CN111799241A

CN111799241A - Bonding structure, manufacturing method thereof and display panel

Info

Publication number: CN111799241A
Application number: CN202010585900.2A
Authority: CN
Inventors: 朱永斌
Original assignee: Bazhou Yungu Electronic Technology Co ltd
Current assignee: Bazhou Yungu Electronic Technology Co ltd
Priority date: 2020-06-24
Filing date: 2020-06-24
Publication date: 2020-10-20

Abstract

The application relates to a bonding structure, a manufacturing method thereof and a display panel. The bonding structure includes a first device, a second device, and an array of conductive pillars. The first device includes a first electrode. The second device is disposed opposite the first device. The second device includes a second electrode. The conductive column array is clamped between the first electrode and the second electrode, and electrically connects the first electrode and the second electrode. The two ends of the conductive column array can be respectively in contact connection with the first electrode and the second electrode, so that good electric contact between the first electrode and the second electrode can be ensured by setting the contact area between the two ends of the conductive column array and the first electrode and the second electrode. The purpose of circuit conduction can be achieved by enabling the two ends of the conductive column array to be respectively contacted with the first electrode and the second electrode.

Description

Bonding structure, manufacturing method thereof and display panel

Technical Field

The invention relates to the technical field of display, in particular to a bonding structure, a manufacturing method thereof and a display panel.

Background

With the development of display technology, the requirements for electrical connection between panels and components are higher and higher.

In the conventional technology, the pads of the panel and the pads of the component are electrically connected by metal particles exposed in Anisotropic Conductive Film (ACF) after the particles are crushed. However, the anisotropic conductive adhesive has a high requirement on the contact area between the pad and the bonding pad, and when the contact area is small, the number of metal particles between the pad and the bonding pad is small, which affects the conductive effect.

Disclosure of Invention

In view of the above, it is desirable to provide a bonding structure, a method for manufacturing the same, and a display panel.

One aspect of the present application provides a bonding structure, including: a first device including a first electrode; a second device disposed opposite the first device, the second device including a second electrode; and the conductive column array is clamped between the first electrode and the second electrode and is used for electrically connecting the first electrode and the second electrode.

In one embodiment, the conductive pillar array includes a plurality of conductive pillars arranged in parallel, and the plurality of conductive pillars extend from the first electrode to the second electrode. The present embodiment provides an implementable manner of the extending direction of the conductive pillar.

In one embodiment, the plurality of conductive posts are spaced apart. In this embodiment, the conductive pillars may have a gap therebetween. The gap can be filled with colloid, and then the contact area between the colloid and the side wall of the conductive column is increased.

In one embodiment, the cross-sectional areas of the plurality of conductive pillars become smaller in a gradient from the first electrode to the second electrode in a direction parallel to the first electrode; preferably, the conductive post is in the shape of a cone. This embodiment may facilitate the insertion of the conductive pillars into the encapsulant.

In one embodiment, the conductive pillar includes a plurality of circular truncated cones, and bottoms and tops of the plurality of circular truncated cones are sequentially connected. The conductive post may also include a truncated cone structure, providing one possible implementation of a conductive post.

In one embodiment, the conductive pillar array further includes a plurality of conductive particles, and an end of each conductive pillar away from the first electrode is in contact with the second electrode through one of the conductive particles. In this embodiment, the area of the conductive particles attached to the inner surface of the recess of the second electrode is larger, so that the conductive area can be increased, and the on-resistance can be reduced.

In one embodiment, the device further includes a colloid layer sandwiched between the first device and the second device, and the conductive pillar array is located in the colloid layer. In this embodiment, the glue layer can increase the firmness of the connection between the first electrode and the second electrode.

Another aspect of the present application provides a method for manufacturing a bonding structure, including: providing a first device comprising a first electrode; forming a conductive column array on the surface of the first electrode; a second device is brought into relative proximity with the first device such that a second electrode of the second device contacts a surface of the array of conductive pillars remote from the first device.

In one embodiment, in the step of forming the conductive pillar array on the surface of the first electrode, the conductive pillar array is integrally formed with the first electrode. The embodiment can improve the connection firmness of the conductive column array and the first electrode, and simultaneously simplifies the process steps.

The present application further provides a display panel, which includes the bonding structure or the bonding structure manufactured by the method for manufacturing the bonding structure; the first device is a panel main body, and the second device is a component.

The bonding structure comprises a first device, a second device and a conductive column array. Wherein the first device comprises a first electrode; a second device disposed opposite the first device, the second device including a second electrode; the conductive column array is clamped between the first electrode and the second electrode and used for electrically connecting the first electrode and the second electrode. Because the two ends of the conductive column array can be respectively in contact connection with the first electrode and the second electrode, the contact area between the two ends of the conductive column array and the first electrode and the contact area between the two ends of the conductive column array and the second electrode are set, so that the first electrode and the second electrode can be ensured to have good electric contact, and the purpose of circuit conduction can be achieved. Meanwhile, the problem that the first device or the second device is damaged due to the fact that the first electrode and the second electrode are extruded at high temperature and high pressure can be solved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a cross-sectional view of a bonding structure provided by an embodiment of the present application;

FIG. 2 is a cross-sectional view of a bonding structure provided in accordance with another embodiment of the present application;

fig. 3 is a cross-sectional view of a conductive post including a truncated cone according to an embodiment of the present application;

FIG. 4 is a cross-sectional view of a bonding structure provided in accordance with yet another embodiment of the present application;

fig. 5 is a cross-sectional view of the conductive pillar connected to the second electrode through the conductive particles according to the embodiment of the present application.

Description of reference numerals:

a bonding structure 10; a first device 100; a first electrode 110; a second device 200; a second electrode 210; a conductive pillar array 300; a conductive post 310; a circular table 312; conductive particles 320; a colloidal layer 400.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention. It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The applicant has long studied that pads and pins between devices are typically connected by anisotropic conductive glue. When it is necessary to electrically connect the pad and the lead, the anisotropic conductive paste is generally applied between the pad and the lead. The device is then pressed at high temperature by a ram such that the pad and the pin are brought into close proximity. Meanwhile, the particles in the anisotropic conductive adhesive are crushed, so that the conductive particles in the anisotropic conductive adhesive are exposed. And the conductive particles dispersed in the anisotropic conductive adhesive are in close contact with each other and are in contact conduction with the bonding pad and the pin. However, when the area of the pad or the lead facing each other is small, or when the pad and the lead are misaligned in the butt joint, or when the density distribution of the conductive particles is not uniform, the number of the conductive particles that can connect the lead or the pad is small, which affects the conductive effect. If the pad and the pin are misaligned seriously, a short circuit may be caused.

Referring to fig. 1, an embodiment of the present application provides a bonding structure 10. Bonding structure 10 includes a first device 100, a second device 200, and an array of conductive pillars 300. The first device 100 comprises a first electrode 110. The second device 200 is arranged opposite to the first device 100, the second device 200 comprising a second electrode 210. The conductive pillar array 300 is sandwiched between the first electrode 110 and the second electrode 210, and the conductive pillar array 300 is used for electrically connecting the first electrode 110 and the second electrode 210.

In one embodiment, the first device 100 may be a flexible circuit board, a driving chip, a touch screen driving chip, or the like. The second device 200 may be a display panel main body. It can be understood that the first device 100 may also be a display panel main body, and the second device 200 may be a flexible circuit board, a driving chip, or a touch screen driving chip, and may be specifically configured according to actual situations.

The first electrode 110 and the second electrode 210 may be pads, pins, or the like formed on the first device 100 and the second device 200. When the first device 100 and the second device 200 need to be electrically connected, the first electrode 110 and the second electrode 210 may be correspondingly connected. It is understood that each of the first devices 100 may include a plurality of first electrodes 110. Each of the second devices 200 may include a plurality of second electrodes 210. The plurality of first electrodes 110 and the plurality of second electrodes 210 may be disposed in a one-to-one correspondence. That is, the first electrode 110 and the second electrode 210 in one-to-one correspondence may form one conductive path.

In one embodiment, at least one of the first electrode 110 and the second electrode 210 may be a multi-layered metal structure. The material of the first electrode and the second electrode may include molybdenum, nickel, palladium, cobalt, tungsten, rhodium, titanium, chromium, gold, silver, platinum, or the like.

In one embodiment, the first electrode 110 and/or the second electrode 210 may be at least two metal layers disposed in a stacked manner. For example, the first electrode 110 and/or the second electrode 210 may be a first metal layer, a second metal layer, and a third metal layer structure which are stacked. The metal materials of the first metal layer and the third metal layer can be molybdenum, nickel, palladium, cobalt, tungsten, rhodium, titanium, chromium, gold, silver, platinum and other materials with good corrosion resistance. The second metal layer may be made of a material having good conductivity, such as gold, silver, copper, aluminum, or iron.

In one embodiment, the first electrode 110 and the second electrode 210 may have a cubic structure, and a projection of the cubic structure on the surface of the first device 100 or the second device 200 is rectangular. The width of the rectangle may be 10 to 200 microns. The rectangle is 80 microns to 2 millimeters in length. Further, the width of the first electrode 110 and/or the second electrode 210 may be 20 micrometers, and the length may be 100 micrometers.

The conductive pillar array 300 may include a plurality of conductive pillars 310. One conductive pillar array 300 may be disposed between each pair of the first electrode 110 and the second electrode 210. The conductive pillar array 300 is disposed between the first electrode 110 and the second electrode 210. The plurality of conductive pillars 310 are arranged on the surfaces of the first electrode 110 opposite to the second electrode 210, so as to form the conductive pillar array 300. The conductive pillar array 300 may be a rectangular array, a circular array, a linear array, or the like. Both ends of the conductive pillar array 300 may be in contact with two surfaces of the first electrode 110 and the second electrode 210 opposite to each other. Accordingly, the conductive pillar array 300 may electrically connect the first electrode 110 and the second electrode 210.

In one embodiment, the conductive pillar array 300 may be a rectangular array, and a projection of the rectangular array on the first device 100 or the second device 200 may be a rectangle. The width of the rectangle may be 8 to 70 microns, and the length of the conductive pillar array 300 may be 15 to 180 microns.

Both ends of the conductive pillar array 300 may be connected to the first electrode 110 and the second electrode 210, respectively. Therefore, the contact area between the two ends of the conductive pillar array 300 and the first electrode 110 and the second electrode 210 can be ensured by setting the contact area between the two ends of the conductive pillar array 300 and the first electrode 110 and the second electrode 210, so that the conductive effect between the first electrode 110 and the second electrode 210 is ensured. Meanwhile, since the shape of the conductive pillar array 300 is relatively fixed, compared with the randomness of the distribution of the conductive particles in the anisotropic conductive paste when the first electrode 110 and the second electrode 210 are in contact with each other, the shape of the conductive pillar array is more stable. Further, the first electrode 110 and the second electrode 210 are connected by using the conductive pillar array 300, as long as both ends of the conductive pillar array 300 are respectively in contact with the first electrode 110 and the second electrode 210. Therefore, the problem that the first device 100 or the second device 200 is damaged due to the need of high temperature and high voltage to connect the first electrode 110 and the second electrode 210 when anisotropic conductive adhesive is used can be avoided.

The bonding structure 10 provided by the embodiments of the present application includes a first device 100, a second device 200, and an array of conductive pillars 300. The first device 100 comprises a first electrode 110. The second device 200 is disposed opposite the first device 100. The second device 200 comprises a second electrode 210. The conductive pillar array 300 is sandwiched between the first electrode 110 and the second electrode 210. The conductive pillar array 300 is used to electrically connect the first electrode 110 and the second electrode 210. Both ends of the conductive pillar array 300 can be respectively connected to the first electrode 110 and the second electrode 210 in a contact manner, so that a good electrical contact between the first electrode 110 and the second electrode 210 can be ensured by setting a contact area between both ends of the conductive pillar array 300 and the first electrode 110 and the second electrode 210. The conductive pillar array 300 is in contact with the first electrode 110 and the second electrode 210 at two ends, so as to achieve the purpose of conducting the circuit. Meanwhile, the first device 100 or the second device 200 can be prevented from being damaged due to the high-temperature and high-pressure extrusion of the first electrode 110 and the second electrode 210.

In one embodiment, the conductive pillar array 300 includes a plurality of the conductive pillars 310, where a plurality refers to two or more. The conductive pillar 310 extends from the first electrode 110 to the second electrode 210. That is, the conductive pillar 310 is vertically disposed between the first electrode 110 and the second electrode 210. Specifically, the plurality of conductive pillars 310 are arranged in parallel. The two ends of the conductive pillar 310 are respectively connected to the first electrode 110 and the second electrode 210. By setting the cross-sectional areas of the two ends of the conductive pillar 310, the electrical contact areas of the conductive pillar 310 and the first electrode 110 and the second electrode 210 can be determined, so as to ensure the electrical conductivity between the first electrode 110 and the second electrode 210.

In one embodiment, one conductive pillar array 300 may include 2 to 5 conductive pillars 310. Further, one conductive pillar array 300 may include 3 conductive pillars 310.

In one embodiment, the material of the conductive pillar 310 may be one or more of nickel, palladium, cobalt, tungsten, rhodium, titanium, chromium, gold, silver, and platinum.

In one embodiment, the conductive pillars 310 may be a multi-layer structure from the inside out. The outer layer material of the conductive post 310 may be molybdenum, nickel, palladium, cobalt, tungsten, rhodium, titanium, chromium, gold, silver, or platinum material with good corrosion resistance, so as to avoid being corroded by colloid.

The conductive pillar 310 may be cylindrical, or may be in the shape of a cube, a cone, or the like. The distance that the conductive pillar 310 extends from the first electrode 110 to the second electrode 210 may be the height of the conductive pillar 310. The distance between the first electrode 110 and the second electrode 210 may be defined by setting the height of the conductive pillar 310.

In one embodiment, the height of the conductive pillar 310 may be 3 to 10 micrometers, which can further save materials and reduce costs on the basis of ensuring the conduction between the first electrode 110 and the second electrode 210. Further, the height of the conductive pillar 310 may be 5 to 8 micrometers. Still further, the height of the conductive pillar 310 may be 7 micrometers.

In one embodiment, the conductive pillars 310 may have a diameter of 1 to 8 microns, which is easy to fabricate in a process within this range of values. Further, the conductive posts may have a diameter of 2 to 3 microns. In one embodiment, the conductive posts have a diameter of 2 microns.

The conductive pillars 310 are arranged in parallel, that is, the conductive pillars 310 may be independent structures and are arranged between the first electrode 110 and the second electrode 210. The conductive pillars 310 may also be partially in contact with each other or integrally formed.

In one embodiment, the space around the conductive pillar array 300 between the first electrode 110 and the second electrode 210 may be adhered by colloid filling. It is possible to ensure the reliability of the connection of the first electrode 110 and the second electrode 210.

Referring to fig. 2, in one embodiment, the conductive pillars 310 are disposed at intervals. Accordingly, a plurality of the conductive pillars 310 in the conductive pillar array 300 may have voids therebetween. By filling the colloid between the first electrode 110 and the second electrode 210, the contact area between the colloid and the sidewall of the conductive pillar 310 can be increased, and the adhesion between the colloid and the sidewall of the conductive pillar 310 can be improved. Meanwhile, the colloid is also in contact with the surfaces of the first electrode 110 and the second electrode 210 opposite to each other. Accordingly, the adhesiveness among the first electrode 110, the second electrode 210, and the conductive pillar 310 may be improved. Meanwhile, the overall firmness of the first electrode 110, the second electrode 210 and the conductive pillar 310 is improved. In one embodiment, the sidewalls of the conductive pillars 310 may be rough surfaces, so that the adhesion between the adhesive and the conductive pillars 310 may be improved.

In one embodiment, the cross-sectional area of the conductive pillars 310 decreases in a gradient from the first electrode 110 to the second electrode 210 in a direction parallel to the first electrode 110. That is, the cross-sectional areas of the conductive pillars 310 tend to become smaller from the first electrode 110 toward the second electrode 210. The cross-sectional area of the end of the conductive post 310 distal from the first electrode 110 is smaller than the cross-sectional area of the end of the conductive post 310 proximal to the first electrode 110.

When the conductive pillar 310 is disposed on the first electrode 110 and an adhesive is coated on the surface of the first electrode 110, the conductive pillar 310 can be inserted into the adhesive conveniently because the cross-sectional area of the end of the conductive pillar 310 away from the first electrode 110 is small. Optionally, the colloid may be disposed on the second electrode 210, or may be disposed on other structures, which may be specifically disposed according to actual situations. In one embodiment, the conductive pillar 310 is a cone, and the manner and process for manufacturing the cone are simple, so that the production cost can be reduced.

Further, when the colloid is filled between the conductive pillars 310, the content of the colloid changes along the extending direction from the first electrode 110 to the second electrode 210, so that the contact area between the colloid and the conductive pillars 310 at different positions can be changed, and the adhesion is further improved. That is, when the gradient is large, the diameter of the conductive pillar 310 changes greatly from the first electrode 110 to the second electrode 210. When the gradient is small, the diameter of the conductive pillar 310 changes less in a direction from the first electrode 110 to the second electrode 210. Further, when the gradient changes to zero, the diameters of the conductive pillars 310 at different positions may be the same. Further, in a certain area of the conductive pillars 310, the gradient of the diameters of the conductive pillars 310 may be abrupt, that is, the diameters of the conductive pillars 310 may be abrupt. It is understood that the diameter of the conductive pillar 310 in the present embodiment is the maximum distance between two points in the outer peripheral edge of the cross-sectional area of the conductive pillar 310.

Referring to fig. 3, in one embodiment, the conductive pillar 310 includes a plurality of round tables 312. The bottom (the surface close to the first electrode 110) and the top (the surface close to the second electrode 210) of the plurality of round tables 312 are sequentially connected. It will be appreciated that the bottom area of the circular table 312 is greater than the top area of the circular table 312. The top of a first circular truncated cone 312 is in contact with the bottom of another circular truncated cone 312, and the conductive pillars 310 are formed by sequentially connecting the tops of the first circular truncated cones 312 and the bottoms of the other circular truncated cones 312. Therefore, the surface area of the conductive pillars 310 in the axial direction may have a plurality of abrupt changes, and when the colloid is filled between the conductive pillars 310, the adhesion area between the colloid and the conductive pillars 310 may be increased, and the adhesion firmness may be increased.

In one embodiment, the plurality of conductive pillars 310 are integrally formed with the first electrode 110. Accordingly, the conductive pillar 310 may be formed on the surface of the first electrode 110. One end of the conductive pillars 310 away from the first electrode 110 is in contact with the second electrode 210.

In one embodiment, the conductive pillar 310 may be formed on the surface of the first electrode 110 through deposition, exposure, and etching processes.

Referring to fig. 4, in one embodiment, the conductive pillar 310 may be disposed on a surface of the second electrode 210 opposite to the first electrode 110. At this time, the surface of the first electrode 110 may be coated with a colloid, and then the second electrode 210 may be relatively close to the first electrode 110. At this time, the end of the conductive pillar 310 away from the second electrode 210 can be inserted into the glue body quickly.

Referring to fig. 5, in one embodiment, the conductive pillar array 300 further includes a plurality of conductive particles 320. One end of each conductive pillar 310 away from the first electrode 110 is in contact with the second electrode 210 through one of the conductive particles 320. It is understood that the surface of the second electrode 210 is generally rough, i.e., the surface of the second electrode 210 has a pit structure. Thus, when the end of the conductive pillar 310 away from the first electrode 110 abuts the rough surface of the second electrode 210 via the conductive particles 320, the conductive particles 320 can be embedded in the pit structure. The robustness between the conductive pillar 310 and the second electrode 210 can be increased. Further, the area of the conductive particles 320 attached to the inner surface of the recess is large, so that the conductive area can be increased, and the on-resistance can be reduced.

In one embodiment, the material of the conductive particles 320 may be one or more of gold, silver, and platinum materials with good conductivity, so that the conductivity performance may be improved. The shape of the conductive particles 320 may be a sphere, an irregular polygon, or the like.

In one embodiment, the conductive particles 320 may be integrally formed with the conductive pillar 310, or may be adhered to an end of the conductive pillar 310 away from the first electrode 110. It is understood that, in order to adapt to the size of the conductive particles 320, a pit structure adapted to the size of the conductive particles 320 may be formed on the surface of the second electrode 210.

In one embodiment, the conductive particles 320 may have a diameter of 0.5 to 1 micron. Further, the diameter of the conductive particles 320 is 0.7 μm, which can be adapted to the pit structure of the rough surface of the second electrode 210.

In one embodiment, the bonding structure 10 further includes a glue layer 400. The colloidal layer 400 is sandwiched between the first device 100 and the second device 200. The conductive pillar array 300 is located in the glue layer 400. The gel layer 400 may include a gel. When the conductive pillar array 300 is disposed on the first electrode 110, the adhesive layer 400 may be coated on the surface of the conductive pillar array 300, and the conductive pillar array 300 is inserted into the adhesive layer 400. Alternatively, the colloid layer 400 may be coated on the surface of the second electrode 210, and then the surface of the first electrode 110, which is disposed on the conductive pillar array 300, is close to the colloid layer 400, so that the conductive pillar array 300 is inserted into the colloid layer 400. The glue layer 400 can increase the firmness of the connection between the first electrode 110 and the second electrode 210. The material of the colloidal layer 400 may be a resin gel. The resin gel may include a thermoplastic resin or a thermosetting resin, or the like. The material of the colloid layer 400 may also be acrylate adhesive, composite structural adhesive, polymer adhesive, hot melt adhesive, pressure sensitive adhesive, etc.

The embodiment of the present application further provides a method for manufacturing the bonding structure 10. The method comprises the following steps:

s10, providing a first device 100, the first device 100 comprising the first electrode 110;

s20, forming a conductive pillar array 300 on the surface of the first electrode 110;

s30, relatively approaching the second device 200 to the first device 100, so that the second electrode 210 of the second device contacts the surface of the conductive pillar array 300 away from the first device 100.

Specifically, in S10, the first device 100 may be a display panel main body. The surface of the display panel body may have a first electrode 110. The first electrode 110 may be a pad.

In S20, the conductive pillar array 300 may be formed on the surface of the first electrode 110 through deposition, exposure, etching, and the like.

In S30, the second electrode 210 disposed on the surface of the second device 200 may be a pin. The surface of the second device 200 disposed on the second electrode 210 is adjacent to the surface of the first device 100 disposed on the conductive post array 300, such that the second electrode 210 contacts the surface of the conductive post array 300 away from the first device 100, and thus the conductive post 310 can electrically connect the first electrode 110 and the second electrode 210.

In one embodiment, a colloidal layer 400 may be applied to the surface of the first electrode 110 before the second electrode 210 contacts the surface of the conductive pillar array 300 away from the first device 100. When the conductive pillar array 300 is inserted into the glue layer 400, the second electrode 210 is covered on the surface of the conductive pillar array 300 away from the first electrode 110.

In one embodiment, in forming the conductive pillar array 300 on the surface of the first electrode 110, the conductive pillar array 300 is integrally formed with the first electrode 110. The conductive pillar array 300 and the first electrode 110 are integrally formed, so that the firmness of the conductive pillar array 300 and the first electrode 110 can be improved.

The embodiment of the application also provides a display panel. The display panel includes the bonding structure 10 described in the above embodiments or the bonding structure 10 manufactured by the above embodiments. Wherein the first device 100 is a panel body. The second device 200 is a component. The panel body may have a panel bonding area, and the first electrode 110 may be disposed at the panel bonding area. The second device 200 is a component, the component may also have a device bonding area, and the second electrode 210 may be disposed in the device bonding area.

The panel main body can be an OLED panel, and the panel main body can also be a flexible display screen. The second device 200 is a component. The components can be flexible circuit boards, driving chips, touch screen driving chips and the like. The display panel main body can be driven to display through the driving chip. The touch screen driving chip can control the panel main body to display in a feedback mode.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A bonding structure, comprising:

a first device including a first electrode;

a second device disposed opposite the first device, the second device including a second electrode; and

and the conductive column array is clamped between the first electrode and the second electrode and is used for electrically connecting the first electrode and the second electrode.

2. The bonding structure of claim 1, wherein the array of conductive pillars includes a plurality of conductive pillars extending from the first electrode in a direction of the second electrode.

3. The bonding structure of claim 2, wherein the plurality of conductive pillars are spaced apart.

4. The bonding structure of claim 3, wherein the cross-sectional area of the plurality of conductive pillars, in a direction parallel to the first electrode, tapers from the first electrode to the second electrode;

preferably, the conductive post is in the shape of a cone.

5. A bonding structure according to claim 3, wherein the conductive post includes a plurality of truncated cones, the bottom and top of which are connected in series.

6. The bonding structure of claim 2, wherein the array of conductive pillars further includes a plurality of conductive particles, an end of each of the conductive pillars distal from the first electrode being in contact with the second electrode through one of the conductive particles.

7. A bonding structure according to claim 1, further comprising a glue layer sandwiched between the first and second devices, the array of conductive pillars being located in the glue layer.

8. A method of fabricating a bonding structure, comprising:

providing a first device comprising a first electrode;

forming a conductive column array on the surface of the first electrode;

a second device is brought into relative proximity with the first device such that a second electrode of the second device contacts a surface of the array of conductive pillars remote from the first device.

9. The method of claim 8, wherein the step of forming the array of conductive pillars on the surface of the first electrode is performed integrally with the first electrode.

10. A display panel comprising the bonding structure of any one of claims 1-7 or the bonding structure fabricated by the method of fabricating the bonding structure of claims 8-9;

the first device is a panel main body, and the second device is a component.