KR101909471B1 - Liquid mixing unit and Apparatus for treating a substrate with the unit - Google Patents

Liquid mixing unit and Apparatus for treating a substrate with the unit Download PDF

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Publication number
KR101909471B1
KR101909471B1 KR1020150093155A KR20150093155A KR101909471B1 KR 101909471 B1 KR101909471 B1 KR 101909471B1 KR 1020150093155 A KR1020150093155 A KR 1020150093155A KR 20150093155 A KR20150093155 A KR 20150093155A KR 101909471 B1 KR101909471 B1 KR 101909471B1
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KR
South Korea
Prior art keywords
mixer
space
mixing
liquid
substrate
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KR1020150093155A
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Korean (ko)
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KR20170003037A (en
Inventor
김재열
유재혁
Original Assignee
세메스 주식회사
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Priority to KR1020150093155A priority Critical patent/KR101909471B1/en
Publication of KR20170003037A publication Critical patent/KR20170003037A/en
Application granted granted Critical
Publication of KR101909471B1 publication Critical patent/KR101909471B1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Abstract

The present invention relates to a liquid mixing unit and a substrate processing apparatus. A liquid mixing unit according to an embodiment of the present invention includes a mixing member including a housing having a space therein and a mixer disposed in the inner space and having a mixing space therein; And a liquid supply pipe for supplying a liquid mixed in the inner space to the outside, wherein the mixer includes a liquid mixing unit in which holes for connecting the mixing cavity and the inner space are formed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a liquid mixing unit,

The present invention relates to a liquid mixing unit for mixing a liquid supplied onto a substrate and a substrate processing apparatus including the same.

In general, processes for processing glass substrates and wafers in the manufacture of flat panel display devices or semiconductor manufacturing processes include a photoresist coating process, a developing process, an etching process, an ashing process, and the like Various processes are performed.

Particularly, as the semiconductor device has a high density, high integration and high performance, the miniaturization of the circuit pattern progresses rapidly, so that contaminants such as particles, organic contaminants and metal contaminants remaining on the surface of the substrate have a great effect on the characteristics of the device and the yield of production . Therefore, a cleaning process for removing various contaminants adhering to the surface of the substrate is very important in the semiconductor manufacturing process, and a process of cleaning the substrate at the front and rear stages of each unit process for manufacturing a semiconductor is being carried out.

On the other hand, in the step of manufacturing the substrate, a liquid treatment process is performed by supplying various chemical solutions onto the substrate. The chemical liquid supplied onto the substrate can be prepared by mixing a plurality of liquids. Mixing of the chemical solution is carried out in a separate container.

However, when the chemical solution is mixed, it should be mixed at a uniform concentration. There is a problem that the efficiency of the substrate processing process is lowered when the substrate is processed by supplying the chemical liquid having a uniform concentration to the substrate.

The present invention provides a liquid mixing unit capable of uniformly mixing a chemical liquid supplied to a substrate and a substrate processing apparatus including the same.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and the problems not mentioned can be clearly understood by those skilled in the art from the description and the accompanying drawings will be.

The present invention provides a unit for mixing liquids.

According to an embodiment of the present invention, the liquid mixing unit includes a mixing member having a housing having a space therein and a mixer having a mixing space therein, the mixing member being located in the inner space, A plurality of liquid inlet pipes for supplying the liquid and a liquid supply pipe for supplying the liquid mixed in the inner space to the outside, and holes for connecting the mixing space and the inner space may be formed in the mixer.

According to one embodiment, the mixer may be provided in a shape in which the longitudinal direction thereof is provided in a vertical direction, and the mixer is formed in a shape in which the cross section decreases as it goes downward.

According to one embodiment, the mixer may be provided in a truncated cone shape whose lower surface is smaller in area than the upper surface.

According to one embodiment, the holes may be spaced apart from the outer circumferential surface of the mixer at regular intervals.

According to an embodiment, the mixing member may further include a first baffle which is located in the mixing space and divides the mixing space into an upper space and a lower space, and a through hole penetrating in the up and down direction is formed.

According to one embodiment, the mixing member may further include a support for supporting the mixer, wherein the support includes a pedestal placed on the bottom surface of the housing, and a protective portion positioned between the mixer and the pedestal.

According to one embodiment, the protector may be provided in a shape in which the cross section is widened downward.

According to one embodiment, the protector may be provided in a truncated cone shape whose upper surface is smaller in area than the lower surface.

According to one embodiment, the pedestal may be provided in a rectangular parallelepiped shape with its bottom surface opened, and a connection hole may be formed on an outer side surface of the pedestal to be connected to the internal space.

According to one embodiment, the connection hole may be provided in an arch shape.

According to an embodiment of the present invention, the mixing member may further include a second baffle disposed between the protector and the lower surface of the mixer, the through bore penetrating in a vertical direction.

According to one embodiment, the second baffle may be provided in a smaller area than the first baffle.

According to one embodiment, the plurality of liquids supplied from the liquid supply pipe may include pure water, ammonia, and hydrogen peroxide.

According to one embodiment, the mixer may be attached to the inner wall of the housing.

According to one embodiment, the mixer may be spaced a distance from the inner wall of the housing.

The present invention provides an apparatus for processing a substrate.

According to one embodiment of the present invention, the substrate processing apparatus includes a container having a processing space therein, a support unit which is located in the processing space and on which the substrate is placed, and a liquid supply unit And a liquid mixing unit which is connected to the liquid supply unit and mixes the plurality of liquids to supply the mixed liquid to the liquid supply unit, the liquid mixing unit comprising: a housing having a space therein; A mixing member having a mixing space therein, a plurality of liquid inlet pipes for supplying a plurality of liquids to the mixing space, and a liquid supply pipe for supplying a liquid mixed in the inner space to the outside, The mixing chamber may have holes for connecting the mixing space and the inner space.

According to one embodiment, the mixer may be provided in a shape in which the longitudinal direction thereof is provided in a vertical direction, and the mixer is formed in a shape in which the cross section decreases as it goes downward.

According to one embodiment, the mixer may be provided in a truncated cone shape whose lower surface is smaller in area than the upper surface.

According to one embodiment, the holes may be spaced apart from the outer circumferential surface of the mixer at regular intervals.

According to an embodiment, the mixing member may further include a first baffle which is located in the mixing space and divides the mixing space into an upper space and a lower space, and a through hole penetrating in the up and down direction is formed.

According to one embodiment, the mixing member may further include a support for supporting the mixer, wherein the support includes a pedestal placed on the bottom surface of the housing, and a protective portion positioned between the mixer and the pedestal.

According to one embodiment, the protector may be provided in a shape in which the cross section is widened downward.

According to one embodiment, the protector may be provided in a truncated cone shape whose upper surface is smaller in area than the lower surface.

According to one embodiment, the pedestal may be provided in a rectangular parallelepiped shape with its bottom surface opened, and a connection hole may be formed on an outer side surface of the pedestal to be connected to the internal space.

According to one embodiment, the connection hole may be provided in an arch shape.

According to an embodiment of the present invention, the mixing member may further include a second baffle disposed between the protector and the lower surface of the mixer, the through bore penetrating in a vertical direction.

According to one embodiment, the plurality of liquids supplied from the liquid supply pipe may include pure water, ammonia, and hydrogen peroxide.

According to one embodiment, the mixer may be attached to the inner wall of the housing.

According to one embodiment, the mixer may be spaced a distance from the inner wall of the housing.

According to an embodiment of the present invention, it is possible to improve the efficiency of the substrate processing process by providing a liquid mixing unit capable of uniformly mixing the liquid supplied to the substrate.

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and attached drawings.

1 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
2 is a view schematically showing a configuration of a substrate processing apparatus provided in the process chamber of FIG.
3 is a cross-sectional view showing a substrate processing apparatus provided in the process chamber of FIG.
Fig. 4 is a perspective view showing the liquid mixing unit of Fig. 2; Fig.
5 is a cross-sectional view showing the liquid mixing unit of Fig.
Figure 6 is a perspective view showing the mixing member of Figure 4;
7 is a cross-sectional view showing the mixing member of Fig.
Figure 8 is a perspective view showing the first baffle and the second baffle of Figure 6;
Fig. 9 is a perspective view showing another embodiment of the liquid mixing unit of Fig. 4; Fig.
10 is a sectional view of the liquid mixing unit of Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Accordingly, the shapes of the components and the like in the drawings are exaggerated in order to emphasize a clearer description.

1 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 1, the substrate processing apparatus 1 includes an index module 10 and a processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the process module 20 are arranged is referred to as a first direction 12. A direction perpendicular to the first direction 12 is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction (16).

The carrier 130 in which the substrate W is accommodated is mounted on the load port 120. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. In FIG. 1, four load ports 120 are shown. However, the number of load ports 120 may increase or decrease depending on conditions such as process efficiency and footprint of the process module 20. A carrier (130) is provided with a slot (not shown) provided to support the edge of the substrate (W). The slots are provided in a plurality of third directions 16 and the substrates W are positioned in the carrier so as to be stacked on each other along the third direction 16. As the carrier 130, a front opening unified pod (FOUP) may be used.

The process module 20 has a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed on one side and the other side of the transfer chamber 240 along the second direction 14, respectively. The process chambers 260 located at one side of the transfer chamber 240 and the process chambers 260 located at the other side of the transfer chamber 240 are provided to be symmetrical with respect to the transfer chamber 240. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, at one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B (where A and B are each at least one natural number). Where A is the number of process chambers 260 provided in a row along the first direction 12 and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. Also, unlike the above, the process chamber 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed, and a plurality of slots (not shown) are provided to be spaced apart from each other in the third direction 16. The surface of the buffer unit 220 opposed to the transfer frame 140 and the surface of the transfer chamber 240 facing each other are opened.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 130 while the other part is used to transfer the substrate W from the carrier 130 to the processing module 20. [ As shown in Fig. This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided for forward and backward movement relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16. A main arm 244c used when the substrate W is transferred from the buffer unit 220 to the process chamber 260 and a main arm 244b used when the substrate W is transferred from the process chamber 260 to the buffer unit 220 The main arms 244c may be different from each other.

In the process chamber 260, a substrate processing apparatus 300 for performing a cleaning process on the substrate W is provided. The substrate processing apparatus 300 provided in each process chamber 260 may have a different structure depending on the type of the cleaning process to be performed. Alternatively, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, and the substrate processing apparatuses 300 provided in the process chambers 260 belonging to the same group have the same structure and are provided in the process chambers 260 belonging to different groups The substrate processing apparatuses 300 may have different structures from each other. For example, if the process chambers 260 are divided into two groups, a first group of process chambers 260 is provided on one side of the transfer chamber 240 and a second group of process chambers 260 are provided on the other side of the transfer chamber 240 Process chambers 260 may be provided. Optionally, a first group of process chambers 260 may be provided on the lower layer and a second group of process chambers 260 may be provided on the upper and lower sides of the transfer chamber 240, respectively. The first group of process chambers 260 and the second group of process chambers 260 may be classified according to the type of the chemical used and the type of the cleaning method.

An example of the substrate processing apparatus 300 for cleaning the substrate W by using the process liquid will be described below. FIG. 2 is a schematic view showing a configuration of a substrate processing apparatus provided in the process chamber of FIG. 1, and FIG. 3 is a sectional view showing a substrate processing apparatus provided in the process chamber of FIG. 2 and 3, the substrate processing apparatus 300 includes a container 320, a support unit 340, a lift unit 360, a liquid supply unit 380, and a liquid mixing unit 400.

The vessel 320 provides a processing space in which the substrate processing process is performed. The container 320 is provided in an open top shape. The container 320 includes an inner recovery cylinder 322, an intermediate recovery cylinder 324, and an outer recovery cylinder 326. Each of the recovery cylinders 322, 324 and 326 recovers the different treatment liquids among the treatment liquids used in the process. The inner recovery cylinder 322 is provided in an annular ring shape surrounding the support unit 340. The intermediate recovery bottle 324 is provided in an annular ring shape surrounding the inner recovery bottle 322. The outer recovery cylinder 326 is provided in the form of an annular ring surrounding the intermediate recovery cylinder 324. The inner space 322a of the inner recovery cylinder 322 and the space 324a between the inner recovery cylinder 322 and the intermediate recovery cylinder 324 and the space 324 between the intermediate recovery cylinder 324 and the outer recovery cylinder 326 326a function as an inlet through which the processing liquid flows into the inner recovery cylinder 322, the intermediate recovery cylinder 324, and the outer recovery cylinder 326, respectively. Recovery passages 322b, 324b, and 326b extending vertically downward from the bottom of the recovery passages 322, 324, and 326 are connected to the recovery passages 322, 324, and 326, respectively. Each of the recovery lines 322b, 324b, and 326b discharges the processing liquid that has flowed through the respective recovery cylinders 322, 324, and 326. [ The discharged treatment liquid can be reused through an external treatment liquid recovery system (not shown).

The support unit 340 is disposed within the container 320. The support unit 340 supports the substrate W and rotates the substrate W during the substrate processing process. The support unit 340 includes a body 342, a support pin 344, a chuck pin 346, and a support shaft 348. The body 342 has a top surface that is generally circular when viewed from the top. A support shaft 348 rotatable by a motor 349 is fixedly coupled to the bottom surface of the body 342. A plurality of support pins 344 are provided. The support pins 344 are spaced apart from the edge of the upper surface of the body 342 and protrude upward from the body 342. The support pins 344 are arranged so as to have a generally annular ring shape in combination with each other. The support pins 344 support the rear edge of the substrate W such that the substrate W is spaced from the upper surface of the body 342 by a predetermined distance.

A plurality of chuck pins 346 are provided. The chuck pin 346 is disposed farther away from the center of the body 342 than the support pin 344. The chuck pin 346 is provided to protrude upward from the body 342. The chuck pin 346 supports the side of the substrate W so that the substrate W is not laterally displaced in place when the support unit 340 is rotated. The chuck pin 346 is provided so as to be linearly movable between a standby position and a supporting position along the radial direction of the body 342. The standby position is a distance from the center of the body 342 relative to the support position. When the substrate W is loaded or unloaded to the support unit 340, the chuck pin 346 is positioned in the standby position and the chuck pin 346 is positioned in the support position when the substrate is being processed. At the support position, the chuck pin 346 contacts the side of the substrate.

The lifting unit 360 moves the container 320 in the vertical direction. As the container 320 is moved up and down, the relative height of the container 320 to the support unit 340 is changed. The lifting unit 360 includes a bracket 362, a moving shaft 364, and a driver 366.

 The bracket 362 is fixed to the outer wall of the container 320. A moving shaft 364, which is moved in the vertical direction by a driver 366, is fixedly coupled to the bracket 362. The container 320 is lowered so that the support unit 340 protrudes to the upper portion of the container 320 when the substrate W is placed on the support unit 340 or is lifted from the support unit 340. When the process is performed, the height of the container 320 is adjusted so that the process liquid may flow into the predetermined collection container 360 according to the type of the process liquid supplied to the substrate W.

For example, the substrate W is located at a height corresponding to the inner space 322a of the inner recovery cylinder 322 while processing the substrate W with the first processing liquid. During the processing of the substrate W with the second processing solution and the third processing solution, the substrate W is separated into the space 324a between the inner recovery tube 322 and the intermediate recovery tube 324, And may be located at a height corresponding to the space 326a between the cylinder 324 and the outer recovery cylinder 326. [ The elevation unit 360 may move the support unit 340 in the vertical direction instead of the container 320 as described above.

The liquid supply unit 380 supplies the process liquid to the substrate W during the process of the substrate W process. The liquid supply unit 380 includes a liquid supply line 381, a valve 385, a nozzle support 382, a nozzle 384, a support shaft 386, and a driver 388. The support shaft 386 is provided along its lengthwise direction along the third direction 16 and a driver 388 is coupled to the lower end of the support shaft 386. The driver 388 rotates and lifts the support shaft 386. The nozzle support 382 is coupled perpendicular to the opposite end of the support shaft 386 coupled to the driver 388. The nozzle 384 is installed at the bottom end of the nozzle support 382. The nozzle 384 is moved by a driver 388 to a process position and a standby position. The process position is that the nozzle 384 is located at the vertically upper portion of the container 320 and the standby position is the position at which the nozzle 384 is away from the vertical upper portion of the container 320. The nozzle 382 receives the liquid from the liquid reservoir 387 through the liquid supply line 381 and supplies the liquid onto the substrate W. [ A valve 385 is provided in the liquid supply line 381. The valve 385 regulates the amount of liquid supplied to the nozzle 382.

One or a plurality of liquid supply units 380 may be provided. When a plurality of liquid supply units 380 are provided, the chemical, the rinsing liquid, or the organic solvent may be provided through mutually different liquid supply units 380. The rinsing liquid may be pure, and the organic solvent may be a mixture of an isopropyl alcohol vapor and an inert gas or an isopropyl alcohol liquid.

Fig. 4 is a perspective view showing the liquid mixing unit of Fig. 2, and Fig. 5 is a sectional view showing the liquid mixing unit of Fig. 4 and 5, the liquid mixing unit 400 is a unit for mixing the liquid supplied onto the substrate W. The liquid mixing unit 400 receives a plurality of liquids and mixes the liquids at a uniform concentration. The liquid mixing unit 400 includes a housing 410, a mixing member 430, a liquid inflow pipe 450, and a liquid supply pipe 470.

The housing 410 has an internal space 401. The housing 410 is coupled to the liquid inflow pipe 450 at the upper portion and coupled to the liquid supply pipe 470 at the lower portion. The housing 410 may have a circular shape when viewed from above. The housing 410 may be provided in a cylindrical shape. The inner space 401 is connected to the mixing space 402 in which the liquid is mixed. The inner space 401 is provided so that the mixing space 402 and the liquid can move.

Fig. 6 is a perspective view showing the mixing member of Fig. 4, and Fig. 7 is a sectional view showing the mixing member of Fig. 4 to 7, the mixing member 430 may mix a plurality of liquids. The mixing member 430 is located inside the housing 410. The mixing member 430 is located in the inner space 401. The mixing member 430 is spaced a certain distance from the inner wall of the housing 410. The mixing member 430 includes a mixer 440, a first baffle 443, a second baffle 444, a support 445, and an exhaust pipe 480.

The mixer 440 has a mixing space 402 therein. The mixer 440 may mix a plurality of liquids. The mixer 440 is provided with its longitudinal direction in the up-and-down direction. The mixer 440 is provided in such a shape that its cross-sectional area decreases as it goes down. The mixer 440 is provided in a circular shape when viewed from above. The mixer 440 is spaced a certain distance from the inner wall of the housing 410. For example, the mixer 440 may be provided in a frusto-conical shape whose lower surface is smaller than the upper surface. The upper surface of the mixer 440 is located opposite to the liquid inflow pipe 450. The mixer 440 is spaced apart from the upper surface of the housing 410 by a certain distance. The upper surface of the mixer 440 is disposed in parallel with the upper surface of the housing 410.

A hole 441 is formed in the outer peripheral surface of the mixer 440. The holes 441 allow the liquid to move into the inner space 401 and the mixing space 402 when a plurality of liquids are mixed. A plurality of holes 441 are provided. The holes 441 connect the mixing space 402 with the inner space 401 of the housing 410. The holes 441 are formed on the outer circumferential surface of the mixer 440 at regular intervals. For example, the horizontal distance and the vertical distance between the holes 441 can be constantly provided. Alternatively, the spacing between the respective holes 441 may be different from each other. The liquid is mixed while the plurality of liquids smoothly move through the holes 441 and the mixing space 402 with the inner cavity.

Figure 8 is a perspective view showing the first baffle and the second baffle of Figure 6; Referring to FIG. 8, the first baffle 443 is located in the mixing space 402. The first baffle 443 makes it possible to move the liquid into the upper space and the lower space of the mixing space 402 when a plurality of liquids are mixed. The first baffle 443 divides the mixing space 402 into an upper space and a lower space. A through hole 443a is formed in the first baffle 443. The through hole 443a is formed in the vertical direction and passes through the first baffle 443. The first baffle 443 may be provided as a circular plate. The first baffle 443 is located inside the mixer 440. The first baffle 443 is disposed parallel to the bottom surface of the housing 410. The first baffle 443 is located in the center of the mixer 440.

The second baffle 444 is located in the mixing space 402. The second baffle 444 allows the liquid to move into the lower space and into the space within the protective portion 447 when mixing a plurality of liquids. A through hole 444a is formed in the second baffle 444. The through hole 444a is formed in the vertical direction and passes through the second baffle 444. The second baffle 444 may be provided as a circular plate. The second baffle 444 is provided in a smaller area than the first baffle 443. The second baffle 444 is positioned parallel to the first baffle 443. The second baffle 444 is positioned between the protection portion 447 and the lower surface of the mixer 440. The second baffle 444 is positioned facing the lower surface of the mixer 440.

The support 445 is located below the mixer 440. The support table 445 supports the mixer 440 and has a space in which the liquid can move. The support 445 includes a protector 447 and a pedestal 446.

The protective portion 447 is located below the mixer 440. The protective portion 447 is located at the bottom of the second baffle 444. The upper surface of the backup portion abuts the lower surface of the second baffle 444. The protective portion 447 is provided in a shape having a larger cross-section toward the lower portion. For example, the protection portion 447 is provided in a truncated cone shape whose upper surface is smaller than the lower surface.

The pedestal 446 is located at the bottom of the protective portion 447. The pedestal 446 is placed on the bottom surface of the housing 410. The pedestal 446 is provided in a rectangular parallelepiped shape. The pedestal 446 is connected to a guard at the top. The upper surface of the pedestal 446 is in contact with the protective portion 447 and a hole 441 having the same size as the lower surface of the protective portion 447 is formed. The pedestal 446 has a connection hole 441 formed on its outer surface. The connection hole 441 is connected to the inner space 401. The connection hole 441 allows the mixed liquid in the mixer 440 to move between the inner cavity of the pedestal 446 and the inner space 401 of the housing 410. The connection holes 441 may be formed on four sides. For example, the connection hole 441 may be provided in an arch shape. Alternatively, the connection hole 441 may be provided in a different shape.

The exhaust pipe 480 is a pipe for discharging gas generated in the housing 410 when a plurality of liquids are mixed. The exhaust pipe 480 is connected to the upper surface of the housing 410. The exhaust pipe 480 is connected to the upper surface edge of the housing 410.

The liquid inflow pipe 450 supplies a plurality of liquids to the mixing space 402, respectively. The liquid inlet pipe 450 is connected to the upper portion of the housing 410. A plurality of liquid inflow pipes 450 are provided. The liquid inflow pipe 450 includes a first inflow pipe 451, a second inflow pipe 452, and a third inflow pipe 453.

The first inflow pipe 451, the second inflow pipe 452 and the third inflow pipe 453 receive the chemical liquid from the outside and supply the liquid to the mixing space 402, respectively. The first inlet pipe 451, the second inlet pipe 452 and the third inlet pipe 453 are connected to the upper portion of the housing 410, respectively. The first inflow pipe 451, the second inflow pipe 452 and the third inflow pipe 453 supply liquid by a predetermined amount. For example, the liquid supplied from the first inflow pipe 451 may be pure water. The liquid supplied from the second inlet pipe 452 may be ammonia. The liquid supplied from the third inflow pipe 453 may be hydrogen peroxide. Alternatively, the first inlet pipe 451, the second inlet pipe 452, and the third inlet pipe 453 may provide a selected one of ammonia, hydrogen peroxide, and pure water, respectively. The plurality of liquids are not limited to those described above, and other liquids can be supplied in accordance with the processing steps of the substrate W. [ Further, depending on the type of liquid, the number of liquid inflow pipes 450 may be provided in four or more.

The liquid supply pipe 470 supplies the mixed liquid to the liquid reservoir 387. The liquid supply pipe 470 is connected to the lower surface of the housing 410. The liquid supply pipe 470 is connected to the bottom surface of the housing 410 located under the pedestal 446.

Fig. 9 is a perspective view showing another embodiment of the liquid mixing unit of Fig. 4, and Fig. 10 is a sectional view of the liquid mixing unit of Fig. 9 and 10, the housing 510 of the liquid mixing unit 500 may be provided in a rectangular parallelepiped shape unlike the housing 410 of FIG. The mixing member 530 is provided attached to the inner wall of the housing 510 unlike the mixing member 430 of FIG. The mixer 540 is provided in such a shape that its cross-sectional area decreases as it goes downward. The cross section of the mixer 540 is provided in a trapezoidal shape. The protective portion 547 is provided in such a shape that the cross-sectional area increases toward the bottom. The cross-sectional area of the protection portion 547 is provided in a trapezoidal shape. The pedestal 546 is provided substantially the same as the pedestal 446 of FIG.

Hereinafter, a process of mixing a plurality of liquids into the liquid mixing unit 400 will be described.

The liquid inflow pipe (450) supplies a plurality of liquids to the mixing member (430). The amount of liquid is supplied by a predetermined amount. The supplied liquid is supplied to the lower part through the mixer 440. At this time, potential energy is generated due to the free fall of the liquids. In addition, the supplied liquids can move through the holes 441 of the mixer 440 in the inner space 401 and the mixing space 402. The movement of the liquid causes a continuous flow of liquid through the potential energy of the liquid due to the free fall and the kinetic energy generated when the holes 441 pass through. Through the flow of the liquid, the liquids often have a chance of contact, and the liquid can be mixed without a separate driving device. Further, when the liquid moves to the lower portion of the mixer 440, the liquid passes through the first baffle 443 and the second baffle 444. As the liquids pass through the first baffle 443 and the second baffle 444, the cross-sectional area decreases as the liquid moves to the lower portion of the mixer 440, thereby speeding up the flow. At this time, 2 baffle 444 to move into the interior space 401 through the holes 441 of the mixer 440 against the first baffle 443 and the second baffle 444. Also, the liquid can be moved between the inner space 401 and the mixing space 402 through the connection holes 441 at the lower portion of the pedestal 446. In the upper and lower portions, liquids can move between the inner space 401 and the mixing space 402, so that the plurality of liquids can be uniformly mixed.

In the above example, the liquid mixing unit is provided in the apparatus for cleaning the substrate. However, the present invention is not limited thereto, and the present invention can be applied to an apparatus for supplying a liquid to a substrate to perform a liquid processing process.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

300; Substrate processing apparatus 320: container
340: support unit 380: liquid supply unit
400: liquid mixing unit 410: housing
430: mixing member 440: mixer
450: liquid inlet pipe 470: liquid feed pipe

Claims (29)

In the liquid mixing unit
A housing having a space therein;
A mixing member located in the inner space, the mixing member including a mixer having a mixing space therein;
A plurality of liquid inlet pipes for supplying a plurality of liquids to the mixing space; And
A liquid supply pipe for supplying a liquid mixed in the inner space to the outside; ≪ / RTI &
Holes for connecting the mixing space and the inner space are formed in the mixer,
Wherein the mixing member further includes a first baffle which is located in the mixing space and divides the mixing space into an upper space and a lower space and in which a through hole penetrating in a vertical direction is formed,
Wherein the mixing member further comprises a support for supporting the mixer,
[0028]
A pedestal resting on the bottom surface of the housing;
A protective portion located between the mixer and the pedestal; Containing liquid mixing unit.
The method according to claim 1,
Wherein the mixer is provided with a longitudinal direction in a vertical direction,
Wherein the mixer is provided in a shape in which the cross-sectional area decreases as it goes down.
3. The method of claim 2,
Wherein the mixer is provided in a frusto-conical shape whose lower surface is smaller in area than the upper surface.
The method according to claim 1,
Wherein the holes are spaced apart from each other by a predetermined distance on an outer circumferential surface of the mixer.
delete delete The method according to claim 1,
Wherein the protector is provided in a shape such that its cross-section becomes wider as it goes downward.
8. The method of claim 7,
Wherein the protective portion is provided in a truncated conical shape whose upper surface is smaller in area than the lower surface.
The method according to claim 1,
The pedestal is provided in a rectangular parallelepiped shape having its bottom surface opened,
Wherein a connection hole is formed on an outer surface of the pedestal to connect with the inner space.
10. The method of claim 9,
Wherein the connection holes are provided in an arch shape.
The method according to claim 1,
Wherein the mixing member further includes a second baffle disposed between the protector and the lower surface of the mixer and having a through hole penetrating in a vertical direction.
12. The method of claim 11,
Wherein the second baffle is provided in a smaller area than the first baffle.
The method according to claim 1,
Wherein the plurality of liquids supplied from the liquid supply pipe include pure water, ammonia, and hydrogen peroxide.
3. The method of claim 2,
Wherein the mixer is attached to an inner wall of the housing.
3. The method of claim 2,
Wherein the mixer is located at a distance from the inner wall of the housing.
An apparatus for processing a substrate,
A vessel having a processing space therein;
A support unit positioned in the processing space and in which the substrate is placed;
A liquid supply unit for supplying liquid onto the substrate placed on the support unit; And
And a liquid mixing unit connected to the liquid supply unit and mixing the plurality of liquids to supply the mixed liquid to the liquid supply unit,
The liquid mixing unit includes:
A housing having a space therein;
A mixing member located in the inner space, the mixing member including a mixer having a mixing space therein;
A plurality of liquid inlet pipes for supplying a plurality of liquids to the mixing space; And
A liquid supply pipe for supplying a liquid mixed in the inner space to the outside; ≪ / RTI &
Holes for connecting the mixing space and the inner space are formed in the mixer,
Wherein the mixing member further includes a first baffle which is located in the mixing space and divides the mixing space into an upper space and a lower space and in which a through hole penetrating in a vertical direction is formed,
Wherein the mixing member further comprises a support for supporting the mixer,
[0028]
A pedestal resting on the bottom surface of the housing;
A protective portion located between the mixer and the pedestal; And the substrate processing apparatus.
17. The method of claim 16,
Wherein the mixer is provided with a longitudinal direction in a vertical direction,
Wherein the mixer is provided in a shape such that its cross-section decreases as it goes down.
18. The method of claim 17,
Wherein the mixer is provided in a truncated cone shape whose lower surface is smaller in area than the upper surface.
17. The method of claim 16,
Wherein the holes are spaced apart from each other at an outer peripheral surface of the mixer.
delete delete 17. The method of claim 16,
Wherein the protective portion is provided in a shape such that its cross-sectional surface becomes wider as it goes down.
23. The method of claim 22,
Wherein the protective portion is provided in a truncated cone shape whose upper surface is smaller in area than the lower surface.
17. The method of claim 16,
The pedestal is provided in a rectangular parallelepiped shape having its bottom surface opened,
Wherein a connection hole is formed on an outer surface of the pedestal to be connected to the inner space.
25. The method of claim 24,
Wherein the connection hole is provided in an arch shape.
17. The method of claim 16,
Wherein the mixing member further comprises a second baffle disposed between the protector and the lower surface of the mixer and having a through hole penetrating in a vertical direction.
17. The method of claim 16,
Wherein the plurality of liquids supplied from the liquid supply pipe include pure water, ammonia, and hydrogen peroxide.
18. The method of claim 17,
Wherein the mixer is attached to an inner wall of the housing.
18. The method of claim 17,
Wherein the mixer is spaced apart from an inner wall of the housing by a predetermined distance.
KR1020150093155A 2015-06-30 2015-06-30 Liquid mixing unit and Apparatus for treating a substrate with the unit KR101909471B1 (en)

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JP2001338903A (en) * 2000-05-29 2001-12-07 Tokyo Electron Ltd Method and equipment for liquid process

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JPH06218257A (en) * 1993-01-25 1994-08-09 Fuji Electric Co Ltd Two liquid mixer
JPH07211643A (en) * 1994-01-20 1995-08-11 Hitachi Electron Eng Co Ltd Reaction gas mixer for cvd system
JPH11197477A (en) * 1998-01-16 1999-07-27 Isis:Kk Liquid mixer
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JP3144278U (en) * 2008-06-11 2008-08-21 株式会社ユニフィードエンジニアリング Liquid mixing device
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JP2001338903A (en) * 2000-05-29 2001-12-07 Tokyo Electron Ltd Method and equipment for liquid process

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