KR20240077099A - Apparatus and method for processing substrate - Google Patents

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method that can increase mixing efficiency by evenly mixing a first liquid and a second liquid, comprising: a first liquid supply line for supplying the first liquid; a second liquid supply line supplying the second liquid; a liquid mixing device that has one side connected to the first liquid supply line and the other side connected to the second liquid supply line, and capable of mixing the first liquid and the second liquid; and a mixed liquid supply line that supplies the mixed liquid mixed in the liquid mixing device to the nozzle.

Description

Substrate processing device and substrate processing method {Apparatus and method for processing substrate}

The present invention relates to a substrate processing device and a substrate processing method, and more specifically, to a substrate processing device and a substrate processing method that allow mixing the first liquid and the second liquid evenly to increase mixing efficiency.

In general, in the semiconductor manufacturing process, processes such as deposition of insulating films and metal materials, etching, photo resist coating, development, and asher removal are repeated several times. An array of fine patterning is formed, and a cleaning process using a cleaning solution such as pure water (DIW, Deionized Water) or isopropyl alcohol (IPA, Isopropyl Alcohol) is used to remove foreign substances generated in each process. Process) is widely applied.

Meanwhile, the cleaning liquid supply device used in the conventional cleaning process includes a pure water supply device for supplying pure water and an isopropyl alcohol supply device for supplying isopropyl alcohol.

However, in this conventional cleaning liquid supply device, due to the individually configured DIW nozzle and IPA nozzle, more or less DIW may be supplied or less may be supplied at a specific location on the substrate, and more or less IPA may be supplied. There were problems such as insufficient supply and uneven cleaning of the substrate.

The present invention is intended to solve various problems including the problems described above, and provides a substrate processing device and a substrate processing method that allow the first liquid and the second liquid to be uniformly mixed with each other and then supplied to the substrate. The purpose. However, these tasks are illustrative and do not limit the scope of the present invention.

A substrate processing apparatus according to the spirit of the present invention for solving the above problems includes a first liquid supply line for supplying a first liquid; a second liquid supply line supplying the second liquid; a liquid mixing device that has one side connected to the first liquid supply line and the other side connected to the second liquid supply line, and capable of mixing the first liquid and the second liquid; and a mixed liquid supply line that supplies the mixed liquid mixed in the liquid mixing device to the nozzle.

In addition, according to the present invention, the liquid mixing device includes a first pipe portion in which a first transfer path is formed in a first direction, and an orifice portion in which the width of the first transfer path is gently or sharply reduced is formed in the middle. ; And a second pipe portion connected to the first pipe portion and formed inside in a second direction to form a second transfer path joining the first transfer path.

In addition, according to the present invention, the liquid mixing device is formed as a whole in which the first pipe portion is formed in a horizontal direction, and the second pipe portion protrudes downward or upward from the first pipe portion in a direction perpendicular to the first pipe portion. It may be a T-shaped tube formed in a T-shape.

Additionally, according to the present invention, the first liquid supply line is connected to the inlet of the first pipe portion, the second liquid supply line is connected to the inlet of the second pipe portion, and the mixed liquid supply line is connected to the first pipe portion. can be connected to the outlet of

In addition, according to the present invention, at least one of a first flow meter, a first flow control valve, a first on-off valve, or a combination thereof is installed in the first liquid supply line, and the second liquid At least one or more of a second flow meter, a second flow control valve, a second on-off valve, or a combination thereof may be installed in the supply line.

In addition, according to the present invention, a first control signal is applied to the first flow control valve so that the first liquid can be supplied at a first flow rate or a first pressure as the main stream, and the second liquid is supplied as a sub-stream. It may further include a control unit that applies a second control signal to the second flow control valve to supply the second flow rate or the second pressure.

Additionally, according to the present invention, the first flow rate or the first pressure may be less than the second flow rate or the second pressure.

Additionally, according to the present invention, the first liquid may be isopropyl alcohol (IPA), and the second liquid may be pure water (DIW).

Additionally, according to the present invention, the mixed liquid may be a cleaning liquid for cleaning the substrate.

Meanwhile, a substrate processing method according to the spirit of the present invention for solving the above problem includes a first liquid supply line for supplying the first liquid, a second liquid supply line for supplying the second liquid, and one side supplying the first liquid. A liquid mixing device connected to a line, the other side of which is connected to the second liquid supply line, mixing the first liquid and the second liquid, and a mixed liquid supply line for supplying the mixed liquid mixed in the liquid mixing device to a nozzle. A substrate processing method using a substrate processing apparatus comprising: (a) closing the first liquid supply line and opening the second liquid supply line to supply the second liquid to the nozzle; (b) supplying the mixed liquid to the nozzle by opening the first liquid supply line while opening the second liquid supply line; (c) partially closing the second liquid supply line while opening the first liquid supply line to supply a mixed solution with a lowered concentration of the second liquid to the nozzle; and (d) supplying the first liquid to the nozzle by closing the second liquid supply line while the first liquid supply line is open.

According to various embodiments of the present invention as described above, the first liquid and the second liquid can be uniformly mixed with each other to increase mixing efficiency and then supplied to the substrate through an integrated nozzle, and the overall uniformity can be achieved even under various process conditions. This has the effect of significantly improving the uniformity of the process by supplying a single cleaning solution. Of course, the scope of the present invention is not limited by this effect.

1 is a plan view showing a substrate processing facility according to some embodiments of the present invention.
FIG. 2 is a conceptual diagram showing a substrate processing device of the substrate processing equipment of FIG. 1 .
FIG. 3 is an enlarged cross-sectional view showing the liquid mixing device of the substrate processing device of FIG. 2.
FIG. 4 is a table showing results obtained from simulation analysis of the liquid mixing device of the substrate processing device of FIG. 3.
5 is a flowchart showing a substrate processing method according to some embodiments of the present invention.

Hereinafter, various preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified into various other forms, and the scope of the present invention is as follows. It is not limited to the examples. Rather, these embodiments are provided to make the present disclosure more faithful and complete and to fully convey the spirit of the present invention to those skilled in the art. Additionally, the thickness and size of each layer in the drawings are exaggerated for convenience and clarity of explanation.

The terms used herein are used to describe specific embodiments and are not intended to limit the invention. As used herein, the singular forms include the plural forms unless the context clearly indicates otherwise. Additionally, when used herein, “comprise” and/or “comprising” means specifying the presence of stated features, numbers, steps, operations, members, elements and/or groups thereof. and does not exclude the presence or addition of one or more other shapes, numbers, operations, members, elements and/or groups.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will now be described with reference to drawings that schematically show ideal embodiments of the present invention. In the drawings, variations of the depicted shape may be expected, for example, depending on manufacturing technology and/or tolerances. Accordingly, embodiments of the present invention should not be construed as being limited to the specific shape of the area shown in this specification, but should include, for example, changes in shape resulting from manufacturing.

1 is a plan view showing a substrate processing facility 1 according to some embodiments of the present invention.

As shown in FIG. 1, the substrate processing equipment 1 according to some embodiments of the present invention has an index module 100 and a process processing module 200, and the index module 100 has a load port 120. ) and a transfer frame 140. The load port 120, the transfer frame 140, and the process processing module 200 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the process processing module 200 are arranged is referred to as the first direction 12. And when viewed from the top, the direction perpendicular to the first direction 12 is called the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is called the third direction. It is called (16).

The carrier 130 containing the substrate W is seated in the load port 140. A plurality of load ports 120 are provided, and they are arranged in a row along the second direction 14. Figure 1 shows that four load ports 120 are provided. However, the number of load ports 120 may increase or decrease depending on conditions such as process efficiency and footprint of the process processing module 200. A slot (not shown) provided to support the edge of the substrate is formed in the carrier 130. A plurality of slots are provided in the third direction 16, and the substrates are placed in the carrier to be stacked in a spaced apart state along the third direction 16. A Front Opening Unified Pod (FOUP) may be used as the carrier 130.

The process processing module 200 has a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is arranged so that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed on one side and the other side of the transfer chamber 240 along the second direction 14, respectively. The process chambers 260 located on one side of the transfer chamber 240 and the process chambers 260 located on the other side of the transfer chamber 240 are provided to be symmetrical to each other with respect to the transfer chamber 240. Some of the process chambers 260 are arranged along the longitudinal direction of the transfer chamber 240. Additionally, some of the process chambers 260 are arranged to be stacked on top of each other. That is, on one side of the transfer chamber 240, the process chambers 260 may be arranged in an arrangement of A Here, A is the number of process chambers 260 provided in a row along the first direction 12, and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in a 2 x 2 or 3 x 2 arrangement. The number of process chambers 260 may increase or decrease. Unlike what was described above, the process chamber 260 may be provided only on one side of the transfer chamber 240. Additionally, unlike what was described above, the process chamber 260 may be provided as a single layer on one and both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before it is transferred between the transfer chamber 240 and the transfer frame 140. The buffer unit 220 is provided with slots (not shown) on which the substrate W is placed, and a plurality of slots (not shown) are provided to be spaced apart from each other along the third direction 16. In the buffer unit 220, the surface facing the transfer frame 140 and the surface facing the transfer chamber 240 are open.

The transfer frame 140 transfers the substrate W between the carrier 130 mounted on the load port 120 and the buffer unit 220. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided with its longitudinal direction parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and moves straight along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Additionally, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to move forward and backward with respect to the body 144b. A plurality of index arms 144c are provided to be individually driven. The index arms 144c are arranged to be stacked and spaced apart from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 200 to the carrier 130, and other portions are used to transfer the substrate W from the carrier 130 to the processing module 200. Can be used when returning. This can prevent particles generated from the substrate W before processing from attaching to the substrate W after processing during the process of the index robot 144 loading and unloading the substrate W.

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260, and between the process chambers 260. A guide rail 242 and a main robot 244 are provided in the transfer chamber 240. The guide rail 242 is arranged so that its longitudinal direction is parallel to the first direction 12. The main robot 244 is installed on the guide rail 242 and moves linearly along the first direction 12 on the guide rail 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Additionally, the body 244b is provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b, and is provided to move forward and backward with respect to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are arranged to be stacked and spaced apart from each other along the third direction 16. The main arm 244c, which is used when transferring the substrate from the buffer unit 220 to the process chamber 260, and the main arm 244c, which is used when transferring the substrate from the process chamber 260 to the buffer unit 220, are may be different from each other.

A substrate processing device 300 that performs a cleaning process on the substrate W is provided within the process chamber 260. The substrate processing device 300 provided within each process chamber 260 may have a different structure depending on the type of cleaning process being performed. Optionally, the substrate processing apparatus 300 within each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, so that the substrate processing devices 300 provided to the process chambers 260 belonging to the same group have the same structure and are provided to the process chambers 260 belonging to different groups. The substrate processing devices 300 may have different structures. For example, when the process chamber 260 is divided into two groups, a first group of process chambers 260 is provided on one side of the transfer chamber 240, and a second group of process chambers 260 is provided on the other side of the transfer chamber 240. Process chambers 260 may be provided. Optionally, a first group of process chambers 260 may be provided in the lower layer and a second group of process chambers 260 may be provided in the upper layer on one side and the other of the transfer chamber 240, respectively. The first group of process chambers 260 and the second group of process chambers 260 may be classified according to the type of chemical used or the type of cleaning method, respectively.

FIG. 2 is a conceptual diagram showing the substrate processing apparatus 300 of the substrate processing equipment 1 of FIG. 1 .

As shown in FIG. 2, the substrate processing apparatus 300 according to some embodiments of the present invention includes a cup 320, a spin head 340, an elevating unit 360, an injection member 380, and an inversion unit ( 370) and a control unit 395. The cup 320 provides a space where a substrate processing process is performed, and its top is open.

The cup 320 includes an internal recovery container 322, an intermediate recovery container 324, and an external recovery container 326. Each recovery container (322, 324, and 326) recovers different treatment liquids among the treatment liquids used in the process. The internal recovery container 322 is provided in an annular ring shape surrounding the spin head 340, the middle recovery container 324 is provided in an annular ring shape surrounding the internal recovery container 322, and the external recovery container 326 ) is provided in an annular ring shape surrounding the intermediate recovery container 324. The inner space (322a) of the internal recovery container (322), the space (324a) between the internal recovery container (322) and the intermediate recovery container (324), and the space between the intermediate recovery container (324) and the external recovery container (326) ( 326a) functions as an inlet through which the treatment liquid flows into the internal recovery container 322, the intermediate recovery container 324, and the external recovery container 326, respectively. Each of the recovery bins (322, 324, and 326) is connected to a recovery line (322b, 324b, and 326b) extending vertically downward from the bottom thereof. Each recovery line (322b, 324b, and 326b) discharges the treatment liquid introduced through each recovery container (322, 324, and 326).

The discharged treatment liquid can be reused through an external treatment liquid regeneration system (not shown).

Spin head 340 is disposed within cup 320. The spin head 340 supports the substrate W and rotates the substrate W during the process. The spinhead 340 has a body 342, a support pin 334, a chuck pin 346, and a support shaft 348. Body 342 has an upper surface that is generally circular when viewed from above. A support shaft 348 rotatable by a motor 349 is fixedly coupled to the bottom of the body 342. A plurality of support pins 334 are provided. The support pins 334 are disposed at predetermined intervals on the edge of the upper surface of the body 342 and protrude upward from the body 342. The support pins 334 are arranged to have an overall annular ring shape by combining them with each other. The support pin 334 supports the rear edge of the substrate W so that it is spaced a certain distance from the upper surface of the body 342. A plurality of chuck pins 346 are provided. The chuck pin 346 is disposed farther away from the center of the body 342 than the support pin 334. The chuck pin 346 is provided to protrude upward from the body 342. The chuck pin 346 supports the side of the substrate so that the substrate does not deviate laterally from its original position when the spin head 340 is rotated. The chuck pin 346 is provided to be linearly movable between the standby position and the support position along the radial direction of the body 342. The standby position is a position further away from the center of the body 342 compared to the support position. When the substrate W is loaded or unloaded on the spin head 340, the chuck pin 346 is positioned in the standby position, and when a process is performed on the substrate W, the chuck pin 346 is positioned in the support position. . In the supported position, the chuck pin 346 is in contact with the side of the substrate.

The lifting unit 360 moves the cup 320 straight up and down. As the cup 320 moves up and down, the relative height of the cup 320 with respect to the spin head 340 changes. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixedly installed on the outer wall of the cup 320, and a moving shaft 364 that moves in the vertical direction by the driver 366 is fixedly coupled to the bracket 362. When the substrate W is placed on the spin head 340 or lifted from the spin head 340, the cup 320 is lowered so that the spin head 340 protrudes toward the top of the cup 320. Additionally, as the process progresses, the height of the cup 320 is adjusted so that the processing liquid can flow into the preset recovery container 360 according to the type of processing liquid supplied to the substrate W. For example, while the substrate W is being treated with the first treatment liquid, the substrate W is positioned at a height corresponding to the inner space 322a of the internal recovery container 322. In addition, while treating the substrate W with the second treatment liquid and the third treatment liquid, the substrate W is exposed to the space 324a between the internal recovery container 322 and the intermediate recovery container 324, and the intermediate recovery container, respectively. It may be located at a height corresponding to the space 326a between the bin 324 and the external recovery bin 326. Unlike what was described above, the lifting unit 360 can move the spin head 340 in the vertical direction instead of the cup 320.

The injection member 380 supplies a processing liquid to the substrate W during the substrate processing process. The spray member 380 has a nozzle support 382, an integrated nozzle 384, a support shaft 386, and an actuator 388. The support shaft 386 is provided along the third direction 16 in its longitudinal direction, and a driver 388 is coupled to the lower end of the support shaft 386. The driver 388 rotates and moves the support shaft 386 up and down. The nozzle support 382 is vertically coupled to the opposite end of the support shaft 386 coupled to the actuator 388. The integrated nozzle 384 is installed on the bottom surface of the end of the nozzle support 382. The integrated nozzle 384 is moved by the actuator 388 between the process position and the standby position. The process position is a position where the integrated nozzle 384 is disposed at the vertical upper part of the cup 320, and the standby position is a position where the integrated nozzle 384 is deviated from the vertical upper part of the cup 320. One or more injection members 380 may be provided.

Meanwhile, the substrate processing apparatus 300 according to some embodiments of the present invention includes a first liquid supply line 391 that is connected to the first liquid main line ML1 installed in the factory and supplies the first liquid L1; , a second liquid supply line 392 that supplies the second liquid (L2) connected to the second liquid main line (ML2) installed in the factory, one side is connected to the first liquid supply line 391, and the other side is connected to the second liquid main line (ML2) installed in the factory. A liquid mixing device 393 connected to the second liquid supply line 392 and capable of mixing the first liquid (L1) and the second liquid (L2), and a mixed liquid (L3) mixed in the liquid mixing device 393. ) may include a mixed liquid supply line 394 that supplies liquid to the integrated nozzle 384, and a control unit 395 that can control the first liquid supply line 391 and the second liquid supply line 392.

More specifically, for example, the first liquid supply line 391 includes at least one of a first flow meter (M1), a first flow control valve (FV1), and a first on-off valve (OV1) or a combination thereof. More than one can be installed.

In addition, for example, the second liquid supply line 392 includes at least one of a second flow meter (M2), a second flow control valve (FV2), and a second on-off valve (OV2) or combinations thereof. This can be installed.

FIG. 3 is an enlarged cross-sectional view showing the liquid mixing device 393 of the substrate processing device 300 of FIG. 2.

As shown in FIGS. 2 and 3, the liquid mixing device 393 is an orifice in which a first transfer path is formed in a first direction, and the width of the first transfer path is gently or sharply reduced in the middle. A first pipe portion (P1) in which the portion (P1a) is formed and a confluence portion (P1a) connected to the first pipe portion (P1) and formed inside in a second direction to join the rear (or front) of the orifice portion (P1a). It may include a second pipe portion (P2) connected to P2a) to form a second transport path joining the first transport path.

Here, the orifice portion (P1a) is an example of a grid-shaped orifice whose width decreases rapidly and then rapidly increases again after passing the neck. However, it is not necessarily limited to this, and has a variety of forms such as the width gradually decreases and then gradually increases again. Orifice or venturi tube or narrow section can all be applied.

Additionally, it is possible for a confluence to be formed near or in the orifice portion P1a.

More specifically, for example, in the liquid mixing device 393, the first pipe portion P1 is formed in a horizontal direction, and the second pipe portion P2 is formed in a direction perpendicular to the first pipe portion P1. It may be a T-shaped pipe that protrudes downward (illustrated in FIG. 3) or upward (not shown) of (P1) and is formed in an overall T-shape.

Therefore, the first liquid supply line 391 is connected to the inlet of the first pipe part (P1), the second liquid supply line 392 is connected to the inlet of the second pipe part (P2), and the mixed liquid supply line 394 Can be connected to the outlet of the first pipe (P1).

The control unit 395 applies a first control signal to the first flow control valve (FV1) so that the first liquid (L1) can be supplied at a first flow rate or a first pressure as the main stream, and the second liquid (L2) ) can be applied to the second flow control valve (FV2) to supply the sub-stream at a second flow rate or a second pressure.

Here, as a result of repeated simulation analysis, the mixed liquid (L3) is a cleaning liquid for cleaning the substrate (W), and the first liquid (L1) is used as the main stream to maximize the uniformity of cleaning. Isopropyl alcohol (isopropyl alcohol), a type of organic solvent IPA) can be applied, and the second liquid (L2) can be applied as a rinsing liquid or pure water (DIW), a type of inorganic solvent, as a sub-stream.

Here, the first liquid (L1) or the second liquid (L2) can also be used by mixing an inert gas.

In addition, here, as a result of repetitive simulation analysis, it is preferable that the first flow rate or first pressure of the main stream is less than the second flow rate or second pressure of the sub-stream.

Here, the first flow rate or first pressure and the second flow rate or second pressure can be continuously changed according to the cleaning recipe.

For example, the control unit 385 may close the first liquid supply line 391 and open the second liquid supply line 392 to supply only the second liquid (L2) to the integrated nozzle 384.

Next, the control unit 385 may supply the mixed liquid (L3) to the integrated nozzle 384 by opening the first liquid supply line 391 while opening the second liquid supply line 392.

Subsequently, the control unit 385 partially closes the second liquid supply line 392 while opening the first liquid supply line 391 to supply a mixed liquid with a lowered concentration of the second liquid L2 to the integrated nozzle 384. (L3) can be supplied.

Subsequently, the control unit 385 may supply only the first liquid L1 to the integrated nozzle 384 by closing the second liquid supply line 392 while opening the first liquid supply line 391.

Therefore, according to the present invention, the first liquid (L1) and the second liquid (L2) can be uniformly mixed with each other to increase mixing efficiency, and then supplied to the substrate (W) with high uniformity through the integrated nozzle 384. , not only can the uniformity of the process be greatly improved by supplying an overall uniform cleaning liquid even under various process conditions, but it is also possible to adjust the valves to discharge either the first liquid (L1) or the second liquid (L2). do.

FIG. 4 is a table showing results obtained from simulation analysis of the liquid mixing device 393 of the substrate processing device 300 of FIG. 3 .

As shown in Figure 4, as a result of repeated simulation analysis, when determining that the lower the variation, the better the uniformity, as in the present invention, CASE 6 sets the main stream as IPA and DIW at a 90 degree angle. It was confirmed that flowing as a sub-stream was the best. In addition, it was confirmed that at angles other than 90 degrees, such as 45 degrees, the variance was high and uniformity deteriorated. Here, IDM (IPA DIW Mixture) refers to the mixed solution.

5 is a flowchart showing a substrate processing method according to some embodiments of the present invention.

1 to 5, a substrate processing method according to some embodiments of the present invention is a substrate processing method using the above-described substrate processing apparatus 300, which includes (a) the first liquid supply line ( 391) and opening the second liquid supply line 392 to supply the second liquid (L2) to the integrated nozzle 384, (b) the second liquid supply line 392 supplying the mixed liquid (L3) to the integrated nozzle 384 by opening the first liquid supply line 391 in an open state; (c) opening the first liquid supply line 391; supplying a mixed liquid (L3) with a lowered concentration of the second liquid (L2) to the integrated nozzle 384 by partially closing the second liquid supply line 392; and (d) the first liquid supply line. It may include supplying the first liquid (L1) to the integrated nozzle 384 by closing the second liquid supply line 392 while opening (391).

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the attached patent claims.

1: Substrate processing equipment
W: substrate
100: Intex module
200: Process processing module
300: Substrate processing device
384: nozzle
L1: 1st liquid
L2: Second liquid
L3: mixed liquid
ML1: 1st liquid main line
ML2: Second liquid main line
391: First liquid supply line
392: Second liquid supply line
393: Liquid mixing device
P1: 1st tract
P1a: Orifice part
P2: 2nd tract
P2a: confluence
M1: first flow meter
FV1: First flow control valve
OV1: 1st on/off valve
M2: Second flow meter
FV2: Second flow control valve
OV2: 2nd on/off valve
394: Mixed liquid supply line
395: Control unit

Claims (10)

a first liquid supply line supplying the first liquid;
a second liquid supply line supplying the second liquid;
a liquid mixing device that has one side connected to the first liquid supply line and the other side connected to the second liquid supply line, and capable of mixing the first liquid and the second liquid; and
a mixed liquid supply line that supplies the mixed liquid mixed in the liquid mixing device to an integrated nozzle;
A substrate processing device comprising: According to claim 1,
The liquid mixing device,
A first pipe portion in which a first transfer path is formed in a first direction, and an orifice portion in which the width of the first transfer path is gently or sharply reduced is formed in the middle; and
a second pipe portion connected to the first pipe portion and formed inside in a second direction to form a second transfer path joining the first transfer path;
Including, a substrate processing device. According to claim 2,
The liquid mixing device,
A substrate processing apparatus, wherein the first pipe portion is formed in a horizontal direction, and the second pipe portion is a T-shaped pipe that protrudes downward or upward from the first pipe portion in a direction perpendicular to the first pipe portion. . According to claim 2,
The first liquid supply line is connected to the inlet of the first pipe section,
The second liquid supply line is connected to the inlet of the second pipe part,
The mixed liquid supply line is connected to an outlet of the first pipe portion. According to claim 1,
At least one of a first flow meter, a first flow control valve, a first on-off valve, or a combination thereof is installed in the first liquid supply line,
A substrate processing apparatus, wherein at least one of a second flow meter, a second flow control valve, a second on-off valve, or a combination thereof is installed in the second liquid supply line. According to claim 1,
A first control signal is applied to the first flow control valve to supply the first liquid at a first flow rate or a first pressure with the first liquid as a main stream, and a second flow rate or second pressure is applied with the second liquid as a sub-stream. a control unit that applies a second control signal to the second flow control valve to supply pressure;
A substrate processing device further comprising: According to claim 6,
The first flow rate or the first pressure is less than the second flow rate or the second pressure. According to claim 7,
The first liquid is isopropyl alcohol (IPA),
The second liquid is pure water (DIW). According to claim 8,
The mixed liquid is a cleaning liquid for cleaning a substrate. A first liquid supply line for supplying the first liquid, a second liquid supply line for supplying the second liquid, one side is connected to the first liquid supply line, the other side is connected to the second liquid supply line, and the second liquid supply line A substrate processing method using a substrate processing device including a liquid mixing device for mixing the first liquid and the second liquid and a mixed liquid supply line for supplying the mixed liquid mixed in the liquid mixing device to an integrated nozzle,
(a) closing the first liquid supply line and opening the second liquid supply line to supply the second liquid to the integrated nozzle;
(b) supplying the mixed liquid to the integrated nozzle by opening the first liquid supply line while opening the second liquid supply line;
(c) partially closing the second liquid supply line while opening the first liquid supply line to supply a mixed liquid with a lowered concentration of the second liquid to the integrated nozzle; and
(d) supplying the first liquid to the integrated nozzle by closing the second liquid supply line while opening the first liquid supply line;
Including, a substrate processing method.

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