CN107146839B - A kind of continuous crystal solidifying apparatus of LED and its die-bonding method - Google Patents
A kind of continuous crystal solidifying apparatus of LED and its die-bonding method Download PDFInfo
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- CN107146839B CN107146839B CN201710308968.4A CN201710308968A CN107146839B CN 107146839 B CN107146839 B CN 107146839B CN 201710308968 A CN201710308968 A CN 201710308968A CN 107146839 B CN107146839 B CN 107146839B
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 23
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
A kind of continuous crystal solidifying apparatus of LED and its die-bonding method are related to LED chip encapsulation.Described device is equipped with substrate film feeding system, transmission system, dispenser system, die bond system, heating system and substrate and goes out membranous system；The substrate film feeding system, transmission system, dispenser system, die bond system, heating system and substrate go out membranous system and are sequentially placed in ground.The die-bonding method is included: installation and is carried out the transmission of substrate using substrate film feeding system and transmission system；The dispensing of substrate is carried out using dispenser system；The LED die bond of substrate is carried out using die bond system；The solidification of elargol is carried out using heating system；It is bonded in LED chip firmly on substrate.It can be obtained the continuous carbon SiClx ceramic substrate encapsulating products of high quality, realize the onboard led chip of continuous carbonization silicon thin film substrate continuously automatic die bond and encapsulating products industrialized production, obtain the more superior LED finished device of performance.
Description
Technical field
The present invention relates to LED chip encapsulation, more particularly, to a kind of continuous crystal solidifying apparatus of LED and its die-bonding method.
Background technique
LED (Light Emitting Diode) has small in size, brightness as a kind of semiconductor devices haveing excellent performance
The features such as height, service life length, energy conservation and environmental protection.In recent years, the output power of LED chip is continuously improved, to power-type LED semiconductor device
For part, high-power Integrated design and small size labyrinth can accumulate amount of heat in a short time, directly acceleration fluorescent powder
Quantum yield decline and device aging, shorten device service life, even result in chip failure.For the heat for generating LED
It more efficiently exports, it is necessary to using high thermal conductivity, the heat sink material of low thermal resistance, and use reasonable encapsulating structure, and then improve
The heat-sinking capability of device.
The heat-radiating substrate that most of power-type LED semiconductor devices is selected currently on the market is broadly divided into two classes: gold
Belong to substrate and ceramic substrate.Metal substrate selects metal material such as Cu, Al etc., although at low cost, its thermal expansion coefficient is big, with
Chip substrate mismatches, and is easy to produce thermal stress, and needs additional insulating layer to overcome its electric conductivity；Ceramic substrate material is such as
Al2O3, AlN etc. there is higher heat-conductivity, lower dielectric constant and dielectric loss, but its preparation process is complicated, at high cost and difficult
To make conductive layer, therefore practical application is restricted.In addition, metal-base composites AlSiC sufficiently combines silicon carbide pottery
The different advantages of porcelain and metallic aluminium, the thermal expansion coefficient to match with high-termal conductivity, with chip, density are small, light-weight, and
High rigidity and high-flexural strength, but extra insulation layer is still needed to, circuit production complex process causes finished device at high cost, does not have
Standby price advantage.
SiC material is strong with thermal conductivity, high mechanical strength, chemical stability are good, the oxidable growth in situ in surface is high absolutely
The good characteristics such as edge layer are easier to match with chip substrate compared with metal-base composites, and make insulating layer without additional,
It is easier to process compared with other ceramic materials, the obtained heat-radiating substrate for high power LED semiconductor device can be very
The heat dissipation problem for solving LED well, just gradually to promoting in the market.
Embrane method is spun with melting according to applicant's precursor pyrolysis and hot pressing disclosed in Chinese patent CN101219788 to combine
Prepare continuous SiC film, using a kind of special carborundum films molding machine, can be prepared surfacing, even compact,
Continuous carborundum films.In addition, widened from branch according to applicant's one kind disclosed in Chinese patent CN105135876A
Support silicon oxygen C film preparation facilities and preparation method, available widened self-supporting silicon oxygen C film.After the film is made, lead to
Silk-screen printing production silver paste conductive layer is crossed, continuous SiC substrate can be obtained.Certainly based on structure-function integration made from process above
SiC thin-film ceramics heat-radiating substrate is supported, has the characteristics that high thermal conductivity, high insulation, high rigidity, and is consistent with chip hot swollen
Swollen coefficient.The operation such as dispensing, die bond, bonding wire is carried out on the substrate, the substrate with LED chip can be obtained, so as to apply
Cloth is mixed with the heat conductive silica gel of fluorescent powder, obtains COB (encapsulation of Chip on Board chip on board) high power LED semiconductor device.
Chip on board encapsulation is the key technology of continuous carbonization silicon substrate encapsulation, and this packaged type is clear in structure, technique
Simply, low in cost, packaging density is not only increased, packaging thermal resistance is also effectively reduced, improve light emitting diode goes out light
Efficiency and service life are suitable for the multiple LED chip array formula encapsulation of same substrate, it is small-sized to meet great-power electronic packaging
Change the requirement with high-density packages.
Chinese patent CN106024647A discloses a kind of COB packaging low cost production thereof, passes through PCB pattern
Technology generations replace existing bracket, eliminate mold opening cost, improve efficiency and flexibility, but its metal for being only applicable to macroplate
Or ceramic substrate.And continuous SiC free film substrate thickness is only 8~100 microns, and narrower width, can not apply this figure
The packaging technology of shape carries out die bond and encapsulation.
Chinese patent CN105932019A discloses a kind of high power LED structure encapsulated using COB, by simplifying encapsulation knot
Structure, spreader surface open up the die bond and encapsulation that the modes such as groove carry out chip on board.This structure requires heat dissipation in die bond
The slot concave/convex that there is height to rise and fall on the surface of material, and continuous SiC free film substrate surface is smooth, thickness is very thin, nothing
Method carries out die bond and encapsulation using this encapsulating structure.
Chinese patent CN104979439A discloses a kind of multirow combination roller bonder, by cylinder linkage dispensing and admittedly
Brilliant process, and die bond is carried out using roller feeding, it may be implemented to carry out die bond to the position on same straight line.But due to
This device is only applicable to the pcb board of fixed-area, needs manually to be replaced after every pcb board die bond, therefore this die bond
Device can not carry out automatically dropping glue and die bond for the continuous film substrate for exceeding hundred meters.
Existing COB packaging technology and encapsulating structure are only applicable to metal or traditional ceramics heat-radiating substrate, the die bond of use
The packaging systems such as machine are also suitable only for plate-like printed circuit board (PCB).Currently, automatic bonder due to die bond efficiency not
The reasons such as height, poor quality, troublesome in poeration are less to be used.COB encapsulation in actual production mostly uses artificial die bond, dispensing
And bonding wire.Although the utilization efficiency of chip can be improved in artificial encapsulation to a certain extent, need in process of production pair
Skilled worker carries out special encapsulation technology training, at high cost, time-consuming, and this accurate encapsulation manual operation often exists seriously
Rigging error, be unfavorable for industrialized production.For highly integrated great power LED die bond, taken using automatic crystal solidifying apparatus
It is the research hotspot of current Packaging Industry for artificial die bond.As a kind of good heat dissipation thin-film material, continuous carbonization silicon thin film
Heat-radiating substrate is long and thin, and is not all suitable for such substrate for the COB packaging method of thick film and automatic crystal solidifying apparatus at present, because
This enables the superiority of the substrate to pass through it is necessary to invent a kind of LED crystal solidifying apparatus that can be adapted for this substrate and method
The industrialized production of device is used widely.According to the characteristic of continuous carbonization silicon thin film substrate, transmission device and die bond are utilized
The mode that device combines is invented a kind of continuous crystal solidifying apparatus of LED and its method, can be greatly improved in continuous carbonization silicon thin film base
Die bond efficiency on plate saves production cost, breaks through the encapsulation bottleneck of carborundum films substrate, realizes that LED chip is continuously automatic
Change die bond industrial production.
The country, which yet there are no, at present is related to the LED crystal solidifying apparatus or die-bonding method of continuous SiC free film ceramic heat-dissipating substrate.
Summary of the invention
It is an object of the invention to be directed to the limitation of existing LED crystal solidifying apparatus, that is, it is only applicable to metal material or biography
Unite ceramic material plate-like printed circuit board (PCB) die bond, a kind of continuous crystal solidifying apparatus of LED and its die bond side are provided
Method.
The continuous crystal solidifying apparatus of LED is equipped with substrate film feeding system, transmission system, dispenser system, die bond system, heating system
System and substrate go out membranous system；The substrate film feeding system, transmission system, dispenser system, die bond system, heating system and substrate go out
Membranous system is sequentially placed in ground；
The continuous carbonization silicon thin film substrate from substrate film feeding system send out, successively reach dispenser system, die bond system and
Heating system carries out die bond on the plate of LED chip, finally goes out from substrate and sends out the substrate for having LED chip from membranous system；
The substrate film feeding system includes carborundum films substrate, substrate reel, motor and bracket, and the support height can
It adjusts, cradle top is fixed with motor, and the shaft leading portion of the motor is equipped with screw thread, 10 substrate reels can at most will be inserted in simultaneously
In the shaft of motor, and can nut fixed substrate reel, by machine shaft rotate drive substrate reel rotation, shaft diameter with
The internal diameter phase of substrate reel；The substrate reel makes carborundum films substrate, and it is just stuck between two side walls and can make base
Board stacking is coiled；
The transmission system includes positioning track, conveyer belt, motor, control panel and supporting leg, and the height of landing leg is adjustable,
Dispenser system, die bond system are respectively fixed at the top of supporting leg；The conveyer belt is high using supporting rack, across dispenser system, die bond
System and heating system can set the revolving speed of its driving motor by control panel to change conveyor belt speed, so that conveyer belt
Speed and substrate film feeding system substrate send out speed it is identical；
The dispenser system includes adhesive dispensing system, workstation control system, two-dimentional bracket workbench, gas cylinder, plastics
The fixed bracket of tracheae, syringe, syringe, Glue dripping head and elargol；The lower end of the syringe is fixed Glue dripping head, and the upper end of syringe is by moulding
Expect that one end of tracheae is fixed firmly, cylinder is provided with elargol, and syringe is fixed on longitudinal pedestal vertically by the fixed bracket of syringe, by two
Dimensional scaffold workbench regulates and controls its relative position；The other end of the plastics tracheae is tightly placed in the gas outlet of gas cylinder；The dispensing control
The gas output and time-controllable dispensing amount that system processed passes through regulation gas cylinder；The workstation control system passes through stepper motor control
Steering, revolving speed and time-controllable two dimension bracket workbench movement；It is described two dimension bracket workbench include transverse moving device,
Longitudinal movement device and vertical fixed device；Vertical fixed device is fixed on the supporting leg of transmission system；Transverse moving device packet
Bottom plate, cross track, cross lead screw, shaft coupling, stepper motor, baffle and transverse base are included, transverse base passes through ball nut
Cross lead screw and frame are fixed on cross track, and cross track is fixed on bottom plate, and cross lead screw is fixed on bottom by baffle
On plate, the axis connection of screw rod one end shaft coupling and stepper motor；Longitudinal movement device includes long rails, longitudinal screw mandrel, connection
Axis device, stepper motor, baffle and longitudinal pedestal, longitudinal pedestal are fixed on longitudinal screw mandrel and frame in long rails by ball nut
On, long rails are fixed in transverse base, and longitudinal screw mandrel is fixed in transverse base by baffle, screw rod one end shaft coupling
With the axis connection of stepper motor；
The die bond system includes feeding device, feeding device, two-dimentional bracket workbench, workstation control system and monitoring
System；The feeding device includes feeding device, brilliant material positioning device and fixed frame；Fixed frame on feeding device will be for
Material device is fixed in transverse base；The feeding device includes wafer, crystal cup and thimble machine, and thimble machine is located under crystal cup
Side is equipped with thimble micromotion mechanism and thimble；The brilliant material positioning device is equipped with stepper motor, shaft coupling, accurate lead screw and guide rail,
Accurate lead screw is connected with the crystal cup on wafer, the feeding device include telescopic cylinder, plastics tracheae, suction nozzle, CCD camera,
Infrared detector, pick-up arm, turning-bar and fixed frame；Feeding device is fixed on vertical by the fixed frame in feeding device vertically
To pedestal；Turning-bar is connected with pick-up arm, and pick-up arm end is equipped with CCD camera and infrared detector, infrared spy straight down
Laser straight down can be launched by surveying device；One end of plastics tracheae is connected with suction nozzle, the plastics tracheae other end and telescopic cylinder
It is closely coupled；The workstation control system is worked by the steering of stepper motor control, revolving speed and time-controllable two dimension bracket
The movement of platform；Two-dimentional bracket workbench include transverse moving device, longitudinal movement device and vertically fix device；Vertical fixed dress
It sets on the supporting leg for being fixed on transmission system；Transverse moving device includes bottom plate, cross track, cross lead screw, shaft coupling, stepping electricity
Machine, baffle and transverse base, transverse base are fixed on cross lead screw and frame on cross track by ball nut, cross track
It is fixed on bottom plate, cross lead screw is fixed on bottom plate by baffle, the axis connection of screw rod one end shaft coupling and stepper motor；
Longitudinal movement device includes that long rails, longitudinal screw mandrel, shaft coupling, stepper motor, baffle and longitudinal pedestal, longitudinal pedestal pass through
Ball nut is fixed on longitudinal screw mandrel and frame on long rails, and long rails are fixed in transverse base, and longitudinal screw mandrel passes through
Baffle is fixed in transverse base, the axis connection of screw rod one end shaft coupling and stepper motor；The monitoring system is equipped with display
Screen and control panel, display screen show the monitoring image of CCD camera and infrared detector, and control panel is to crystal cup position, top
Pin position, telescopic cylinder and turning-bar are regulated and controled；
The heating system include cabinet, baking import, baking outlet, blower motor, fan blade, exhaust outlet, air inlet, every
Thermosphere, heating wire, thermocouple, ventilating board, temperature control panel；Be fitted at three after in front of the enclosure top blower motor and
Exhaust outlet, three air inlets be opened in front of cabinet side respectively in after at three；In the inside of cabinet, fan blade is fixed on air blast electricity vertically
In the shaft of machine, box house is equipped with thermal insulation layer, and 6 heating wire are fixed on non-entering to dry inside thermal insulation layer vertically respectively and bake mouth
Two sides.There are three thermocouples for suspension respectively at three after in front of the thermal insulation layer inside, for monitoring heating system internal temperature simultaneously
Temperature adjusting is carried out by temperature control panel.The baking import is only capable of through conveyer belt and substrate, the latter half of transmission system
Into cabinet inside, the conveyer belt bottom is thermal insulation layer, and conveyer belt turns back to form periodic motion before reaching baking outlet；
The substrate goes out membranous system equipped with receiving platform, baking of the carborundum films substrate with LED chip from heating system
Outlet is continuously sent to receiving platform.
The substrate reel internal diameter is preferably 20mm, and outer diameter is not less than 80mm, has film substrate, outer diameter two sides on outer diameter
Should respectively have a height of 20mm of wall, wall thickness is the side wall of 1mm so that carborundum films substrate its be just stuck between two side walls
And substrate can be made to be laminated into volume, guarantee that substrate launching position is fixed when reel rotation, substrate reel integral thickness 3~10mm it
Between can be changed, material is preferably plastics；The substrate width can be 1~8mm.
The conveyor width is fixed as 100mm, and ten substrates can be driven to move ahead side by side.The positioning track is fixed on biography
Send band front end, be equipped with ten tracks altogether, overall width and conveyer belt it is of same size, the width of every track should be with substrate
Of same size, distance is adjustable between track and track, a length of 100mm of positioning track, width 100mm, a height of 10mm, positioning track
Material be plastics.
The crystalline substance diameter of a circle can be 100mm, 150mm or 200mm, and chip is spaced about 0.6mm after expanding crystalline substance；Crystal cup it is straight
For diameter by the size control of diameter wafer, pedestal diameters can be 150mm, 200mm or 250mm；Thimble machine is located at below crystal cup,
Equipped with thimble micromotion mechanism and thimble, thimble is milled by tungsten steel precision, length in 10mm or so, body diameter 0.68mm~
Between 0.70mm, thimble tip is generally spherical in shape, and tip arc radius is preferably 0.1mm.The screw pitch of the accurate lead screw is most
It is well 5mm.The tip diameter size of the suction nozzle can be preferably according to chip size size control, the radius at suction nozzle tip
0.25mm, suction nozzle length are preferably 40mm or so, and the material of suction nozzle preferably selects bakelite suction nozzle.
The length of the cabinet can be 1.5m；The baking import is only capable of through conveyer belt and substrate, a height of 70mm, is dried
Roasting entrance width is 100mm.The baking outlet is only capable of through at most ten substrates, a height of 5mm, width 100mm.
The continuous die-bonding method of LED the following steps are included:
1) install and carry out using substrate film feeding system and transmission system the transmission of substrate；
2) dispensing of substrate is carried out using dispenser system；
3) the LED die bond of substrate is carried out using die bond system；
4) solidification of elargol is carried out using heating system；
5) it is bonded in LED chip firmly on substrate.
In step 1), the specific side of the installation and the transmission using substrate film feeding system and transmission system progress substrate
Method can are as follows:
(1) in the shaft that the substrate reel of at most ten consistency of thickness is covered to insertion motor simultaneously, tightening nut makes reel
Position fix, substrate send out during do not move；
(2) it is secured with nuts the height of transmission system, the highest point of conveyer belt should be cut with coiled substrate highest point as far as possible
Line is in same level；
(3) leading portion of conveyer belt is positioning track, with tweezers by each substrate respectively from reel pull-out after, be accurately caught in
In each track of positioning track, so that fixed film substrate enters the position of conveyer belt；
(4) setting substrate and the transmission speed of conveyer belt is all 0.5m/min, automatic to open substrate film feeding system simultaneously
The motor of motor and transmission system does the forward travel fricton-tight with conveyer belt after so that substrate is entered conveyer belt.
In step 2), the specific method for dispensing glue for carrying out substrate using dispenser system can are as follows:
(1) when substrate at dispensing when being transferred into immediately below Glue dripping head, the motor and power train of substrate film feeding system
The motor of system is simultaneously stopped immediately, substrate stop motion；
(2) Glue dripping head is moved to right above first substrate central axes of left number by workstation control system, and Glue dripping head is most
The height distance of lower end and left first substrate of number is 2mm；
(3) under the regulation of adhesive dispensing system, the gas in gas cylinder is squeezed out the elargol in syringe by plastics tracheae
Glue dripping head, where falling in elargol accurately on the central axes of substrate；
(4) using adhesive dispensing system adjust gel quantity, it is ensured that can be obtained on substrate every time diameter about 0.2~
The elargol of 0.3mm；It should be noted that the elargol of about 3/4 syringe volume, first substrate dispensing should be full of in syringe before first time dispensing
After, workstation control system, which turns right Glue dripping head, to be moved a certain distance to the surface of left several Article 2 substrates central axes,
The height distance of the bottom and left several Article 2 substrates that keep Glue dripping head is preferably 2mm, then in the tune of adhesive dispensing system
Under control, the elargol in syringe is squeezed out and is fallen on substrate；
(5) it repeats step (1)~(4) from left to right successively to complete all substrate dispensings, the dispensing process of substrate is general
For 1min, the substrate for being coated with elargol is obtained after the completion of dispensing, waits 2min later, then open substrate film feeding system simultaneously automatically
Motor and transmission system motor, so that substrate is continued to do the forward travel fricton-tight with conveyer belt, set after 6s it is automatic simultaneously
Stop the motor of substrate film feeding system and the motor of transmission system, substrate is made to halt, and starts to carry out dispensing；Same base
Distance for dispensing glue is 50mm twice on plate.
In step 3), the specific method of the LED die bond that substrate is carried out using die bond system can are as follows:
(1) before substrate for dispensing glue reaches die bond system, pick-up arm position is adjusted by workstation control system, make its
The surface of left first substrate central axes of number；
(2) infrared detector should be located at the surface 50mm of the substrate central axes, infrared detector be opened, when infrared spy
When survey device monitors elargol, the motor of substrate film feeding system and the motor stalls of transmission system, substrate halt, and start
Carry out onboard led chip die bond；
(3) position that suction nozzle should be mixed up before first time feeding makes it be placed exactly in elargol center on first substrate of left number
Surface, at this time CCD camera can by the image information of one line of two o'clock taken reflect on a display screen；
(4) control turning-bar rotates clockwise 45 °, and suction nozzle is mobile brilliant by the program set above crystal cup at this time
Seat and thimble machine, so that suction nozzle, chip and thimble are on the same line, the sight alignment that CCD camera can will take at this time
Image information reflection on a display screen；
(5) regulate and control to inhale brilliant height in vertical direction by workstation control system, decline suction nozzle height make suction nozzle with
The distance of wafer is preferably 2mm；
(6) thimble jacks up chip when feeding, opens simultaneously telescopic cylinder, takes air in suction nozzle away, so that vacuum slot
Chip is picked up, so that suction nozzle is risen 48mm vertically by workstation control system, turning-bar is rotated counterclockwise 45 °, is taken at this time
Material arm returns to right above first substrate central axes of left number；
(7) being vertically lowered suction nozzle is bonded chip with elargol, simultaneously closes off telescopic cylinder, at this time Ying Chengxian on display screen
The image that chip and elargol fit closely；
After (8) first substrate die bonds, suction nozzle is set to rise 50mm by workstation control system, then moved to right one
Set a distance passes through the information of infrared detector and display screen to the surface of left several Article 2 substrate elargol, confirms suction nozzle
Correct position, start die bond, every substrate die bond is from left to right successively completed in (1)~(7) that repeat the above steps, substrate
Die bond process is generally 3min；
(9) substrate of microarray strip is obtained after the completion of die bond, the automatic motor and power train for opening substrate film feeding system simultaneously
The motor of system makes substrate continue to do the forward travel fricton-tight with conveyer belt, is simultaneously stopped substrate film feeding system automatically after setting 6s
The motor of system and the motor of transmission system, make substrate halt, and start progress die bond, two neighboring on same substrate
The distance of LED chip is 50mm.
In step 4), the cured specific method for carrying out elargol using heating system can are as follows:
Conveyer belt and substrate are entered in cabinet together by baking import, and the temperature in cabinet thermal insulation layer can not be entered in substrate
125 DEG C of constant temperature are set before cabinet in temperature control panel, the effective heated length of cabinet is about 1.5m, the transmission of conveyer belt and substrate
Speed is 0.5m/min, and total transmission time 3min, the spacing of two chips of every substrate is 50mm, in cabinet on each substrate
There can be about 30 LED chips simultaneously, up to 3min of individual process time, the total elapsed time 90min of each chip, therefore
The total time of elargol baking-curing is 93min；After being completely heat-treated, elargol solidification is completed, is bonded in LED chip tightly
On substrate；Substrate is sent out by baking outlet；Conveyer belt back transmits formation circulation.
It is described when the motor of the motor of substrate film feeding system and transmission system is simultaneously stopped rotation, dispenser system and die bond
System carries out operation to substrate simultaneously, and the activity duration adds up to 3min.Two motors are rotated simultaneously again after 3min, are rotated
It is simultaneously stopped again after 6s, and starts dispensing operation and die bond operation.It is realized based on this circulation to coiled silicon carbide ceramics substrate
Dispensing and the serialization of die bond and automation processing.
After completing above-mentioned encapsulation process, a series of carborundum films substrates with LED chip, these substrates will be obtained
It is sent to receiving platform, post-production can be carried out.After an entire volume substrate use, new substrate reel is needed to change, and repeat
The die-bonding method of this crystal solidifying apparatus, to complete more carborundum films substrate die bonds.
In conclusion the present invention provides a kind of continuous crystal solidifying apparatus of LED and die-bonding method, using continuous carbonization silicon thin film as base
Plate, the mode combined using transmission device and crystal solidifying apparatus carry out dispensing, die bond and baking to coiled carborundum films substrate
It is roasting, obtain a series of carborundum films substrates with chip.It, can be continuous using crystal solidifying apparatus and die-bonding method of the invention
Die bond is carried out to carborundum films substrate, LED chip die bond efficiency is greatly improved, has filled up existing crystal solidifying apparatus and die bond technique
The blank that chip on board die bond can not be carried out for continuous thin film substrate, it is for dispensing glue accurate compared with existing artificial die bond
The utilization rate of property and LED chip will be further enhanced.Work is encapsulated based on this COB (chip on board encapsulation) for carrying out substrate
The continuous carbon SiClx ceramic substrate encapsulating products of high quality can be obtained in skill, realize the onboard led core of continuous carbonization silicon thin film substrate
Piece continuously automatic die bond and encapsulating products industrialized production, obtain the more superior LED finished device of performance.
Detailed description of the invention
Fig. 1 is the main view of the continuous crystal solidifying apparatus of LED of the present invention.
Fig. 2 is the schematic diagram of substrate reel and substrate top perspective view in substrate film feeding system in Fig. 1.
Fig. 3 is the schematic diagram of positioning track in transmission system in Fig. 1.
Fig. 4 is the main view of dispenser system in Fig. 1.
Fig. 5 is the side view of dispenser system in Fig. 1.
Fig. 6 is the main view of die bond system in Fig. 1.
Fig. 7 is the side view of die bond system in Fig. 1.
Fig. 8 is the magnified partial view of feeding device in Fig. 6 die bond system.
Fig. 9 is the partial duty schematic diagram of Fig. 6 die bond system.
Figure 10 is conveyer belt upper substrate partial enlarged view in Fig. 9.
Figure 11 is the side view of heating system in Fig. 1.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer and understand, below in conjunction with exemplary embodiment,
And describe the present invention with reference to the accompanying drawings.
The continuous crystal solidifying apparatus of this kind of LED provided by the invention, as shown in Figure 1, comprising: substrate film feeding system 1, transmission system
2, dispenser system 3, die bond system 4, heating system 5 and substrate go out membranous system 6.Go out in membranous system 1 in substrate, including to die bond
Carborundum films substrate 10, drive substrate reel 11, the motor 12 and bracket 13 that rotate.In transmission system 2, including it is located at and passes
Send the positioning track 21 of 22 front end of band, high-temperature resistant rubber conveyer belt 22, motor 23, velocity of rotation control panel 24 and supporting leg
25.In dispenser system 3, main includes two-dimentional bracket workbench 31, Glue dripping head 32, plastics tracheae 33, workstation control system
34 and adhesive dispensing system 35 etc..In die bond system 4, main includes two-dimentional bracket workbench 41, feeding device 42, feed dress
Set 43, workstation control system 44 and monitoring system 45 etc..In heating system 5, substrate to be dried by baking import 55 into
Enter, sent out by baking outlet 56, heated baking is carried out to the substrate 50 for completing die bond by the heating device in cabinet 51, it is described
Heating device includes temperature control panel 52, three blower motors 531,532,533 and three exhaust outlets 54 etc..Go out membranous system in substrate
In 6, the sliding surface ceramics receiving platform 61 including receiving the carborundum films substrate 60 of sealing chip.
Wherein, as shown in Fig. 2, the substrate reel 11 for belonging to substrate film feeding system 1 is made of plastics, internal diameter is
20mm, outer diameter 100mm, thickness can be changed in 3~10mm according to the width of carborundum films substrate 10, for fixing silicon carbide
Film substrate 10 is laminated coiled two side walls wall height and is fixed as 20mm, and wall thickness is fixed as 1mm.10 width of substrate should be 1
Between~8mm, it is stuck in it just between the two side walls of substrate reel 11.In general, a complete substrate reel 11
Contained substrate 10 should be in 200m or more.It, can be same by the substrate reel 11 of at most ten consistency of thickness when using die bond of the present invention
When set be inserted in the shaft of motor 12, using it is preceding must true substrate reel 11 fastening, slide it will not between each other.At this
In exemplary embodiment, the width of carborundum films substrate is fixed as 2mm.
As shown in figure 3, the positioning track 21 is made of ten tracks, track overall length is 100mm, width 100mm, a height of
10mm, every track width and substrate it is of same size, distance is adjustable between track.Due to the carbonization in the present exemplary embodiment
Silicon thin film substrate width is 2mm, therefore every track width is 2mm, and interorbital most two sides orbit sidewall and is passed away from being adjusted to 2mm
Sending belt edge distance is 30mm.
As shown in Figures 4 and 5, the dispenser system 3 include: two-dimentional bracket workbench 31, Glue dripping head 32, plastics tracheae 33,
The fixed bracket 39 of workstation control system 34, adhesive dispensing system 35, gas cylinder 36, syringe 37, elargol 38 and syringe.The two dimension
Bracket workbench 31 mainly includes vertical fixed device 311, bottom plate 312, transverse base 313, longitudinal pedestal 314, cross track
3151, long rails 3152, cross lead screw 3161, longitudinal screw mandrel 3162, shaft coupling 3171 and 3172, stepper motor 3181 with
3182, baffle 3191 and 3192.Wherein, tightly lock is on the supporting leg 25 of transmission system 2 for fixed device 311 vertically, by dispenser system 3
It is installed on the surface of transmission system 2.Syringe 37 is fastened on longitudinal pedestal 313 by the fixed bracket 39 of syringe, and the upper end must
Must be locked plastics tracheae, and lower end must be locked Glue dripping head 32.Shaft coupling 3171 locks cross lead screw 3161 and stepper motor 3181
Tightly；Shaft coupling 3172 locks longitudinal screw mandrel 3162 and stepper motor 3182.Transverse base 313 must be fastened on cross with ball nut
To screw rod 3161 and frame is on cross track 3151, and under the regulation of workstation control system 34, stepper motor 3181 drives cross
It is rotated to screw rod 3161, transverse base 313 moves, and in the present example embodiment, must ensure that Glue dripping head 32 can transmit
Side-to-side movement is smooth in width range with 22；Longitudinal pedestal 313 must be fastened on longitudinal screw mandrel 3162 with ball nut and frame exists
On long rails 3152, under the regulation of workstation control system 34, stepper motor 3182 drives longitudinal screw mandrel 3162 to rotate, and indulges
Moved to pedestal 314, in the present example embodiment, must ensure Glue dripping head 32 can at 22 surface 20mm of conveyer belt into
Row dispensing.33 both ends of plastics tracheae are separately connected gas cylinder 36 and syringe 37, and syringe is provided with elargol 38, control system in dispensing
Under the regulation of system 35, the gas in gas cylinder 36 is delivered to syringe 37 by plastics tracheae 33, and gas pressure intensity increases in syringe 37, will
Elargol 38 is depressed into Glue dripping head 32 in cylinder, is squeezed out by Glue dripping head 32.Adhesive dispensing system 35 by control gas cylinder 36 gas output and
Time controls dispensing amount.In the present example embodiment, dispensing amount is fixed as obtaining the glue of diameter 0.2mm on substrate every time
Spot, the substrate after dispensing is in point colloidal state 30 (referring to Fig. 8).
As shown in Figure 6 and Figure 7, the die bond system 4 includes: two-dimentional bracket workbench 41, feeding device 42, feeding device
43, workstation control system 44 and monitoring system 45.The two dimension bracket workbench 41 mainly include vertical fixed device 411,
Bottom plate 412, transverse base 413, longitudinal pedestal 414, cross track 4151, long rails 4152, cross lead screw 4161, Zong Xiangsi
Bar 4162, shaft coupling 4171 and 4172, stepper motor 4181 and 4182, baffle 4191 and 4192.Wherein, device is fixed vertically
Die bond system 4 is installed on the surface of transmission system 2 on the supporting leg 25 of transmission system 2 by 411 tight locks.Reclaimer system 42
Fixed frame 428 is fastened on longitudinal pedestal 414 of two-dimentional bracket workbench 41, enables two-dimentional bracket workbench 41 to feeding
System 42 is controlled.Shaft coupling 4171 locks cross lead screw 4161 and stepper motor 4181；Shaft coupling 4172 is by longitudinal silk
Bar 4162 and stepper motor 4182 are locked.Transverse base 413 must be fastened on cross lead screw 4161 and frame in transverse direction with ball nut
On track 4151, under the regulation of workstation control system 44, stepper motor 4181 drives cross lead screw 4161 to rotate, lateral bottom
Seat 413 moves, and in the present example embodiment, must ensure that the suction nozzle 423 of feeding device 42 can be in the width of conveyer belt 22
Side-to-side movement is smooth in range；Longitudinal pedestal 413 must be fastened on longitudinal screw mandrel 4162 and frame in long rails with ball nut
On 4152, under the regulation of workstation control system 44, stepper motor 4182 drives longitudinal screw mandrel 4162 to rotate, longitudinal pedestal
414 move, and in the present example embodiment, it is suitable must to ensure that suction nozzle 423 can move in 2~50mm above conveyer belt 22
Freely.The feeding device 43, main includes fixed bracket 431, brilliant material positioning device 432, wafer 433, crystal cup 434 and thimble machine
435.For the high usage for ensuring chip, the brilliant screw pitch for expecting accurate lead screw in positioning device should be less than 5mm.It is exemplary at this
In embodiment, wafer carried out expanding in advance it is brilliant, expand it is brilliant after chip chamber away from for 0.6mm, diameter wafer 150mm, pedestal diameters
It is designed as 200mm, wafer and the concyclic heart of crystal cup.It is 10mm that length is equipped with below crystal cup, and body diameter is the thimble of 0.68mm, thimble
Tip arc radius be 0.1mm.The monitoring system 45 includes display screen 451 and control panel 452.
As shown in figure 8, the feeding device 42 specifically include that telescopic cylinder 421 (referring to Fig. 6 and 7), plastics tracheae 422,
Suction nozzle 423, CCD camera 424, infrared detector 425, pick-up arm 426, turning-bar 427 and fixed frame 428 (referring to Fig. 6 and
7).422 one end of plastics tracheae is locked suction nozzle 423, and the other end is locked telescopic cylinder 421 (referring to Fig. 6 and 7).In this exemplary reality
It applies in example, the radius at suction nozzle tip is 0.25mm, and suction nozzle length is 40mm.
As shown in figure 9, die bond system work when, according to the present exemplary embodiment, pick-up arm 426 rotate clockwise 45 ° from
Absorption chip on wafer 432, Chip scale are 16mil × 18mil (0.41mm × 0.46mm), and another mistake hour hands rotate 45 ° for core
Piece is fixed on substrate.Pick-up arm 426 can be achieved to move left and right and complete ten bases under the drive of two-dimentional bracket workbench 41
The die bond process of plate 30.
As shown in Figure 10, substrate is after dispenser system to the processing of die bond system, from the point colloidal state 30 after dispensing to admittedly
Die bond state 40 after crystalline substance.
It as shown in figure 11, mainly include fan blade 511, thermocouple 512, heating wire 513, ventilated net inside the heating system
514, thermal insulation layer 515 etc., and it is equipped with exhaust outlet 54 and air inlet 57.51 overall length 150m of cabinet, substrate 50 to be dried and transmission
Band 22 is toasted from baking import 55 into heating system jointly, and after baking terminates, substrate 60 leaves from baking outlet 56
Heating system enters receiving platform 61, and conveyer belt 22 then forms circulation by back transmitting.
It is that a kind of die bond side LED is proposed below in conjunction with attached drawing to a kind of explanation of LED crystal solidifying apparatus of the present invention above
The exemplary embodiment of method.
A kind of packaging method for continuous thin film ceramic substrate chip packaging system provided by the invention is specific to wrap
Include: installation and the transport that substrate is carried out using substrate film feeding system 1 and transmission system 2 carry out the point of substrate using dispenser system 3
Glue carries out the die bond of LED chip using die bond system 4, and the solidification of elargol is carried out using heating system 5.Specific step is as follows:
It is installing and is being carried out in substrate conveying using substrate film feeding system 1, the substrate reel for being 2mm by ten consistency of thickness
11 cover simultaneously in the shaft of insertion motor 12, and shaft diameter is 20mm and there is screw thread in front end, these substrates volume is fastened with nut
Disk 11 slide it will not between each other, and the spacing between reel 11 is 2mm.With tweezers by ten substrates 10 respectively from ten
It after substrate reel 11 pulls out, is accurately caught in each track of positioning track 21, carefully pulls substrate 10 horizontal by fixed
Position track 21, it is ensured that skew, distortion or bending do not occur for substrate 10, so that fixed substrate 10 enters the position of conveyer belt.To base
10 front end of plate passes through completely after positioning track enters conveyer belt, automatic motor 12, the power train for opening substrate film feeding system 1 simultaneously
The motor 23 of system 2, the transmission speed for setting two motors is mutually all 0.5m/min, is done after so that ten substrates 10 is entered conveyer belt 22
The fricton-tight forward travel with conveyer belt.
In the dispensing for carrying out substrate using dispenser system 3, when ten substrates 10 are to be transferred into Glue dripping head at dispensing
When 32 underface, it is simultaneously stopped the motor 12 of substrate film feeding system 1 and the motor 23 of transmission system 2 immediately, substrate 10 stops fortune
It is dynamic.Glue dripping head 32 is moved to the surface of left first substrate central axes of number by operation element bench control system 34, is adjusted
It is preferably 2mm at a distance from first substrate in the bottom of Glue dripping head 32 and left number.In first time dispensing, elargol 38 should be poured into
About 3/4 is full in syringe 37, before formal dispensing, should control gas cylinder 36 in dispenser system 3 by adjusting adhesive dispensing system 35
Gas output and the time so that an area can be formed after the 2mm of whereabouts from the amount of the elargol 38 squeezed out in Glue dripping head 32 every time
The about gum spot of 0.2~0.3mm.Dispensing is carried out in the surface of first substrate of left number by operation adhesive dispensing system 35,
At this point, the center of gained elargol should be fallen on the central axes of place substrate.After first substrate dispensing, pass through operation
Workstation control system 34 is by the past 4mm that moves right of Glue dripping head 32 to left several Article 2 substrates surfaces, the bottom of Glue dripping head 32
Be preferably 2mm at a distance from left several Article 2 substrates, repeat the above steps from left to right by ten substrates 10 successively dispensing complete.
The dispensing process of ten substrates 10 is generally 1min.Ten substrates 30 for being coated with elargol are obtained after the completion of dispensing.It is automatic after 2min
Open the motor 12 of substrate film feeding system 1 and the motor 23 of transmission system 2 simultaneously, make ten substrates 30 continue to do with conveyer belt without
The forward travel of sliding is simultaneously stopped the motor 12 of substrate film feeding system 1 and the motor of transmission system 2 after setting 6s automatically again
23, dispensing on plate is carried out, the distance of same substrate dispensing twice at this time is 50mm.
In the die bond for carrying out substrate using die bond system 4, before substrate 30 for dispensing glue reaches die bond system 4, pass through tune
Section workstation control system 44 by CCD camera 424 and infrared detector 425 be moved to first substrate central axes of left number just on
At square 50mm, infrared detector 425 should be opened, when infrared detector 425 monitors band with substrate-parallel by adjusting pick-up arm 426
When the substrate 30 of elargol and when the motor 12 of substrate film feeding system 1 and the motor 23 of transmission system 2 stop operating, start to carry out plate
Upper LED chip die bond.The position that suction nozzle 423 should be mixed up before first time feeding is placed exactly in it on first substrate plate of left number
The surface of elargol, the image information of one line of two o'clock taken can be reflected on display screen 451 by CCD camera 424 at this time.
Turning-bar 427 is rotated clockwise 45 °, suction nozzle 423 passes through the mobile crystal cup 434 of the program set above crystal cup 434 at this time
With thimble machine 435 so that suction nozzle 423, the chip on wafer 433 and the thimble on thimble machine 435 are on the same line, at this time
The image information of the sight alignment taken can be reflected on display screen 451 by CCD camera 424.Pass through operation element platform control
System 44 processed regulates and controls in the vertical direction inhales brilliant height, and the height of decline suction nozzle 423 makes suction nozzle 423 at a distance from wafer 433
For 2mm, thimble jacks up chip when feeding, opens simultaneously telescopic cylinder 421, takes air in suction nozzle 423 away, so that vacuum slot
423 pick up chip.Suction nozzle 423 is risen into 48mm in the vertical direction by operation element bench control system 44, by turning-bar
45 ° are rotated counterclockwise, the height of decline suction nozzle 423 is bonded chip with elargol, simultaneously closes off telescopic cylinder 421, shows at this time
The image that chip and elargol fit closely should be presented in display screen 451.After first substrate die bond, pass through operation element platform control
Suction nozzle 423 is risen 50mm by system 44 processed vertically, then moves to right the surface of elargol on 4mm to left several Article 2 substrate plates, simultaneously
By the information of CCD camera 424 and infrared detector 425, the correct position of suction nozzle 424 is confirmed.Then it repeats the above steps
From left to right by ten substrates 30, successively die bond is completed.The die bond process of ten substrates 30 is generally 3min.After the completion of die bond
It is automatic to open the motor 12 of substrate film feeding system 1 and the motor 23 of transmission system 2 simultaneously to the substrate 40 of ten microarray strips, make
Ten substrates 40 continue to do the forward travel fricton-tight with conveyer belt, are simultaneously stopped substrate film feeding system automatically again after setting 6s
1 motor 12 and the motor 23 of transmission system 2 carry out die bond on plate, and same substrate two adjacent LEDs chip distance is at this time
50mm。
In the solidification for carrying out elargol using heating system 5, conveyer belt 22 and ten substrates 40 are together from baking import 55
Into in cabinet 51, the temperature in cabinet thermal insulation layer 515 can be before the substrate 40 of ten microarray strips enter cabinet 21 in control
Setting in warm panel 52 permanent is 125 DEG C；The total time of elargol baking-curing is about 1.5h.After being completely heat-treated, final ten
The carborundum films substrate 60 of the microarray strip of item drying leaves heating system 5 from baking outlet 56, and conveyer belt 22 then back transmits
Form circulation.
After completing above-mentioned encapsulation process, a series of carborundum films substrates 60 with chip, these substrates will be obtained
It is sent to receiving platform 61, waits the processing of next step.To continue to carry out die bond to silicon carbide ceramics substrate 10, then need replacing
New substrate reel 11, and repeat the die-bonding method of this crystal solidifying apparatus.
Technology contents of the invention are explained in detail above.It will be understood by those skilled in the art that: more than
Described is only exemplary embodiment of the present invention, is not intended to restrict the invention.
Claims (6)
1. a kind of continuous crystal solidifying apparatus of LED, it is characterised in that be equipped with substrate film feeding system, transmission system, dispenser system, die bond system
System, heating system and substrate go out membranous system；The substrate film feeding system, transmission system, dispenser system, die bond system, heating system
System and substrate go out membranous system and are sequentially placed in ground；
The continuous carbonization silicon thin film substrate is sent out from substrate film feeding system, successively reaches dispenser system, die bond system and heating
System carries out die bond on the plate of LED chip, finally goes out from substrate and sends out the substrate for having LED chip from membranous system；
The substrate film feeding system includes carborundum films substrate, substrate reel, motor and bracket, and the support height is adjustable,
Cradle top is fixed with motor, and the shaft leading portion of the motor is equipped with screw thread, at most will be inserted in motor simultaneously by 10 substrate reels
Shaft on, and can nut fixed substrate reel, rotated by machine shaft and drive the rotation of substrate reel, shaft diameter and substrate
The internal diameter of reel is identical；The substrate reel makes carborundum films substrate, and it is just stuck between two side walls and can make substrate
Stacking is coiled；
The transmission system includes positioning track, conveyer belt, motor, control panel and supporting leg, and the height of landing leg is adjustable, supporting leg
Top is respectively fixed with dispenser system, die bond system；The conveyer belt is high using supporting rack, across dispenser system, die bond system
And heating system, the revolving speed of its driving motor is set to change conveyor belt speed by control panel, so that the speed of conveyer belt
It is identical that speed is sent out with the substrate of substrate film feeding system；
The dispenser system include adhesive dispensing system, workstation control system, two-dimentional bracket workbench, gas cylinder, plastics tracheae,
The fixed bracket of syringe, syringe, Glue dripping head and elargol；The lower end of the syringe is fixed Glue dripping head, and the upper end of syringe is by plastics gas
One end of pipe is fixed firmly, and cylinder is provided with elargol, and syringe is fixed on longitudinal pedestal vertically by the fixed bracket of syringe, is propped up by two dimension
Frame workbench regulates and controls its relative position；The other end of the plastics tracheae is tightly placed in the gas outlet of gas cylinder；Dispensing control system
The gas output and time-controllable dispensing amount that system passes through regulation gas cylinder；The workstation control system is turned by stepper motor control
To, the movement of revolving speed and time-controllable two dimension bracket workbench；The two dimension bracket workbench includes transverse moving device, longitudinal direction
Telecontrol equipment and vertical fixed device；Vertical fixed device is fixed on the supporting leg of transmission system；Transverse moving device includes bottom
Plate, cross track, cross lead screw, shaft coupling, stepper motor, baffle and transverse base, transverse base are fixed by ball nut
In cross lead screw and frame is on cross track, and cross track is fixed on bottom plate, and cross lead screw is fixed on bottom plate by baffle,
The axis connection of screw rod one end shaft coupling and stepper motor；Longitudinal movement device include long rails, longitudinal screw mandrel, shaft coupling,
Stepper motor, baffle and longitudinal pedestal, longitudinal pedestal are fixed on longitudinal screw mandrel and frame on long rails by ball nut, indulge
It is fixed in transverse base to track, longitudinal screw mandrel is fixed in transverse base by baffle, screw rod one end shaft coupling and step
Into the axis connection of motor；
The die bond system includes feeding device, feeding device, two-dimentional bracket workbench, workstation control system and monitoring system
System；The feeding device includes feeding device, brilliant material positioning device and fixed frame；Fixed frame on feeding device will be fed
Device is fixed in transverse base；The feeding device includes wafer, crystal cup and thimble machine, and thimble machine is located at below crystal cup,
Equipped with thimble micromotion mechanism and thimble；The brilliant material positioning device is equipped with stepper motor, shaft coupling, accurate lead screw and guide rail, essence
Close screw rod is connected with the crystal cup on wafer, and the feeding device includes telescopic cylinder, plastics tracheae, suction nozzle, CCD camera, red
External detector, pick-up arm, turning-bar and fixed frame；Feeding device is fixed on longitudinal direction by the fixed frame in feeding device vertically
Pedestal；Turning-bar is connected with pick-up arm, and pick-up arm end is equipped with CCD camera and infrared detector, infrared acquisition straight down
Device can launch laser straight down；One end of plastics tracheae is connected with suction nozzle, and the plastics tracheae other end and telescopic cylinder are tight
It is close to be connected；The workstation control system passes through the steering of stepper motor control, revolving speed and time-controllable two dimension bracket workbench
Movement；Two-dimentional bracket workbench include transverse moving device, longitudinal movement device and vertically fix device；Vertical fixed device
It is fixed on the supporting leg of transmission system；Transverse moving device includes bottom plate, cross track, cross lead screw, shaft coupling, stepping electricity
Machine, baffle and transverse base, transverse base are fixed on cross lead screw and frame on cross track by ball nut, cross track
It is fixed on bottom plate, cross lead screw is fixed on bottom plate by baffle, the axis connection of screw rod one end shaft coupling and stepper motor；
Longitudinal movement device includes that long rails, longitudinal screw mandrel, shaft coupling, stepper motor, baffle and longitudinal pedestal, longitudinal pedestal pass through
Ball nut is fixed on longitudinal screw mandrel and frame on long rails, and long rails are fixed in transverse base, and longitudinal screw mandrel passes through
Baffle is fixed in transverse base, the axis connection of screw rod one end shaft coupling and stepper motor；The monitoring system is equipped with display
Screen and control panel, display screen show the monitoring image of CCD camera and infrared detector, and control panel is to crystal cup position, top
Pin position, telescopic cylinder and turning-bar are regulated and controled；
The heating system includes cabinet, baking import, baking outlet, blower motor, fan blade, exhaust outlet, air inlet, heat-insulated
Layer, heating wire, thermocouple, ventilating board, temperature control panel；Blower motor and row are fitted at three after in front of the enclosure top
Port, three air inlets be opened in front of cabinet side respectively in after at three；In the inside of cabinet, fan blade is fixed on blower motor vertically
Shaft on, box house is equipped with thermal insulation layer, and 6 heating wire are fixed on the two sides of non-inlet and outlet inside thermal insulation layer vertically respectively；
There are three thermocouples for suspension respectively at three after in front of the thermal insulation layer inside, for monitoring heating system internal temperature and passing through control
Warm panel carries out temperature adjusting；The baking import is only capable of through conveyer belt and substrate, and the latter half of transmission system enters machine
Inside case, the conveyer belt bottom is thermal insulation layer, and conveyer belt turns back to form periodic motion before reaching baking outlet；
The substrate goes out membranous system equipped with receiving platform, and the carborundum films substrate with LED chip is exported from the baking of heating system
Continuously it is sent to receiving platform.
2. a kind of continuous crystal solidifying apparatus of LED as described in claim 1, it is characterised in that the substrate reel internal diameter is 20mm, outside
Diameter is not less than 80mm, has film substrate on outer diameter, and respectively there are a height of 20mm of wall in outer diameter two sides, and wall thickness is the side wall of 1mm, institute
Stating substrate reel integral thickness is 3~10mm, and material is plastics；The substrate width is 1~8mm.
3. a kind of continuous crystal solidifying apparatus of LED as described in claim 1, it is characterised in that the conveyor width is fixed as 100mm；
The a length of 100mm of positioning track, width 100mm, a height of 10mm, the material of positioning track is plastics.
4. a kind of continuous crystal solidifying apparatus of LED as described in claim 1, it is characterised in that the crystalline substance diameter of a circle be 100mm,
150mm or 200mm, expand it is brilliant after chip chamber away from for 0.6mm；By the size control of diameter wafer, pedestal diameters are the diameter of crystal cup
150mm, 200mm or 250mm；The length of the thimble is 10mm, and body diameter is 0.68~0.70mm, and thimble tip is generally in ball
Shape, tip arc radius are 0.1mm；The screw pitch of the accurate lead screw is 5mm；The tip diameter size of the suction nozzle is according to core
Chip size size control, the radius at suction nozzle tip are 0.25mm, and suction nozzle length is 40mm, the material selection bakelite suction nozzle of suction nozzle.
5. a kind of continuous crystal solidifying apparatus of LED as described in claim 1, it is characterised in that the length of the cabinet is 1.5m；It is described
Baking import is only capable of through conveyer belt and substrate, a height of 70mm, and baking entrance width is 100mm；The baking outlet is only capable of leading to
Cross at most ten substrates, a height of 5mm, width 100mm.
The continuous die-bonding method of 6.LED, it is characterised in that the following steps are included:
1) transmission of substrate is installed and carries out using substrate film feeding system and transmission system, method particularly includes:
(1) in the shaft that the substrate reel of at most ten consistency of thickness is covered to insertion motor simultaneously, tightening nut makes the position of reel
Fixation is set, is not moved during substrate is sent out；
(2) be secured with nuts the height of transmission system, the highest point of conveyer belt should the tangent line as far as possible with coiled substrate highest point exist
In same level；
(3) leading portion of conveyer belt is positioning track, with tweezers by each substrate respectively from reel pull-out after, be accurately caught in positioning
In each track of track, so that fixed film substrate enters the position of conveyer belt；
(4) setting substrate and the transmission speed of conveyer belt is all 0.5m/min, the automatic motor for opening substrate film feeding system simultaneously
With the motor of transmission system, the forward travel fricton-tight with conveyer belt is done after so that substrate is entered conveyer belt；
2) dispensing of substrate is carried out using dispenser system, method particularly includes:
(1) when substrate at dispensing when being transferred into immediately below Glue dripping head, the motor of substrate film feeding system and transmission system
Motor is simultaneously stopped immediately, substrate stop motion；
(2) Glue dripping head is moved to right above first substrate central axes of left number by workstation control system, the bottom of Glue dripping head
Height distance with left first substrate of number is 2mm；
(3) under the regulation of adhesive dispensing system, the elargol in syringe is squeezed out dispensing by plastics tracheae by the gas in gas cylinder
Head, where falling in elargol accurately on the central axes of substrate；
(4) gel quantity is adjusted using adhesive dispensing system, it is ensured that can obtain the silver of 0.2~0.3mm of diameter on substrate every time
Glue；It should be noted that being full of the elargol of 3/4 syringe volume, after first substrate dispensing, workbench in syringe before first time dispensing
Control system, which turns right Glue dripping head, to be moved a certain distance to the surface of left several Article 2 substrates central axes, keeps Glue dripping head most
The height distance of lower end and left several Article 2 substrates is 2mm, then under the regulation of adhesive dispensing system, by the elargol in syringe
It squeezes out and falls on substrate；
(5) step (1)~(4) are repeated, dispensing, total dispensing time one successively from left to right is carried out to a certain position of every substrate
As be 1min, the substrate for being coated with elargol at this is obtained after the completion of dispensing, waits 2min later, then automatic open substrate simultaneously and send
The motor of membranous system and the motor of transmission system make substrate continue to do the forward travel fricton-tight with conveyer belt, set after 6s from
The motor of the dynamic motor for being simultaneously stopped substrate film feeding system and transmission system, makes substrate halt, and start to every substrate
Next place place not for dispensing glue carries out dispensing；Distance for dispensing glue is 50mm twice on same substrate；
3) the LED die bond of substrate is carried out using die bond system, method particularly includes:
(1) before substrate for dispensing glue reaches die bond system, pick-up arm position is adjusted by workstation control system, makes it in left number
The surface of first substrate central axes；
(2) infrared detector is located at the surface 50mm of the substrate central axes, opens infrared detector, when infrared detector is supervised
When measuring elargol, the motor of substrate film feeding system and the motor stalls of transmission system, substrate halt, and start to carry out plate
Upper LED chip die bond；
(3) position that suction nozzle should be mixed up before first time feeding makes it be placed exactly on first substrate of left number elargol center just
Top, CCD camera can reflect the image information of one line of two o'clock taken on a display screen at this time；
(4) control turning-bar rotates clockwise 45 °, at this time suction nozzle above crystal cup, by the mobile crystal cup of the program that sets and
Thimble machine, so that suction nozzle, chip and thimble are on the same line, CCD camera can be by the figure of the sight alignment taken at this time
On a display screen as message reflection；
(5) regulate and control to inhale brilliant height in vertical direction by workstation control system, the height for declining suction nozzle makes suction nozzle and wafer
Distance be 2mm；
(6) thimble jacks up chip when feeding, opens simultaneously telescopic cylinder, takes air in suction nozzle away, so that vacuum slot is by core
Piece picks up, and so that suction nozzle is risen 48mm vertically by workstation control system, turning-bar is rotated counterclockwise 45 °, at this time pick-up arm
It returns to right above first substrate central axes of left number；
(7) being vertically lowered suction nozzle is bonded chip with elargol, simultaneously closes off telescopic cylinder, and chip should be presented on display screen at this time
The image fitted closely with elargol；
After (8) first substrate die bonds, suction nozzle is set to rise 50mm by workstation control system, then moved to right a spacing
Surface from extremely left several Article 2 substrate elargol, while passing through the information of infrared detector and display screen, confirm suction nozzle just
True position starts die bond, and every substrate die bond is from left to right successively completed in (1)~(7) that repeat the above steps, the die bond of substrate
Process is generally 3min；
(9) substrate of microarray strip at this is obtained after the completion of die bond, the automatic motor and power train for opening substrate film feeding system simultaneously
The motor of system makes substrate continue to do the forward travel fricton-tight with conveyer belt, is simultaneously stopped substrate film feeding system automatically after setting 6s
The motor of system and the motor of transmission system, make substrate halt, and then start to carry out at next dispensing to every substrate
Die bond；Two adjacent LED chips distance is 50mm on same substrate；
4) solidification of elargol is carried out using heating system, method particularly includes:
Conveyer belt and substrate are entered in cabinet together by baking import, the temperature in cabinet thermal insulation layer substrate do not enter cabinet it
Preceding that 125 DEG C of constant temperature are set in temperature control panel, the effective heated length of cabinet is 1.5m, and the transmission speed of conveyer belt and substrate is
0.5m/min, total transmission time 3min, the spacing of two chips of every substrate are 50mm, are had simultaneously on each substrate in cabinet
30 LED chips, up to 3min of individual process time, the total elapsed time 90min of each chip, therefore elargol baking is solid
The total time of change is 93min；After being completely heat-treated, elargol solidification is completed, is bonded in LED chip tightly on substrate；Base
Plate is sent out by baking outlet；Conveyer belt back transmits formation circulation；
5) it is bonded in LED chip firmly on substrate.
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| CN201710308968.4A CN107146839B (en) | 2017-05-04 | 2017-05-04 | A kind of continuous crystal solidifying apparatus of LED and its die-bonding method |
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| CN201710308968.4A CN107146839B (en) | 2017-05-04 | 2017-05-04 | A kind of continuous crystal solidifying apparatus of LED and its die-bonding method |
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| CN100576589C (en) * | 2007-09-14 | 2009-12-30 | 深圳市龙岗区横岗光台电子厂 | The manufacture method of a kind of LED |
| CN102878470A (en) * | 2011-07-15 | 2013-01-16 | 广东德豪润达电气股份有限公司 | Light-emitting diode (LED) flexible linear light source and manufacturing method thereof |
| CN103050604B (en) * | 2012-11-30 | 2015-09-09 | 广州市鸿利光电股份有限公司 | A kind of manufacture method of MLCOB light source module |
| CN203521465U (en) * | 2013-10-25 | 2014-04-02 | 深圳市新益昌自动化设备有限公司 | Led die bonder |
| CN203631582U (en) * | 2013-11-27 | 2014-06-04 | 东莞市光宇实业有限公司 | surface-mounted LED production line |
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