JP6646491B2 - Electronic circuit device and inverter-integrated electric compressor having the same - Google Patents

Description

  The present invention relates to an electronic circuit device in which a leadless package component is mounted on a circuit board, and an inverter-integrated electric compressor including the same.

  2. Description of the Related Art Conventionally, as an electric compressor used for an air conditioner for a vehicle, an inverter-integrated electric compressor in which an inverter circuit unit is attached to a housing is used in consideration of switching noise. In this case, the inverter circuit unit is configured by an electronic circuit device in which a plurality of power switching elements are mounted on a circuit board, and drives the motor in the housing with the power switching elements (for example, see Patent Document 1). 1).

  In recent years, this power switching element has also become a leadless package component. The reason is that the on-resistance is reduced, the current is increased, the parasitic inductance is reduced, and the performance is improved by using the leadless package component (for example, see Patent Document 2).

JP-A-2004-190547 JP-A-9-8444

  However, when the power switching element is formed into a leadless package component, the lead terminals are extremely short (leadless), so that a current probe cannot be passed through the terminals when mounted on a circuit board. For this reason, there has been a problem that element characteristics cannot be measured at the time of evaluation at the development stage or at the time of substrate inspection at the time of mass production.

  Also, if a gap is provided by extending the terminal to allow the current probe to pass, the parasitic inductance of the terminal will change. It cannot be measured.

  The present invention has been made to solve such a conventional technical problem, and it is an object of the present invention to accurately measure element characteristics in a state where a power switching element formed of a leadless package component is mounted on a circuit board. It is an object of the present invention to provide an electronic circuit device capable of performing the above-described steps, and an inverter-integrated electric compressor including the same.

  An electronic circuit device according to a first aspect of the present invention is configured by mounting a leadless package component on a circuit board, wherein the leadless package component is a power switching element, and the circuit board has a vicinity of the power switching element. , At least one pair of through holes for inspection are formed in the width direction of the power switching element.

  An electronic circuit device according to a second aspect of the present invention comprises a leadless package component mounted on a circuit board, wherein the leadless package component is a power switching element, and the power switching element has a width on the circuit board. A plurality of power switching elements are arranged in parallel in the direction and connected in parallel with each other to form a power switching element group. The circuit board has a through hole for inspection located near the power switching element group. Characterized in that at least one pair is formed in the width direction.

  In the electronic circuit device according to a third aspect of the present invention, in each of the above aspects, the power switching element connects the semiconductor chip molded with the resin, the terminal exposed from the resin, and the semiconductor chip molded with the resin to the terminal. And a through hole is formed corresponding to a region where the wiring member is provided.

  According to a fourth aspect of the present invention, there is provided an inverter-integrated electric compressor, comprising: a housing in which a motor is built; and an electronic circuit device according to each of the above inventions, and an inverter circuit unit for supplying power to the motor. I do.

  In the inverter-integrated electric compressor according to a fifth aspect of the present invention, in the above invention, the inverter circuit portion is mounted on the housing, and in that state, the power switching element is in a heat exchange relationship with the housing via the heat conduction filler. It is characterized by being arranged.

  According to a sixth aspect of the present invention, in the inverter-integrated electric compressor according to the fourth aspect, the inverter circuit portion is attached to the housing, and in that state, the power switching element is in heat exchange relation with the housing via the heat conducting sheet. It is characterized by being arranged in.

  According to a seventh aspect of the present invention, in the inverter-integrated electric compressor according to the fourth aspect, the inverter circuit portion is attached to the housing by bonding the circuit board to the housing with an adhesive.

  According to the first aspect of the present invention, in an electronic circuit device having a leadless package component mounted on a circuit board, the leadless package component is a power switching element, and the leadless package component is located near the power switching element on the circuit board. Since at least one pair of through holes for inspection are formed in the width direction of the power switching element, the power probe is mounted on the circuit board by passing a current probe through the pair of through holes. Current can be measured.

  As a result, even when the power switching element is made into a leadless package component, the characteristics (current and voltage) when the power switching element is actually switched can be inspected during the evaluation at the development stage and the board inspection during mass production. It is possible to accurately measure the characteristic at the time of the original operation and improve the quality. In particular, since the structure is simple, it is possible to suppress a rise in production cost.

  Further, when a plurality of power switching elements are arranged in parallel in the width direction on the circuit board and are connected in parallel with each other to form a power switching element group, the circuit board may include: By forming at least one pair of inspection through holes in the width direction of the power switching element group located near the power switching element group, by passing a current probe through the pair of through holes, The current of the power switching element group in a mounted state can be measured.

  As a result, even when a plurality of power switching elements made of leadless package parts are arranged in parallel and connected in parallel with each other to form a power switching element group, it can be used for evaluation at the development stage, board inspection during mass production, etc. In addition, it is possible to inspect the characteristics when the power switching element group is actually switched, and to accurately measure the characteristics at the time of the original operation to improve the quality. Also in this case, the structure is similarly simple, so that a rise in production cost can be suppressed.

  In particular, the power switching element includes a semiconductor chip molded with resin, a terminal exposed from the resin, and a wiring member molded with resin to connect the semiconductor chip and the terminal. In such a case, by forming the through hole corresponding to the region where the wiring member is provided, the current flowing through the wiring member can be measured with a current probe more accurately.

  An electronic circuit device according to each of the above aspects of the present invention is configured such that the inverter circuit section of an inverter-integrated electric compressor including a housing in which a motor is built and an inverter circuit section for supplying power to the motor are configured. Particularly preferred.

  For example, in the case where the inverter circuit portion is attached to the housing as in the invention of claim 5, and the power switching element is arranged in a heat exchange relationship with the housing via the heat conduction filler in that state. Whether or not the filler is sufficiently filled can be visually checked using the through holes. Thus, it is possible to prevent the inconvenience of serious failure such as smoke and ignition due to poor cooling of the power switching element by the housing.

  Also, in the case where the inverter circuit portion is attached to the housing as in the invention of claim 6 and the power switching element is arranged in a heat exchange relationship with the housing via the heat conduction sheet in that state, Whether or not the heat conduction sheet is sufficiently adhered can be visually checked using the through holes. This makes it possible to avoid the inconvenience of causing a serious failure such as smoke and ignition due to poor cooling of the power switching element by the housing.

  Furthermore, in the case where the inverter circuit portion is attached to the housing by bonding the circuit board to the housing with an adhesive as in the invention of claim 7, it is determined whether or not the adhesive has sufficiently hardened. You will be able to use and confirm. This makes it possible to avoid inconveniences such as a failure of a circuit component due to a poor mounting of the inverter circuit portion to the housing.

1 is a perspective view of an inverter-integrated electric compressor according to one embodiment to which the electronic circuit device of the present invention is applied. FIG. 2 is a perspective view of the inverter-integrated electric compressor of FIG. 1 with a cover member removed. FIG. 2 is a plan view of the inverter-integrated electric compressor of FIG. 1 with a lid member removed, as viewed from an inverter housing unit side. FIG. 4 is a sectional view taken along line AA of FIG. 3. FIG. 2 is an exploded perspective view of a portion other than a smoothing capacitor of an inverter circuit portion of the inverter-integrated electric compressor of FIG. 1. FIG. 6 is an enlarged plan view of a power switching element group mounted on a high heat dissipation board of the inverter circuit unit of FIG. 5. FIG. 7 is a top perspective view of a power switching element included in the power switching element group of FIG. FIG. 8 is a lower perspective view of the power switching element of FIG. 7. FIG. 8 is a sectional view taken along line BB of the power switching element of FIG. 7. FIG. 8 is a perspective view illustrating an internal configuration of the power switching element in FIG. 7. FIG. 4 is an enlarged plan view when a single power switching element is mounted on a high heat dissipation board.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The inverter-integrated electric compressor 1 according to the embodiment constitutes a part of a refrigerant circuit of a vehicle air conditioner for air-conditioning a vehicle interior of a vehicle (not shown), and is driven by a motor (not shown) and the motor. A housing 2 having a built-in compression mechanism (not shown) and an inverter circuit 3 for driving a motor are provided. The inverter circuit section 3 constitutes the electronic circuit device of the present invention.

  The housing 2 includes a motor housing 4 containing the motor, a compression mechanism housing 6 connected to one axial side of the motor housing 4 and containing the compression mechanism, and an opening on one side of the compression mechanism housing 6. , A compression mechanism cover 7 for closing the motor housing 4, an inverter accommodating portion 8 formed on the other axial side of the motor housing 4, and a lid member 11 for opening and closing the opening 9 on the other side of the inverter accommodating portion 8. ing. The inverter circuit section 3 is housed in the inverter housing section 8.

  1 and 2, the inverter-integrated electric compressor 1 of the embodiment is shown with the inverter accommodating portion 8 up and the compression mechanism cover 7 down, but the compression mechanism cover 7 is actually On one side, the inverter accommodating portion 8 is arranged in the lateral direction so as to be on the other side.

  The motor of the embodiment is constituted by a three-phase synchronous motor (brushless DC motor), and the compression mechanism is, for example, a scroll type compression mechanism. The compression mechanism is driven by a motor, compresses the refrigerant, and discharges the refrigerant into the refrigerant circuit. The low-temperature gas refrigerant sucked from the evaporator (also referred to as a heat absorber), which also forms a part of the refrigerant circuit, flows through the motor housing 4. Therefore, the inside of the motor housing 4 is cooled. The inverter accommodating portion 8 is partitioned from the inside of the motor housing 4 in which the motor is accommodated by a partition wall 12 formed in the motor housing 4, and the partition wall 12 is also cooled by a low-temperature gas refrigerant.

(1) Configuration of Inverter Circuit Unit 3 The inverter circuit unit 3 includes a high heat dissipation board 14 (in the present invention) on which a power switching element 13 (leadless package component) constituting an arm of each phase of a three-phase inverter circuit is mounted. A circuit board), a control board 17 on which the control circuit 16 is mounted, a bus bar assembly 18 connected to the power switching element 13 of the high heat radiation board 14, and a filter mold assembly 21 on which the smoothing capacitor 19 is mounted. I have.

  The inverter circuit section 3 converts DC power supplied from a vehicle battery (not shown) into three-phase AC power and supplies the three-phase AC power to a stator coil (not shown) of the motor. Therefore, the connection point between the power switching element 13 on the upper arm side and the power switching element 13 on the lower arm side of each phase is connected to three extraction terminals 22, 23, and 24 extending from the partition 12 of the motor housing 4. The power terminals of the power switching element 13 on the upper arm side and the ground terminal of the power switching element 13 on the lower arm side are called HV connectors of a connector case 27 attached to the motor housing 4. It is connected to the above-mentioned power harness from the battery via the high-power connector 28 (made of a screw).

  In this case, the lead-out terminals 22 to 24 to which the connection points of the power switching element 13 on the upper arm side and the power switching element 13 on the lower arm side of each phase are connected, penetrate the partition wall 12, and Are connected to the aforementioned stator coil. The power terminal and the ground terminal are connected to the terminal plate 29 of the filter mold assembly 21, a conductive member 31 called an EMC bus bar assembly, a conductive circuit board 32 called an EMC board, a connector bus bar 33, and the high power Is connected to a power supply harness via a connector 28 and the like. Reference numeral 34 denotes a bus bar case called an EMC filter case in which the connector bus bar 33 is built.

(2) Configuration of the high heat dissipation board 14 The high heat dissipation board 14 is formed in a thick plate shape with a resin for molding the circuit board, and the power switching elements 13 and the circuit components around them are arranged on one surface side. In addition, the power switching element 13 is configured to penetrate through the high heat radiation board 14 so as to be able to exchange heat with the other surface side. Circuit components around the power switching element 13 are also arranged on the other surface.

  Also, on one surface of the high heat radiation board 14, electrode terminals (screw) 36, 37, 38 that are electrically connected to the connection point between the power switching element 13 on the upper arm side and the power switching element 13 on the lower arm side of each phase described above. These are connected to the lead-out terminals 22, 23, 24 drawn out of the partition wall 12 via the bus bars 46, 47, 48 of the bus bar assembly 18, which will be described later, via the terminal plate 26, respectively. . Further, on one surface of the high heat radiation board 14, electrode terminals (screw) 42, 43 for conducting to the above-mentioned power supply terminal and ground terminal protrude, and these protrude through bus bars 49, 50 of the bus bar assembly 18, which will be described later. It will be connected to the terminal board 44 of the filter mold assembly 21. Further, a connector 39 connected to the control circuit 16 of the control board 17 outside the bus bar assembly 18 is attached to a peripheral portion of one surface of the high heat dissipation board 14.

(3) Configuration of Control Board 17 The control circuits 16 of the control board 17 are arranged on both sides of the control board 17 and control the switching of each power switching element 13 of the high heat radiation board 14 based on an external command. . Further, it has a function of transmitting the driving state of the motor to the outside, and is configured by connecting circuit components such as a microcomputer by printed wiring. Further, a connection portion 41 to which the connector 39 of the high heat radiation board 14 is connected is arranged around the control board 17.

(4) Configuration of Filter Mold Assembly 21 The smoothing capacitor 19 is connected between a power terminal and a ground terminal of the three-phase inverter circuit, and absorbs a high-frequency component of a switching current of the three-phase inverter circuit. The smoothing capacitor 19 is disposed on a filter mold assembly (circuit board) 21, and the terminal plate 29 of the filter mold assembly 21 is connected to the conductive member 31 as described above, and the conductive circuit board 32, the connector bus bar 33, and The terminal plate 44 is electrically connected to the power harness via the high power connector 28 and the like, and the terminal plate 44 is connected to the electrode terminals 42 and 43 of the high heat radiation board 14 described above.

(5) Configuration of Bus Bar Assembly 18 The bus bar assembly 18 has five bus bars 46, 47, 48, 49, and 50 forming wirings of the three-phase inverter circuit. The busbars 46 to 50 are arranged at positions outside the control board 17 and are integrated by insert molding of an insulating hard resin. The busbars 46 to 48 enable the electrode terminals 36 and 37 of the high heat radiation board 14 to be integrated. , 38 are connected to the respective terminal plates 26, and the bus bars 49, 50 connect the electrode terminals 42, 43 to the terminal plates 44 of the filter mold assembly 21.

(6) Assembling and Assembling of Inverter Circuit 3 Next, a procedure for assembling the inverter circuit 3 will be described. First, as shown in FIG. 5, a high heat dissipation board 14 on which a power switching element 13 and the like are mounted and a control board 17 on which a control circuit 16 is mounted sandwich the bus bar assembly 18 and the high heat dissipation board 14 and the bus bar assembly. 18 and the control board 17 are stacked.

  In this stacked state, the electrode terminals 36, 37, 38, 42, and 43 composed of screws are inserted from the other side of the high heat dissipation board 14, and penetrated through the high heat dissipation board 14 to form a bus bar. The bus bars 46 to 50 of the assembly 18 are screwed respectively. Due to this screw connection, the electrode terminals 36, 37, 38, 42, 43 are electrically connected to the circuit board of the high heat radiation board 14 and the bus bars 46 to 50.

  Also, screws 51 and 52 are inserted from one side of the control board 17, penetrate the control board 17, and are screwed to the bus bar assembly 18. By such screwing, the high heat dissipation board 14, the bus bar assembly 18, and the control board 17 are integrated. Next, with the smoothing capacitor 19 on the high heat dissipation board 14 side, the terminal plate 44 of the filter mold assembly 21 is addressed to one surface side of the bus bars 49, 50 of the bus bar assembly 18, and screws 53, 54 are inserted into the bus bar. The filter mold assembly 21 is screwed to the bus bar assembly 18 by screwing the filter mold assembly 49 to the bus bar assembly 18. In this state, the terminal plate 44 is electrically connected to the electrode terminals 42 and 43 via the bus bars 49 and 50, respectively. As a result, the inverter circuit unit 3 including the high heat radiation board 14, the control board 17, the bus bar assembly 18, and the filter mold assembly 21 (smoothing capacitor 19) is integrated (sub-assembly).

  The integrated inverter circuit section 3 is housed in the inverter housing section 8 of the motor housing 4 with the high heat radiation board 14 as the partition wall 12 side. At this time, the other surface of the high heat dissipation board 14 at a position corresponding to the power switching element 13 is filled with a filler (such as grease) for heat conduction, and each power switching element 13 is separated from the partition wall 12 through the filler. And heat exchange. Further, the smoothing capacitor 19 is also brought into close contact with the partition wall 12 to establish a heat exchange relationship.

  Then, the inverter circuit unit 3 is attached to the motor housing 4 (housing 2) with a plurality of screws. Thereafter, the terminal plate 26 is attached between the lead-out terminals 22, 23, 24 and the bus bars 46, 47, 48 by screws to conduct the connection. In addition, the terminal plate 29 of the filter mold assembly 21 is attached to the conductive member 31 with the screw 56 to make it conductive (FIGS. 4 and 2). Then, finally, the lid member 11 is attached to the opening 9 of the inverter accommodating section 8 with a plurality of screws, and the opening 9 of the inverter accommodating section 8 is closed so as to be openable and closable (FIG. 1).

(7) Configuration of Power Switching Element 13 and Structure of High Heat Dissipation Substrate 14 Therearound Next, a configuration of the power switching element 13 and a structure of the high heat dissipation substrate 14 therearound will be described with reference to FIGS. I do. As described above, a plurality of power switching elements 13 are mounted on the high heat dissipation board 14 as a circuit board of the electronic circuit device (inverter circuit section 3) in the present invention. In this case, in the embodiment, each of the power switching elements 13 is arranged two by two as shown in FIG. 6, and is electrically connected in parallel to each other to form a power switching element group 13G (FIG. 6). . Then, three power switching element groups 13G are used on the upper arm side and three on the lower arm side of each phase.

  Further, in the present invention, each power switching element 13 is constituted by a leadless package component. That is, the power switching element 13 is, for example, a MOSFET, and as shown in FIGS. 7 to 10, a semiconductor chip 57, a drain terminal 58 connected to the back surface of the semiconductor chip 57 by solder 60, a plurality of source terminals 59, The semiconductor device includes a gate terminal 61 and a plurality of wiring members 62 made of aluminum wire for connecting the surface of the semiconductor chip 57 to the source terminal 59 and the gate terminal 61, respectively.

  The semiconductor chip 57 and the wiring member 62 are molded with the resin 63, and the source terminal 59 and the gate terminal 61 are exposed side by side from the resin 63 on one side in the vertical direction (one side in the vertical direction of the power switching element 13). The drain terminal 58 is exposed from the resin 63 to the back surface. These terminals 58, 59 and 61 are connected to and mounted on the circuit board of the high heat radiation board 14.

  In the embodiment, a pair of through holes 64 for inspection are formed on both sides of the power switching element group 13G in the width direction on the high heat dissipation board 14 near each power switching element group 13G. In this case, the through holes 64 are formed corresponding to the region X1 where the wiring member 62 is provided as shown in FIGS. Each through hole 64 has an opening size that allows a current probe to be inserted.

  With the above configuration, when measuring the characteristics of the power switching element group 13G (power switching element 13) mounted on the high heat dissipation board 14 at the time of evaluation at the development stage, board inspection at the time of mass production, or the like, the current probe ( A general Rogowski coil current probe) is passed through the pair of through holes 64 for measurement. In the case where the other surface of the high heat dissipation substrate 14 is filled with a filler for heat conduction as in the embodiment and the power switching element 13 is brought into close contact with the partition wall 12, this filler is visually confirmed from each through hole 64. I do.

  As described above, the pair of through holes 64 for inspection are formed in the high heat dissipation board 14 near the power switching element group 13G in the width direction of the power switching element group 13G. By passing the current probe through the through-hole, the current of the power switching element group 13G mounted on the high heat dissipation board 14 can be measured.

  Accordingly, when a plurality of power switching elements 13 formed as leadless package parts are arranged in parallel and connected in parallel with each other to form a power switching element group 13G, the power switching elements 13 may be evaluated at the development stage or when inspecting a board during mass production. In addition, the characteristics when the power switching element group 13G is actually switched can be inspected, and the characteristics during the original operation can be accurately measured to improve the quality. In addition, since it can be achieved with a simple structure in which the through hole 64 is formed, a rise in production cost can be suppressed.

  In particular, the power switching element 13 includes the semiconductor chip 57 molded with the resin 63, the terminals 58, 59, 61 exposed from the resin 63, and the semiconductor chip 57 and the terminals 59, 61 molded with the resin 63. Since the wiring member 62 to be connected is provided and the through hole 64 is formed corresponding to the region X1 where the wiring member 62 is provided, the current flowing through the wiring member 62 can be measured with a current probe more accurately. Will be able to

  In particular, the inverter circuit unit 3 of the inverter-integrated electric compressor 1 including the motor housing 4 in which the motor is incorporated as in the embodiment and the inverter circuit unit 3 for supplying power to the motor is constituted by the electronic circuit device of the present invention. When the inverter circuit unit 3 is attached to the motor housing 4 and the power switching element 13 is arranged in a heat exchange relationship with the motor housing 4 via a heat-conducting filler in that state, Whether or not the material is sufficiently filled can be visually checked using the through hole 64. Thus, it is possible to prevent the inconvenience of causing a serious failure such as smoke and ignition due to poor cooling of the power switching element 13 by the motor housing 4.

  Here, in the embodiment, two power switching elements 13 are arranged in parallel and connected in parallel to form a power switching element group 13G. However, three power switching elements 13 (single) are provided on the upper arm side of each phase, In the case of using three on the arm side, as shown in FIG. 11, a pair of power switching elements 13 are located in the high heat radiation board 14 near the power switching elements 13 An inspection through hole 64 may be formed. Also in this case, each through hole 64, 64 is formed corresponding to the region X1 where the wiring member 62 is provided.

  With such a configuration, the current of the power switching element 13 mounted on the high heat dissipation board 14 can be measured by passing the current probe through the pair of through holes 64, 64, and the power switching element can be measured. Even when the component 13 is made into a leadless package component, the characteristics (current and voltage) when the power switching element 13 is actually switched can be inspected at the time of evaluation at the development stage or substrate inspection at the time of mass production. Become like As a result, it is possible to accurately measure the characteristics at the time of the original operation to improve the quality, and to simplify the structure, so that it is possible to suppress a rise in the production cost.

  In the embodiment, the pair of through holes 64 is formed near the power switching element group 13 (power switching element 13), but more pairs of through holes may be formed. Further, in the embodiment, the wiring member 63 is made of an aluminum wire, but may be made of a thin metal (for example, copper) plate.

  In the embodiment, the other surface of the high heat radiation substrate 14 is filled with a filler for heat conduction and the power switching element 13 is adhered to the partition 12. A heat conduction sheet (solid) may be provided on the other surface, and each power switching element 13 may be brought into close contact with the partition 12 via the heat conduction sheet to establish a heat exchange relationship. Also in that case, whether or not the heat conducting sheet is sufficiently adhered can be visually checked using the through holes 64. Thus, it is possible to avoid the inconvenience of causing a serious failure such as smoke and ignition due to poor cooling of the power switching element 13 by the motor housing 4.

  Further, in the embodiment, the inverter circuit unit 3 is attached to the motor housing 4 by screws, but may be attached by applying an adhesive to the other surface of the high heat radiation board 14 and adhering to the motor housing 4. In this case, it is possible to check whether or not the adhesive is sufficiently hardened by using the through hole 64. Inconveniences such as occurrence of a failure can be avoided beforehand.

  Furthermore, the shapes and structures of the inverter circuit section 3, the motor housing 4, and the power switching element 13 shown in the embodiment are not limited to those described above, and can be variously changed without departing from the spirit of the present invention. Needless to say. Furthermore, the electronic circuit device of the present invention is effective not only for the inverter-integrated electric compressor of the embodiment but also for various electric appliances.

DESCRIPTION OF SYMBOLS 1 Inverter integrated type electric compressor 2 Housing 3 Inverter circuit part (electronic circuit device)
4 Motor Housing 6 Compression Mechanism Housing 8 Inverter Housing 12 Partition Wall 13 Power Switching Element (Leadless Package Parts)
13G power switching element group 14 high heat dissipation board (circuit board)
17 Control Board 18 Bus Bar Assembly 19 Smoothing Capacitor 21 Filter Mold Assembly 22 to 24 Lead Out Terminal 46 to 50 Bus Bar 57 Semiconductor Chip 58 Drain Terminal 59 Source Terminal 61 Gate Terminal 62 Wiring Member 63 Resin 64 Through Hole

Claims (7)

In an electronic circuit device comprising a leadless package component mounted on a circuit board,
The leadless package component is a power switching element,
An electronic circuit device, wherein at least one pair of through holes for inspection are formed in the circuit board near the power switching element in a width direction of the power switching element. In an electronic circuit device comprising a leadless package component mounted on a circuit board,
The leadless package component is a power switching element, and a plurality of the power switching elements are arranged on the circuit board in a width direction thereof, and are connected in parallel with each other to form a power switching element group.
An electronic circuit device, wherein at least one pair of through holes for inspection are formed in the circuit board near the power switching element group in a width direction of the power switching element group. The power switching element includes a semiconductor chip molded with resin, a terminal exposed from the resin, and a wiring member molded with the resin and connecting the semiconductor chip and the terminal,
The electronic circuit device according to claim 1, wherein the through hole is formed corresponding to a region where the wiring member is provided.   An inverter-integrated type comprising: a housing in which a motor is built; and an electronic circuit device according to any one of claims 1 to 3, further comprising an inverter circuit unit that supplies power to the motor. Electric compressor.   The inverter circuit unit is attached to the housing, and in this state, the power switching element is disposed in a heat exchange relationship with the housing via a heat-conducting filler. Inverter integrated electric compressor.   The inverter according to claim 4, wherein the inverter circuit unit is attached to the housing, and in that state, the power switching element is arranged in a heat exchange relationship with the housing via a heat conduction sheet. Integrated electric compressor.   The electric compressor according to claim 4, wherein the inverter circuit unit is attached to the housing by bonding the circuit board to the housing with an adhesive.

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