the copper foil solid patterns 28 of the solder surface large current patterns 27d and 27g. In the vicinity of portion B in FIG. 6A, the copper foil solid pattern 28 of the solder surface large current patterns 27d and 27g is particularly close. For this reason, there is a possibility that the copper foil solid patterns 28 may be short-circuited with solder by flow soldering. By forming the resist portion 32 with a certain width on the outer periphery of each copper foil solid pattern 28, it is possible to suppress a short circuit due to soldering between the adjacent copper foil solid patterns 28 during flow soldering.

  As described above, by configuring the printed circuit board 1 of the electronic control device 100, the solder 31 is fixed to the jumper lead wire 30 during flow soldering, and the volume of the conductive portion is reduced to that of the jumper lead wire 30. It can be increased beyond the volume. For example, the heat dissipation performance of the solder surface large current patterns 27d and 27g can be expanded and the current allowable value can be improved.

  In addition, by forming the resist portion 32 with a certain width on the outer periphery of the copper foil solid pattern 28, adjacent copper foil solid patterns 28 do not short-circuit with each other during flow soldering. be able to.

Embodiment 3 FIG.
7 and 8 are diagrams showing the third embodiment, FIG. 7 is a diagram showing a solder surface of the printed wiring board 1, and FIG. 8 is an enlarged view of a solder surface large current pattern 27e.

  In FIG. 7, the solder surface large current patterns 27 a to 27 i that require a large current to flow are the copper foil solid patterns 28 in which the copper foil is stripped.

  A through-hole 29 for inserting a jumper lead wire 30 is formed on each copper foil solid pattern 28. In this printed wiring board 1, jumper leads having substantially the same width dimension w (FIGS. 5 and 8) are provided. The wire 30 is flow soldered.

  Further, after performing a process of forming a resist portion 32 with a certain width on the outer periphery of each copper foil solid pattern 28, the jumper lead wire 30 is mounted on the copper foil solid pattern 28 and soldered by flow soldering. ing.

  FIG. 8 is an enlarged view of the solder surface large current pattern 27e. In FIG. 8, the copper foil solid pattern 28 of the solder surface large current pattern 27e, the through hole 29 formed in the copper foil solid pattern 28, and the through hole are shown. 29 shows a jumper lead wire 30 inserted in 29, and the resist portion 32 and the like are omitted.

  As described above, by configuring the printed wiring board 1 of the electronic control device 100, when mounting the jumper lead wire 30 on the printed wiring board 1 with an automatic insertion machine, it is necessary to switch the width dimension w of the jumper lead wire 30. Since the time loss for switching the width dimension w of the jumper lead wire 30 is reduced, the productivity of the printed wiring board 1 can be improved.

Embodiment 4 FIG.
9 and 10 are diagrams showing the fourth embodiment, FIG. 9 is a diagram showing a solder surface of the printed wiring board 1, and FIG. 10 is a diagram showing a state in which a crack is generated in the copper foil solid pattern 28. FIG. FIG. 11 is a view for comparison, and shows a state in which a crack has occurred when the arrangement of the jumper lead wire 30 is not dusty.

  In FIG. 9, the solder surface large current patterns 27a to 27i that require a large current to flow are the copper foil solid patterns 28 in which the copper foil is stripped.

  A through hole 29 for inserting the jumper lead wire 30 is provided on the copper foil solid pattern 28.

  Further, after performing a process of forming a resist portion 32 with a certain width on the outer periphery of each copper foil solid pattern 28, the jumper lead wire 30 is mounted on the copper foil solid pattern 28 and soldered by flow soldering. ing.

  In this printed wiring board 1, the jumper lead wires 30 are mounted on the copper foil solid pattern 28, and the jumper lead wires 30 having the same width dimension w (FIG. 10) are combined with each other in the printed wiring board 1. As shown in the figure, it is mounted in a dust shape and soldered by flow. However, the width dimension w of the jumper lead wire 30 may not be the same.

  The jumper lead wire 30 is mounted on the copper foil solid pattern 28 in a crisp shape and is soldered by flow soldering so that, for example, even if a crack or disconnection as shown in FIG. The wire 30 and the solder 31 (not shown) act so as to compensate for cracks and breaks in the copper foil solid pattern 28.

  As shown in FIG. 11, when the arrangement of the jumper lead wire 30 is not crisp, a crack or breakage occurs in the copper foil solid pattern 28, and a crack or breakage occurs between adjacent jumper lead wires 30. The jumper lead wire 30 and the solder 31 (not shown) cannot make up for cracks and breaks in the copper foil solid pattern 28.

  As described above, by configuring the printed wiring board 1 of the electronic control device 100, even if, for example, cracks or breaks occur in the copper foil solid pattern 28 of the printed wiring board 1, the jumper lead wire 30 and the solder 31 are Since it acts so as to compensate for cracks and breaks in the copper foil solid pattern 28, the safety and reliability of the printed wiring board 1 can be ensured.

Embodiment 5 FIG.
12 and 13 show the fifth embodiment. FIG. 12 shows the printed wiring board 1. FIG. 13 shows a jumper lead wire 30 mounted on the copper foil solid pattern 28 of the solder surface large current pattern 27e. FIG.

  In FIG. 12, the solder surface large current patterns 27a to 27i that require a large current to flow are the copper foil solid patterns 28 in which the copper foil is stripped.

  A through hole 29 for inserting the jumper lead wire 30 is provided on the copper foil solid pattern 28.

  Further, after performing a process of forming a resist portion 32 with a certain width on the outer periphery of each copper foil solid pattern 28, the jumper lead wire 30 is mounted on the copper foil solid pattern 28 and soldered by flow soldering. ing.

  In this printed wiring board 1, a plurality of jumper lead wires 30 having different width dimensions are combined.

For example, as shown in FIG. 13, the jumper lead wire 30 is combined with, for example, three types of jumper lead wires 30a, 30b, and 30c. When the width dimensions of the three kinds of jumper lead wires 30a, 30b, and 30c are Wa, Wb, and Wc, Wa, Wb, and Wc satisfy the relationship of the following expression.
Wa>Wb> Wc (1)

  Further, when the soldering directions of the three types of jumper lead wires 30a, 30b, and 30c are flow soldered, they are mounted in the horizontal direction and the vertical direction with respect to the transport direction of the printed wiring board 1, and are flow soldered.

  However, the type and arrangement of the jumper lead wire 30 may be arbitrary.

  As described above, since the printed wiring board 1 is configured, the mounting density of the jumper lead wires 30 on the copper foil solid pattern 28 is larger than that of the printed wiring board 1 of the first to fourth embodiments. The volume of the conductive portion of the solid pattern 28 can be increased, and the heat dissipation performance can be further expanded and the current allowable value can be improved.

Embodiment 6 FIG.
FIG. 14 is a diagram showing the sixth embodiment, and is a view of the clinch shape of the jumper lead wire 30 part of the printed wiring board 1 as viewed from the side surface ((a-1) is a side view of the general clinch shape of the jumper lead wire 30). (A-2) shows a general clinch shape of the jumper lead wire 30 viewed from the side (after flow soldering), and (b-1) weakens the clinch tension. (B-2) is a view of the clinching shape of the jumper lead wire 30 with reduced clinch tension viewed from the side (after flow soldering). )).

  In FIG. 14, when the jumper lead wire 30 is clinched and mounted from the flow soldering surface side of the printed wiring board 1 by an automatic insertion machine, a general clinching mounting shape 33 (FIGS. 14A-1 and 14A) is used. -2)), the clinch tension (bending force) is weaker than the normal tension, for example, a clinch shape such as a clinch mounting shape 34 (FIGS. 14B-1 and 14B-2). ).

  The clinch shape of the jumper lead wire 30 is a clinch mounting shape 34 as shown in FIGS. 14 (b-1) and 14 (b-2), so that a copper foil solid pattern of the flow solder portion of the printed wiring board 1 is obtained. The distance between the surface 28 and the jumper lead wire 30 can be made wider than the general clinch mounting shape 33 (FIGS. 14A-1 and 14A-2).

  As described above, when the jumper lead wire 30 is clinch mounted by an automatic insertion machine, the tension (bending force) of the clinch is weaker than a normal tension, for example, a clinch shape such as the clinch mounting shape 34, During the flow soldering, the jumper lead wire 30 has an expanded space (a space of a predetermined size) between the copper foil solid pattern 28 surface of the flow solder portion of the printed wiring board 1 and the jumper lead wire 30. More solder 31 adheres. Therefore, the heat dissipation performance can be further expanded and the current allowable value can be improved as compared with the general clinch mounting shape 33.

Embodiment 7 FIG.
FIG. 15 is a diagram showing the seventh embodiment, and is a pattern diagram on the surface side (component surface) on which a component with leads of the printed wiring board 1 of the electronic control device 100 is mounted.

  In FIG. 15, the electronic component with lead is disposed at a position where it does not come into contact with the clinch mounting shape 34 of the jumper lead wire 30 mounted from the flow soldering surface, and is flow soldered.

  The leaded electronic components are, for example, noise filter coils 22a to 22c, noise filter capacitors 23a to 23g, and the like.

  As described above, by configuring the printed wiring board 1, the clinch mounting shape 34 of the jumper lead wire 30 mounted from the flow soldering surface, which is a charging unit, and the electronic component with leads do not come into contact with each other. Safety of attached electronic parts can be ensured.

  In general, the solder material has a low melting point, and the melted solder has suitable fluidity, viscosity, and surface tension, and has good wettability with the base material. Those satisfying the requirements for characteristics such as electrical conductivity are used. As the solder used for flow soldering in this embodiment, it is preferable to use lead-free solder. However, eutectic solder of tin and lead may be used.

  Hereinafter, the characteristics of the electronic control device according to the embodiment of the present invention will be described again.

The electronic control device in the embodiment of the present invention is
An electronic control device in which a current circuit is formed on a printed wiring board, and electronic components with lead terminals are soldered to the printed wiring board using a flow soldering method,
The solder surface current pattern in which the current of the current circuit on the solder surface side to be soldered to the flow of the printed wiring board flows, and a copper foil solid pattern in which the copper foil is stripped,
A through hole formed in the copper foil solid pattern;
A jumper lead wire mounted on the through hole from the solder surface side and soldered by the flow soldering method.

  The solder surface current pattern to which the jumper lead wire is soldered is a solder surface large current pattern in which a current of 20 A or more flows.

  The solder surface current pattern to which the jumper lead wire is soldered is a solder surface large current pattern through which a current for operating the compressor of the air conditioner flows.

  A resist portion having a predetermined width is formed on the outer periphery of the copper foil solid pattern.

  The width dimension of all the jumper lead wires in the printed wiring board is set to be substantially the same dimension.

  The jumper lead wire is mounted on the copper foil solid pattern in a crisp shape.

  The jumper lead wires having different width dimensions are combined and mounted on the copper foil solid pattern.

  When the jumper lead wire is clinch mounted from the solder surface side of the printed wiring board, the clinch is bent so that a space of a predetermined size is formed between the copper foil solid pattern and the jumper lead wire. Weaken the power.

  The electronic components with lead terminals mounted on the component surface of the printed wiring board are arranged so as not to contact the jumper lead wires.

  Lead-free solder is used for the flow soldering.

  1 printed wiring board, 2 AC commercial power supply, 3 rectifier circuit, 4 power factor improving reactor, 5 smoothing capacitor, 6 compressor, 7 compressor inverter circuit, 8 noise filter circuit, 9 outdoor control microcomputer, 10 power supply circuit, DESCRIPTION OF SYMBOLS 11 Inverter control circuit, 12 Fan motor, 13 Drive circuit, 14 Electronic expansion valve, 15 Drive circuit, 16 Refrigerant temperature detection sensor, 17 Conversion circuit, 18 Pressure open / close switch, 19 Conversion circuit, 20 Non-volatile memory, 21 Changeover switch 22a Noise filter coil, 22b Noise filter coil, 22c Noise filter coil, 23a Noise filter capacitor, 23b Noise filter coil, 23c Noise filter coil, 23d Noise filter coil, 23e Noise filter coil, 23 f Coil for noise filter, 23g Coil for noise filter, 24a Lead component mounting side large current pattern, 24b Lead component mounting side large current pattern, 24c Lead component mounting side large current pattern, 24d Lead component mounting side large current pattern, 24e Lead Component mounting side large current pattern, 24f Lead component mounting side large current pattern, 24g Lead component mounting side large current pattern, 24h Lead component mounting side large current pattern, 25a Lead component mounting side small current pattern, 25b Lead component mounting side small current Pattern, 25c Lead component mounting side small current pattern, 25d Lead component mounting side small current pattern, 26a Solder surface small current pattern, 26b Solder surface small current pattern, 26c Solder surface small current pattern, 26d Solder surface small current pattern, 26e Solder Oden Koden Pattern, 26f Solder surface small current pattern, 26g Solder surface small current pattern, 26h Solder surface small current pattern, 26i Solder surface small current pattern, 26j Solder surface small current pattern, 27a Solder surface large current pattern, 27b Solder surface large current pattern 27c Solder side high current pattern, 27d Solder side high current pattern, 27e Solder side high current pattern, 27f Solder side high current pattern, 27g Solder side high current pattern, 27h Solder side high current pattern, 27i Solder side high current pattern, 28 Copper Foil Solid Pattern, 29 Through Hole, 30 Jumper Lead Wire, 30a Jumper Lead Wire, 30b Jumper Lead Wire, 30c Jumper Lead Wire, 31 Solder, 32 Resist Part, 33 Clinch Mount Shape, 34 Clinch Mount Shape, 100 Electronic Control apparatus 220 high-current circuit unit.

Claims (8)

A printed wiring board having a solder surface to be flow soldered and having a through hole formed in a predetermined area of the solder surface;
Electronic components with lead terminals flow soldered to the solder surface;
A current pattern that is formed in the predetermined area of the solder surface and is connected to the electronic component with a lead terminal to flow a current, and a copper foil solid pattern with a stripped copper foil,
An electronic device comprising: a jumper lead wire inserted into the through hole from the solder surface side and mounted in a dust shape on the copper foil solid pattern and flow soldered to the copper foil solid pattern Control device.   The electronic control device according to claim 1, wherein the copper foil solid pattern is a current pattern for passing a current of 20 A or more.   3. The electronic control device according to claim 1, wherein the copper foil solid pattern is a current pattern for supplying a current for operating a compressor of an air conditioner. 4.   4. The electronic control device according to claim 1, wherein a resist portion having a predetermined width is formed on an outer periphery of the copper foil solid pattern.   5. The electronic control device according to claim 1, wherein all the jumper lead wires mounted on the copper foil solid pattern have substantially the same width. 6.   5. The electronic control device according to claim 1, wherein the jumper lead wires having different widths are combined and mounted on the copper foil solid pattern. 6.   The electronic component with lead terminals is arranged on the surface opposite to the solder surface of the printed wiring board so as not to contact the jumper lead wire. Electronic control device.   8. The electronic control device according to claim 1, wherein lead-free solder is used for the flow soldering.

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