CN111883525A - Packaging method of three-wire system light-emitting character LED lamp string - Google Patents
Packaging method of three-wire system light-emitting character LED lamp string Download PDFInfo
- Publication number
- CN111883525A CN111883525A CN202010910858.7A CN202010910858A CN111883525A CN 111883525 A CN111883525 A CN 111883525A CN 202010910858 A CN202010910858 A CN 202010910858A CN 111883525 A CN111883525 A CN 111883525A
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- Prior art keywords
- led
- packaging
- wafer
- led lamp
- epoxy resin
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000003990 capacitor Substances 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011324 bead Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 230000009471 action Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000005282 brightening Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a packaging method of a three-wire system light-emitting character LED lamp string, which relates to the technical field of LED packaging. The LED lamp bead support platform is additionally provided with the capacitor, the packaging is optimized in a near step, the application cost is saved, and the application reliability is enhanced. The packaging method of the three-wire system light-emitting character LED lamp string can accurately realize the packaging work of the light-emitting character LED lamp string.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a packaging method of a three-wire system light-emitting character LED lamp string.
Background
LED lamp cluster product adopts advanced LED semiconductor chip as light-emitting component, through scientific water repellent, the luminous word installation that adopts LED lamp cluster to constitute is also very convenient, effectively reduce installation cost, promote the quality greatly, reduce bad loss, the nimble two-way setting of getting, the dress of LED lamp stand, let the maintenance become simple, thoroughly solve the difficult problem of LED engineering maintenance, it is the renewal product of replacing traditional night scene illumination and decoration, it is an environmental protection and energy saving, technological content is very high, succinctly bright, brightening decoration and illumination light source, be used for specially giving out light in the solid word, various signs, landscape design is decorated, building brightening light source.
In the prior art, compared with the traditional four-wire system, the current three-wire system LED reduces one main wire, further simplifies the production process, and saves the internal space of the lamp strip, but the current three-wire system LED application scene, namely a monochromatic lamp or a colored lamp, is used for a synchronous lamp string, and cannot apply luminous characters based on address information, so that the application bottleneck is realized. Therefore, in the market, the light-emitting character also adopts a four-wire system traditional mode.
The traditional LED utilizes the pins in a vertical state to be inserted into the control board to realize display, and in the mode, because the pins are multiple, if the pins are required to be respectively and accurately inserted into the pin jacks of the control board, the accuracy is high, the difficulty of automatic packaging is large, and the production efficiency is low.
Aiming at the phenomenon, the application provides a packaging method of the three-wire system light-emitting character LED lamp string, which can accurately realize the packaging work of the light-emitting character LED lamp string.
Disclosure of Invention
The invention aims to provide a packaging method of a three-wire system light-emitting character LED lamp string, which can accurately realize the packaging work of the light-emitting character LED lamp string.
The invention provides a packaging method of a three-wire system light-emitting character LED lamp string, which comprises the following steps:
the method comprises the following steps: mounting, namely placing a mounted component on the surface of the support through a movable mounting head of an LED (light-emitting diode) chip mounter;
step two: die bonding, namely conveying the support to a working position by using a feeding mechanism, dispensing at a position where the support needs to be bonded with the wafer by using a dispensing mechanism, and fixing the wafer at the dispensing position;
step three: welding wires for welding inner leads of the LED lamp string;
step four: sealing glue, namely packaging the welded LED bracket by using epoxy resin;
step five: and packaging, wherein a protective shell is arranged outside the LED lamp string.
Further, the mounted components in the first step are resistors and capacitors.
Further, the feeding mechanism in the second step is a conveyor belt, the support is placed above the conveyor belt, and the conveyor belt drives the support to move.
Further, in the second step, the bonding arm is used for moving from the original position to a wafer sucking position, the wafer is placed on the expander wafer tray supported by the thin film, the suction nozzle moves downwards after the bonding arm is in place, the bonding arm returns to the original position after the bonding arm moves upwards to pick up the wafer, the bonding arm moves from the original position to the bonding position again, and the suction nozzle bonds the wafer downwards and then the bonding arm returns to the original position again.
Further, the wafer includes an RGB die and a control die.
Further, the packaging method in the fourth step is as follows: LED glue pouring packaging and LED mould pressing packaging;
and (3) encapsulating and packaging the LED: injecting liquid epoxy resin into an LED forming die cavity, then inserting the welded LED support, putting the LED support into an oven to cure the epoxy resin, and then removing the LED from the die cavity to form the LED;
and (3) LED mould pressing and packaging: and (3) placing the welded LED support into a mold, closing the upper and lower molds by using a hydraulic machine, vacuumizing, putting solid epoxy resin into an inlet of the glue injection channel, heating, pressing the solid epoxy resin into the mold glue channel by using a hydraulic ejector rod, and allowing the epoxy resin to enter each LED forming groove along the glue channel and be cured.
Compared with the prior art, the invention has the following remarkable advantages:
the invention provides a packaging method of a three-wire system light-emitting character LED lamp string. The LED lamp bead support platform is additionally provided with the capacitor, power supply ripples and other interference noise signals are effectively filtered, a power supply is purified, signals are conditioned, meanwhile, compared with an external capacitor circuit, the packaging is optimized in one step, the external circuit is cancelled, the application cost is saved, and meanwhile, the application reliability is enhanced. The packaging method of the three-wire system light-emitting character LED lamp string can accurately realize the packaging work of the light-emitting character LED lamp string.
Drawings
Fig. 1 is a flowchart of a method for packaging a three-wire LED string.
Detailed Description
The technical solutions of the embodiments of the present invention are clearly and completely described below with reference to the drawings in the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
Referring to fig. 1, the invention provides a packaging method of a three-wire system light-emitting character LED lamp string, which comprises the following steps:
the method comprises the following steps: mounting, namely placing a mounted component on the surface of the support through a movable mounting head of an LED (light-emitting diode) chip mounter;
step two: die bonding, namely conveying the support to a working position by using a feeding mechanism, dispensing at a position where the support needs to be bonded with the wafer by using a dispensing mechanism, and fixing the wafer at the dispensing position;
step three: welding wires for welding inner leads of the LED lamp string;
step four: sealing glue, namely packaging the welded LED bracket by using epoxy resin;
step five: and packaging, wherein a protective shell is arranged outside the LED lamp string.
Example 1
And the surface-mounted components in the first step are resistors and capacitors. The resistor is used for solving the problem of short circuit of the circuit, and the capacitor is used for solving the problem of interference.
Example 2
And the feeding mechanism in the second step is a conveyor belt, the support is placed above the conveyor belt, and the conveyor belt drives the support to move.
And in the second step, the bonding arm is used for moving from the original position to a wafer sucking position, the wafer is placed on a wafer expander disc supported by a thin film, the suction nozzle moves downwards after the bonding arm is in place, the bonding arm returns to the original position after the bonding arm moves upwards to pick up the wafer, the bonding arm moves from the original position to the bonding position again, and the suction nozzle bonds the wafer downwards and then the bonding arm returns to the original position again.
The wafer includes RGB dies and control dies.
Example 3
The packaging method in the fourth step comprises the following steps: LED glue pouring packaging and LED mould pressing packaging;
and (3) encapsulating and packaging the LED: injecting liquid epoxy resin into an LED forming die cavity, then inserting the welded LED support, putting the LED support into an oven to cure the epoxy resin, and then removing the LED from the die cavity to form the LED;
and (3) LED mould pressing and packaging: and (3) placing the welded LED support into a mold, closing the upper and lower molds by using a hydraulic machine, vacuumizing, putting solid epoxy resin into an inlet of the glue injection channel, heating, pressing the solid epoxy resin into the mold glue channel by using a hydraulic ejector rod, and allowing the epoxy resin to enter each LED forming groove along the glue channel and be cured.
The welding wire machine utilizes mechanical vibration energy of ultrasonic frequency to connect the same metal or dissimilar metal, when the metal is subjected to ultrasonic welding, the metal does not transmit current to a workpiece or apply a high-temperature heat source to the workpiece, only the vibration energy is converted into friction of a workshop, the temperature of the metal on the welding surface is limited to rise, plastic deformation is generated, an oxide film and impurities on the welding area are eliminated, and the two metals are bonded together under the action of certain static pressure, so that firm welding is realized.
The welding process is a physical change process, firstly the head end of the gold wire must be processed to form a ball shape, and the welded metal surface is firstly preheated, then the gold wire ball can produce plastic deformation on the metal welding surface under the combined action of time and pressure to make two media be reliably contacted, and by means of ultrasonic friction vibration, the metal bond can be formed between two metal atoms under the action of atomic affinity force so as to implement welding of gold wire lead.
The above disclosure is only for a few specific embodiments of the present invention, however, the present invention is not limited to the above embodiments, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (6)
1. A packaging method of a three-wire light-emitting character LED lamp string is characterized by comprising the following steps:
the method comprises the following steps: mounting, namely placing a mounted component on the surface of the support through a movable mounting head of an LED (light-emitting diode) chip mounter;
step two: die bonding, namely conveying the support to a working position by using a feeding mechanism, dispensing at a position where the support needs to be bonded with the wafer by using a dispensing mechanism, and fixing the wafer at the dispensing position;
step three: welding wires for welding inner leads of the LED lamp string;
step four: sealing glue, namely packaging the welded LED bracket by using epoxy resin;
step five: and packaging, wherein a protective shell is arranged outside the LED lamp string.
2. The method of claim 1 in which the mounted devices in step one are resistors and capacitors.
3. The method as claimed in claim 1, wherein the feeding mechanism in the second step is a conveyor belt, the rack is placed above the conveyor belt, and the rack is moved by the conveyor belt.
4. The method as claimed in claim 3, wherein the bonding arm is moved from the original position to a suction wafer position in the second step, the wafer is placed on a film-supported expander wafer tray, the suction nozzle is moved downward after the bonding arm is in position, the bonding arm returns to the original position after the bonding arm is moved upward to pick up the wafer, the bonding arm is moved from the original position to the bonding position again, and the suction nozzle is moved downward to bond the wafer and then the bonding arm returns to the original position again.
5. The method of claim 4 wherein said die includes an RGB die and a control die.
6. The method as claimed in claim 1, wherein the packaging method in step four comprises: LED glue pouring packaging and LED mould pressing packaging;
and (3) encapsulating and packaging the LED: injecting liquid epoxy resin into an LED forming die cavity, then inserting the welded LED support, putting the LED support into an oven to cure the epoxy resin, and then removing the LED from the die cavity to form the LED;
and (3) LED mould pressing and packaging: and (3) placing the welded LED support into a mold, closing the upper and lower molds by using a hydraulic machine, vacuumizing, putting solid epoxy resin into an inlet of the glue injection channel, heating, pressing the solid epoxy resin into the mold glue channel by using a hydraulic ejector rod, and allowing the epoxy resin to enter each LED forming groove along the glue channel and be cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010910858.7A CN111883525A (en) | 2020-09-02 | 2020-09-02 | Packaging method of three-wire system light-emitting character LED lamp string |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010910858.7A CN111883525A (en) | 2020-09-02 | 2020-09-02 | Packaging method of three-wire system light-emitting character LED lamp string |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111883525A true CN111883525A (en) | 2020-11-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010910858.7A Pending CN111883525A (en) | 2020-09-02 | 2020-09-02 | Packaging method of three-wire system light-emitting character LED lamp string |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111883525A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203871361U (en) * | 2014-03-01 | 2014-10-08 | 吴章友 | LED of built-in capacitor |
| CN203910796U (en) * | 2014-04-21 | 2014-10-29 | 上海蓝邦光电科技有限公司 | Novel LED lamp bead |
| CN109950382A (en) * | 2019-03-27 | 2019-06-28 | 深圳市宇亮光电技术有限公司 | High-voltage LED lamp bead and its packaging method |
-
2020
- 2020-09-02 CN CN202010910858.7A patent/CN111883525A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203871361U (en) * | 2014-03-01 | 2014-10-08 | 吴章友 | LED of built-in capacitor |
| CN203910796U (en) * | 2014-04-21 | 2014-10-29 | 上海蓝邦光电科技有限公司 | Novel LED lamp bead |
| CN109950382A (en) * | 2019-03-27 | 2019-06-28 | 深圳市宇亮光电技术有限公司 | High-voltage LED lamp bead and its packaging method |
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Application publication date: 20201103 |
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| RJ01 | Rejection of invention patent application after publication |