CN107749438A - A kind of LED die-bonding methods - Google Patents
A kind of LED die-bonding methods Download PDFInfo
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- CN107749438A CN107749438A CN201710778730.8A CN201710778730A CN107749438A CN 107749438 A CN107749438 A CN 107749438A CN 201710778730 A CN201710778730 A CN 201710778730A CN 107749438 A CN107749438 A CN 107749438A
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000000853 adhesive Substances 0.000 claims abstract description 58
- 230000001070 adhesive effect Effects 0.000 claims abstract description 58
- 239000003292 glue Substances 0.000 claims abstract description 30
- 239000000084 colloidal system Substances 0.000 claims abstract description 14
- 238000007598 dipping method Methods 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims abstract description 4
- 230000008569 process Effects 0.000 claims description 13
- 239000004568 cement Substances 0.000 claims description 8
- 239000004922 lacquer Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000003522 acrylic cement Substances 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83024—Applying flux to the bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to LED die bond technical fields, there is provided a kind of LED die-bonding methods, including：Crystalline substance is inhaled, is specially：LED chip is picked up by inhaling brilliant device；Glue is dipped in, is specially：The LED chip bottom is dipped by crystal-bonding adhesive by the brilliant device of suction；Die bond, it is specially：The LED chip is transferred to by support and fixation by the brilliant device of suction；Baking-curing, it is specially：The branch of the fixation LED chip is placed in baking box and carries out baking-curing.Due to dipping in glue after directly LED chip is picked up using suction brilliant device, then carrying out die bond, so as to eliminate Glue dripping head dispensing link, technique is saved, simplifies flow；Simultaneously because crystal-bonding adhesive directly contacts with LED chip bottom, avoid and off normal and the technical problem of colloid skewness easily occurs when LED chip aligns with crystal-bonding adhesive in traditional handicraft.
Description
Technical field
The invention belongs to LED die bond technical fields, are to be related to a kind of LED die-bonding methods more specifically.
Background technology
LED die bonds are also known as Die Bond or load, refer to by colloid (generally conducting resinl, insulating cement or solder)
Wafer bonding in the designated area of support, heat passage or electric pathway are formed, the process that condition is provided is connected for the routing of postorder.
When carrying out LED die bonds, crystal-bonding adhesive is generally dipped by Glue dripping head, puts in support bowl, it is then brilliant with inhaling
Pole is pressed together on LED wafer on crystal-bonding adhesive, and whole process, which needs Glue dripping head and inhales brilliant pole, coordinates completion, and dispensing glue position needs
It is coincide with LED chip bottom.Because die bond colloid is mostly liquid not liquid, therefore needed after dispensing during placement LED chip
LED chip and colloid are aligned, therefore not only technique is cumbersome for traditional LED die bonds mode, and during contraposition
The problem of easily producing off normal.
Above deficiency, has much room for improvement.
The content of the invention
It is an object of the invention to provide a kind of LED die-bonding methods, to solve LED die bonds process present in prior art
The technical problem of off normal is easily produced during cumbersome, LED chip and colloid contraposition.
To achieve the above object, the technical solution adopted by the present invention is：A kind of LED die-bonding methods are provided, including：
Crystalline substance is inhaled, is specially：LED chip is picked up by inhaling brilliant device；
Glue is dipped in, is specially：The LED chip bottom is dipped by crystal-bonding adhesive by the brilliant device of suction；
Die bond, it is specially：The LED chip is transferred to by support and fixation by the brilliant device of suction；
Baking-curing, it is specially：The branch of the fixation LED chip is placed in baking box and carries out baking-curing.
Further, described to inhale brilliant device including inhaling brilliant pole and vacuum equipment, the brilliant pole of suction is hollow, and the brilliant pole of suction
One end be connected with the vacuum equipment, the other end for inhaling brilliant pole is used to be connected with the LED chip.
Further, the brilliant process of suction is specially：
The vacuum equipment starts so that described inhale produces negative pressure in brilliant pole；
One end and the upper surface of the LED chip that brilliant pole is not connected with the vacuum equipment are inhaled by described；
The brilliant pole drive LED chip of inhaling moves up, so as to pick up the LED chip.
Further, the glue process of dipping in is specially：
The LED chip is transferred to above die bond lacquer disk(-sc) by the suction brilliant pole；
The LED chip is dropped to by the contact crystal-bonding adhesive by the brilliant pole of suction；
Risen by the brilliant pole drive LED chip of inhaling, so that the LED chip leaves the crystal-bonding adhesive.
Further, it is described to be inhaled by described during the LED chip drops to the contact crystal-bonding adhesive by brilliant pole, institute
State LED chip and drop to the height for contacting the crystal-bonding adhesive according to the decision of the amount of the required crystal-bonding adhesive, when required described solid
The amount of brilliant glue is more, then the height that the LED chip declines is bigger；When the amount of the required crystal-bonding adhesive is fewer, then the LED core
The height that piece declines is smaller.
Further, it is described during the LED chip being dropped into the contact crystal-bonding adhesive by the suction brilliant pole
LED chip is immersed in thickness of the height no more than the LED chip of the crystal-bonding adhesive.
Further, the die bond process is specially：
The LED chip is transferred to above the support by the suction brilliant pole；
The LED chip is dropped to the die bond position for the base for contacting the support by the brilliant pole of suction；
The vacuum equipment is closed, and the brilliant pole of suction is removed from the LED chip upper surface.
Further, brilliant, the described process for dipping in glue, the die bond and the baking-curing of suction can be by having automated
Into.
Further, the crystal-bonding adhesive is that liquid is heating and curing class colloid, including silicon based insulating glue, epoxy insulating cement,
Acrylic system insulating cement, falope ring oxa- syzygy insulating cement, elargol and Anisotropically conductive heat conduction class colloid.
Further, the support includes COB supports, SMD supports and substrate.
A kind of beneficial effect of LED die-bonding methods provided by the invention is：Brilliant device is inhaled by LED core due to directly using
Piece dips in glue, then carries out die bond after picking up, so as to eliminate Glue dripping head dispensing link, save technique, simplify flow；Simultaneously
Because crystal-bonding adhesive directly contacts with LED chip bottom, avoid and easily occur when LED chip aligns with crystal-bonding adhesive in traditional handicraft
The technical problem of off normal and colloid skewness.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, on the premise of not paying creative work, can also be attached according to these
Figure obtains other accompanying drawings.
Fig. 1 is the flow chart one of LED die-bonding methods provided in an embodiment of the present invention；
Fig. 2 is the flowchart 2 of LED die-bonding methods provided in an embodiment of the present invention；
Fig. 3 is the flow chart 3 of LED die-bonding methods provided in an embodiment of the present invention；
Fig. 4 is the flow chart four of LED die-bonding methods provided in an embodiment of the present invention；
Fig. 5 is the schematic diagram of LED die-bonding methods provided in an embodiment of the present invention.
Wherein, each reference in figure：
1- inhales brilliant pole；2-LED chips；3- die bond lacquer disk(-sc)s；
4- crystal-bonding adhesives；5- supports；
Embodiment
In order that technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
It should be noted that when element is referred to as " being arranged at " another element, it can be directly on another element
Or it is connected on another element.When an element is known as " being connected to " another element, it can directly be connected
It is connected to another element or is indirectly connected on another element.In addition, term " first ", " second " are only used for describing mesh
, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, limit
Surely there is " first ", one or more this feature can be expressed or be implicitly included to the feature of " second ".The present invention's
In description, " multiple " are meant that two or more, unless otherwise specifically defined.
Referring to Fig. 1, a kind of LED die-bonding methods, including：
Step S1：Crystalline substance is inhaled, is specially：LED chip is picked up by inhaling brilliant device；
Step S2：Glue is dipped in, is specially：LED chip bottom is dipped into crystal-bonding adhesive by inhaling brilliant device；
Step S3：Die bond, it is specially：The LED chip is transferred to by support and fixation by the brilliant device of suction；
Step S4：Baking-curing, it is specially：The branch of the fixation LED chip is placed in baking box and toasted
Solidification.
The beneficial effect for the LED die-bonding methods that the present embodiment provides is：Brilliant device is inhaled by LED chip due to directly using
Glue is dipped in after picking up, then carries out die bond, so as to eliminate Glue dripping head dispensing link, technique is saved, simplifies flow；While by
Directly contacted in crystal-bonding adhesive with LED chip bottom, avoid and easily occur partially when LED chip aligns with crystal-bonding adhesive in traditional handicraft
Position and the technical problem of colloid skewness, without contraposition during die bond, and crystal-bonding adhesive distribution is more uniform.
Further, inhaling brilliant device includes inhaling brilliant pole and vacuum equipment, inhales that brilliant pole is hollow, and the one end and vacuum for inhaling brilliant pole are set
Standby to be connected, the other end for inhaling brilliant pole is used to be connected with LED chip.Can be to inhale brilliant pole carry after vacuum equipment is connected with the brilliant pole of suction
For negative pressure, so that inhaling when brilliant pole contacts with LED chip smoothly can pick up LED chip.It should be appreciated that inhale brilliant pole
Can be any equipment that LED chip can be picked up, such as conventional suction nozzle etc.；Inhaling the power of the suction of brilliant pole can be set by vacuum
Standby different working modes provide.
Referring to Fig. 2, further, step S1 is specially：
Step S101：Vacuum equipment starts so that inhales and negative pressure is produced in brilliant pole；
Step S102：The upper surface of one end that brilliant pole is not connected with vacuum equipment and LED chip will be inhaled；
Step S103：Inhaling brilliant pole drives LED chip to move up, so as to pick up LED chip.
Referring to Fig. 3, further, step S2 is specially：
Step S201：LED chip is transferred to above die bond lacquer disk(-sc) by inhaling brilliant pole；
Step S202：LED chip is dropped into contact crystal-bonding adhesive by inhaling brilliant pole；
Step S203：LED chip is driven to rise by inhaling brilliant pole, so that LED chip leaves crystal-bonding adhesive.
Further, during step S22, LED chip drops to the height for contacting crystal-bonding adhesive crystal-bonding adhesive needed for
Amount determines that when the amount of required crystal-bonding adhesive is more, then the height that LED chip declines is bigger；When the amount of required crystal-bonding adhesive is fewer, then
The height that LED chip declines is smaller, and LED chip is immersed in thickness of the height no more than LED chip of crystal-bonding adhesive.
The height of crystal-bonding adhesive is immersed by LED chip to control the method for amount that LED chip dips crystal-bonding adhesive simple to operate,
It is and controllable.Traditional uses in Glue dripping head technique for dispensing glue, when LED chip is large scale LED chip or rectangle LED chip
When, the mode of generally use multi-point adhesive or control the dispensing amount of crystal-bonding adhesive by the way of more Glue dripping heads, need during dispensing
Debugged；When dispensing amount is excessive, the mode of generally use centrifugation is thinned dispensing amount, but so operation can increase work
Sequence, it is not only cumbersome, cost is added, and also crystal-bonding adhesive spreads in centrifugal process, and it is serious so as to be produced to subsequent handling
Influence；Moreover, during centrifugation, also with the diffusion of crystal-bonding adhesive off normal can occur for LED chip.
In the present embodiment, it is once to complete because LED chip dips crystal-bonding adhesive, and it is unrelated with the shape of LED chip, because
This avoids multiple process for dispensing glue in traditional handicraft, simplifies work when LED chip is larger chip or oblong chips
Skill, dispensing efficiency is improved, eliminate the fittings cost of more Glue dripping heads, and avoid LED chip center die bond in traditional handicraft
Glue glue amount is more and situation that surrounding glue amount is few so that crystal-bonding adhesive distribution is more uniform.
Referring to Fig. 4, further, step S3 is specially：
Step S301：LED chip is transferred to above support by inhaling brilliant pole；
Step S302：By inhale brilliant pole by LED chip drop to contact support base die bond position；
Step S303：Vacuum equipment is closed, and brilliant pole will be inhaled and removed from LED chip upper surface.
It should be appreciated that in above-mentioned steps S303, vacuum equipment can not also be closed, but by the suction of vacuum equipment
Reduce, can be removed until inhaling brilliant pole from LED chip.
Further, LED chip includes formal dress structure LED chip and single electric level LED chip.
Further, crystal-bonding adhesive is that liquid is heating and curing class colloid, including silicon based insulating glue, epoxy insulating cement, Ya Ke
Power system insulating cement, falope ring oxa- syzygy insulating cement, elargol and Anisotropically conductive heat conduction class colloid etc..
Further, support includes COB supports, SMD supports and substrate.
Further, the branch for being fixed with LED chip is placed in step S4 during carrying out baking-curing in baking box, by
Be that liquid is heating and curing class colloid in crystal-bonding adhesive, therefore when the temperature increases, crystal-bonding adhesive can solidify, so as to by LED chip firmly
It is fixed on support.
Further, the LED die-bonding methods that the present embodiment provides can be by automatically completing, can be as needed, once leads to
Cross multiple brilliant poles of suction and pick up LED chip progress die bond operation, not only save human cost, avoid the waste of crystal-bonding adhesive, and
And operating efficiency is also substantially increased, improve product quality.
Referring to Fig. 5, the LED die-bonding methods that the present embodiment provides are as follows：
The brilliant pole 1 of suction for inhaling brilliant device is connected with inhaling the vacuum equipment of brilliant device first, and started true in the brilliant device of suction
Null device so that inhale and negative pressure is produced in brilliant pole；
One end and the upper surface of LED chip 2 that brilliant pole 1 is not connected with vacuum equipment are inhaled, brilliant pole 1 is inhaled and drives LED core
Piece 2 moves up, so as to pick up LED chip 2；
Inhale brilliant pole 1 and LED chip 2 be transferred to the top of die bond lacquer disk(-sc) 3, LED chip 2 is then dropped into contact crystal-bonding adhesive 4,
The amount that LED chip 2 drops to height crystal-bonding adhesive 4 needed for of contact crystal-bonding adhesive 4 determines；
Inhaling brilliant pole 1 drives LED chip 2 to rise, so that LED chip 2 leaves crystal-bonding adhesive 4, and LED chip 2 is shifted
To the top of support 5；
Inhale the die bond position for the base that brilliant pole 1 drives LED chip 2 to drop to contact support 5；
Vacuum equipment is then shut off, and brilliant pole 1 will be inhaled and removed from the upper surface of LED chip 2, so as to which the die bond of LED chip 2 be existed
The die bond position of support 5, finally by baking-curing in an oven, LED chip 2 is secured firmly on support 5.
In the present embodiment, the amount of crystal-bonding adhesive 4 and brilliant pole 1 is inhaled during dipping drive LED chip in die bond lacquer disk(-sc) 3
2 height declined are according to needing glue amount 4 to be configured.
In the present embodiment, multiple LED chips 2 can be also placed into die bond lacquer disk(-sc) 3 and crystal-bonding adhesive 4 by inhaling brilliant pole 1
Contact, then LED chip 2 is fixed on support 5 successively by inhaling brilliant pole 1 again.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
- A kind of 1. LED die-bonding methods, it is characterised in that：IncludingCrystalline substance is inhaled, is specially：LED chip is picked up by inhaling brilliant device；Glue is dipped in, is specially：The LED chip bottom is dipped by crystal-bonding adhesive by the brilliant device of suction；Die bond, it is specially：The LED chip is transferred to by support and fixation by the brilliant device of suction；Baking-curing, it is specially：The branch of the fixation LED chip is placed in baking box and carries out baking-curing.
- 2. LED die-bonding methods as claimed in claim 1, it is characterised in that：The brilliant device of suction includes inhaling brilliant pole and vacuum is set Standby, the brilliant pole of suction is hollow, and described one end for inhaling brilliant pole is connected with the vacuum equipment, and the other end for inhaling brilliant pole is used for It is connected with the LED chip.
- 3. LED die-bonding methods as claimed in claim 2, it is characterised in that：It is described to inhale brilliant process and be specially：The vacuum equipment starts so that described inhale produces negative pressure in brilliant pole；One end and the upper surface of the LED chip that brilliant pole is not connected with the vacuum equipment are inhaled by described；The brilliant pole drive LED chip of inhaling moves up, so as to pick up the LED chip.
- 4. LED die-bonding methods as claimed in claim 2, it is characterised in that：The glue process of dipping in is specially：The LED chip is transferred to above die bond lacquer disk(-sc) by the suction brilliant pole；The LED chip is dropped to by the contact crystal-bonding adhesive by the brilliant pole of suction；Risen by the brilliant pole drive LED chip of inhaling, so that the LED chip leaves the crystal-bonding adhesive.
- 5. LED die-bonding methods as claimed in claim 4, it is characterised in that：It is described to inhale brilliant pole by the LED chip by described Drop to during the contact crystal-bonding adhesive, the LED chip drops to the height for contacting the crystal-bonding adhesive according to required institute The amount for stating crystal-bonding adhesive determines that when the amount of the required crystal-bonding adhesive is more, then the height that the LED chip declines is bigger；When required The amount of the crystal-bonding adhesive is fewer, then the height that the LED chip declines is smaller.
- 6. LED die-bonding methods as claimed in claim 5, it is characterised in that：The LED chip is declined by the suction brilliant pole To during contacting the crystal-bonding adhesive, the LED chip is immersed in the height of the crystal-bonding adhesive no more than the LED chip Thickness.
- 7. LED die-bonding methods as claimed in claim 2, it is characterised in that：The die bond process is specially：The LED chip is transferred to above the support by the suction brilliant pole；The LED chip is dropped to the die bond position for the base for contacting the support by the brilliant pole of suction；The vacuum equipment is closed, and the brilliant pole of suction is removed from the LED chip upper surface.
- 8. LED die-bonding methods as claimed in claim 1, it is characterised in that：The suction is brilliant, described to dip in glue, the die bond and institute The process for stating baking-curing can be by automatically completing.
- 9. LED die-bonding methods as claimed in claim 1, it is characterised in that：The crystal-bonding adhesive is that liquid is heating and curing class colloid, Including silicon based insulating glue, epoxy insulating cement, acrylic system insulating cement, falope ring oxa- syzygy insulating cement, elargol and incorgruous lead The hot class colloid of conductance.
- 10. LED die-bonding methods as claimed in claim 1, it is characterised in that：The support include COB supports, SMD supports and Substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710778730.8A CN107749438A (en) | 2017-09-01 | 2017-09-01 | A kind of LED die-bonding methods |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710778730.8A CN107749438A (en) | 2017-09-01 | 2017-09-01 | A kind of LED die-bonding methods |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807650A (en) * | 2018-06-15 | 2018-11-13 | 佛山宝芯智能科技有限公司 | A kind of semiconductor die bond and cured full-automatic continuous productive process method |
| CN111416028A (en) * | 2019-01-04 | 2020-07-14 | 台湾爱司帝科技股份有限公司 | Semiconductor chip repairing method and semiconductor chip repairing device |
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| CN103872193A (en) * | 2014-03-15 | 2014-06-18 | 深圳翠涛自动化设备股份有限公司 | Glue coating crystal solidifying method and system thereof |
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