CN111886366A - 水平电镀装置以及方法 - Google Patents
水平电镀装置以及方法 Download PDFInfo
- Publication number
- CN111886366A CN111886366A CN201980019953.3A CN201980019953A CN111886366A CN 111886366 A CN111886366 A CN 111886366A CN 201980019953 A CN201980019953 A CN 201980019953A CN 111886366 A CN111886366 A CN 111886366A
- Authority
- CN
- China
- Prior art keywords
- plating
- substrate
- anode
- horizontal direction
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 54
- 238000009713 electroplating Methods 0.000 title claims description 28
- 238000007747 plating Methods 0.000 claims abstract description 287
- 239000000758 substrate Substances 0.000 claims abstract description 159
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims description 41
- 238000005507 spraying Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000000206 photolithography Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 43
- 229910001374 Invar Inorganic materials 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- -1 iron ions Chemical class 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000001363 water suppression through gradient tailored excitation Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005097 cold rolling Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 3
- 229910001453 nickel ion Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021577 Iron(II) chloride Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- DAPUDVOJPZKTSI-UHFFFAOYSA-L ammonium nickel sulfate Chemical compound [NH4+].[NH4+].[Ni+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DAPUDVOJPZKTSI-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229960002089 ferrous chloride Drugs 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N iridium(IV) oxide Inorganic materials O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052603 melanterite Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0685—Spraying of electrolyte
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0035521 | 2018-03-28 | ||
| KR1020180035521A KR102124406B1 (ko) | 2018-03-28 | 2018-03-28 | 수평 도금 장치 및 방법 |
| PCT/KR2019/003208 WO2019190115A1 (ko) | 2018-03-28 | 2019-03-20 | 수평 도금 장치 및 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111886366A true CN111886366A (zh) | 2020-11-03 |
Family
ID=68062255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980019953.3A Pending CN111886366A (zh) | 2018-03-28 | 2019-03-20 | 水平电镀装置以及方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7020726B2 (ko) |
| KR (1) | KR102124406B1 (ko) |
| CN (1) | CN111886366A (ko) |
| WO (1) | WO2019190115A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115261954A (zh) * | 2021-04-30 | 2022-11-01 | 株式会社波因特 | 电镀装置及利用其的电镀方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102639533B1 (ko) * | 2018-12-31 | 2024-02-21 | 엘지디스플레이 주식회사 | 전기도금장치 및 수평도금장치 |
| KR102636830B1 (ko) * | 2018-12-31 | 2024-02-14 | 엘지디스플레이 주식회사 | 전기 도금 장치 및 이를 이용한 전기 도금 방법 |
| KR102410794B1 (ko) * | 2020-04-03 | 2022-06-20 | (주)포인텍 | 양산형 고품질 도금 장치 |
| KR102410787B1 (ko) * | 2020-04-03 | 2022-06-20 | (주)포인텍 | 이동형 수직애노드가 장착된 도금장치 |
| CN112680769A (zh) * | 2020-12-30 | 2021-04-20 | 深圳市合成快捷电子科技有限公司 | 一种线路板的智能电镀装置及电镀方法 |
| KR102519062B1 (ko) * | 2021-04-07 | 2023-04-10 | 주식회사 엔원테크 | 전해동박 제조용 애노드전극 조립체 |
| JP2023180832A (ja) * | 2022-06-10 | 2023-12-21 | 株式会社Ｓｃｒｅｅｎホールディングス | めっき装置およびめっき方法 |
| CN115449886A (zh) * | 2022-09-30 | 2022-12-09 | 昆山东威科技股份有限公司 | 一种电镀槽及具有其的电镀生产线 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1341166A (zh) * | 1999-12-24 | 2002-03-20 | 株式会社荏原制作所 | 基片的电镀装置和电镀方法以及电解处理方法及其装置 |
| KR20080014519A (ko) * | 2006-08-11 | 2008-02-14 | 지 량 리아오 | 기판에 박막을 수평으로 전기 도금, 전착 및 무전해도금하는 방법 |
| JP2014105339A (ja) * | 2012-11-24 | 2014-06-09 | Marunaka Kogyo Kk | 水平搬送式電解メッキ装置 |
| CN104024490A (zh) * | 2012-11-01 | 2014-09-03 | 油研工业股份有限公司 | 一种电镀装置、喷嘴－阳极单元、电镀构件的制造方法以及被镀构件固定装置 |
| CN106350841A (zh) * | 2016-10-18 | 2017-01-25 | 东莞宇宙电路板设备有限公司 | 一种电镀装置 |
| KR20180000133A (ko) * | 2016-06-22 | 2018-01-02 | (주)포인텍 | 애노드 이동형 수평도금장치 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100311453B1 (ko) * | 1999-02-20 | 2001-11-02 | 차인석 | 금속판 도금장치 |
| KR20140060423A (ko) * | 2012-11-09 | 2014-05-20 | 삼성전기주식회사 | 도금 장치 |
| KR101788678B1 (ko) * | 2016-06-30 | 2017-10-20 | (주)포인텍 | 수평도금용 기판의 클램핑 장치 |
-
2018
- 2018-03-28 KR KR1020180035521A patent/KR102124406B1/ko active IP Right Grant
-
2019
- 2019-03-20 CN CN201980019953.3A patent/CN111886366A/zh active Pending
- 2019-03-20 JP JP2020566521A patent/JP7020726B2/ja active Active
- 2019-03-20 WO PCT/KR2019/003208 patent/WO2019190115A1/ko active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1341166A (zh) * | 1999-12-24 | 2002-03-20 | 株式会社荏原制作所 | 基片的电镀装置和电镀方法以及电解处理方法及其装置 |
| KR20080014519A (ko) * | 2006-08-11 | 2008-02-14 | 지 량 리아오 | 기판에 박막을 수평으로 전기 도금, 전착 및 무전해도금하는 방법 |
| CN104024490A (zh) * | 2012-11-01 | 2014-09-03 | 油研工业股份有限公司 | 一种电镀装置、喷嘴－阳极单元、电镀构件的制造方法以及被镀构件固定装置 |
| JP2014105339A (ja) * | 2012-11-24 | 2014-06-09 | Marunaka Kogyo Kk | 水平搬送式電解メッキ装置 |
| KR20180000133A (ko) * | 2016-06-22 | 2018-01-02 | (주)포인텍 | 애노드 이동형 수평도금장치 |
| CN106350841A (zh) * | 2016-10-18 | 2017-01-25 | 东莞宇宙电路板设备有限公司 | 一种电镀装置 |
Non-Patent Citations (1)
| Title |
|---|
| 陈亚等, 国防工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115261954A (zh) * | 2021-04-30 | 2022-11-01 | 株式会社波因特 | 电镀装置及利用其的电镀方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021514425A (ja) | 2021-06-10 |
| KR20190113181A (ko) | 2019-10-08 |
| JP7020726B2 (ja) | 2022-02-16 |
| KR102124406B1 (ko) | 2020-06-18 |
| WO2019190115A1 (ko) | 2019-10-03 |
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