CN111886684A - 芯片、芯片封装结构及封装方法 - Google Patents

芯片、芯片封装结构及封装方法 Download PDF

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CN111886684A
CN111886684A CN201880091555.8A CN201880091555A CN111886684A CN 111886684 A CN111886684 A CN 111886684A CN 201880091555 A CN201880091555 A CN 201880091555A CN 111886684 A CN111886684 A CN 111886684A
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gold
chip
layer
substrate
packaging
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CN111886684B (zh
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李晓勇
韩梅
滕辉
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Abstract

一种芯片(1)、芯片封装结构及封装方法，该芯片(1)包括：芯片基板、背面设有含金层(11)背金芯片(1)、以及依次设于所述芯片基板的背面的含金层(11)和至少一层非含金层(2)，非金层(2)用于通过锡焊焊接耦合至用于封装所述芯片基板的封装基板(4)。通过非金层(2)隔离锡焊料连接部(3)与含金层(11)，避免锡焊工艺中脆性的金锡合金的形成，进而避免金脆效应的产生，使得芯片(1)与封装基板(4)之间的焊接更加牢固。

Description

PCT国内申请，说明书已公开。

Claims (16)

  1. PCT国内申请，权利要求书已公开。
CN201880091555.8A 2018-04-16 2018-04-16 芯片、芯片封装结构及封装方法 Active CN111886684B (zh)

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CN101699622A (zh) * 2009-11-18 2010-04-28 晶方半导体科技（苏州）有限公司 半导体器件封装结构及其封装方法
CN101826472A (zh) * 2010-03-04 2010-09-08 江阴新顺微电子有限公司 芯片背面复合材料多层金属化方法
CN102148221A (zh) * 2010-02-10 2011-08-10 精材科技股份有限公司 电子元件封装体及其制造方法
CN203300630U (zh) * 2013-05-20 2013-11-20 扬州晶新微电子有限公司 可用于共晶焊的p型硅器件芯片背面金属化结构
CN104078369A (zh) * 2014-06-11 2014-10-01 昆山华太电子技术有限公司 一种低成本的大功率电子器件封装工艺
CN107240556A (zh) * 2017-07-28 2017-10-10 中芯长电半导体（江阴）有限公司 人脸识别芯片的封装结构及封装方法

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CN102157405B (zh) * 2010-12-22 2012-07-04 北京时代民芯科技有限公司 基于熔封封帽工艺的芯片真空共晶焊接方法
US9735126B2 (en) * 2011-06-07 2017-08-15 Infineon Technologies Ag Solder alloys and arrangements
CN103633050A (zh) * 2013-11-29 2014-03-12 华为技术有限公司 芯片、芯片封装结构及芯片焊接的方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101465305A (zh) * 2008-10-22 2009-06-24 杭州士兰集成电路有限公司 芯片低接触电阻背面金属化工艺方法以及结构
CN101699622A (zh) * 2009-11-18 2010-04-28 晶方半导体科技（苏州）有限公司 半导体器件封装结构及其封装方法
CN102148221A (zh) * 2010-02-10 2011-08-10 精材科技股份有限公司 电子元件封装体及其制造方法
CN101826472A (zh) * 2010-03-04 2010-09-08 江阴新顺微电子有限公司 芯片背面复合材料多层金属化方法
CN203300630U (zh) * 2013-05-20 2013-11-20 扬州晶新微电子有限公司 可用于共晶焊的p型硅器件芯片背面金属化结构
CN104078369A (zh) * 2014-06-11 2014-10-01 昆山华太电子技术有限公司 一种低成本的大功率电子器件封装工艺
CN107240556A (zh) * 2017-07-28 2017-10-10 中芯长电半导体（江阴）有限公司 人脸识别芯片的封装结构及封装方法

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