CN101694860A

CN101694860A - Novel LED die bonding method

Info

Publication number: CN101694860A
Application number: CN200910201686A
Authority: CN
Inventors: 黄金鹿; 黄莺; 缪应明; 吴海生
Original assignee: Suzhou Zhongze Optoelectronics Technology Co Ltd
Current assignee: Suzhou Zhongze Optoelectronics Technology Co Ltd
Priority date: 2009-10-15
Filing date: 2009-10-15
Publication date: 2010-04-14

Abstract

The invention relates to a novel LED die bonding method which comprises the steps: firstly, coating a thin layer of die bonding glue on a bottom die bonding surface of a LED crystal particle fixing concave pit with a reflection layer on a metal base; after completion, placing the LED crystal particles at a base die bonding surface dispensed with die bonding glue, compacting and completing primary die bonding, then welding gold thread, coating fluorescent powder, and finally encapsulating by silica gel so as to wholly wrap LED crystal particles in the silica gel, thus completing final die bonding. The traditional LED carry out die bonding by the die bonding glue, while in the invention, only a thin layer of die bonding glue is coated for playing a role of primary die bonding, and finally the die bonding protection is carried out by encapsulating the silica gel. The method does not influence LED solid luminescence, and the light emitted from the periphery thereof is reflected out by the fixing concave pit, thus improving light extraction efficiency.

Description

A kind of Novel LED die bonding method

Technical field

The present invention relates to LED die package field, definite a kind of novel die-bonding method of saying so.

Background technology

Gu crystal technique is one of key technology of LED encapsulation field, Gu the quality of crystalloid amount will influence stability, radiating efficiency and the light extraction efficiency etc. of LED, different selected solid crystal type according to the size of LED power and packaging technology is different, in general, low-power LED crystal grain conducts heat by insulating cement fixed electrode pin and gets final product; The LED that power is big slightly can be by heat conduction elargol or silica gel adhesion heat radiation; Usually adopt the fixing heat radiation of mode of high heat conduction elargol or eutectic welding for watt level LED, the bonding solid crystal type of heat-conducting glue commonly used at present is owing to glue consumption, the problems such as uniformity and pull-out capacity of smearing often are wrapped in the part of LED crystal grain and influence light extraction efficiency in the crystal-bonding adhesive.

Summary of the invention

For solving the problem of above-mentioned LED bright dipping deficiency, the invention provides a kind of die-bonding method that helps to improve the LED light extraction efficiency.

Technical scheme of the present invention is as follows: a kind of die-bonding method that improves the LED light extraction efficiency comprises the steps:

The metal base preparation: metal base is made by the high-thermal conductive metal material, generally adopts the copper coin electroplate, is furnished with fixedly pit of LED crystal grain on the metal base, pit inner surface plating reflector layer, and the bottom surface is solid crystal face.

The crystal-bonding adhesive preparation: crystal-bonding adhesive is generally heat conductive silica gel or elargol, preferentially selects high heat conduction elargol.

Get glue and some glue: utilize Glue dripping head to dip in to get the crystal-bonding adhesive point to invest on the metal base fixedly pit baseplane of LED crystal grain, it is moderate that smearing thickness is made every effort to, and crystal-bonding adhesive only is applied in metal base LED the crystal grain fixedly baseplane of pit and the contact site of LED crystal grain bottom surface metal.

Gu brilliant step: place the pedestal point that the Gu Jingmianchu of crystal-bonding adhesive is arranged LED crystal grain, compacting is just finished preliminary brilliant admittedly, welds gold thread, coating fluorescent material then, and the silica gel embedding is wrapped in LED crystal grain integral body and finishes final solid crystalline substance in the silica gel more at last.

Good effect of the present invention: the solid crystal type of the present invention reduces the area coverage of crystal-bonding adhesive, reduce the outgoing that hinders LED light because of the covering of crystal-bonding adhesive to greatest extent, crystal-bonding adhesive only as preliminary solid brilliant, finally encapsulates silica gel and tamps the solid crystalline substance that the substrate pit is finished real meaning in this invention; Be furnished with fixedly pit of LED crystal grain on the metal base, be coated with reflector layer around the pit, the light that LED like this sends improves exitance through the reflection of reflector layer all around, strengthens directive property.

Description of drawings:

Fig. 1: be die-bonding method FB(flow block) of the present invention;

Fig. 2: be metal base schematic diagram of the present invention;

Fig. 3～7: be the solid brilliant step schematic diagram of the present invention.

Indication legend in the accompanying drawing

1, metal base 2, pit 3, reflector layer 4, solid crystal face 5, crystal-bonding adhesive 6, LED crystal grain 7, gold thread 8, fluorescent material 9, encapsulation silica gel

Embodiment

A kind of die-bonding method that improves the LED light extraction efficiency, flow process comprises as shown in Figure 1: the preparation of metal base, get glue and some glue, preliminary solid crystalline substance, bonding wire, coating fluorescent material, last embedding silica gel carries out finally solid crystalline substance, the non-solid brilliant step of bonding wire and coating fluorescent material wherein, but whole process flow must progressively be carried out according to above-mentioned flow process, is described in detail below with solid brilliant several steps in close relations.

Be illustrated in figure 2 as metal base (1), metal base is made by the high-thermal conductive metal material, the general copper coin electroplate that adopts, be furnished with fixedly pit (2) of LED crystal grain on the metal base, pit adopts bell mouth shape usually, horn mouth inner surface polishing back plating reflector layer (4), the pit bottom surface is solid crystal face (4).

Be depicted as solid brilliant step schematic diagram as Fig. 3～7, at first get glue and put glue, utilize Glue dripping head to dip in to get the crystal-bonding adhesive point to invest on the metal base the fixedly i.e. crystal face admittedly in pit baseplane of LED crystal grain, it is moderate that smearing thickness is made every effort to, and crystal-bonding adhesive only is applied in metal base LED the crystal grain fixedly baseplane of pit and the contact site of LED crystal grain bottom surface metal.

Crystal-bonding adhesive (5) is generally heat conductive silica gel or elargol, preferentially selects high heat conduction elargol.

Place the pedestal point that the Gu Jingmianchu of crystal-bonding adhesive is arranged LED crystal grain (6), compacting is just finished preliminary brilliant admittedly, welds gold thread (7), coating fluorescent material (8) then, and silica gel (9) embedding is wrapped in LED crystal grain integral body and finishes final solid crystalline substance in the silica gel more at last.Since when preliminary solid brilliant in order not influence bright dipping, crystal-bonding adhesive is only smeared very thin one deck, Gu crystalline substance is not firm, therefore must be undertaken again solid brilliant by encapsulation silica gel, again because the LED die package in the metal base pit, silica gel fills up and tamps the purpose that whole pedestal pit reaches solid crystalline substance and can realize.

Claims

1. a Novel LED die bonding method is characterized in that: fixedly at first be coated with the skim crystal-bonding adhesive on the crystal face admittedly in the bottom of pit at the LED crystal grain that has reflector layer on the metal base; LED crystal grain is placed the pedestal point that the Gu Jingmianchu of crystal-bonding adhesive is arranged after finishing, compacting is just finished preliminary brilliant admittedly, welds gold thread, coating fluorescent material then again, and the silica gel embedding is wrapped in LED crystal grain integral body and finishes final solid crystalline substance in the silica gel more at last.

2. a kind of Novel LED die bonding method according to claim 1 is characterized in that: described metal base is made by the high-thermal conductive metal material, is furnished with fixedly pit of LED crystal grain on the metal base, is coated with reflector layer around the pit, and the bottom surface is solid crystal face.

3. a kind of Novel LED die bonding method according to claim 1 is characterized in that: described crystal-bonding adhesive is heat conductive silica gel or elargol, preferentially selects high heat conduction elargol.

4. a kind of Novel LED die bonding method according to claim 1, it is characterized in that: described crystal-bonding adhesive only is applied in metal base LED the crystal grain fixedly baseplane of pit and the contact site of LED crystal grain bottom surface metal, and crystal-bonding adhesive does not produce parcel to other five face of LED crystal grain.

5. a kind of Novel LED die bonding method according to claim 1 is characterized in that: described silica gel fills up whole pedestal pit.