CN111825918A - 一种无机纳米聚合物改性高强度塑料及制备方法 - Google Patents
一种无机纳米聚合物改性高强度塑料及制备方法 Download PDFInfo
- Publication number
- CN111825918A CN111825918A CN202010622207.8A CN202010622207A CN111825918A CN 111825918 A CN111825918 A CN 111825918A CN 202010622207 A CN202010622207 A CN 202010622207A CN 111825918 A CN111825918 A CN 111825918A
- Authority
- CN
- China
- Prior art keywords
- inorganic nano
- polymer
- strength plastic
- modified high
- polymer modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 79
- 239000004033 plastic Substances 0.000 title claims abstract description 36
- 229920003023 plastic Polymers 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000011159 matrix material Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000004014 plasticizer Substances 0.000 claims abstract description 14
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 12
- 229910000077 silane Inorganic materials 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 11
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 10
- 239000003377 acid catalyst Substances 0.000 claims abstract description 9
- -1 alkoxy silane Chemical compound 0.000 claims abstract description 9
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 9
- 239000003607 modifier Substances 0.000 claims abstract description 9
- 239000003112 inhibitor Substances 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 8
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims abstract description 8
- 150000001450 anions Chemical class 0.000 claims abstract description 7
- 239000003021 water soluble solvent Substances 0.000 claims abstract description 7
- 230000001590 oxidative effect Effects 0.000 claims abstract description 5
- 239000007800 oxidant agent Substances 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims abstract description 3
- 230000008018 melting Effects 0.000 claims abstract description 3
- 238000003756 stirring Methods 0.000 claims description 18
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 239000000344 soap Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- 229920002292 Nylon 6 Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 230000032683 aging Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 229950000688 phenothiazine Drugs 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 3
- LGNQGTFARHLQFB-UHFFFAOYSA-N 1-dodecyl-2-phenoxybenzene Chemical compound CCCCCCCCCCCCC1=CC=CC=C1OC1=CC=CC=C1 LGNQGTFARHLQFB-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 2
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 claims description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 2
- 229940077388 benzenesulfonate Drugs 0.000 claims description 2
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 claims description 2
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 claims description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims description 2
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 claims description 2
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 claims description 2
- UBCPEZPOCJYHPM-UHFFFAOYSA-N dimethoxy-methyl-octadecylsilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](C)(OC)OC UBCPEZPOCJYHPM-UHFFFAOYSA-N 0.000 claims description 2
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 claims description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 2
- PELGKMTVNFFDDL-UHFFFAOYSA-N dodecyl-dimethoxy-methylsilane Chemical compound CCCCCCCCCCCC[Si](C)(OC)OC PELGKMTVNFFDDL-UHFFFAOYSA-N 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- 235000019253 formic acid Nutrition 0.000 claims description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid group Chemical group C(CCCCCCC\C=C/CCCCCCCC)(=O)O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 2
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 claims description 2
- BFHYAOOZWLJQEP-UHFFFAOYSA-N sodium;1,2-xylene Chemical compound [Na].CC1=CC=CC=C1C BFHYAOOZWLJQEP-UHFFFAOYSA-N 0.000 claims description 2
- KZOJQMWTKJDSQJ-UHFFFAOYSA-M sodium;2,3-dibutylnaphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(S([O-])(=O)=O)=C(CCCC)C(CCCC)=CC2=C1 KZOJQMWTKJDSQJ-UHFFFAOYSA-M 0.000 claims description 2
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 claims description 2
- JUAHWAGHDQJOLT-UHFFFAOYSA-M sodium;propane-2-sulfonate Chemical compound [Na+].CC(C)S([O-])(=O)=O JUAHWAGHDQJOLT-UHFFFAOYSA-M 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
- XUJLWPFSUCHPQL-UHFFFAOYSA-N 11-methyldodecan-1-ol Chemical compound CC(C)CCCCCCCCCCO XUJLWPFSUCHPQL-UHFFFAOYSA-N 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 6
- 230000002776 aggregation Effects 0.000 abstract description 3
- 238000005054 agglomeration Methods 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 abstract description 2
- 230000005012 migration Effects 0.000 abstract description 2
- 238000013508 migration Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 19
- 239000000203 mixture Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 8
- 229920000098 polyolefin Polymers 0.000 description 8
- 230000035882 stress Effects 0.000 description 7
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 6
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000005299 abrasion Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000002105 nanoparticle Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000002086 nanomaterial Substances 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 3
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 3
- 229960001826 dimethylphthalate Drugs 0.000 description 3
- YAFOVCNAQTZDQB-UHFFFAOYSA-N octyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC)OC1=CC=CC=C1 YAFOVCNAQTZDQB-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 235000011837 pasties Nutrition 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- XFRVVPUIAFSTFO-UHFFFAOYSA-N 1-Tridecanol Chemical compound CCCCCCCCCCCCCO XFRVVPUIAFSTFO-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000011185 multilayer composite material Substances 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000011160 polymer matrix composite Substances 0.000 description 1
- 229920013657 polymer matrix composite Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/005—Reinforced macromolecular compounds with nanosized materials, e.g. nanoparticles, nanofibres, nanotubes, nanowires, nanorods or nanolayered materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/10—Homopolymers or copolymers of propene
- C08J2323/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
本发明提供一种无机纳米聚合物改性高强度塑料及制备方法,包括以下质量组份:聚合物基体材料50~100、无机纳米聚合物0~50,增塑剂0.1~0.5,抗氧剂0.1~2;所述无机纳米聚合物包括以下质量组分:纳米硅溶胶20%~70%、烷氧基硅烷10%~70%、酸催化剂0.01%~5%、阴离子改性剂0.1%~10%、阻聚剂0.05%~0.2%和2%~20%水溶性溶剂,制备过程为将聚合物基体材料、无机纳米聚合物、增塑剂和氧化剂高温熔融后共混后挤出造粒,即得无机纳米聚合物改性高强度塑料。本发明制备的高强度塑料其力学性能和耐磨性能得到显著提升,无机纳米聚合物表面含有活性基团,与聚合物基体材料相容性极佳,制备的复合材料在长期使用过程中粒子无迁移和团聚现象,无应力缺陷。
Description
技术领域
本发明属于塑料材料技术领域,具体涉及一种无机纳米聚合物改性高强度塑料及制备方法。
背景技术
制备高强度的聚烯烃材料是高分子科学领域研究热点之一,聚烯烃材料的特殊性能决定了其在生活和工业中的用途,单一的聚烯烃塑料的强度并不能完全满足市场需求,因此对聚烯烃材料进行改性是提高其强度、拓展其应用领域的重要手段。
聚酰胺材料作为机械零部件材料,能承受较高的机械应力以及适应更严格的化学、物理环境,具有质量轻、噪声低、耐腐蚀、化学性质稳定的特点,同时具备可设计性强、成本较低、工艺相对简单的优点。随着聚合物类材料在摩擦领域的广泛运用,摩擦引起磨损造成零部件失效的问题亟待解决。
目前,制备无机纳米材料改性的复合材料主要有五种方法:(1)原位聚合法,先将无机纳米粒子均匀分散于溶液中,再进行乳液聚合、本体聚合、氧化聚合或缩聚,制备的材料粒子分布均匀,但这种方法成本高,工艺复杂。(2)直接分散法,让纳米粒子直接分散在基体材料中,条件易控制,成本低,但纳米粒子易团聚,导致性能缺陷。(3)插层复合法,利用具备层状结构的无机材料插入聚合物基体中形成多层复合材料,但分散相的尺寸较大,难以控制。(4)溶胶-凝胶法,可以制备多种聚合物基复合材料,但干燥过程中由于溶剂的挥发,造成内部应力大,材料容易产生裂纹。(5)共混复合法,在熔融、乳液或溶液状态下,将无机纳米材料粉体与基体材料混合,从而制得多种聚合物基复合材料,但由于常规的无机纳米材料和聚合物的相容性缺陷,通过这种方法制备的复合材料中的纳米材料易团聚,从而导致应力缺陷。
发明专利CN201080051767.7公布了一种交联的熔融成型的制品以及制备该制品的组合物,公开了可交联混合物,其包含聚烯烃、烷氧基硅烷、有机基聚硅氧烷、自由基引发剂;和液体聚合物改性剂。有机基聚硅氧烷包含两个或更多个羟基端基。当使可交联混合物熔融成型时,形成独特交联的组合物。液体聚合物改性剂改善熔融成型的制品的挠性而不会降低介电强度,通过液体聚合物对聚烯烃进行改性,改性后的材料会有应力缺陷。
发明内容
为了克服现有技术中的问题,本申请提供一种无机纳米聚合物改性高强度塑料及制备方法,本发明采用的无机纳米聚合物表面留有活性基团,与聚合物材料的相容性极佳,通过熔融共挤出造粒即可制备得到改性材料,显著提高了基体材料的耐磨耐热和力学性能,并且不影响基体材料的韧性,无机纳米聚合物与基体材料的相容性好,无应力缺陷。
为了实现上述目的,本发明通过以下技术方案实现:
一种无机纳米聚合物改性高强度塑料,包括以下质量组份:聚合物基体材料50~100、无机纳米聚合物0~50,增塑剂0.1~0.5,抗氧剂0.1~2;所述无机纳米聚合物包括以下质量组分:纳米硅溶胶20%~70%、烷氧基硅烷10%~70%、酸催化剂0.01%~5%、阴离子改性剂0.1%~10%、阻聚剂0.05%~0.2%和2%~20%水溶性溶剂。
进一步地,所述烷氧基硅烷包括甲基三甲氧基硅烷、甲基三乙氧基硅烷、二甲基二甲氧基硅烷、二甲基二乙氧基硅烷、苯基三甲氧基硅烷、苯基三乙氧基硅烷、二苯基二甲氧基硅烷、二苯基二乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、γ-甲基丙烯酰氧基丙基三甲氧基硅烷、3-缩水甘油醚氧基丙基三甲氧基硅烷、环氧丙氧丙基甲基二甲氧基硅烷、环氧丙氧丙基甲基二乙氧基硅烷、十二烷基甲基二甲氧基硅烷和十八烷基甲基二甲氧基硅烷中的至少一种。
进一步地,所述阻聚剂包括吩噻嗪、对苯二酚、对叔丁基邻苯二酚、硝基苯中的至少一种,本申请中阻聚剂在反应开始前分散于体系中,反应过程中阻聚剂与自由基反应并降低硅羟基之间缩聚的倾向,进一步保持体系的稳定。
进一步地,所述阴离子改性剂包括月桂酸皂、松香油皂、油酸皂、甲基苯磺酸钠、二甲基苯磺酸钠、异丙基磺酸钠、十二烷基硫酸钠、十二烷基苯磺酸钠、二丁基萘磺酸钠、十二烷基二苯醚磺酸钠、硬脂酸钠、N,N-二羟乙基月桂酰胺、异构十三醇醚硫酸钠中的至少一种,本申请中阴离子改性剂会吸附于纳米硅醇的表面形成界面相,起降低体系黏度,提高体系流动性,保持体系稳定的作用,其与羟基之间的氢键作用在一定程度上也降低了硅醇自缩聚的趋势。
进一步地,所述酸催化剂包括甲酸、乙酸、盐酸中的一种或多种。
进一步地,所述水溶性溶剂为甲醇、乙醇、异丙醇、丁醇、丙二醇甲醚醋酸酯中的一种或多种。
进一步地,所述聚合物基体材料包括聚丙烯、聚酰胺6、聚酰胺66中的至少一种。
进一步地,所述无机纳米聚合物的粒径为10~160nm。
一种无机纳米聚合物改性高强度塑料制备方法,具体制备过程如下:将聚合物基体材料、无机纳米聚合物、增塑剂和氧化剂高温熔融后共混后挤出造粒,即得无机纳米聚合物改性高强度塑料。
进一步地,所述无机纳米聚合物的制备过程包括如下步骤:
S1、室温下将烷氧基硅烷混合均匀,加入阻聚剂、阴离子改性剂充分搅拌,形成硅烷混合液;
S2、将纳米硅溶胶和酸催化剂搅拌均匀后逐步滴加到步骤S1制备的硅烷混合液中,10min内滴加完成,搅拌后升温至45~80℃反应0.5~15h;
S3、将水溶性溶剂加入步骤S2制备的溶液中,搅拌5~30min,升温至60~80℃后停止搅拌,并保温陈化1-72h;
S4、搅拌的同时减压蒸馏除去多余的溶剂后停止加热,自然冷却后即可获得透明或半透明状的粘稠状液体,即为无机纳米聚合物。
所述增塑剂可以为本领域中常用的各种增塑剂,例如邻苯二甲酸二丁酯、邻苯二甲酸二乙酯、邻苯二甲酸二甲酯、邻苯二甲酸二辛酯、己二酸二辛酯、磷酸二苯一辛酯、环氧四氢邻苯二甲酸二辛酯。优选地,所述增塑剂增塑剂为邻苯二甲酸二丁酯、己二酸二辛酯和环氧四氢邻苯二甲酸二辛酯的混合物,或者为邻苯二甲酸二辛酯、磷酸二苯一辛酯和邻苯二甲酸二甲酯的混合物。
所述抗氧剂可以为本领域中常用的各种增塑剂,例如巴斯夫B225、245、BHT501、氰特CYANOX 1790、2777、朗盛Vulkanox BHT264。优选地,所述抗氧剂为抗氧剂1790、2777和BHT501的混合物,或者为抗氧剂B225、245和BHT264的混合物
本发明的改性原理如下:
本发明中制备的无机纳米聚合物材料含有硅烷偶联剂(即硅烷),通过硅烷偶联剂和硅羟基与基体材料形成偶联键,增强了纳米粒子与聚合物基体材料的作用力,相比常规无机纳米材料的表面能很高,非常容易发生团聚现象。本发明采用经过改性的无机纳米聚合物材料的表面自聚集倾向被抑制,形成稳定的高效的膏状流体无机纳米混合物,只有在一定温度下才会恢复,因此纳米粒子无团聚现象,极大减少了应力集中导致的应力缺陷。
本发明中制备的无机纳米聚合物为三维网络结构,在基体材料中起结构支撑作用,除了偶联键的存在,还存在分子间氢键和范德华力,可以增强塑料材料整体承受外力作用的效果,降低损耗,在塑料材料进行摩擦时,分子内的无机纳米聚合物材料也会随之运动,由于均匀的分散性和化学键合,其粒子之间不易产生摩擦,降低了摩擦力。
本发明中制备的无机纳米聚合物作为塑料基材的增强材料,宏观上具有和白炭黑(纳米二氧化硅)类似的性质,但相容性更好,并且工艺更简单。相比于白炭黑,无机纳米聚合物增强的塑料成型后均匀分散,无自聚集现象。每个粒子都结合多条分子链。在外力的作用下,分子链伸展并取向,当粒子之间的较短的塑料分子链充分伸长时,较长的分子链则先在粒子表面滑移,当外力逐渐增加,较长的分子链逐渐伸展并达到最大值。当超过临界值时,上述过程也不复存在,分子链出现结构性破坏,宏观上体现为断裂。
本发明的有益效果如下:
(1)本发明制备的无机纳米聚合物改性高强度塑料,其力学性能和耐磨性能得到显著提升,制备方法较简单,反应易于控制,并且不影响基体材料的韧性。
(2)本发明中的无机纳米聚合物表面含有活性基团,与聚合物基体材料的相容性极佳,制备的复合材料在长期使用过程中粒子无迁移和团聚现象,无应力缺陷。
(3)本发明制备了一种无机纳米聚合物改性高强度塑料,采用高温熔融共混挤出造粒的方法,方法简单,反应易于控制,适合于工业化生产。
附图说明
图1为本发明制备的无机纳米聚合物的粒径分布图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合具体实施例,对本发明进行进一步详细说明。
1、本发明实施例提供一种无机纳米聚合物改性高耐磨橡胶。
(1)无机纳米聚合物的制备
S1:室温下取10份甲基三乙氧基硅烷,加入2份月桂酸皂充分搅拌30min,形成硅烷混合液;
S2:将70份的20nm级酸性硅溶胶和1份的乙酸、0.5份的吩噻嗪搅拌均匀后逐步滴加至硅烷混合液中,10min内滴加完成,搅拌30min后升温至80℃反应1h;
S3:加入16.5份的甲醇,搅拌30min,升温至80℃后停止搅拌,并保温陈化24h;
S4:开启搅拌,同时减压蒸馏除去多余的溶剂后停止加热,自然冷却后即可获得透明或半透明状的粘稠状液体,即为无机纳米聚合物。
采用英国马尔文Nano-ZS90激光粒度仪,经动态光散射法测得无机纳米聚合物的粒径,结果如图1所示。
(2)无机纳米聚合物改性高强度塑料的制备
制备原料包括上述制备的无机纳米聚合物、聚合物基体材料、增塑剂和抗氧剂。
实施例1-4和对比例1中聚合物基体材料为聚丙烯、增塑剂为邻苯二甲酸二丁酯、己二酸二辛酯和环氧四氢邻苯二甲酸二辛酯的混合物,抗氧剂为抗氧剂1790、2777和BHT501的混合物。
实施例1-4和对比例1各原料的质量分数比按表1配置。
表1
实施例5-8和对比例2中聚合物基体材料为聚酰胺6、增塑剂为邻苯二甲酸二辛酯、磷酸二苯一辛酯和邻苯二甲酸二甲酯的混合物,抗氧剂为抗氧剂B225、245和BHT264的混合物。
实施例5-8和对比例2各原料的质量分数比按表2配置。
表2
无机纳米聚合物改性高强度塑料的制备方法如下:
将无机纳米聚合物、聚合物基体材料、增塑剂聚和氧化剂按比例混合均匀,将所得到的混合物料加入SHJ-20型双螺杆挤出机的料筒,经高温熔融共混挤出机挤出、冷却、造粒,即制得机纳米聚合物改性高强度塑料。
SHJ-20型双螺杆挤出机的温度设定如下所示:
(1)实施例1-4和对比例1中双螺杆挤出机设置一区温度175℃,二区温度185℃,三区温度195℃,四区温度200℃,五区温度195℃。
(2)实施例5-8和对比例2中双螺杆挤出机设置一区温度250℃,二区温度255℃,三区温度250℃,四区温度260℃,五区温度255℃。
2、性能测试
将母料经注塑机注塑成型,制备得GB1040II型哑铃型试样条,尺寸为150mmx10mmx4mm,GB1843矩形试样条,尺寸为63.5mmx10mmx4mm,所得试样条均在25℃和50℃处理24h后测试。
力学性能采用日本岛津AG-10TA型万能材料试样机测试,拉伸速率50mm/min。
抗冲击强度采用XJU-2.75型悬臂梁冲击试验机测试。
耐磨性能采用MG200型立轴销盘式磨损试验机测试,转速200rpm。
测试结果取三次结果的平均值,测试结果如表3所示。
表3
由表3可知,实施例1-4与对比例1相比,实施例5-8与对比例2相比,塑料的拉伸强度、弯曲强度和缺口冲击强度得到显著提升,且随着无机纳米聚合物用量的增加,力学性能越好。与不添加无机纳米聚合物的对照组相比,塑料的磨损量明显降低,且随着无机纳米聚合物用量的增加,磨损量越来越低,使塑料的耐磨性能得到提升。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明,不能认定本发明的具体实施只限于这些说明。对于本发明所属领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本发明的保护范围。
Claims (10)
1.一种无机纳米聚合物改性高强度塑料,其特征在于,包括以下质量组份:聚合物基体材料50~100、无机纳米聚合物0~50,增塑剂0.1~0.5,抗氧剂0.1~2;所述无机纳米聚合物包括以下质量组分:纳米硅溶胶20%~70%、烷氧基硅烷10%~70%、酸催化剂0.01%~5%、阴离子改性剂0.1%~10%、阻聚剂0.05%~0.2%和2%~20%水溶性溶剂。
2.根据权利要求1所述的无机纳米聚合物改性高强度塑料,其特征在于,
所述烷氧基硅烷包括甲基三甲氧基硅烷、甲基三乙氧基硅烷、二甲基二甲氧基硅烷、二甲基二乙氧基硅烷、苯基三甲氧基硅烷、苯基三乙氧基硅烷、二苯基二甲氧基硅烷、二苯基二乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、γ-甲基丙烯酰氧基丙基三甲氧基硅烷、3-缩水甘油醚氧基丙基三甲氧基硅烷、环氧丙氧丙基甲基二甲氧基硅烷、环氧丙氧丙基甲基二乙氧基硅烷、十二烷基甲基二甲氧基硅烷和十八烷基甲基二甲氧基硅烷中的至少一种。
3.根据权利要求1所述的无机纳米聚合物改性高强度塑料,其特征在于,
所述阻聚剂包括吩噻嗪、对苯二酚、对叔丁基邻苯二酚、硝基苯中的至少一种。
4.根据权利要求1所述的无机纳米聚合物改性改性高强度塑料,其特征在于,所述阴离子改性剂包括月桂酸皂、松香油皂、油酸皂、甲基苯磺酸钠、二甲基苯磺酸钠、异丙基磺酸钠、十二烷基硫酸钠、十二烷基苯磺酸钠、二丁基萘磺酸钠、十二烷基二苯醚磺酸钠、硬脂酸钠、N,N-二羟乙基月桂酰胺、异构十三醇醚硫酸钠中的至少一种。
5.根据权利要求1所述的无机纳米聚合物改性改性高强度塑料,其特征在于,所述酸催化剂包括甲酸、乙酸、盐酸中的一种或多种。
6.根据权利要求1所述的无机纳米聚合物改性改性高强度塑料,其特征在于,所述水溶性溶剂为甲醇、乙醇、异丙醇、丁醇、丙二醇甲醚醋酸酯中的一种或多种。
7.根据权利要求1所述的无机纳米聚合物改性改性高强度塑料,其特征在于,所述聚合物基体材料包括聚丙烯、聚酰胺6、聚酰胺66中的至少一种。
8.根据权利要求1所述的无机纳米聚合物改性高强度塑料,其特征在于,所述无机纳米聚合物的粒径为10~160nm。
9.一种如权利要求1-8任一所述的无机纳米聚合物改性高强度塑料的制备方法,其特征在于,具体制备过程如下:将聚合物基体材料、无机纳米聚合物、增塑剂和氧化剂高温熔融后共混后挤出造粒,即得无机纳米聚合物改性高强度塑料。
10.根据权利要求9所述的无机纳米聚合物改性高强度塑料的制备方法,其特征在于,所述无机纳米聚合物的制备过程包括如下步骤:
S1、室温下将烷氧基硅烷混合均匀,加入阻聚剂、阴离子改性剂充分搅拌,形成硅烷混合液;
S2、将纳米硅溶胶和酸催化剂搅拌均匀后逐步滴加到步骤S1制备的硅烷混合液中,10min内滴加完成,搅拌后升温至45~80℃反应0.5~15h;
S3、将水溶性溶剂加入步骤S2制备的溶液中,搅拌5~30min,升温至60~80℃后停止搅拌,并保温陈化1-72h;
S4、开启搅拌,同时减压蒸馏除去多余的溶剂后停止加热,自然冷却后即可获得透明或半透明状的粘稠状无机纳米聚合物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010622207.8A CN111825918A (zh) | 2020-07-01 | 2020-07-01 | 一种无机纳米聚合物改性高强度塑料及制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010622207.8A CN111825918A (zh) | 2020-07-01 | 2020-07-01 | 一种无机纳米聚合物改性高强度塑料及制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111825918A true CN111825918A (zh) | 2020-10-27 |
Family
ID=72900010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010622207.8A Pending CN111825918A (zh) | 2020-07-01 | 2020-07-01 | 一种无机纳米聚合物改性高强度塑料及制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111825918A (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050027040A1 (en) * | 2001-05-31 | 2005-02-03 | Nelson Gordon L. | Organic/inorganic nanocomposites obtained by extrusion |
CN101851374A (zh) * | 2010-06-24 | 2010-10-06 | 华东理工大学 | 一种增塑聚丙烯/无机纳米复合材料及其制备方法 |
CN109485051A (zh) * | 2018-11-02 | 2019-03-19 | 中国林业科学研究院林产化学工业研究所 | 一种改性硅溶胶的快速制备方法 |
-
2020
- 2020-07-01 CN CN202010622207.8A patent/CN111825918A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050027040A1 (en) * | 2001-05-31 | 2005-02-03 | Nelson Gordon L. | Organic/inorganic nanocomposites obtained by extrusion |
CN101851374A (zh) * | 2010-06-24 | 2010-10-06 | 华东理工大学 | 一种增塑聚丙烯/无机纳米复合材料及其制备方法 |
CN109485051A (zh) * | 2018-11-02 | 2019-03-19 | 中国林业科学研究院林产化学工业研究所 | 一种改性硅溶胶的快速制备方法 |
Non-Patent Citations (1)
Title |
---|
杨明山等, 中国轻工业出版社 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101841774B1 (ko) | 복합재 조성물 | |
CN106009449B (zh) | 一种耐高温耐油热塑性硫化胶及其制备方法 | |
CN1775858A (zh) | 尼龙包装薄膜用加工母料 | |
CN103937232B (zh) | 一种蒙脱土尼龙6复合材料的制备方法 | |
CN102492213A (zh) | 一种滚塑级交联聚乙烯耐磨复合材料及其制备方法 | |
CN111073320A (zh) | 天然橡胶改性沥青及制备方法 | |
CN112812512A (zh) | 一种用于非透明可降解塑胶袋的材料及其制备方法 | |
CN109320853B (zh) | 三元乙丙橡胶及其制备方法 | |
CN105255082A (zh) | 一种丙烯酸酯橡胶/尼龙热塑性硫化胶及其制备方法 | |
CN102477205A (zh) | 一种纳米改性的无卤耐磨电缆料及其制备方法 | |
CN111961283A (zh) | 一种高介电常数聚丙烯复合材料及其制备方法 | |
CN105086378A (zh) | 液晶聚合物原位复合材料及其制备方法 | |
JP2016141720A (ja) | 天然ゴム−カーボンブラックウェットマスターバッチの製造方法 | |
CN114031874A (zh) | 一种cpvc电缆保护管的制造方法 | |
CN111825918A (zh) | 一种无机纳米聚合物改性高强度塑料及制备方法 | |
CN112708230B (zh) | 具有特殊表面性质的热塑性聚乙烯醇组合物、薄膜及其制备方法 | |
CN111849131A (zh) | 一种无机纳米聚合物改性光伏背板膜及制备方法 | |
Du et al. | Effects of mixing temperature on the extrusion rheological behaviors of rubber-based compounds | |
CN111748154A (zh) | 一种高性能增强聚丙烯复合材料 | |
CN111393771B (zh) | 一种电线电缆用pvc阻燃塑料粒子及其制备工艺 | |
WO2010137718A1 (ja) | 押出成形時のメヤニ発生を抑制するポリマー微粒子 | |
CN110305457B (zh) | 透明增韧聚乳酸材料制备方法 | |
CN111440376A (zh) | 一种耐磨聚乙烯膜材 | |
CN111825899B (zh) | 一种无机纳米聚合物改性高耐磨橡胶及制备方法 | |
CN113388221B (zh) | Abs复合材料及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201027 |