CN111900138B - 系统模组封装结构及系统模组封装方法 - Google Patents

系统模组封装结构及系统模组封装方法 Download PDF

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CN111900138B
CN111900138B CN201910372116.0A CN201910372116A CN111900138B CN 111900138 B CN111900138 B CN 111900138B CN 201910372116 A CN201910372116 A CN 201910372116A CN 111900138 B CN111900138 B CN 111900138B
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upper substrate
substrate
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cavity
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CN111900138A (zh
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肖俊义
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Shunsin Technology Zhongshan Ltd
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Abstract

一种系统模组封装结构，包括上基板、下基板、第一元件、至少一中介层及第一封胶体。所述上基板具有第一侧。所述下基板具有面对所述上基板的所述第一侧的第二侧。所述第一元件设置于所述上基板的所述第一侧或所述下基板的所述第二侧。至少一中介层，与所述上基板的所述第一侧及所述下基板的所述第二侧连接，并围绕所述第一元件，以于所述上基板及所述下基板之间形成第一腔体。所述第一封胶体填充于所述第一腔体中，用以包覆所述第一元件。本发明还公开了一种系统模组封装方法。本发明公开的系统模组封装结构及系统模组封装方法可提升封装的可靠度及加强放水性能。

Description

系统模组封装结构及系统模组封装方法
技术领域
本发明是关于一种封装结构及封装方法，尤其关于一种适用于系统模组的封装结构及系统模组封装方法。
背景技术
随着科技的进步，半导体器件大量地使用于例如个人计算机、移动电话、数码相机和其他电子设备的各种电子应用中。半导体工业通过连续减小最小部件的尺寸来连续改进各种电子部件(例如，晶体管、二极管、电阻器、电容器等)的集成密度，这使得更多的部件被集成到给定面积中。然而，在现有的封装技术中，PoP堆叠封装(Package on Package)及SMT堆叠封装(Surface-mount technology)焊点相对脆弱，当跌落测试时，有锡球断裂的风险。此外，实际应用时常需要点胶在堆栈之间的缝隙，进而增加成本。因此，如何增加封装的可靠度及利用率为目前所需解决的问题。
发明内容
有鉴于此，需要一种适用于系统模组的封装结构及封装方法来提升封装的可靠度。
本发明提供一种系统模组封装结构，包括上基板、下基板、第一元件、至少一中介层及第一封胶体。所述上基板具有第一侧。所述下基板具有面对所述上基板的所述第一侧的第二侧。所述第一元件设置于所述上基板的所述第一侧或所述下基板的所述第二侧。至少一中介层，与所述上基板的所述第一侧及所述下基板的所述第二侧连接，并围绕所述第一元件，以于所述上基板及所述下基板之间形成第一腔体。所述第一封胶体填充于所述第一腔体中，用以包覆所述第一元件。
本发明还提供一种系统模组封装方法，其特征在于，所述步骤包括：设置第一元件于上基板的第一侧或下基板的第二侧，其中所述上基板的所述第一侧面对所述下基板的所述第二侧；形成至少一中介层于所述下基板的所述第二侧上，其中所述至少一中介层围绕所述第一元件；连接所述至少一中介层及所述上基板的所述第一侧，以于所述上基板及所述下基板之间形成第一腔体；及填充第一封胶体于所述第一腔体中，以包覆所述第一元件。
根据本发明一实施例，所述步骤更包括：形成至少一开口于所述中介层、所述上基板及所述下基板之间，其中所述开口与所述第一腔体连通，注射装置将所述第一封胶体经由所述开口填充于所述第一腔体中。
根据本发明一实施例，所述步骤更包括：设置第二元件于所述上基板的第三侧，并覆盖第二封胶体于所述第二元件上，其中所述上基板的所述第三侧位于所述上基板相对于所述第一侧的另一侧。
根据本发明一实施例，所述步骤更包括：形成第二腔体于所述上基板的所述第三侧与模具之间，注射装置将所述第二封胶体填充于所述第二腔体中以覆盖所述第二元件，其中所述第一封胶体及所述第二封胶体为环氧树脂。
根据本发明一实施例，所述步骤更包括：透过焊锡设置所述第一元件于所述上基板的所述第一侧或所述下基板的所述第二侧，及透过所述焊锡连接所述至少一中介层与所述上基板的所述第一侧及所述下基板的所述第二侧，使得所述上基板与所述下基板透过所述至少一中介层电性连接。
附图说明
图1为根据本发明一实施例所述的系统模组封装结构的示意图。
图2A、2B为根据本发明一些实施例所述的系统模组封装结构中中介层的配置示意图。
图3为根据本发明另一实施例所述的系统模组封装结构的示意图。
图4为根据本发明一实施例所述的系统模组封装方法的流程图。
图5A-5D为根据本发明一实施例所述的系统模组封装方法的剖面图。
主要元件符号说明
Figure BDA0002050339020000031
具体实施方式
有关本发明的系统及方法适用的其他范围将于接下来所提供的详述中清楚易见。必须了解的是下列的详述以及具体的实施例，当提出有关系统模组封装结构及系统模组封装方法的示范实施例时，仅作为描述的目的以及并非用以限制本发明的范围。
图1为根据本发明一实施例所述的系统模组封装结构的示意图。系统模组封装结构100由至少一上基板110、一下基板120、一第一元件130、一中介层140及第一封胶体150。上基板110具有一第一侧111及相对于第一侧111的一第三侧112。下基板120具有一第二侧121。其中，上基板110的第一侧111面对下基板120的第二侧121。元件130可为芯片、被动元件、电容、电阻、天线或连接器等元件，其透过表面黏着技术(SMT)设置于上基板110的第一侧111或下基板120的第二侧121上，以实现其与上基板110或下基板120的电连接。中介层140由导电材料所构成(例如以绝缘材料包覆铜线)，其围绕第一元件130且其高度高于第一元件130，并透过表面黏着技术与上基板110及下基板120连接，使得上基板110可透过中介层140与所述下基板120电连接。举例来说，如图1所示，中介层140透过锡膏141焊接于下基板120的第二侧121及上基板110的第一侧111。其中，上基板110、下基板120及中介层140所构成的第一腔体具有至少一开口(如图2A、2B所示)，使得注射装置可将第一封胶体150经由开口填充至第一腔体中。第一封胶体150可为环氧成型模料(Epoxy Mold compound)，可用以覆盖第一元件130及上基板110與下基板120上未被第一元件130所遮住的区域，并包覆中介层140的四周，以达到保护电路板及元件的目的。
图2A、2B为根据本发明一些实施例所述的系统模组封装结构中中介层的配置示意图。如图2A所示，开口即为未被中介层140所遮蔽的缺口(如图中标号”210”所示)，使得注射装置可经由缺口210将第一封胶体150充满上基板110、下基板120及中介层140之间。此外，根据本发明另一实施例，如图2B所示，设置于上基板110与下基板120之间的中介层140的数量为7个，而由于每2个中介层140之间会形成1个缺口，即图2B所示的中介层配置具有7个开口。值得注意的是，图2A、2B所示的中介层140的配置仅为本发明的2个实施例，中介层140亦可配置为紧邻第一元件130，或沿着上基板110及下基板120的边缘设置等，并不以此为限。
图3为根据本发明另一实施例所述的系统模组封装结构的示意图。如图中所示，元件311-333透过表面黏着技术设置于下基板320的第二侧321，及元件334、335透过表面黏着技术设置于上基板的第一侧311。同样地，中介层341亦透过表面黏着技术与上基板310的第一侧311及下基板320的第二侧321电连接。于此一实施例中，系统模组封装结构300更包括设置于上基板310的第三侧312上的第二元件361、362及中介层342。如图中所示，第二元件361为透过表面黏着技术与上基板310的第三侧312电连接的芯片，且被第二封胶体352所覆盖。中介层342的下侧亦透过表面黏着技术与上基板310的第三侧312电连接，而侧边被第二封胶体370所包围，但其上侧并未被第二封胶体352所覆盖，使得外部元件或外部装置可透过位于中介层242上侧的锡球与上基板310的第三侧312电连接。此外，第二元件362为连接器，用以与外部装置连接，故并未被第二封胶体370所覆盖。换言之，第二封胶体352可视使用者的需求整个覆盖上基板310的第三侧312，或者仅覆盖一部份的区域。其中，于形成第二封胶体352时，首先将模具与上基板310的第三侧312接合以形成具有至少一开口的第二腔体，接着注射装置经由开口将第二封胶体352填充于第二腔体中，最后经过冷却阶段后再将模具与上基板310分离。
图4为根据本发明一实施例所述的系统模组封装方法的流程图。图5A-5D为根据本发明一实施例所述的系统模组封装方法的剖面图。首先，于步骤S401(配合参阅第5A图)，第一元件531-536及中介层541、542透过表面黏着技术设置于下基板520的第二侧521，第一元件537-540透过表面黏着技术设置于上基板510的第一侧511，及第二元件561、562与中介层543、544透过表面黏着技术设置于上基板510的第三侧512上。于步骤S402(配合参阅第5B图)，透过表面黏着技术连接上基板510与已设置于下基板520的第二侧521上的中介层140，使得上基板510可透过中介层341与下基板520电连接，并于上基板510与下基板520之间形成第一腔体。于步骤S403(配合参阅第5C图)，填充第一封胶体551于介于上基板510与下基板520之间的第一腔体中，以包覆位于上基板110及下基板120之间的第一元件531-540。此外，针对设置于上基板510的第三侧512的第二元件561及中介层542，于填充第二封胶体前，首先先将模具(未显示)与上基板510的第三侧512接合以形成具有至少一开口的第二腔体，接着注射装置经由开口将第二封胶体552填充于第二腔体中，最后经过冷却阶段后再将模具与上基板310分离，以使得第二封胶体552覆盖位于上基板510的第三侧512上的第二元件561、536并围绕中介层543。其中，由于图5A-5C的实施例中，完成品中包含2个封装，因此于完成前述的步骤后，更将完成品切割为一半以形成如图5D所示的单个封装。
值得注意的是，尽管上述方法已在使用一系列步骤或方框的流程图的基础上描述，但本发明不局限于这些步骤的顺序，并且一些步骤可不同于其余步骤的顺序执行或其余步骤可同时进行。此外，本领域技术人员将可理解在流程图中所示的步骤并非唯一的，其可包括流程图的其它步骤，或者一或多个步骤可被删除而不会影响本发明的范围。
综上所述，根据本发明一些实施例所提出的系统模组封装结构及系统模组封装方法，藉由将封胶体填充于上基板及下基板之间，或将封胶体覆盖于基板上具有元件的区域上，以达到提升可靠度、封装密封性、防水性能与封装利用率的目的。
值得注意的是，以上实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或等同替换，而不脱离本发明技术方案的精神和范围。

Claims (9)

1.一种系统模组封装结构，其特征在于，包括：
上基板，具有第一侧；
下基板，具有面对所述上基板的所述第一侧的第二侧；
第一元件，设置于所述下基板的所述第二侧；
至少一中介层，与所述上基板的所述第一侧及所述下基板的所述第二侧连接，并围绕所述第一元件，以于所述上基板及所述下基板之间形成第一腔体；及
第一封胶体，填充于所述第一腔体中，以包覆所述第一元件，所述中介层、所述上基板及所述下基板之间具有至少一开口，所述开口与所述第一腔体连通，使得所述第一封胶体透过注射装置经由所述开口填充于所述第一腔体中、所述开口位于所述下基板的所述第二侧上。
2.如权利要求1所述的系统模组封装结构，其特征在于，更包括：
第二元件，设置于所述上基板的第三侧，并被第二封胶体所覆盖，其中所述上基板的所述第三侧位于所述上基板相对于所述第一侧的另一侧。
3.如权利要求2所述的系统模组封装结构，其特征在于，所述第一元件透过表面黏着技术设置于所述上基板的所述第一侧或所述下基板的所述第二侧，及所述至少一中介层透过所述表面黏着技术连接所述上基板的所述第一侧及所述下基板的所述第二侧，使得所述上基板与所述下基板透过所述至少一中介层电连接。
4.如权利要求2所述的系统模组封装结构，其特征在于，所述第一封胶体及所述第二封胶体为环氧树脂。
5.一种系统模组封装方法，其特征在于，包括：
设置第一元件于上基板的第一侧或下基板的第二侧，其中所述上基板的所述第一侧面对所述下基板的所述第二侧；
形成至少一中介层于所述下基板的所述第二侧上，其中所述至少一中介层围绕所述第一元件；
连接所述至少一中介层及所述上基板的所述第一侧，以于所述上基板及所述下基板之间形成第一腔体；及
填充第一封胶体于所述第一腔体中，以包覆所述第一元件。
6.如权利要求5所述的系统模组封装方法，其特征在于，更包括：
形成至少一开口于所述中介层、所述上基板及所述下基板之间，其中所述开口与所述第一腔体连通，注射装置将所述第一封胶体经由所述开口填充于所述第一腔体中。
7.如权利要求5所述的系统模组封装方法，其特征在于，更包括：
设置第二元件于所述上基板的第三侧，并覆盖第二封胶体于所述第二元件上，其中所述上基板的所述第三侧位于所述上基板相对于所述第一侧的另一侧。
8.如权利要求7所述的系统模组封装方法，其特征在于，更包括：
形成第二腔体于所述上基板的所述第三侧与模具之间，注射装置将所述第二封胶体填充于所述第二腔体中以覆盖及/或围绕所述第二元件，其中所述第一封胶体及所述第二封胶体为环氧树脂。
9.如权利要求8所述的系统模组封装方法，其特征在于，更包括：
透过表面黏着技术设置所述第一元件于所述上基板的所述第一侧或所述下基板的所述第二侧，及透过所述表面黏着技术连接所述至少一中介层与所述上基板的所述第一侧及所述下基板的所述第二侧，使得所述上基板与所述下基板透过所述至少一中介层电连接。
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