CN103338584A - Crossover line component for PCB - Google Patents
Crossover line component for PCB Download PDFInfo
- Publication number
- CN103338584A CN103338584A CN2013102450732A CN201310245073A CN103338584A CN 103338584 A CN103338584 A CN 103338584A CN 2013102450732 A CN2013102450732 A CN 2013102450732A CN 201310245073 A CN201310245073 A CN 201310245073A CN 103338584 A CN103338584 A CN 103338584A
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- Prior art keywords
- pcb
- cross
- line
- crossover line
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Abstract
The invention relates to a crossover line component for a PCB (Printed Circuit Board), which comprises a crossover line. The component is characterized in that bending pins are arranged at the two ends of the crossover line respectively; the bending angle of the bending pins is 40 to 120 degrees; the length of the bending pins is 3 to 5 mm; the length of the crossover line is 20 to 40 mm; the thickness of the crossover line is 0.5 to 1.5 mm; a tin coating covers the periphery of the crossover line. Therefore, the crossover line component can carry out a most effective assembling connection with the PCB, and can be inserted on the PCB straightly; meanwhile by the means of the existence of the tin coating, manual tinning is not needed after the wave-soldering, the manual work is reduced, and the output is increased; moreover the component is simple in construct and easy to produce.
Description
Technical field
The present invention relates to a kind of cross-line assembly, relate in particular to a kind of PCB cross-line assembly.
Background technology
PCB design at present has following two kinds of methods that increase electric current:
1, the copper sheet thickness of increase copper sheet thickness---PCB mainly contains following several 35um, 50 um, 70um can select, and will make the thickening of monoblock wiring board but do like this.Existing market price 35um/0.05 unit/cm
250um/0.06 unit/cm
270um/0.07 unit/cm
2If calculate with just 6.5 yuan of 35um by wiring board a 87.5 * 135mm, use 50um7.08 unit, use 70um8.25 unit.With 35um cheap 1.75 yuan than 70um.If just economized 1.75 ten thousand yuan output 10,000/moon, province still apparent in view.
2, the printed board back side adds and helps layer---and the tin surface large area adds and helps layer on PCB.The price of tin is 120 yuan/kilogram now, goes up tin at this moment by the even upward the most broad 35um of tin and is about 0.5 gram/cm
2, be 2cm * 0.035mm=0.7mm as walking line length 3.2 cm * wide 2cm(increase area at this moment
2) calculate to need go up tin 0.38 and add that artificial benefit tin is minimum wants 0.5 yuan/piece.
Thus, lack a kind of assembly that reduces cost and do not weaken PCB conducting effect.
Summary of the invention
Purpose of the present invention is exactly in order to solve the above-mentioned problems in the prior art, and a kind of PCB is provided the cross-line assembly.
Purpose of the present invention is achieved through the following technical solutions:
A kind of PCB cross-line assembly, include cross-line, wherein: described cross-line two ends are provided with the bending pin, the bending angle of described bending pin is 40 to 120 degree, the length of described bending pin is 3 to 5 millimeters, described cross-line length is 20 to 40 millimeters, and described cross-line thickness is 0.5 to 1.5 millimeter, and described cross-line periphery is enclosed with tin coating.
Further, above-mentioned a kind of PCB cross-line assembly, wherein: the bending angle of described bending pin is 90 degree.
Further, above-mentioned a kind of PCB cross-line assembly, wherein: described cross-line length is 32 millimeters.
Further, above-mentioned a kind of PCB cross-line assembly, wherein: described cross-line thickness is 1 millimeter.
Further, above-mentioned a kind of PCB cross-line assembly, wherein: the length of described bending pin is 4 millimeters.
Again further, above-mentioned a kind of PCB cross-line assembly, wherein: be provided with angle between the described bending pin, described angle is 0.5 degree.
The advantage of technical solution of the present invention is mainly reflected in: can carry out the most effective assembling with PCB and be connected, can straight cutting on PCB.Simultaneously, rely on the existence of tin coating, also do not need manually to go up tin through behind the wave-soldering, reduced and manually improved output again.Moreover simple structure of the present invention is easy to produce.
Description of drawings
Purpose of the present invention, advantage and characteristics will illustrate by the non-limitative illustration of following preferred embodiment and explain.
Fig. 1 is the organigram that this PCB uses the cross-line assembly.
Fig. 2 is the left view that this PCB uses the cross-line assembly.
| 1 | Cross-line | 2 | The bending pin |
。
Embodiment
A kind of PCB cross-line assembly as shown in Figure 1 and Figure 2 includes cross-line 1, and its unusual part is: cross-line of the present invention 1 two ends are provided with bending pin 2.Specifically, the bending angle of bending pin 2 is 40 to 120 degree, and the length of bending pin 2 is 3 to 5 millimeters.Simultaneously, cross-line 1 length is 20 to 40 millimeters, and cross-line 1 thickness is 0.5 to 1.5 millimeter.And, in order to satisfy effective conductive cross-sectional area, satisfy simultaneously and effectively help the weldering effect, be enclosed with tin coating in cross-line 1 periphery.
With regard to the present invention's one preferred implementation, in order to satisfy common PCB processing design needs, reduce unnecessary design thickness, reduce the printing that backboard helps layer, the bending angle of bending pin 2 is 90 degree.Simultaneously, cross-line 1 length is 32 millimeters, and thickness is 1 millimeter.Corresponding is that the length of bending pin 2 is 4 millimeters with it.
Further, consider electric elements are carried out best conducting, reduce track lengths, be provided with angle between the bending pin 2, this angle is 0.5 degree.Certainly, consider the manufacturing needs that adapt to different PCB classifications, take into account some special application, every numerical value that the present invention adopts all can suitably be adjusted.
By above-mentioned character express as can be seen, behind employing the present invention, can carry out the most effective assembling with PCB and be connected, can directly be inserted on the PCB.Simultaneously, rely on the existence of tin coating, also do not need manually to go up tin through behind the wave-soldering, reduced and manually improved output again.Moreover simple structure of the present invention is easy to produce.
These embodiment only are the prominent examples of using technical solution of the present invention, and all technical schemes of taking to be equal to replacement or equivalent transformation and forming all drop within the scope of protection of present invention.
Claims (6)
1. PCB cross-line assembly, include cross-line, it is characterized in that: described cross-line two ends are provided with the bending pin, the bending angle of described bending pin is 40 to 120 degree, the length of described bending pin is 3 to 5 millimeters, described cross-line length is 20 to 40 millimeters, and described cross-line thickness is 0.5 to 1.5 millimeter, and described cross-line periphery is enclosed with tin coating.
2. a kind of PCB cross-line assembly according to claim 1 is characterized in that: the bending angle of described bending pin is 90 degree.
3. a kind of PCB cross-line assembly according to claim 1, it is characterized in that: described cross-line length is 32 millimeters.
4. a kind of PCB cross-line assembly according to claim 1, it is characterized in that: described cross-line thickness is 1 millimeter.
5. a kind of PCB cross-line assembly according to claim 1, it is characterized in that: the length of described bending pin is 4 millimeters.
6. a kind of PCB cross-line assembly according to claim 1 is characterized in that: be provided with angle between the described bending pin, described angle is 0.5 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102450732A CN103338584A (en) | 2013-06-20 | 2013-06-20 | Crossover line component for PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102450732A CN103338584A (en) | 2013-06-20 | 2013-06-20 | Crossover line component for PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103338584A true CN103338584A (en) | 2013-10-02 |
Family
ID=49246660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102450732A Pending CN103338584A (en) | 2013-06-20 | 2013-06-20 | Crossover line component for PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103338584A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681171A (en) * | 2013-12-07 | 2014-03-26 | 四川天微电子有限责任公司 | Ceramic gas discharge tube |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59172290A (en) * | 1983-03-18 | 1984-09-28 | 松下電器産業株式会社 | Method of connecting both-side printed circuit board |
| CN1187751A (en) * | 1997-01-09 | 1998-07-15 | 株式会社东芝 | Printed circuit board for large current |
| US20040002257A1 (en) * | 2002-06-26 | 2004-01-01 | Tatsuo Katayama | Jump wire structure |
| CN202694820U (en) * | 2012-07-17 | 2013-01-23 | 江西康成铜业有限公司 | Tin-plated copper wire |
| CN203423850U (en) * | 2013-06-20 | 2014-02-05 | 张家港市华为电子有限公司 | Jumper wire component for PCB |
-
2013
- 2013-06-20 CN CN2013102450732A patent/CN103338584A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59172290A (en) * | 1983-03-18 | 1984-09-28 | 松下電器産業株式会社 | Method of connecting both-side printed circuit board |
| CN1187751A (en) * | 1997-01-09 | 1998-07-15 | 株式会社东芝 | Printed circuit board for large current |
| US20040002257A1 (en) * | 2002-06-26 | 2004-01-01 | Tatsuo Katayama | Jump wire structure |
| CN202694820U (en) * | 2012-07-17 | 2013-01-23 | 江西康成铜业有限公司 | Tin-plated copper wire |
| CN203423850U (en) * | 2013-06-20 | 2014-02-05 | 张家港市华为电子有限公司 | Jumper wire component for PCB |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681171A (en) * | 2013-12-07 | 2014-03-26 | 四川天微电子有限责任公司 | Ceramic gas discharge tube |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131002 |