CN111757666B - 电子设备的生产系统和电子设备的生产方法 - Google Patents

电子设备的生产系统和电子设备的生产方法 Download PDF

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Publication number
CN111757666B
CN111757666B CN202010223430.5A CN202010223430A CN111757666B CN 111757666 B CN111757666 B CN 111757666B CN 202010223430 A CN202010223430 A CN 202010223430A CN 111757666 B CN111757666 B CN 111757666B
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China
Prior art keywords
data
mounting
detection data
inspection
detection
Prior art date
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CN202010223430.5A
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English (en)
Chinese (zh)
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CN111757666A (zh
Inventor
安泽昭伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
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Juki Corp
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/087—Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • General Factory Administration (AREA)
CN202010223430.5A 2019-03-28 2020-03-26 电子设备的生产系统和电子设备的生产方法 Active CN111757666B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019064219A JP7323316B2 (ja) 2019-03-28 2019-03-28 生産システム、及び生産方法
JP2019-064219 2019-03-28

Publications (2)

Publication Number Publication Date
CN111757666A CN111757666A (zh) 2020-10-09
CN111757666B true CN111757666B (zh) 2024-03-26

Family

ID=72673125

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010223430.5A Active CN111757666B (zh) 2019-03-28 2020-03-26 电子设备的生产系统和电子设备的生产方法

Country Status (2)

Country Link
JP (1) JP7323316B2 (ja)
CN (1) CN111757666B (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216589A (ja) * 2005-02-01 2006-08-17 Omron Corp プリント基板の品質管理システム
JP2014079907A (ja) * 2012-10-15 2014-05-08 Panasonic Corp スクリーン印刷装置およびスクリーン印刷における不良原因の解析装置ならびに不良原因の解析方法
WO2015115426A1 (ja) * 2014-01-30 2015-08-06 オムロン株式会社 品質管理装置、品質管理方法
JP2018101674A (ja) * 2016-12-20 2018-06-28 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3612712B2 (ja) * 2002-10-02 2005-01-19 オムロン株式会社 基板実装ライン用プログラム提供方法
JP2004228252A (ja) * 2003-01-21 2004-08-12 Yamaha Motor Co Ltd 実装システムの異常追跡方法および異常追跡装置を備えた実装システム
JP4555117B2 (ja) * 2005-02-21 2010-09-29 パナソニック株式会社 不良部品検出方法、および部品実装方法
JP4617998B2 (ja) * 2005-05-18 2011-01-26 オムロン株式会社 不良要因分析システム
JP2007194252A (ja) * 2006-01-17 2007-08-02 Yamaha Motor Co Ltd 実装システム
JP4896655B2 (ja) * 2006-10-17 2012-03-14 ヤマハ発動機株式会社 実装不良の原因特定方法および実装基板製造装置
JP2012129434A (ja) * 2010-12-17 2012-07-05 Fuji Mach Mfg Co Ltd 対基板作業機
JP5812908B2 (ja) * 2012-03-20 2015-11-17 富士機械製造株式会社 対回路基板作業機

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216589A (ja) * 2005-02-01 2006-08-17 Omron Corp プリント基板の品質管理システム
JP2014079907A (ja) * 2012-10-15 2014-05-08 Panasonic Corp スクリーン印刷装置およびスクリーン印刷における不良原因の解析装置ならびに不良原因の解析方法
WO2015115426A1 (ja) * 2014-01-30 2015-08-06 オムロン株式会社 品質管理装置、品質管理方法
JP2018101674A (ja) * 2016-12-20 2018-06-28 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法

Also Published As

Publication number Publication date
JP2020167206A (ja) 2020-10-08
CN111757666A (zh) 2020-10-09
JP7323316B2 (ja) 2023-08-08

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