CN111834321A - 电性贴附结构及其形成方法 - Google Patents

电性贴附结构及其形成方法 Download PDF

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CN111834321A
CN111834321A CN201911014246.3A CN201911014246A CN111834321A CN 111834321 A CN111834321 A CN 111834321A CN 201911014246 A CN201911014246 A CN 201911014246A CN 111834321 A CN111834321 A CN 111834321A
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contact
contact pad
electrode
substrate
liquid layer
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CN111834321B (zh
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陈立宜
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Mikro Mesa Technology Co Ltd
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Mikro Mesa Technology Co Ltd
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Abstract

本发明公开了一种电性贴附结构，其包含基板、接触垫组，以及微型元件以及电极组的组合。接触垫组位于基板之上，其中接触垫组包含至少一个接触垫，并且至少一个接触垫是导电的。组合位于接触垫组之上，电极组的相对两侧分别与微型元件以及接触垫组相接触。接触垫组与电极组间的接触周边在基板上的垂直投影较该微型元件的外周边在基板上的垂直投影长，其中接触周边在基板上的垂直投影被外周边在基板上的垂直投影所包围。此电性贴附结构及其形成方法提供以帮助电极组与接触垫组之间的液体层抓住电极组并将电极组贴附到接触垫组。

Description

电性贴附结构及其形成方法
技术领域
本发明涉及电性贴附结构，特别是涉及一种电性贴附结构以及一种形成电性贴附结构的方法。
背景技术
用于转移元件的传统技术包含借由芯片接合从转移芯片转移到接收基板。一种这样的实施方式是「直接接合」，其涉及从转移芯片到接收基板的元件阵列的一个接合步骤，然后再移除转移芯片。另一种这样的实施方式是「间接接合」，其涉及两个接合/剥离步骤。在间接接合中，转移头可以从施主基板拾取元件阵列，再将元件阵列接合到接收基板，然后移除转移头。
可能影响转移质量的重要议题之一是元件与接收芯片接触的瞬间。
发明内容
本发明的目的在于克服现有技术的缺陷，而提出一种电性贴附结构及其形成方法，使得微型元件能更佳地保持在适当位置以便于后续黏合。
依据本发明一些实施例，提供一种电性贴附结构。所述电性贴附结构包含基板、接触垫组，以及微型元件以及电极组的组合。该接触垫组位于基板之上，其中该接触垫组包含至少一个接触垫，并且至少一个接触垫是导电的。微型元件以及电极组的组合位于接触垫组之上，电极组包含至少一个电极，电极组的相对两侧分别与微型元件以及接触垫组相接触。接触垫组与电极组间的接触周边在基板上的垂直投影比微型元件的外周边在基板上的垂直投影长，其中接触周边在基板上的垂直投影被外周边在基板上的垂直投影所包围。
依据本发明一实施例，电性贴附结构还包含黏着层，介于接触垫组与基板之间。
依据本发明一实施例，接触垫组与电极组中的一个包含铜、锡、钛以及铟中的一个。
依据本发明一实施例，微型元件的侧向长度小于或等于100微米。
依据本发明一些实施例，提供一种形成电性贴附结构的方法。所述方法包含：在基板上形成接触垫组，其中该接触垫组包含至少一个接触垫，并且至少一个接触垫是导电的；将微型元件以及电极组的组合放置于该接触垫组之上，而使电极组的相对两侧分别与微型元件以及接触垫组相接触，电极组包含至少一个电极，该接触垫组与电极组间的接触周边在基板上的垂直投影比微型元件的外周边在基板上的垂直投影长，并且接触周边在基板上的垂直投影被该微型元件的该外周边在基板上的垂直投影所包围；在电极组以及接触垫组之间形成液体层，以使微型元件被液体层所产生的毛细力抓住；以及蒸发液体层，使得电极组贴附至接触垫组并且与接触垫组电性连接。
依据本发明一实施例，形成液体层包含：在包含蒸气的环境，降低接触垫组的温度，使至少一部份的蒸气凝结以形成液体层。
依据本发明一实施例，形成液体层包含：在基板上喷洒蒸气，使得至少一部分的蒸气凝结以形成液体层。
依据本发明一实施例，蒸气的水蒸气压高于环境水蒸气压。
依据本发明一实施例，蒸气包含氮及水。
依据本发明一实施例，在形成接触垫组之前，在基板上形成黏着层。
依据本发明一实施例，液体层包含水。
依据本发明一实施例，液体层在露点的温度下形成。
依据本发明一实施例，蒸发液体层包含：于液体层被蒸发之后，升高接触垫组之温度，使得电极组黏附固定至接触垫组。
依据本发明一实施例，接触垫组以及电极组的至少一个包含黏合材料，并且在蒸发液体层之后，升高接触垫组的温度至高于黏合材料的熔点。
依据本发明一实施例，接触垫组以及电极组的至少一个包含黏合材料，并且在蒸发液体层之后，升高接触垫组的温度至低于黏合材料的熔点并高于液体层的沸点。
依据本发明一实施例，在蒸发液体层之后，升高接触垫组的温度至高于接触垫组与电极组的共晶点。
依据本发明一实施例，当微型元件被毛细力抓住时，介于电极组以及接触垫组间的液体层的厚度小于微型元件的厚度。
依据本发明一实施例，接触垫组与电极组中的一个包含铜、锡、钛以及铟中的一个。
依据本发明一实施例，微型元件的侧向长度小于或等于100微米。
本发明与现有技术相比具有明显的优点和有益效果。借由上述技术方案，本发明的电性贴附结构及其形成方法提供以帮助电极组与接触垫组之间的液体层抓住电极组并将电极组贴附到接触垫组。此电性贴附结构正可使接触周边大于原始接触周边，以增强由液体层所产生用于抓住电极的毛细力。
以上所述仅是用以阐述本发明所欲解决的问题、解决问题的技术手段、及其产生的功效等等，本发明之具体细节将在下文的实施例及相关图式中详细介绍。
附图说明
为让本发明的上述和其他目的、特征、优点与实施例能更明显易懂，所附图式的说明如下：
图1是依据本发明一些实施例的电性贴附结构的剖面示意图；
图1B是依据本发明一些实施例的电性贴附结构的透视示意图；
图1C是依据本发明一些实施例的接触垫组的顶接触表面的仰视示意图；
图1D是依据本发明一些实施例的电极组的底接触表面的仰视示意图；
图1E是依据本发明一些实施例的当电极组靠近或接触接触垫组时，接触垫组以及电极组的仰视示意图；
图1F是依据本发明一些实施例的接触周边的示意图；
图1G是依据本发明一些实施例的原始接触周边的示意图；
图1H是依据本发明一些实施例与电极组以及接触垫组相接触的液体层的透视示意图；
图2是依据本发明一些实施例当电极组靠近或接触接触垫组时，接触垫组以及电极组的仰视示意图；
图3A是依据本发明一些实施例当电极组靠近或接触接触垫组时，接触垫组以及电极组的仰视示意图；
图3B是依据本发明一些实施例当电极组靠近或接触接触垫组时，接触垫组以及电极组的仰视示意图；
图4是依据本发明一些实施例当电极组靠近或接触接触垫组时，接触垫组以及电极组的俯视示意图；
图5A是依据本发明一些实施例的一种类型的接触垫组以及电极组的剖面示意图；
图5B是依据本发明一些实施例的一种类型的接触垫组以及电极组的剖面示意图；
图5C是依据本发明一些实施例的一种类型的接触垫组以及电极组的剖面示意图；
图6A是依据本发明一些实施例的电性贴附结构的剖面示意图；
图6B是依据本发明一些实施例当电极组靠近或接触接触垫组时，接触垫组以及电极组的仰视示意图；
图7是依据本发明一些实施例当电极组靠近或接触接触垫组时，接触垫组以及电极组的仰视示意图；
图8是依据本发明一些实施例的形成电性贴附结构的方法的流程图；
图9A是依据本发明一些实施例的形成电性贴附结构的方法的中间阶段剖面示意图；
图9B是依据本发明一些实施例的形成电性贴附结构的方法的中间阶段剖面示意图；
图9C是依据本发明一些实施例的形成电性贴附结构的方法的中间阶段剖面示意图；以及
图9D是依据本发明一些实施例的形成电性贴附结构的方法的中间阶段剖面示意图。
【主要符号说明】
100A、100E：电性贴附结构
110：基板
120A、120A’、120A”、120A”’、120B、120C、120D、120D’、120E、
120F：接触垫组
120A-1、120A”’-1：接触垫
120A-tcs：顶接触表面
130A、130A’、130A”、130A”’、130B、130C、130D、130D’、130E、
130F：电极组
130A-1、130A”’-1：电极
130A-bcs：底接触表面
140：微型元件
150：液体层
152：弯月面
200：方法
L：侧向长度
OP：外周边
CP、CP1、CP2、CP3、CP4：接触周边
PCP：原始接触周边
SP：凹陷部分
T：厚度
HP：空心部
210-240：操作
具体实施方式
以下将以图式及详细说明阐述本发明的精神，任何所属技术领域中的技术人员在了解本发明的较佳实施例后，当可由本发明所教示的技术，加以改变及修饰，其并不脱离本发明的精神与范围。
在各种实施例中，参考附图进行描述。然而，某些实施例可以在没有这些实务细节中的一个或多个的情况下实施，或者与其他已知方法及配置组合实施。在以下的叙述中，为明确说明起见，许多实务上的细节，例如实务上的配置、尺寸及制程等，将在以下叙述中一并说明。此外，一些习知惯用的半导体制程与制造技术并没有被特别详细地描述，以免不必要地模糊本发明。贯穿全篇说明书对「一个实施例」、「实施例」等的引用意味着与该实施例相关的描述的特定特征、结构、配置或者特性系包含在本发明的至少一个实施例中。因此，贯穿全篇说明书在各个地方出现的词组「在一个实施例中」、「在实施例中」等不一定是指本发明的相同实施例。此外，特定特征、结构、配置或者特性可以在一个或多个实施例中以任何适合的方式组合。
这里使用的术语「在......的上方」、「到」、「于」、「至」、「在......之间」、及「在...之上」可以指一层相对于其他层的相对位置。一层在另一层「的上方」或「之上」或黏合「到」、「于」或「至」另一层可以是直接与另一层接触，或者可以具有一个或多个中间层。多个层「之间」的一层可以直接与这些层接触，或者可以具有一个或多个中间层。
请参照图1A至图1E，图1A是依据本发明一些实施例的电性贴附结构100A的剖面示意图，图1B是依据本发明一些实施例的电性贴附结构100A的透视示意图，图1B提供了三维视图，其使得电性贴附结构100A的结构特征更容易理解。图1C是依据本发明一些实施例的接触垫组120A的顶接触表面120A-tcs的仰视示意图，图1D是依据本发明一些实施例的电极组130A的底接触表面130A-bcs的仰视示意图，途1E是依据本发明一些实施例当电极组130A靠近或接触接触垫组120A时，接触垫组120A的仰视示意图。注意，在图1E不存在电极组130A的标号，因为电极组130A在仰视图与接触垫组120A重合(或完全重叠)。电性贴附结构100A包含基板110、接触垫组120A、以及微型元件140与电极组130A的组合。接触垫组120A位于基板110之上，其中接触垫组120A包含至少一个接触垫120A-1，并且接触垫120A-1是导电的。在一些实施例中，接触垫组120A的厚度小于或等于约2微米(μm)，并且优选地小于或等于约0.5微米。微型元件140以及电极组130A的组合位于接触垫组120A之上，电极组130A包含至少一个电极130A-1。在一些实施例中，电极组130A的厚度范围是约0.2微米至约2微米，并且优选地范围为约0.3微米至约1微米。电极组130A的相对两侧分别与微型元件140以及接触垫组120A相接触。接触垫组120A与电极组130A间的(接触区域的)接触周边CP在基板110上的垂直投影比微型元件140的外周边OP在基板110上的垂直投影长。接触周边CP在基板110上的垂直投影被微型元件140的外周边OP在基板110上的垂直投影所包围。
图1F是依据本发明一些实施例的接触周边CP的示意图，图1G是依据本发明一些实施例的原始接触周边PCP的示意图，图1H是依据本发明一些实施例的分别与电极组130A以及接触垫组120A相接触的液体层150的透视示意图。在一些实施例中，由于接触垫组120A(例如，如在图1C中所例示的「H」的形状)以及电极组130A(例如，如在图1D中所例示的「H」的形状)的故意设计的形状，当接触垫组120A与电极组130A靠近它们之间的液体层150(例如水层)并且液体层150的相对两侧分别接触接触垫组120A与电极组130A时，接触周边CP(如图1F所示)的总长度大于原始接触周边PCP的总长度，其中接触垫组120A与电极组130A的形状并非故意设计的(如图1G所示)。图1F可能也有助于理解所叙述的实施例。这些故意设计的形状被设计以增加接触垫组120A与电极组130A之间的接触周边CP的总长度。以图1C与图1D所示的实施例为例，当接触垫组120A与电极组130A的形状为「H」时，接触周边CP大于原始接触周边PCP，其中接触垫组120A与电极组130A两者的形状均为正方形。注意的是，此比较是在如果重新填充「H」的凹陷部分SP(如图1F所示)的假定下进行的，在此情况下，其总面积将与图1G所示正方形的总面积相同。
说明上述实施例的透视(三维视)图是如图1B及图1H所示。在一些实施例中，电极组130A与接触垫组120A可以彼此靠近并与它们之间的液体层150相接触，使得电极组130A与其上的微型元件140的组合被液体层150所产生的毛细力抓住(例如，参考图1H，其中由于毛细力而形成的液体层150的弯月面152)。然后，液体层150被蒸发使得电极组130A黏附固定并贴附至接触垫组120A。在这些实施例中，由于接触垫组120A与电极组130A被设计为「H」形，此毛细力大于当电极组130A与接触垫组120A都被设计成正方形时的情况。此较大的毛细力对于贴附的质量以及随后电极组130A与接触垫组120A之间的黏合有很大帮助，因为当电极组130A黏附于液体层150时，毛细力可以帮助将电极组130A固定在可控区域内。进一步地，在液体层150蒸发时和液体层150蒸发之后，此毛细力可以有助于在电极组130A与接触垫组120A之间形成贴附(以及也形成黏合)。此贴附是有助于抓住与接触的这些种类的液体层150中发现的特殊现象。此黏合是两个物体(通常为金属)相接触并且原子在两物体间扩散时产生的现象。在一些实施例中，微型元件140的侧向长度L小于或等于约100微米，侧向长度L的限制是为了确保毛细力显著地帮助并支配电极组130A与接触垫组120A之间的贴附。
值得注意的是，当电极组130A与接触垫组120A相接触时，接触周边CP以及原始接触周边PCP可被解释为单个接触周边(或是多个分离的接触周边，如稍后将在一些实施例中所提到的)。当液体层150介于电极组130A以及接触垫组120A之间并与电极组130A以及接触垫组120A相接触时，它们也可以被解释为单个接触周边(或是多个接触周边)。在这种情形之下，接触周边CP(以及原始接触周边PCP)被视为具有厚度T(如图1H所示)的周边，而厚度T是从电极组130A的底接触表面130A-bcs经由液体层150的周边测量到接触垫组120A的顶接触表面120A-tcs。
请参照图2至图3B，图2是依据本发明一些实施例当电极组130A’靠近或接触接触垫组120A’时，接触垫组120A’以及电极组130A’(未明确示出，因为它与图2中的接触垫组120A’重叠并位于其后)的仰视示意图。图3A是依据本发明一些实施例当电极组130A”靠近或接触接触垫组120A”时，接触垫组120A”以及电极组130A”(未明确示出，因为它与图3A中的接触垫组120A”重叠并位于其后)的仰视示意图。图3B是依据本发明一些实施例当电极组130A”’靠近或接触接触垫组120A”’时，接触垫组120A”’以及电极组130A”’(未明确示出，因为它与图3B中的接触垫组120A”’重叠并位于其后)的仰视示意图。接触垫组120A”’包含多个接触垫120A”’-1，并且电极组130A”’包含多个电极130A”’-1(未明确示出，因为它们与图3B中的接触垫120A”’-1重叠并位于其后)。注意，在图2至图3B中电极组130A’、130A”、130A”’并未被标示，因为电极组130A’、130A”、130A”’在仰视图分别与接触垫组120A’、120A”、120A”’重合(或完全重叠)。注意图1A也可以被图2所解释，因为图1A是剖面图。在图2所示的实施例中，接触垫组120A’与电极组130A’被挖空，使得接触周边CP由彼此分离的第一接触周边CP1与第二接触周边CP2所组成(即，CP＝CP1+CP2)。在本发明的不同实施例中，即使存在不同形状的接触周边，所有的接触周边为简单起见仅被标示为「CP」。图2所示的实施例的技术效果类似于图1C至图1E所示实施例的技术效果，将不再详细描述。
图3A所示的实施例可以被视为是对图2所示实施例的修改。图3A所示实施例的接触垫组120A”与电极组130A”具有多个分离的空心部HP。图3B所示实施例，其中多个接触垫120A”’-1以及多个电极130A”’-1(再次，由于「重合」而未明确显示)形成多个个接触周边CP1、CP2、CP3等，接触周边CP是此多个接触周边CP1、CP2、CP3等的总和。注意，这些接触垫120A”’-1中的一个被连接到外面并且被电性连接至施加电压源(未显示于图中)。
图4是依据本发明一些实施例当电极组130B靠近或接触接触垫组120B时，接触垫组120B以及电极组130B的仰视示意图。在这些实施例中，微型元件140的尺寸(或侧向长度L)小于接触垫组120B。
请参照图5A至图5C，图5A至图5C分别为依据本发明一些实施例的三种不同类型的接触垫组以及电极组的剖面示意图。在这些实施例中，至少一个接触周边CP在基板110上的垂直投影被接触垫组120C、120D、120D’在基板110上的垂直投影及/或电极组130C、130D、130D’在基板110上的垂直投影跨越。
请参照图6A、图6B以及图7，图6A是依据本发明一些实施例的电性贴附结构100E的剖面示意图，图6B是依据本发明一些实施例当电极组130E靠近或接触接触垫组120E时，接触垫组120E以及电极组130E(再次，由于「重合」而未明确显示)的仰视示意图，图7是依据本发明一些实施例当电极组130F靠近或接触接触垫组120F时，接触垫组120F以及电极组130F(再次，由于「重合」而未明确显示)的仰视示意图。图6A与图6B示出了接触垫组120E与电极组130E具有锯齿形(zigzag)(或类似于锯齿)的实施例，而图7示出了具有螺旋形的接触垫组120F与电极组130F的实施例。上述实施例展示了一些其他可能的结构特征，这些结构特征遵守如上所述的所有限制，并且也能够增加毛细力。
图8是依据本发明一些实施例的形成电性贴附结构100A的方法200的流程图，图9A至图9D是依据本发明一些实施例的图8的方法200的中间阶段剖面示意图。请参照图8至图9D，方法200开始于操作210，其中接触垫组120A形成于基板110上，而其中接触垫组120A包含至少一个接触垫120A-1，并且接触垫120A-1是导电的(参照图9A)。在一些实施例中，在形成接触垫组120A之前，在基板110上形成黏着层(未显示于图中)。方法200继续进行操作220，其中微型元件140以及电极组130A的组合被放置于接触垫组120A之上，而使电极组130A的相对两侧分别与微型元件140以及接触垫组120A相接触，电极组130A包含至少一个电极130A-1。接触垫组120A与电极组130A间的接触周边CP在基板110上的垂直投影比微型元件140的外周边OP在基板110上的垂直投影长，并且接触周边CP在基板110上的垂直投影被微型元件140之外周边OP在基板110上的垂直投影所包围(参照图9B)。
方法200继续进行操作230，其中液体层150被形成于电极组130A以及接触垫组120A之间，以使微型元件140被液体层150所产生的毛细力抓住(参照图9C)。在一些实施例中，液体层150包含水。值得注意的是，操作220与操作230可以被互换。在一些其他实施例中，液体层150被形成于接触垫组120A之上，接着电极组130A以及微型元件140的组合被放置于接触垫组120A之上，使得电极组130A接触液体层150，并且被液体层150所产生的毛细力抓住。在一些实施例中，液体层150可借由在包含蒸气的环境降低接触垫组120A的温度而形成，使至少一部份的此蒸气凝结以形成液体层150。在一些实施例中，液体层150在大约露点的温度下形成。在一些实施例中，液体层150可以借由在基板110上喷洒蒸气来形成，使得至少一部分的蒸气凝结以形成液体层150。在一些实施例中，此蒸气的水蒸气压高于环境水蒸气压，蒸气基本上由氮及水所组成。在一些实施例中，当微型元件140被液体层150所产生的毛细力抓住时，介于电极组130A以及接触垫组120A间的液体层150的厚度小于微型元件140的厚度。
方法200继续进行操作240，其中液体层150被蒸发，使得电极组130A黏附固定并贴附至接触垫组120A并且电性连接至接触垫组120A(参照图9D。在一些实施例中，借由升高接触垫组120A的温度来蒸发液体层150。在一些实施例中，接触垫组120A与电极组130A中的一个包含黏合材料，并且接触垫组120A的温度可被进一步升高到一个温度点，以将电极组130A黏合到接触垫组120A。此温度点可高于黏合材料的熔点，低于黏合材料的熔点并高于液体层150的沸点，或是高于接触垫组120A与电极组130A的共晶点。在一些实施例中，黏合材料的厚度范围是约0.2微米至约2微米，在一些实施例中，黏合材料的优选厚度范围为约0.3微米至约1微米。接触垫组120A与电极组130A中的一个可包含铜(copper)及富含铜的材料中的一个。此黏合材料可为富含锡(tin)的材料、富含铟(indium)的材料、或是富含钛(titanium)的材料。这里的「富含」意味着占原子总数的一半以上。
综上所述，一种电性贴附结构及其形成方法提供以帮助电极组与接触垫组之间的液体层抓住电极组并将电极组贴附到接触垫组。此电性贴附结构正如同说明书所述，可使接触周边大于原始接触周边，以增强由液体层所产生用于抓住电极的毛细力。
虽然本发明已以实施例发明如上，然其并非用以限定本发明，任何本技术领域的技术人员，在不脱离本发明的精神和范围内，当可作各种的更动与润饰，因此本发明的保护范围当以权利要求所界定的范围为准。

Claims (19)

1.一种电性贴附结构，其特征在于，包含：
基板；
接触垫组，位于所述基板之上，其中所述接触垫组包含至少一个接触垫，其中所述接触垫是导电的；以及
微型元件以及电极组的组合位于所述接触垫组之上，所述电极组包含至少一个电极，所述电极组的相对两侧分别与所述微型元件以及所述接触垫组相接触，所述接触垫组与所述电极组间的接触周边在所述基板上的垂直投影比所述微型元件的外周边在所述基板上之垂直投影长，其中所述接触周边在所述基板上的所述垂直投影被所述外周边在所述基板上的所述垂直投影所包围。
2.如权利要求1所述的电性贴附结构，其特征在于，还包含：黏着层，介于所述接触垫组与所述基板之间。
3.如权利要求1所述的电性贴附结构，其特征在于，所述接触垫组与所述电极组中的一个包含铜、锡、钛以及铟中的一个。
4.如权利要求1所述的电性贴附结构，其特征在于，所述微型元件的侧向长度小于或等于100微米。
5.一种形成电性贴附结构的方法，其特征在于，包含：
在基板上形成接触垫组，其中所述接触垫组包含至少一个接触垫，并且所述至少一个接触垫是导电的；
将微型元件以及电极组的组合放置于所述接触垫组之上，而使所述电极组的相对两侧分别与所述微型元件以及所述接触垫组相接触，所述电极组包含至少一个电极，所述接触垫组与所述电极组间的接触周边在所述基板上的垂直投影比所述微型元件的外周边在所述基板上的垂直投影为长，并且所述接触周边在所述基板上的所述垂直投影被所述微型元件的所述外周边在所述基板上的所述垂直投影所包围；
在所述电极组以及所述接触垫组之间形成液体层，以使所述微型元件被所述液体层所产生的毛细力抓住；以及
蒸发所述液体层，使得所述电极组贴附至所述接触垫组并且与所述接触垫组电性连接。
6.如权利要求5所述的方法，其特征在于，形成所述液体层包含：
在包含蒸气的环境，降低所述接触垫组的温度，使至少一部份的所述蒸气凝结以形成所述液体层。
7.如权利要求5所述的方法，其特征在于，形成所述液体层包含：
在所述基板上喷洒蒸气，使得至少一部分的蒸气凝结以形成所述液体层。
8.如权利要求7所述的方法，其特征在于，所述蒸气的水蒸气压高于环境水蒸气压。
9.如权利要求7所述的方法，其特征在于，所述蒸气包含氮及水。
10.如权利要求5所述的方法，其特征在于，还包含在形成所述接触垫组之前，在所述基板上形成黏着层。
11.如权利要求5所述的方法，其特征在于，所述液体层包含水。
12.如权利要求6所述的方法，其中所述液体层在露点的温度下形成。
13.如权利要求5所述的方法，其特征在于，蒸发所述液体层包含：
在所述液体层被蒸发之后，升高所述接触垫组的温度，使得所述电极组黏附固定至所述接触垫组。
14.如权利要求5所述的方法，其特征在于，所述接触垫组以及所述电极组中的至少一个包含黏合材料，并且所述方法还包含：
在蒸发所述液体层之后，升高所述接触垫组的温度至高于所述黏合材料的熔点。
15.如权利要求5所述的方法，其特征在于，所述接触垫组以及所述电极组中的至少一个包含黏合材料，并且所述方法还包含：
在蒸发所述液体层之后，升高所述接触垫组的温度至低于所述黏合材料的熔点并高于所述液体层的沸点。
16.如权利要求5所述的方法，其特征在于，还包含：
在蒸发所述液体层之后，升高所述接触垫组的温度至高于所述接触垫组与所述电极组的共晶点。
17.如权利要求5所述的方法，其特征在于，当所述微型元件被所述毛细力抓住时，介于所述电极组以及所述接触垫组间的所述液体层的厚度小于所述微型元件的厚度。
18.如权利要求5所述的方法，其特征在于，所述接触垫组与所述电极组中的一个包含铜、锡、钛以及铟中的一个。
19.如权利要求5所述的方法，其特征在于，所述微型元件的侧向长度小于或等于100微米。
CN201911014246.3A 2019-04-22 2019-10-23 形成电性贴附结构的方法 Active CN111834321B (zh)

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