CN111601466B - PCB (printed circuit board) chip mounting equipment and chip mounting method - Google Patents
PCB (printed circuit board) chip mounting equipment and chip mounting method Download PDFInfo
- Publication number
- CN111601466B CN111601466B CN202010512759.3A CN202010512759A CN111601466B CN 111601466 B CN111601466 B CN 111601466B CN 202010512759 A CN202010512759 A CN 202010512759A CN 111601466 B CN111601466 B CN 111601466B
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- motor
- pcb
- baking
- chip mounting
- positioning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Abstract
The invention discloses a PCB (printed circuit board) chip mounting device and a chip mounting method, which belong to the technical field of PCB chip mounting and comprise a base and a fourth motor arranged in the base, wherein the output end of the fourth motor is connected with a chip mounting disc through a lifting rod, a control console is arranged in the chip mounting disc, a positioning disc is arranged at the top of the chip mounting disc, a rotating frame is arranged on one side of the base, the other end of the rotating frame is connected with a baking table, a material box is arranged in the baking table, a motor box is arranged at the bottom of the material box, a plurality of second motors are arranged in the material box, and the output ends of the second motors are connected with telescopic pipes. The electric appliance component after the surface mounting is finished is conveniently baked by the baking device, the accuracy of the position of the component is ensured to avoid displacement after baking, the baking lamp is arranged to integrally bake the PCB after the surface mounting is finished, the baking uniformity of the whole PCB is conveniently ensured, the PCB does not need to enter the baking box to be baked independently, the production time is shortened, and the production efficiency is improved.
Description
Technical Field
The invention relates to a chip mounting device and a chip mounting method, in particular to a PCB chip mounting device and a chip mounting method, and belongs to the technical field of PCB chip mounting.
Background
The chip mounter is mainly applied to the field of electronic product production operation, and is used for installing some basic electronic components on corresponding bonding pads on a PCB in batches, and the main indexes for measuring the performance of the chip mounter are speed and precision.
The existing paster equipment and paster method have the following defects: (1) in the existing chip mounting equipment, the electrical components are pasted on the PCB board by adopting glue dispensing, and the later-stage independent baking is needed, so that the electrical components are easy to deviate in the transferring process; (2) the existing PCB is easy to be misplaced when in surface mounting, so that electrical components are misplaced.
Disclosure of Invention
The invention mainly aims to solve the defects of the prior art and provides a PCB (printed circuit board) chip mounting device and a chip mounting method.
The purpose of the invention can be achieved by adopting the following technical scheme:
the utility model provides a PCB board paster equipment, includes the base and installs the inside fourth motor of base, the output of fourth motor is connected with the paster dish through the lifter, the inside of paster dish is equipped with the control cabinet, the top of paster dish is equipped with the positioning disk, one side of base is equipped with the swivel mount, the other end of swivel mount is connected with toasts the platform, the inside of toasting the platform is equipped with the material case, the bottom of material case is equipped with the motor case, the inside of material case is equipped with a plurality of second motors, the output of second motor is connected with flexible pipe, the head is glued in the other end fixedly connected with point of flexible pipe, the head is glued in the point goes up the cover and is equipped with the solenoid valve, the outside cover of flexible pipe is equipped with the roaster, the top of flexible pipe pass through the conveying pipeline with material case intercommunication.
Preferably, the inside of control cabinet is equipped with the host computer, main electromagnet has been laid at the top of control cabinet, the bottom of control cabinet is equipped with the removal wheel that is used for moving.
Preferably, the top of positioning disk is equipped with the reference column, the inside of reference column is equipped with the camera, the below of camera is equipped with the fan, the inside of positioning disk is equipped with first motor, the telescopic link is all installed to two output ends of first motor, the telescopic link pass through the connecting block with locating piece fixed connection, seted up on the positioning disk and be convenient for the spout that the connecting block removed, the top of positioning disk be equipped with the secondary electromagnet that main electromagnet was mutually supported.
Preferably, the bracing piece that is used for the location is all installed in the slope in the both sides of second motor, the roaster is the hollow round platform form roaster of two bottom intercombinations, evenly distributed's heating wire has been laid to the inside of roaster, the bottom of roaster is seted up be used for the round hole of dispensing head business turn over.
Preferably, the rotating frame is an inverted J-shaped rotating frame, a third motor is arranged inside the base, and an output end of the third motor is fixedly connected with the bottom of the rotating frame.
Preferably, the positioning disc is a semi-cylindrical patch disc, and the positioning column is a semi-cylindrical positioning column.
Preferably, the bottom of toasting the platform is equipped with a plurality of evenly distributed's toast the lamp, the top of toasting the platform be equipped with the feed inlet of material case mutually supporting.
Preferably, the film sticking disc is located under the baking table, the baking table is a cylindrical baking table, and the film sticking disc is a prismatic table-shaped film sticking disc.
A chip mounting method of PCB chip mounting equipment comprises the following steps:
step 1: placing the PCB on a film sticking disc, and placing an electrical element on the PCB by using a manipulator;
step 2: the control console is operated, the main electromagnet is started to drive the positioning disc to operate, the camera is enabled to collect position information of the electrical component on the PCB and transmit the position information to the host, and the host starts the first motor to drive the positioning block to move the electrical component to a position where the electrical component needs to be pasted;
and step 3: after the position is determined, a second motor is started to drive the extension tube to fall down and open the electromagnetic valve, and the adhesive is released to enable the patch to be adhered to the PCB;
and 4, step 4: after dispensing is finished, starting a roaster to carry out 5-20 s on the electrical appliance elements subjected to dispensing;
and 5: after all electrical components paster, start and bake out the lamp and carry out 2~10s to whole PCB board, the paster is accomplished.
Preferably, in step 2, the host controls the moving direction of the moving wheel according to the information acquisition data of the camera.
The invention has the beneficial technical effects that: according to the PCB board surface mounting equipment and the surface mounting method, the roaster is arranged to facilitate baking of the electrical components after surface mounting is finished, the accuracy of the positions of the components is guaranteed to avoid displacement after baking, meanwhile, the roasting lamp is arranged to facilitate overall baking of the PCB after surface mounting is finished, the uniformity of baking of the whole PCB is guaranteed, independent baking in the roasting box is not needed, the production time is reduced, and the production efficiency is improved; be equipped with control cabinet and positioning disk to be equipped with the camera accuracy of being convenient for gather electrical components on the control cabinet, when electrical components position error, the host computer drives the locating piece through controlling first motor and removes electrical components, avoids electrical components position to paste the mistake simultaneously.
Drawings
Fig. 1 is a schematic overall structure diagram of a preferred embodiment of a PCB board mounting apparatus and a mounting method according to the present invention;
FIG. 2 is a schematic diagram of a structure of a chip mounting tray of a preferred embodiment of the PCB chip mounting device and the chip mounting method according to the invention;
FIG. 3 is a schematic structural diagram of a console of a preferred embodiment of a PCB board mounting device and a PCB board mounting method according to the invention;
FIG. 4 is a schematic structural diagram of a baking table according to a preferred embodiment of the PCB board mounting apparatus and the PCB board mounting method of the present invention;
fig. 5 is a schematic diagram of an internal structure of a chip mounting tray according to a preferred embodiment of the PCB chip mounting apparatus and the chip mounting method of the present invention;
FIG. 6 is a schematic diagram of a structure of a chip mounting tray of a PCB chip mounting device and a chip mounting method according to a preferred embodiment of the invention;
fig. 7 is a schematic structural view of a chip mounting device of a preferred embodiment of a PCB chip mounting apparatus and a chip mounting method according to the present invention;
fig. 8 is a schematic structural view of a rotating frame of a preferred embodiment of a PCB board mounting apparatus and a mounting method according to the present invention.
In the figure: 1-base, 2-rotating frame, 3-baking platform, 4-feeding hole, 5-material box, 6-motor box, 7-paster device, 8-paster disc, 9-baking lamp, 10-heat-insulating rod, 11-baking device, 12-fourth motor, 13-lifting rod, 14-control platform, 15-main machine, 16-main electromagnet, 17-moving wheel, 18-positioning disc, 19-positioning block, 20-sliding chute, 21-secondary electromagnet, 22-fan, 23-camera, 24-first motor, 25-telescopic rod, 26-connecting block, 27-conveying pipe, 28-second motor, 29-supporting rod, 30-telescopic pipe, 31-dispensing head, 32-third motor, 33-electromagnetic valve, 34-positioning column.
Detailed Description
In order to make the technical solutions of the present invention more clear and definite for those skilled in the art, the present invention is further described in detail below with reference to the examples and the accompanying drawings, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1-8, the PCB board mounting apparatus provided in this embodiment includes a base 1 and a fourth motor 12 installed inside the base 1, an output end of the fourth motor 12 is connected with a patch tray 8 through a lifting rod 13, a console 14 is installed inside the patch tray 8, a positioning plate 18 is installed at a top of the patch tray 8, a rotating frame 2 is installed on one side of the base 1, the other end of the rotating frame 2 is connected with a baking table 3, a material box 5 is installed inside the baking table 3, a motor box 6 is installed at a bottom of the material box 5, a plurality of second motors 28 are installed inside the material box 5, an output end of each second motor 28 is connected with a telescopic pipe 30, another end of the telescopic pipe 30 is fixedly connected with a dispensing head 31, an electromagnetic valve 33 is sleeved on the dispensing head 31, a roaster 11 is sleeved outside the material box 30, and a top of the telescopic pipe 30 is communicated with the material box 5 through a material conveying. The baking device 11 is arranged to facilitate baking of electrical components after surface mounting is finished, accuracy of the positions of the components is guaranteed to avoid displacement after baking, meanwhile, the baking lamp 9 is arranged to facilitate overall baking of the PCB after surface mounting is finished, uniformity of baking of the whole PCB is guaranteed, the PCB does not need to enter a baking box to be baked independently, production time is shortened, and production efficiency is improved; the control console 14 and the positioning disk 18 are arranged, the camera 23 is arranged on the control console 14, so that the accuracy of the electrical component can be conveniently acquired, and meanwhile, when the position of the electrical component is wrong, the host 15 drives the positioning block 19 to move the electrical component by controlling the first motor 24, so that the position pasting mistake of the electrical component is avoided.
In the present embodiment, as shown in fig. 1 to 3, a main body 15 is provided inside the console 14, a main electromagnet 16 is laid on the top of the console 14, and a moving wheel 17 for moving is provided on the bottom of the console 14. Positioning column 34 is equipped with at the top of positioning disk 18, the inside of positioning column 34 is equipped with camera 23, the below of camera 23 is equipped with fan 22, the inside of positioning disk 18 is equipped with first motor 24, telescopic link 25 is all installed to two output ends of first motor 24, telescopic link 25 passes through connecting block 26 and locating piece 19 fixed connection, the spout 20 that the connecting block 26 of being convenient for removed is seted up on the positioning disk 18, the top of positioning disk 18 is equipped with the secondary electromagnet 21 of mutually supporting with main electromagnet 16. Be equipped with third motor 32 and swivel mount 2, can make third motor 32 drive through swivel mount 2 and toast 3 rotation regulation positions of platform, make it guarantee to toast platform 3 and be located the top of film sticking dish 8 all the time, the point of being convenient for dispensing head 31 glues the paster. The provision of a plurality of patch devices 7 can improve the efficiency of the patch. Be equipped with lifter 13 and fourth motor 12 and be convenient for adjust the height of paster dish 8, make the PCB board be close to the position of baking lamp 9, be convenient for toast.
In this embodiment, as shown in fig. 1 to 7, the two sides of the second motor 28 are both obliquely installed with supporting rods 29 for positioning, the roaster 11 is two hollow truncated cone-shaped roasters whose bottoms are combined with each other, the inside of the roaster 11 is laid with uniformly distributed heating wires, and the bottom of the roaster 11 is provided with a circular hole for the dispensing head 31 to enter and exit. The rotating frame 2 is an inverted J-shaped rotating frame, a third motor 32 is arranged inside the base 1, and the output end of the third motor 32 is fixedly connected with the bottom of the rotating frame 2. The positioning plate 18 is a semi-cylindrical patch plate, and the positioning column 34 is a semi-cylindrical positioning column. The bottom of toasting the platform 3 is equipped with a plurality of evenly distributed's toast lamp 9, toasts the top of platform 3 and is equipped with the feed inlet 4 of mutually supporting with material case 5. The paster disc 8 is located and toasts the platform 3 under, toasts the platform 3 for cylindric toasting the platform, and paster disc 8 is prismoid form paster disc. The positioning plate 18 is a semi-cylindrical patch plate, and the positioning column 34 is a semi-cylindrical positioning column for adjusting the position of the electrical component. The main electromagnet 16 is arranged on the console 14, the secondary electromagnet 21 is arranged on the positioning plate 18, so that the two can be matched with each other conveniently, a track does not need to be arranged on the film sticking plate 8, and the attractiveness of the film sticking plate 8 is improved. The fan 22 is arranged to facilitate cooling of the PCB after baking is finished, so that cooling and shaping of electrical components are accelerated.
A chip mounting method of PCB chip mounting equipment comprises the following steps:
step 1: placing the PCB on the surface mount disc 8, and placing the electrical component on the PCB by using a manipulator;
step 2: operating the console 14 and starting the main electromagnet 16 to drive the positioning disc 18 to operate, enabling the camera 23 to collect position information of the electrical component on the PCB and transmit the position information to the host computer 15, and enabling the host computer 15 to start the first motor 24 to drive the positioning block 19 to move the electrical component to a position where the electrical component needs to be pasted;
and step 3: after the position is determined, the second motor 28 is started to drive the extension tube 30 to fall down, the electromagnetic valve 33 is opened, and the adhesive is released, so that the adhesive is adhered to the PCB;
and 4, step 4: after dispensing, starting a roaster 11 to carry out 5-20 s on the electrical components subjected to dispensing;
and 5: after all electrical components paster, start and bake out lamp 9 and carry out 2~10s to whole PCB board, the paster is accomplished.
In summary, in this embodiment, according to the PCB board mounting apparatus and the PCB board mounting method of this embodiment, the PCB board mounting apparatus and the PCB board mounting method provided in this embodiment are provided with the third motor 32 and the rotating frame 2, so that the third motor 32 can drive the baking table 3 to rotate and adjust the position through the rotating frame 2, and it is ensured that the baking table 3 is always located above the mounting plate 8, thereby facilitating the dispensing and mounting of the dispensing head 31. The provision of a plurality of patch devices 7 can improve the efficiency of the patch. Be equipped with lifter 13 and fourth motor 12 and be convenient for adjust the height of paster dish 8, make the PCB board be close to the position of baking lamp 9, be convenient for toast. The positioning plate 18 is a semi-cylindrical patch plate, and the positioning column 34 is a semi-cylindrical positioning column for adjusting the position of the electrical component. The main electromagnet 16 is arranged on the console 14, the secondary electromagnet 21 is arranged on the positioning plate 18, so that the two can be matched with each other conveniently, a track does not need to be arranged on the film sticking plate 8, and the attractiveness of the film sticking plate 8 is improved. The fan 22 is arranged to facilitate cooling of the PCB after baking is finished, so that cooling and shaping of electrical components are accelerated.
The above description is only for the purpose of illustrating the present invention and is not intended to limit the scope of the present invention, and any person skilled in the art can substitute or change the technical solution of the present invention and its conception within the scope of the present invention.
Claims (8)
1. The PCB board paster equipment is characterized by comprising a base (1) and a fourth motor (12) installed inside the base (1), wherein the output end of the fourth motor (12) is connected with a paster disc (8) through a lifting rod (13), a control console (14) is arranged inside the paster disc (8), a positioning disc (18) is arranged at the top of the paster disc (8), a rotating frame (2) is arranged on one side of the base (1), the other end of the rotating frame (2) is connected with a baking table (3), a material box (5) is arranged inside the baking table (3), a motor box (6) is arranged at the bottom of the material box (5), a plurality of second motors (28) are arranged inside the material box (5), the output end of each second motor (28) is connected with a corresponding one of the corresponding telescopic pipes (30), and glue dispensing heads (31) are fixedly connected to the other ends of the telescopic pipes (30), the upper cover of dispensing head (31) is equipped with solenoid valve (33), the outside cover of flexible pipe (30) is equipped with roaster (11), the top of flexible pipe (30) pass through conveying pipeline (27) with material case (5) intercommunication, the inside of control cabinet (14) is equipped with host computer (15), main electromagnet (16) have been laid at the top of control cabinet (14), the bottom of control cabinet (14) is equipped with removal wheel (17) for the removal, the top of positioning disk (18) is equipped with reference column (34), the inside of reference column (34) is equipped with camera (23), the below of camera (23) is equipped with fan (22), the inside of positioning disk (18) is equipped with first motor (24), telescopic link (25) are all installed to two outputs of first motor (24), telescopic link (25) through connecting block (26) with locating block (19) fixed connection, a sliding groove (20) convenient for the connecting block (26) to move is formed in the positioning disc (18), and a secondary electromagnet (21) matched with the main electromagnet (16) is arranged at the top of the positioning disc (18).
2. The PCB board mounting device of claim 1, wherein two sides of the second motor (28) are obliquely provided with supporting rods (29) for positioning, the roaster (11) is two hollow truncated cone-shaped roasters with bottoms combined with each other, heating wires are uniformly distributed in the roaster (11), and a circular hole for the dispensing head (31) to enter and exit is formed in the bottom of the roaster (11).
3. The PCB board paster device according to claim 1, wherein the rotating frame (2) is an inverted J-shaped rotating frame, a third motor (32) is arranged inside the base (1), and the output end of the third motor (32) is fixedly connected with the bottom of the rotating frame (2).
4. The PCB board pasting device of claim 1, wherein the positioning plate (18) is a semi-cylindrical pasting plate, and the positioning posts (34) are semi-cylindrical positioning posts.
5. The PCB board paster device according to claim 1, wherein a plurality of baking lamps (9) are uniformly distributed at the bottom of the baking table (3), and a feeding port (4) matched with the material box (5) is arranged at the top of the baking table (3).
6. The PCB board pasting device of claim 1, characterized in that the pasting disk (8) is located right below the baking table (3), the baking table (3) is a cylindrical baking table, and the pasting disk (8) is a prismoid pasting disk.
7. A chip mounting method based on the PCB chip mounting device of any one of claims 1-6, characterized by comprising the following steps:
step 1: placing the PCB on a film sticking disc (8), and placing an electrical component on the PCB by using a manipulator;
step 2: the control console (14) is operated, the main electromagnet (16) is started to drive the positioning disc (18) to operate, the camera (23) is enabled to collect position information of the electrical component on the PCB and transmit the position information to the host (15), and the host (15) starts the first motor (24) to drive the positioning block (19) to move the electrical component to a position where the electrical component needs to be pasted;
and step 3: after the position is determined, a second motor (28) is started to drive a telescopic pipe (30) to fall down and open an electromagnetic valve (33), and the adhesive is released to be adhered to the PCB;
and 4, step 4: after dispensing is finished, starting a roaster (11) to carry out 5-20 s on the electrical components subjected to dispensing;
and 5: after all electrical components paster, start baking lamp (9) and carry out 2~10s to whole PCB board, the paster is accomplished.
8. The mounting method of PCB board mounting device according to claim 7, wherein in step 2, the host computer (15) controls the moving direction of the moving wheel (17) according to the information collecting data of the camera (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010512759.3A CN111601466B (en) | 2020-06-08 | 2020-06-08 | PCB (printed circuit board) chip mounting equipment and chip mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010512759.3A CN111601466B (en) | 2020-06-08 | 2020-06-08 | PCB (printed circuit board) chip mounting equipment and chip mounting method |
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| Publication Number | Publication Date |
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| CN111601466A CN111601466A (en) | 2020-08-28 |
| CN111601466B true CN111601466B (en) | 2021-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010512759.3A Active CN111601466B (en) | 2020-06-08 | 2020-06-08 | PCB (printed circuit board) chip mounting equipment and chip mounting method |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1893011A (en) * | 2005-07-06 | 2007-01-10 | 松下电器产业株式会社 | Component pressing device |
| CN101366327A (en) * | 2006-11-07 | 2009-02-11 | 西门子公司 | Placement head comprising a readjusting mechanism, and placement robot |
| KR200447751Y1 (en) * | 2009-06-22 | 2010-02-16 | 제너셈(주) | Focusing controlling apparatus of 3D vision inspection apparatus |
| CN106793747A (en) * | 2017-01-10 | 2017-05-31 | 广东牧特智能装备股份有限公司 | A kind of automatic FPC make-up machines and pasting board method |
| CN206323666U (en) * | 2017-01-06 | 2017-07-11 | 惠安驰骏机械有限公司 | A kind of use for electronic products dispensing paster apparatus |
| CN106998624A (en) * | 2017-04-25 | 2017-08-01 | 广州市楚微信息科技有限公司 | Surface encapsulation chip mounter suction nozzle concentricity automatic compensating method and system |
| CN209593962U (en) * | 2018-09-21 | 2019-11-05 | 北京梦之墨科技有限公司 | A kind of liquid metal printer |
| CN209964397U (en) * | 2019-04-09 | 2020-01-17 | 温州市汇谷科技有限公司 | SMT paster processingequipment |
-
2020
- 2020-06-08 CN CN202010512759.3A patent/CN111601466B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1893011A (en) * | 2005-07-06 | 2007-01-10 | 松下电器产业株式会社 | Component pressing device |
| CN101366327A (en) * | 2006-11-07 | 2009-02-11 | 西门子公司 | Placement head comprising a readjusting mechanism, and placement robot |
| KR200447751Y1 (en) * | 2009-06-22 | 2010-02-16 | 제너셈(주) | Focusing controlling apparatus of 3D vision inspection apparatus |
| CN206323666U (en) * | 2017-01-06 | 2017-07-11 | 惠安驰骏机械有限公司 | A kind of use for electronic products dispensing paster apparatus |
| CN106793747A (en) * | 2017-01-10 | 2017-05-31 | 广东牧特智能装备股份有限公司 | A kind of automatic FPC make-up machines and pasting board method |
| CN106998624A (en) * | 2017-04-25 | 2017-08-01 | 广州市楚微信息科技有限公司 | Surface encapsulation chip mounter suction nozzle concentricity automatic compensating method and system |
| CN209593962U (en) * | 2018-09-21 | 2019-11-05 | 北京梦之墨科技有限公司 | A kind of liquid metal printer |
| CN209964397U (en) * | 2019-04-09 | 2020-01-17 | 温州市汇谷科技有限公司 | SMT paster processingequipment |
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| CN111601466A (en) | 2020-08-28 |
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