JP6774668B2 - 精密電鋳法のための気泡除去方法 - Google Patents
精密電鋳法のための気泡除去方法 Download PDFInfo
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- JP6774668B2 JP6774668B2 JP2017096795A JP2017096795A JP6774668B2 JP 6774668 B2 JP6774668 B2 JP 6774668B2 JP 2017096795 A JP2017096795 A JP 2017096795A JP 2017096795 A JP2017096795 A JP 2017096795A JP 6774668 B2 JP6774668 B2 JP 6774668B2
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- Prior art keywords
- metal layer
- electrolytic solution
- electrodeposition
- bubbles
- electrodeposited metal
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 68
- 238000005323 electroforming Methods 0.000 title claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 61
- 239000002184 metal Substances 0.000 claims description 61
- 238000004070 electrodeposition Methods 0.000 claims description 53
- 239000008151 electrolyte solution Substances 0.000 claims description 50
- 230000008569 process Effects 0.000 claims description 39
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 230000000737 periodic effect Effects 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- 239000011159 matrix material Substances 0.000 claims description 9
- 229910021645 metal ion Inorganic materials 0.000 claims description 9
- 238000007654 immersion Methods 0.000 claims description 2
- 150000001455 metallic ions Chemical class 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 238000012546 transfer Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 11
- 239000000243 solution Substances 0.000 description 10
- 230000006837 decompression Effects 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 238000005868 electrolysis reaction Methods 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 5
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000007872 degassing Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 230000003449 preventive effect Effects 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
実験条件は、次のとおりとし、図7に示すように母型1としての試験片の上側半分の40cmの長さ領域のみ電解液7から露出させる領域とし、下側半分の領域は常に電解液7に浸漬させておく領域とした。すなわち、上側半分の40mmの範囲で液面高さを変化させた。実験には図6に示す第2実施形態の装置を用いた。陽極その他は図示省略している。本実験では、減圧法は適用していない。
・試験片:10mm×80mmのニッケル板(株式会社ニラコ製)
・電解液:スルファミン酸ニッケル2.8mol/L、pH5、23℃
・電析プロセス電流:電流密度4.0mA/cm2
・電析時間:9.3時間(片面の電析金属層厚さ46μm)
・露出周期:30分周期で4分間露出(液面を上下)
2 電析金属層
3 電極層
4 電解槽
5 陽極
6 電源
7 電解液
8 タンク
9A,9B 送液ポンプ
10 真空容器
11 真空ポンプ
12 電磁弁
13A、13B 流路
14 気泡痕
15 気泡
16 固定フレーム
17 昇降用シリンダ
18 真空接続チューブ
19 制御部
20 大気開放流路
101、102 真空容器
130 送液チューブ
Claims (1)
- 金属イオンを含有する電解液内に、陰極となる母型と陽極を配し、これら陰極と陽極間に電圧を印加して数十mA/cm 2 よりも低い電流密度の電析プロセス電流を流すことにより、陰極上で金属イオンが還元され金属単体として析出し、この電析金属層を母型から分離することで、母型の反転形状を得る精密電鋳法において、
前記電析プロセス電流を流している間は、電解液を積極的に流動させる攪拌を行わず、
周期的減圧中に、電析金属層表面を電解液から露出させ、水素気泡を電析金属層表面から除去した後、再び電析金属層表面を電解液に浸漬させるものであり、
前記露出および浸漬の過程は、前記電析プロセス電流を停止させている間に行う、
精密電鋳法のための気泡除去方法。
Priority Applications (1)
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JP2017096795A JP6774668B2 (ja) | 2017-05-15 | 2017-05-15 | 精密電鋳法のための気泡除去方法 |
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JP2017096795A JP6774668B2 (ja) | 2017-05-15 | 2017-05-15 | 精密電鋳法のための気泡除去方法 |
Publications (2)
Publication Number | Publication Date |
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JP2018193576A JP2018193576A (ja) | 2018-12-06 |
JP6774668B2 true JP6774668B2 (ja) | 2020-10-28 |
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JP2017096795A Active JP6774668B2 (ja) | 2017-05-15 | 2017-05-15 | 精密電鋳法のための気泡除去方法 |
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JP (1) | JP6774668B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109722682B (zh) * | 2019-01-29 | 2021-02-05 | 南京航空航天大学 | 负压下高速冲液精密电铸装置及方法 |
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- 2017-05-15 JP JP2017096795A patent/JP6774668B2/ja active Active
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