CN111656502B - 致动器以及打线接合装置 - Google Patents

致动器以及打线接合装置 Download PDF

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Publication number
CN111656502B
CN111656502B CN201980010485.3A CN201980010485A CN111656502B CN 111656502 B CN111656502 B CN 111656502B CN 201980010485 A CN201980010485 A CN 201980010485A CN 111656502 B CN111656502 B CN 111656502B
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CN
China
Prior art keywords
needle
force
force generating
carriage
actuator
Prior art date
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Active
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CN201980010485.3A
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English (en)
Chinese (zh)
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CN111656502A (zh
Inventor
内田洋平
平良尚也
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Shinkawa Ltd
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Shinkawa Ltd
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Publication of CN111656502A publication Critical patent/CN111656502A/zh
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Publication of CN111656502B publication Critical patent/CN111656502B/zh
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
CN201980010485.3A 2018-01-30 2019-01-30 致动器以及打线接合装置 Active CN111656502B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018013321 2018-01-30
JP2018-013321 2018-01-30
PCT/JP2019/003217 WO2019151340A1 (ja) 2018-01-30 2019-01-30 アクチュエータ及びワイヤボンディング装置

Publications (2)

Publication Number Publication Date
CN111656502A CN111656502A (zh) 2020-09-11
CN111656502B true CN111656502B (zh) 2023-05-26

Family

ID=67478738

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980010485.3A Active CN111656502B (zh) 2018-01-30 2019-01-30 致动器以及打线接合装置

Country Status (5)

Country Link
JP (1) JP7002148B2 (ko)
KR (1) KR102420211B1 (ko)
CN (1) CN111656502B (ko)
TW (1) TWI722376B (ko)
WO (1) WO2019151340A1 (ko)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0839375A (ja) * 1994-07-27 1996-02-13 Mitsutoyo Corp テーブル装置
JP2005218202A (ja) * 2004-01-28 2005-08-11 Shinkawa Ltd アクチュエータ及びボンディング装置
JP2005341632A (ja) * 2004-05-24 2005-12-08 Yaskawa Electric Corp ムービングマグネット形リニアスライダ
JP2007005831A (ja) * 2006-10-05 2007-01-11 Nec Corp ワイヤボンディング装置
JP2007232647A (ja) * 2006-03-02 2007-09-13 Sumitomo Heavy Ind Ltd ステージ装置
JP2019134163A (ja) * 2018-01-30 2019-08-08 株式会社新川 ワイヤボンディング装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10323064A (ja) * 1997-05-13 1998-12-04 Hioki Ee Corp 微小位置決めアクチュエータ
DE19928185B4 (de) * 1999-06-19 2006-05-24 Robert Bosch Gmbh Piezoaktor
JP4360064B2 (ja) * 2002-06-10 2009-11-11 株式会社ニコン ステージ装置および露光装置
KR100543176B1 (ko) * 2003-11-06 2006-01-20 한국기계연구원 나노 패터닝용 프린팅헤드 장치
JP2005150218A (ja) * 2003-11-12 2005-06-09 Tdk Corp 積層型電子部品の製造方法および製造装置
JP2005218203A (ja) * 2004-01-28 2005-08-11 Shinkawa Ltd アクチュエータ及びボンディング装置
JP4700570B2 (ja) * 2006-07-14 2011-06-15 株式会社新川 ボンディング装置並びにボンディングツール先端部の洗浄方法及びプログラム
JP4787104B2 (ja) * 2006-07-31 2011-10-05 株式会社新川 ボンディング装置
JP5305380B2 (ja) * 2008-01-08 2013-10-02 Ｎｅｃトーキン株式会社 アクチュエータ、位置決め装置
JP2010283614A (ja) * 2009-06-04 2010-12-16 Sekyurion Nijuyon Kk カメラ制御装置、撮影方向制御方法、カメラ装置
WO2017149428A1 (en) 2016-03-04 2017-09-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and display device including the semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0839375A (ja) * 1994-07-27 1996-02-13 Mitsutoyo Corp テーブル装置
JP2005218202A (ja) * 2004-01-28 2005-08-11 Shinkawa Ltd アクチュエータ及びボンディング装置
JP2005341632A (ja) * 2004-05-24 2005-12-08 Yaskawa Electric Corp ムービングマグネット形リニアスライダ
JP2007232647A (ja) * 2006-03-02 2007-09-13 Sumitomo Heavy Ind Ltd ステージ装置
JP2007005831A (ja) * 2006-10-05 2007-01-11 Nec Corp ワイヤボンディング装置
JP2019134163A (ja) * 2018-01-30 2019-08-08 株式会社新川 ワイヤボンディング装置

Also Published As

Publication number Publication date
KR20200103820A (ko) 2020-09-02
TW201939627A (zh) 2019-10-01
WO2019151340A1 (ja) 2019-08-08
JP7002148B2 (ja) 2022-01-20
TWI722376B (zh) 2021-03-21
KR102420211B1 (ko) 2022-07-13
CN111656502A (zh) 2020-09-11
JPWO2019151340A1 (ja) 2021-01-07

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