CN111644419B

CN111644419B - Cleaning equipment

Info

Publication number: CN111644419B
Application number: CN201910160073.XA
Authority: CN
Inventors: 李广义; 王锐廷; 赵曾男; 张豹
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2019-03-04
Filing date: 2019-03-04
Publication date: 2022-06-17
Anticipated expiration: 2039-03-04
Also published as: CN111644419A

Abstract

The invention provides a cleaning device, which comprises a cleaning chamber, an air inlet device, a limiting structure and a ventilation structure, wherein the air inlet device is used for conveying dry gas into the cleaning chamber; the ventilation structure is arranged on the limiting structure and used for enabling the drying gas to flow to the wafer through the limiting structure. The cleaning equipment provided by the invention can improve the drying effect of the wafer, reduce the defects of the wafer, shorten the drying time and improve the drying efficiency, and has the advantages of simple structure, low manufacturing cost and high reliability.

Description

Cleaning equipment

Technical Field

The invention relates to the technical field of semiconductor equipment, in particular to cleaning equipment.

Background

At present, in a semiconductor process, a wafer is usually required to be cleaned to remove contaminants attached to the wafer during the process, and the wafer is cleaned after being cleaned to prevent the cleaned wafer surface from adhering with a cleaning agent.

In the prior art, a bearing platform, a lifting mechanism, a cylinder and two clamping plates are arranged in a cleaning chamber, wherein the two clamping plates are respectively arranged at two sides of the cleaning chamber, a plurality of clamping grooves are arranged in the clamping plates, the air cylinder is used for controlling the distance between the two clamping plates, in the process of cleaning the wafer, the wafer is placed in the carrying device, the carrying device with the wafer is placed on the bearing table through the mechanical arm, cleaning agent is injected into the cleaning chamber, cleaning the wafer on the bearing table, lifting the wafer from the carrying device by the lifting mechanism after cleaning, the distance between the two movable clamping plates is controlled by the air cylinder, so that the edge of the jacked wafer is clamped between the clamping grooves of the two clamping plates, and introducing a drying gas into the cleaning chamber, wherein the drying gas is diffused to the surface of the wafer from the space between the two clamping plates to dry the wafer.

However, in the prior art, the edge of the wafer is blocked in the clamping groove of the clamping plate, and the wafer is difficult to be thoroughly dried, and the drying gas can only diffuse to the wafer from between two clamping plates, so that the flow of the drying gas leading to the wafer is low, the drying time is long, the wafer is difficult to be thoroughly dried, more cleaning agents can still be left on the wafer after drying, more defects are generated, in addition, the two clamping plates are arranged on two sides of the cleaning cavity, and the cylinder is also needed for assistance, so that the cleaning cavity has a complex structure, high manufacturing cost and low reliability.

Disclosure of Invention

The invention aims to at least solve one of the technical problems in the prior art, and provides a cleaning device which can improve the drying effect of a wafer, reduce the defects of the wafer, shorten the drying time, improve the drying efficiency, and has the advantages of simple structure, low manufacturing cost and high reliability.

The cleaning equipment comprises a cleaning chamber, a gas inlet device, a limiting structure and a ventilation structure, wherein the gas inlet device is used for conveying dry gas into the cleaning chamber; the ventilation structure is arranged on the limiting structure and used for enabling the drying gas to flow to the wafer through the limiting structure.

Preferably, the limiting structure comprises two limiting parts, the two limiting parts are arranged oppositely in the horizontal direction, and two first surfaces of the two limiting parts, which are opposite to each other, are respectively provided with a limiting groove corresponding to each other;

the ventilation structure comprises a ventilation hole; the ventilation hole is formed in the limiting component and communicated with the limiting groove, so that the drying gas is conveyed towards the wafer through the ventilation hole.

Preferably, a plurality of limiting grooves are formed in each limiting part;

the vent hole in each limiting component is communicated with all the limiting grooves on the limiting component.

Preferably, the cross section of the limiting groove in the horizontal direction is triangular or isosceles trapezoid, so that the side surface of the limiting groove is in point contact with the wafer.

Preferably, the number of the vent holes in each limiting component is multiple, and the vent holes are arranged at intervals along the vertical direction; and each of the ventilation holes is communicated with all the limiting grooves on the limiting component.

Preferably, each limiting component comprises a limiting plate, the limiting plates are vertically arranged, and the vent holes are through holes which penetrate through the limiting plates along a direction perpendicular to the first surface;

the ventilation structure further comprises a flow guide structure, wherein the flow guide structure is arranged on the second surface, deviating from the first surface, of the limiting plate, and is used for introducing the drying gas into the ventilation hole.

Preferably, the flow guide structure includes a convex portion disposed on the second surface, the convex portion includes a flow guide surface, the flow guide surface is located on one side of the air inlet end of the vent hole, and the flow guide surface is inclined with respect to the second surface and intersects therewith.

Preferably, the number of the vent holes in each limiting component is multiple, and the vent holes are arranged at intervals along the vertical direction; each vent hole is communicated with all the limiting grooves on the limiting component; a plurality of limiting grooves are formed in each limiting part; the vent hole in each limiting component is communicated with all limiting grooves on the limiting component;

the convex parts on each limiting part are multiple, one convex part is arranged between every two adjacent vent holes, and the number of the flow guide surfaces on each convex part is two and corresponds to the two adjacent vent holes respectively.

Preferably, the air inlet device comprises an air inlet channel, the air inlet channel is arranged in a chamber wall of the cleaning chamber and penetrates through the thickness of the chamber wall, and an air outlet end of the air inlet channel faces the vent hole.

Preferably, the limiting structure further comprises an adjusting structure for adjusting the position of the limiting component in the cleaning device, and the adjusting structure comprises:

the first adjusting assembly is used for adjusting the position of the limiting component in the vertical direction;

the second adjusting assembly is used for adjusting the position of the limiting component in the first horizontal direction;

the third adjusting assembly is used for adjusting the position of the limiting component in the second horizontal direction; the second horizontal direction is perpendicular to the first horizontal direction.

Preferably, the first adjustment assembly comprises a first adjustment body and a first screw, wherein,

the first adjusting body is fixedly connected with the cleaning chamber, a first long hole is formed in the first adjusting body, and a long axis of the first long hole is arranged along the vertical direction;

the first screw penetrates through the first long hole to be in threaded connection with the limiting component.

Preferably, the second adjustment structure includes a second adjustment body and a second screw, wherein,

the second adjusting body is fixedly connected with the cleaning chamber, a second long hole is formed in the second adjusting body, and a long axis of the second long hole is arranged along the first horizontal direction;

the second screw penetrates through the second long hole to be in threaded connection with the limiting component.

Preferably, the third adjustment structure includes a third adjustment body and a third screw, wherein,

the third adjusting body is fixedly connected with the cleaning chamber, a third long hole is formed in the third adjusting body, and a long axis of the third long hole is arranged along the second horizontal direction;

and the third screw penetrates through the third long hole to be in threaded connection with the limiting component.

Preferably, the cleaning apparatus further comprises a lifting table for carrying the wafer, a groove for accommodating a bottom edge portion of the wafer is provided on the lifting table, and a cross-sectional shape of the groove in a vertical direction is a triangle or an isosceles trapezoid so that a side surface of the groove is in point contact with the wafer.

Preferably, a flow guiding convex part is arranged in the groove, and the flow guiding convex part comprises a flow guiding groove which is inclined upwards relative to the bottom of the groove.

Preferably, the cleaning device further comprises a chamber cover, wherein the inner wall of the chamber cover comprises a dome structure, and the orthographic projection profile of the dome structure on the horizontal plane surrounds the limiting component.

Preferably, the cleaning apparatus further includes an exhaust passage for exhausting the gas in the cleaning chamber, and a regulating valve provided in the exhaust passage for regulating a flow rate of the gas in the exhaust passage.

Preferably, the drying gas comprises isopropyl alcohol vapor and hot nitrogen gas.

Preferably, the temperature of the hot nitrogen gas comprises 30 ℃ to 75 ℃.

The invention has the following beneficial effects:

the cleaning equipment provided by the invention comprises a cleaning chamber, an air inlet device, a limiting structure and a ventilation structure, wherein the air inlet device is used for conveying dry gas into the cleaning chamber; the ventilation structure is arranged on the limiting structure and used for enabling the drying gas to flow to the wafer through the limiting structure. By means of the ventilation structure arranged on the limiting structure, when the wafer is fixed by the limiting structure, the drying gas flows to the wafer through the limiting structure to dry the wafer in the limiting structure, so that the cleaning equipment provided by the invention can improve the drying effect of the wafer, reduce the defects of the wafer, shorten the drying time, improve the drying efficiency, and has the advantages of simple structure, low manufacturing cost and high reliability.

Drawings

FIG. 1 is a schematic structural diagram of a cleaning apparatus provided in the present invention;

FIG. 2 is a schematic structural view of a limiting structure and a ventilating structure in the cleaning apparatus provided by the present invention;

FIG. 3 is a schematic structural view of a limiting structure in the cleaning apparatus according to the present invention;

FIG. 4 is a schematic structural view of a limiting structure and a ventilating structure in the cleaning apparatus provided by the present invention;

FIG. 5 is a schematic structural diagram of a lifting platform in the cleaning apparatus provided by the present invention;

FIG. 6 is a schematic structural view of a limiting structure and a ventilating structure in the cleaning apparatus according to the present invention;

FIG. 7 is a schematic structural view of a limiting structure and a ventilating structure in the cleaning apparatus according to the present invention;

FIG. 8 is a schematic structural view of a limiting structure and a ventilating structure in the cleaning apparatus according to the present invention;

FIG. 9 is a schematic structural view of a limiting structure in the cleaning apparatus according to the present invention;

FIG. 10 is a schematic structural view of a limiting structure in the cleaning apparatus according to the present invention;

fig. 11 is a schematic structural view of a limiting structure and a ventilating structure in the cleaning apparatus provided by the present invention;

FIG. 12 is a schematic structural view of a lifting platform in the cleaning apparatus provided by the present invention;

FIG. 13 is a schematic structural view of a lifting platform in the cleaning apparatus provided by the present invention;

description of reference numerals:

1-a carrier device; 2-a container; 21-a wafer; 31-a limiting plate; 32-a limiting groove; 33-a vent; 34-a flow guide surface; 35-a first regulating body; 351-a first slot; 36-a second adjustment body; 361-second slot; 37-a third regulating body; 371-third slot; 4-a lifting device; 41-a lifting platform; 42-a groove; 43-diversion trench; 51-an intake passage; 6-chamber lid; 7-exhaust channel.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the following detailed description of the cleaning apparatus provided by the present invention is provided with reference to the accompanying drawings.

As shown in fig. 1 to 13, the present embodiment provides a cleaning apparatus, which includes a cleaning chamber, an air inlet device for delivering a dry gas into the cleaning chamber, a position limiting structure disposed in the cleaning chamber for fixing a wafer 21 when the wafer 21 is located at a dry position, and a ventilation structure; a vent structure is provided on the retaining structure for allowing the drying gas to flow through the retaining structure to the wafer 21.

The cleaning equipment provided by the embodiment of the invention has the advantages that by means of the ventilation structure arranged on the limit structure, when the wafer 21 is fixed by the limit structure, the drying gas flows to the wafer 21 through the limit structure, and the wafer 21 in the limit structure is dried, so that the cleaning equipment provided by the invention can improve the drying effect of the wafer 21, reduce the defects of the wafer 21, shorten the drying time, improve the drying efficiency, and has the advantages of simple structure, low manufacturing cost and high reliability.

Specifically, as shown in fig. 1, when the wafer 21 needs to be cleaned and dried, the wafer 21 is placed in the container 2 placed on the carrier 1, the wafer 21 in the container 2 is cleaned by the cleaning device, after the wafer 21 is cleaned, the wafer 21 in the container 2 is lifted to the drying position by driving the lifting device 4, the wafer 21 is fixed by the limiting structure, and the drying gas is supplied into the cleaning chamber by the gas supply device to dry the wafer 21, and the drying gas flows to the wafer 21 by the limiting structure through the ventilation structure provided on the limiting structure, after the wafer 21 is dried, the wafer 21 is lowered into the container 2 by driving the lifting device 4, and finally the container 2 containing the wafer 21 is taken out of the cleaning chamber to complete the cleaning of the wafer 21, and during the cleaning and drying of the wafer 21, the drying effect of the wafer 21 can be improved, the defects of the wafer 21 are reduced, the drying time is shortened, the drying efficiency is improved, and the ventilation structure is directly arranged on the limiting structure, so that the cleaning cavity is simple in structure, low in manufacturing cost and high in reliability.

In this embodiment, the limiting structure includes two limiting parts, the two limiting parts are oppositely arranged in the horizontal direction, and two first surfaces of the two limiting parts, which are opposite to each other, are respectively provided with a limiting groove 32 corresponding to each other; the ventilation structure includes a ventilation hole 33, and the ventilation hole 33 is provided in the stopper member and communicates with the stopper groove 32 so that the dry gas is delivered toward the wafer 21 through the ventilation hole 33.

Specifically, two limiting grooves 32 are oppositely arranged in the horizontal direction, and the lower end of each limiting groove 32 vertically penetrates through the limiting part downwards, so that the two side edges of the wafer 21 can respectively enter the two limiting grooves 32 from the lower ends of the two limiting grooves 32 in the rising process, the wafer 21 is driven by the lifting device 4 to rise, the two side edges of the wafer 21 enter the two limiting grooves 32 from the lower ends of the two limiting grooves 32 in the rising process of the wafer 21, when the wafer 21 rises to the drying position, the two side edges of the wafer 21 are limited in the limiting grooves 32 by the limiting grooves 32, so that the wafer 21 is clamped between the two limiting grooves 32 which are horizontally opposite, the wafer 21 is fixed in the limiting part, the drying gas flows to the surface of the wafer 21 from the edges on the two sides of the wafer 21 through the communication part of the vent holes 33 and the limiting grooves 32, and can dry the surface of the wafer 21 and the edges of the wafer 21, and the dry gas can also flow to the surface of the wafer 21 from two sides of the opposite limiting parts in the vertical direction, and through the ventilation structure provided by the embodiment, the dry gas can flow to the surface of the wafer 21 from the vertical direction and the horizontal direction, and can flow to the edge of the wafer 21 from the horizontal direction, so as to dry the edge and the surface of the wafer 21 at the same time, thereby improving the drying effect of the wafer 21, reducing the defects of the wafer 21 and shortening the drying time.

In the present embodiment, there are a plurality of stopper grooves 32 on each stopper member; the vent holes 33 in each stop member communicate with all of the stop grooves 32 on that stop member. In practical application, a plurality of wafers 21 are usually placed in the container 2 for containing the wafers 21, and the cleaning equipment can dry the wafers 21 at the same time by arranging a plurality of limiting grooves 32 on each limiting part, so that the cleaning efficiency of the cleaning equipment is improved, and the drying gas can dry the wafers 21 in all the limiting grooves 32 at the same time by communicating all the limiting grooves 32 on the limiting parts of the ventilation holes 33 in the limiting parts, so that the cleaning efficiency of the cleaning equipment is improved.

In the present embodiment, the cross-sectional shape of the limiting groove 32 in the horizontal direction is a triangle or an isosceles trapezoid, so that the side surface of the limiting groove 32 is in point contact with the wafer 21, the contact area between the wafer 21 and the limiting groove 32 is reduced, and the contact area between the dry gas and the wafer 21 is increased, thereby reducing the possibility of the cleaning agent remaining on the wafer 21, improving the drying effect of the dry gas on the wafer 21, and reducing the defects of the wafer 21 after drying.

In the present embodiment, the ventilation holes 33 in each of the position restricting members are plural and arranged at intervals in the vertical direction; and, every ventilation hole 33 communicates with all spacing grooves 32 on this spacing part, and dry gas flows to wafer 21 through a plurality of ventilation holes 33 that set up at interval in the vertical direction, can dry everywhere of wafer 21 in the vertical direction simultaneously to shorten drying time, improve drying efficiency.

In the present embodiment, each of the limiting members includes a limiting plate 31, the limiting plate 31 is vertically disposed, and the vent hole 33 is a through hole penetrating through the limiting plate 31 in a direction perpendicular to the first surface; the ventilation structure further comprises a flow guiding structure disposed on a second surface of the limiting plate 31 facing away from the first surface for introducing the drying gas into the ventilation holes 33.

Specifically, two limiting plates 31 set up relatively, and set up spacing groove 32 on two limiting plates 31 relative first surfaces, the one end of ventilation hole 33 is located the second that deviates from the first surface on, the other end and the spacing groove 32 intercommunication on the first surface, and the both ends of ventilation hole 33 communicate along the direction of perpendicular to first surface, dry gas gets into the through-hole through the one end that ventilation hole 33 is located the second surface, through being located the other end outflow through-hole on the first surface, wafer 21 between even limiting plate 31 is dried, the water conservancy diversion structure sets up on the same side with the one end that dry gas got into ventilation hole 33, introduce dry gas in ventilation hole 33, improve the dry gas's that gets into ventilation hole 33 flow, in order to shorten drying time, drying efficiency is improved.

In this embodiment, the flow guiding structure includes a convex portion disposed on the second surface, the convex portion includes a flow guiding surface 34, the flow guiding surface 34 is located on one side of the air inlet end of the ventilation hole 33, and the flow guiding surface 34 is inclined relative to the second surface and intersects therewith, the flow guiding surface 34 is inclined relative to the second surface, which is equivalent to increasing the outer diameter of the air inlet end of the ventilation hole 33, as if a funnel is disposed on the outer side of the ventilation hole 33, so that the dry gas is gathered more easily, and thus more dry gas is gathered in the ventilation hole 33.

In the present embodiment, the ventilation holes 33 in each of the position restricting members are plural and arranged at intervals in the vertical direction; and, each ventilation hole 33 communicates with all the stopper grooves 32 on the stopper member; a plurality of limiting grooves 32 are formed on each limiting part; the vent hole 33 in each stopper part communicates with all the stopper grooves 32 on the stopper part; the number of the convex parts on each limiting component is multiple, one convex part is arranged between every two adjacent vent holes 33, and the number of the flow guide surfaces 34 on each convex part is two and corresponds to the two adjacent vent holes 33 respectively.

Specifically, when there are a plurality of vent holes 33 in the limiting component, a convex portion is disposed between each two adjacent vent holes 33, and two flow guide surfaces 34 are disposed on each convex portion, and the two flow guide surfaces 34 respectively guide the dry gas into the two adjacent vent holes 33, that is, one of the two flow guide surfaces 34 guides the dry gas into one vent hole 33 of the two vent holes 33, and the other flow guide surface 34 guides the dry gas into the other vent hole 33. Optionally, the convex portion forms the pointed end in the middle of two adjacent ventilation holes 33, and water conservancy diversion face 34 extends to crossing with the border of ventilation hole 33 along the pointed end slope, makes original plane become two inclined planes between two adjacent ventilation holes 33, avoids dry gas to flow to the plane and is rebounded, influences the dry gas flow direction ventilation hole 33 around the plane afterwards to the dry gas flow that gets into in ventilation hole 33 to improve the flow of the dry gas who gets into in ventilation hole 33.

In this embodiment, the air inlet device includes an air inlet channel 51, the air inlet channel 51 is disposed in the chamber wall of the cleaning chamber and penetrates through the thickness of the chamber wall, the air outlet end of the air inlet channel 51 faces the vent hole 33, and the drying gas passes through the air inlet channel 51, enters the cleaning chamber from the air outlet end of the air inlet channel 51 and flows towards the vent hole 33, so as to dry the wafer 21 in the position limiting component.

In this embodiment, the limit structure further includes an adjusting structure for adjusting the position of the limit component in the cleaning device, and the adjusting structure includes: the device comprises a first adjusting assembly, a second adjusting assembly and a third adjusting assembly, wherein the first adjusting assembly is used for adjusting the position of a limiting component in the vertical direction; the second adjusting assembly is used for adjusting the position of the limiting component in the first horizontal direction; the third adjusting component is used for adjusting the position of the limiting component in the second horizontal direction; the second horizontal direction is perpendicular to the first horizontal direction.

In practical applications, the wafers 21 and the containers 2 for holding the wafers 21 are various, and the positions of the limiting members in the cleaning device are adjusted by the adjusting structure, so that the limiting members can be applied to different kinds of wafers 21 and containers 2 for holding the wafers 21.

Specifically, two limiting plates 31 of the vertical setting of limit structure, and when two limiting plates 31 set up relatively, first adjusting part is used for adjusting the distance between stop part and the load-bearing device 1, the second adjusting part is used for adjusting the distance between two limiting plates 31, the third adjusting part is perpendicular to the direction of regulation of stop part and the second adjusting part is perpendicular to the direction of regulation of stop part level, or first adjusting part is used for adjusting the distance between stop part and the load-bearing device 1, the third adjusting part is used for adjusting the distance between two limiting plates 31, the second adjusting part is perpendicular to the direction of regulation of stop part and the direction of regulation of third adjusting part is perpendicular to stop part level.

In practical application, the adjusting structure can respectively adjust the limiting component in the first horizontal direction, the second horizontal direction and the vertical direction, and can simultaneously adjust the limiting component in the first horizontal direction, the second horizontal direction and the vertical direction, so that the limiting component can change positions in all directions.

Optionally, the first adjusting assembly includes a first adjusting body 35 and a first screw, wherein the first adjusting body 35 is connected to the limiting member, a first long hole 351 is provided in the first adjusting body 35, and a long axis of the first long hole 351 is provided along a vertical direction; the first screw passes through the first long hole 351 and is in threaded connection with the limiting component. Specifically, the first adjustment body 35 is connected to the limiting member through the first adjustment screw, and the limiting member can move in the direction of the first long hole 351, so that the position of the limiting member in the vertical direction is changed.

Optionally, the second adjusting structure includes a second adjusting body 36 and a second screw, wherein the second adjusting body 36 is connected to the first adjusting body 35, a second long hole 361 is provided in the second adjusting body 36, and a long axis of the second long hole 361 is arranged along the first horizontal direction; the second screw passes through the second long hole 361 and is screwed with the first adjusting body 35. Specifically, the second adjustment body 36 is connected to the first adjustment body 35 by a second adjustment screw, and the first adjustment body 35 can move in the direction of the second long hole 361, so that the position of the position restricting member in the first horizontal direction is changed.

Optionally, the third adjusting structure includes a third adjusting body 37 and a third screw, wherein the third adjusting body 37 is connected to the cleaning chamber, a third long hole 371 is provided in the third adjusting body 37, and a long axis of the third long hole 371 is arranged along the second horizontal direction; the third screw passes through the third long hole 371 to be in threaded connection with the cleaning chamber. Specifically, the third adjustment body 37 is connected to the cleaning chamber by a third adjustment screw, and the third adjustment body 37 can move in the direction of the third long hole 371, thereby changing the position of the position restricting member in the second horizontal direction.

In this embodiment, the first adjusting body 35 is connected to the position limiting component by a first adjusting screw, the second adjusting body 36 is connected to the first adjusting body 35 by a second adjusting screw, and the third adjusting body 37 is fixedly disposed on the second adjusting body 36 and is connected to the cleaning chamber by a third adjusting screw, so that the position limiting component is connected to the cleaning chamber by the first adjusting body 35, the second adjusting body 36, and the third adjusting body 37, of course, the connection manner of the first adjusting body 35, the second adjusting body 36, and the third adjusting body 37 is not limited thereto, and here, only the first adjusting body 35, the second adjusting body 36, and the third adjusting body 37 may be connected to each other, and in practical applications, as long as the position limiting component can be changed in all directions.

In the present embodiment, the cleaning apparatus includes a lifting table 41 for carrying the wafer 21, a groove 42 for accommodating a bottom edge portion of the wafer 21 is provided on the lifting table 41, and a cross-sectional shape of the groove 42 in the vertical direction is a triangle or an isosceles trapezoid, so that a side surface of the groove 42 is in point contact with the wafer 21, a contact area between the wafer 21 and the limiting groove 32 is reduced, and a contact area between the drying gas and the wafer 21 is increased, thereby reducing a possibility that the cleaning agent remains on the wafer 21, improving a drying effect of the drying gas on the wafer 21, and reducing defects of the wafer 21 after drying.

In this embodiment, the lifting platform 41 is connected to the lifting device 4 to be driven by the lifting device 4 to ascend or descend, a guiding protrusion is disposed in the groove 42, the guiding protrusion includes a guiding groove 43 inclined upward relative to the bottom of the groove 42, when the wafer 21 is dried, the cleaning agent on the wafer 21 flows from the wafer 21 to the bottom of the groove 42, but the bottom of the groove 42 is parallel to the horizontal plane, the cleaning agent is collected at the bottom of the groove 42, and the guiding groove 43 inclined upward relative to the bottom of the groove 42 enables the cleaning agent to flow out of the bottom of the groove 42 along the slope of the guiding groove 43, so as to facilitate discharging the cleaning agent out of the groove 42, thereby improving the drying effect of the wafer 21, reducing the defects of the wafer 21, shortening the drying time, and improving the drying efficiency.

In this embodiment, the cleaning device comprises a chamber cover 6, the inner wall of the chamber cover 6 comprises a dome structure, and the orthographic profile of the dome structure in a horizontal plane surrounds the stop member. In practical application, in the process of drying wafer 21, the cleaning agent on wafer 21 can condense to the inner wall of chamber cover 6, and the condensed cleaning agent flows to the edge of dome structure along the dome structure through the dome structure, thereby dropping on the outside of the limiting part, avoiding the condensed cleaning agent to drop to wafer 21, improving the drying effect of wafer 21, and reducing the defects of wafer 21. The two limiting plates 31 may be installed at the inner wall of the chamber lid 6 by the first, second and third adjusting assemblies.

In the present embodiment, the cleaning apparatus further includes an exhaust passage 7 for discharging the gas in the cleaning chamber, and a regulating valve provided in the exhaust passage 7 for regulating the flow rate of the gas in the exhaust passage 7. In practical application, when the wafer 21 is dried, the opening degree of the exhaust channel 7 is reduced through the regulating valve, the gas flow in the exhaust channel 7 is reduced, the retention time of the dry gas in the cleaning chamber can be increased, and the content of the dry gas in the cleaning chamber is increased, so that the drying effect of the wafer 21 is improved, the defects of the wafer 21 are reduced, the drying time is shortened, and the drying efficiency is improved.

In this example, the drying gas includes isopropyl alcohol vapor and hot nitrogen gas. Wherein, isopropyl alcohol (IPA) steam utilizes Marangoni effect (Marangoni effect), with the help of the different surface tension of isopropyl alcohol steam and cleaner, suck the remaining cleaner of wafer 21 surface downwards to reach preliminary dry's purpose, pass through hot nitrogen again to remaining cleaner and the isopropyl alcohol steam drying on wafer 21, thereby reach the drying effect to wafer 21, through the cooperation of isopropyl alcohol steam and hot nitrogen, can rapid draing wafer 21, thereby shorten drying time, improve drying efficiency.

In this embodiment, the temperature of the hot nitrogen gas is 30 ℃ to 75 ℃ to achieve a better drying effect.

In summary, the cleaning apparatus provided in this embodiment can improve the drying effect of the wafer 21, reduce the defects of the wafer 21, shorten the drying time, improve the drying efficiency, and has a simple structure, a low manufacturing cost, and a high reliability.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims

1. A cleaning device comprises a cleaning chamber and an air inlet device, wherein the air inlet device is used for conveying dry gas into the cleaning chamber, and is characterized by further comprising a bearing device, a lifting platform, a limiting structure and a ventilation structure, wherein the bearing device, the lifting platform and the limiting structure are arranged in the cleaning chamber; the carrying device is used for carrying a container for placing the wafer; the limiting structure is used for fixing the wafer when the wafer is located at the drying position; the ventilation structure is arranged on the limiting structure and used for enabling the drying gas to flow to the wafer through the limiting structure; wherein the content of the first and second substances,

the limiting structure comprises two limiting parts, the two limiting parts are oppositely arranged in the horizontal direction, and two first surfaces, opposite to each other, of the two limiting parts are respectively provided with a limiting groove corresponding to each other;

the lifting platform is connected with the lifting device; the lifting device is used for driving the wafers in the container to rise and enter the two limiting grooves; the lifting platform is used for bearing the wafer when the wafer rises and is dried, and the limiting grooves are used for limiting the edges of the two sides of the wafer in the limiting grooves.

2. The cleaning apparatus defined in claim 1, wherein the vent structure comprises a vent; the ventilation hole is formed in the limiting component and communicated with the limiting groove, so that the drying gas is conveyed towards the wafer through the ventilation hole.

3. The cleaning apparatus defined in claim 2, wherein the retaining groove on each of the retaining members is plural;

the vent hole in each limiting component is communicated with all the limiting grooves in the limiting component.

4. The cleaning apparatus according to claim 2, wherein the cross-sectional shape of the stopper groove in the horizontal direction is a triangle or an isosceles trapezoid so that the side surface of the stopper groove is in point contact with the wafer.

5. The cleaning apparatus defined in claim 4, wherein the vent holes in each of the retaining members are plural and are spaced apart in a vertical direction; and each of the ventilation holes is communicated with all the limiting grooves on the limiting component.

6. The cleaning equipment according to any one of claims 2 to 5, wherein each limiting component comprises a limiting plate which is vertically arranged, and the vent hole is a through hole which penetrates through the limiting plate in a direction perpendicular to the first surface;

7. The cleaning apparatus defined in claim 6, wherein the flow directing structure comprises a protrusion disposed on the second surface, the protrusion comprising a flow directing surface that is located to one side of the air intake end of the vent, the flow directing surface being inclined relative to and intersecting the second surface.

8. The cleaning apparatus defined in claim 7, wherein the vent holes in each of the restricting members are plural and are arranged at intervals in a vertical direction; each ventilation hole is communicated with all the limiting grooves on the limiting component; a plurality of limiting grooves are formed in each limiting part; the vent hole in each limiting component is communicated with all limiting grooves on the limiting component;

9. The cleaning apparatus defined in any one of claims 2-5, wherein the gas inlet device comprises a gas inlet channel disposed in a chamber wall of the cleaning chamber and extending through a thickness of the chamber wall, and a gas outlet end of the gas inlet channel faces the vent.

10. The cleaning apparatus defined in claim 2, wherein the spacing structure further comprises an adjustment structure for adjusting the position of the spacing component in the cleaning apparatus, the adjustment structure comprising:

11. The cleaning apparatus defined in claim 10, wherein the third adjustment assembly is connected to the second adjustment assembly, which is connected to the first adjustment assembly; the first adjusting assembly is connected with the limiting component;

the third adjustment assembly includes a third adjustment body and a third screw, wherein,

the third adjusting body is connected with the cleaning chamber, a third long hole is formed in the third adjusting body, and a long axis of the third long hole is arranged along the second horizontal direction;

the third screw penetrates through the third long hole to be in threaded connection with the cleaning chamber.

12. The cleaning apparatus defined in claim 11, wherein the second adjustment assembly comprises a second adjustment body and a second screw, wherein,

the second adjusting body is connected with the first adjusting assembly, a second long hole is formed in the second adjusting body, and a long axis of the second long hole is arranged along the first horizontal direction;

the second screw penetrates through the second long hole to be in threaded connection with the first adjusting component.

13. The cleaning apparatus defined in claim 12, wherein the first adjustment assembly comprises a first adjustment body and a first screw, wherein,

the first adjusting body is connected with the limiting component, a first long hole is formed in the first adjusting body, and the long axis of the first long hole is arranged in the vertical direction;

14. The cleaning apparatus according to claim 1, wherein a groove for receiving a bottom edge portion of the wafer is provided on the lift table, and a cross-sectional shape of the groove in a vertical direction is triangular or isosceles trapezoidal such that there is point contact between a side surface of the groove and the wafer.

15. The cleaning apparatus defined in claim 14, wherein a flow guide projection is disposed in the recess, the flow guide projection comprising a flow guide groove that is inclined upwardly relative to a bottom of the recess.

16. The cleaning apparatus defined in claim 1, further comprising a chamber lid, an inner wall of which comprises a dome structure, and an orthographic profile of the dome structure in a horizontal plane surrounds the stop member.

17. The cleaning apparatus according to claim 1, further comprising an exhaust passage for exhausting the gas in the cleaning chamber and a regulating valve provided in the exhaust passage for regulating a flow rate of the gas in the exhaust passage.

18. The cleaning apparatus of claim 1, wherein the drying gas comprises isopropyl alcohol vapor and hot nitrogen gas.

19. The cleaning apparatus defined in claim 18, wherein the temperature of the hot nitrogen gas comprises 30 ℃ to 75 ℃.