CN103456845A - Multi-hole glue-dispensing die bonder - Google Patents
Multi-hole glue-dispensing die bonder Download PDFInfo
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- CN103456845A CN103456845A CN2012101717050A CN201210171705A CN103456845A CN 103456845 A CN103456845 A CN 103456845A CN 2012101717050 A CN2012101717050 A CN 2012101717050A CN 201210171705 A CN201210171705 A CN 201210171705A CN 103456845 A CN103456845 A CN 103456845A
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- glue
- die bond
- point
- led chip
- hole
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Abstract
The invention discloses a multi-hole glue-dispensing die bonder comprising a glue-dispensing manipulator. The glue-dispensing manipulator comprises a glue-dispensing needle in a thing shaft shape, the middle of the glue-dispensing needle is provided with a through hole, the end of the through hole is provided with at least two glue-dispensing holes distributed in arrays, and the entire distributing shape corresponds to the shape of the bottom of an LED chip. The multi-hole glue-dispensing die bonder is provided with multiple glue-dispensing holes, so that the dispensed glue covers the entire bottom of the LED chip basically, the glue overflows less, combination force between the LED chip and an LED rack is enhanced, using amount of the glue is saved, and radiating property of the LED is further enhanced.
Description
[technical field]
The present invention relates to a kind of die bond machine, particularly relate to a kind of porous point glue die bond machine.
[background technology]
LED (Light Emitting Diode), when die bond, mainly comprises a glue, inhales crystalline substance, puts the technical processs such as crystalline substance, die bond, bonding wire, encapsulation.Point glue process is to realize by a point gum machine tool arm, and point gum machine tool arm comprises a dispensing needle head, and the dispensing needle head afterbody is communicated to balsam bottle by sebific duct, and while putting glue, point gum machine tool arm moves to the LED support top at every turn, and the dispensing needle head pressurized is extruded glue.Inhale crystalline substance, put brilliant process by a brilliant mechanical arm realization of suction, inhale brilliant mechanical arm and comprise that is inhaled a brilliant syringe needle, inhale in brilliant syringe needle and there is vacuum, after holding LED chip, move to above LED support, put down LED chip.Bonding wire is the corresponding connection of positive and negative electrode with LED support by the positive and negative electrode of LED chip, and this process can make LED chip be subject to the impact of soldering tip.If in the die bond process, LED chip and LED support bond strength are inadequate, and in the subsequent handling process, LED chip skew will occur or comes off, and produces defective products.
Refer to Fig. 1-Fig. 2, the dispensing needle head 201 of existing die bond machine all only has a some glue hole 20111, and glue spots is scattered by gravity behind LED support 206 bottoms, substantially forms the glue point 207 of a circle.LED chip 205 bottoms generally are rectangle, while getting on the glue point 207 that brilliant mechanical arm 108 is placed on LED chip 205 LED support 206 bottoms, glue point 207 can only contact with the part area of LED chip 205 bottoms, LED chip 205 is inadequate with the bond strength of LED support 206, therefore, in the technical processs such as follow-up bonding wire, LED chip 205 is vibrated or impact and skew will occur or come off; If glue spots is too much, glue can overflow from LED chip 205 both sides again, and the position at two LED chip 205 two ends but can not fully contact with glue.In addition, glue is Heat Conduction Material, and insufficient if glue contacts with LED chip 205 bottoms, the heat that also can make LED chip 205 send can not conduct and distribute in time, thereby affects the radiating effect of LED, reduces the life-span of LED.
Refer to Fig. 3, the brilliant syringe needle 202 of the suction of getting brilliant mechanical arm of existing die bond machine only has one to inhale geode 20211, and after it holds LED chip 205, LED chip 205 easily is offset, rotates or come off, and causes the defective products output.
[summary of the invention]
When overcoming existing single hole point glue die bond machine die bond, glue point contacts insufficient with the LED chip bottom, LED chip and LED support bond strength are inadequate, make LED chip can skew occur or come off in the follow-up operation processes such as bonding wire, and with LED chip, contact insufficient because of glue point, affect the technical problems such as radiating effect of LED chip, the invention provides a kind of glue point that can make and fully contact with LED chip, the porous point glue die bond machine of the heat dispersion of the bond strength between enhancing LED chip and LED support and raising LED.
The technical scheme that the present invention solves the prior art problem is: a kind of porous point glue die bond machine is provided, it comprises some glue mechanical arms, point gum machine tool arm comprises a dispensing needle head, dispensing needle head is thin axle shape, centre has through hole, and the through hole end is provided with plastic hole, it is characterized in that: this dispensing needle head has at least two plastic holes, this at least two plastic hole is array arranges, and the shape of arranging that it is total is corresponding with the LED chip bottom shape.
Preferably, this at least two plastic hole has identical aperture, and its glue point of pointing out is rounded, and wherein the spacing between adjacent two plastic holes is greater than 1/2 of glue spot diameter, is less than the diameter of glue point.
Preferably, the plastic hole of this dispensing needle head is two, and the glue point that it is pointed out is " ∞ " shape.
Preferably, the glue point that this dispensing needle head is pointed out can at least cover the area of LED chip bottom 95%.
Preferably, this dispensing needle head further comprises a shaft shoulder section, and the diameter of shaft shoulder section is greater than the diameter of two sections coupled shaft parts, and forms the shaft shoulder at two ends.
Preferably, the periphery outwardly convex of this shaft shoulder section forms a reference column.
Preferably, this porous point glue die bond machine further comprises gets brilliant mechanical arm, gets brilliant mechanical arm and comprises the brilliant syringe needle of a suction, inhales brilliant syringe needle and is thin axle shape, and centre has through hole, and geode is inhaled in through hole end setting at least two.
Preferably, this is inhaled brilliant syringe needle and further comprises a shaft shoulder section, and the diameter of shaft shoulder section is greater than the diameter of two sections shaft parts that are adjacent.
Preferably, the periphery outwardly convex of this shaft shoulder section forms a reference column.
Porous point glue die bond facility provided by the invention have a plurality of plastic holes, glue and the LED chip bottom shape pointed out are approached, glue covers the whole bottom of LED chip substantially, the glue spill-out is few, so both strengthened the adhesion between LED chip and LED support, avoid LED chip skew or the bad generation come off to occur in the follow-up operation processes such as bonding wire, saved again the glue consumption.In addition, glue adopts Heat Conduction Material, and glue fully contacts with the LED chip bottom, has also strengthened the heat dispersion of LED.
[accompanying drawing explanation]
Fig. 1 be traditional die bond machine dispensing needle head point glue process dissect structural representation.
After Fig. 2 is the traditional dropping glue of die bonder shown in Fig. 1, the shape schematic diagram of glue point on LED support.
Fig. 3 is that the brilliant syringe needle of the suction of traditional die bond machine is inhaled the brilliant syringe needle of suction of brilliant process and the cut-away view of wafer.
Fig. 4 is that a kind of porous point glue die bond owner that first embodiment of the invention provides wants the modular structure schematic diagram.
Fig. 5 is the cut-away view of the dispensing needle head of a kind of porous point glue die bond machine of providing of first embodiment of the invention.
Fig. 6 is the upward view after the dispensing needle head plastic emitting nose end shown in Fig. 5 amplifies.
The cut-away view of the dispensing needle head point glue process of a kind of porous point glue die bond machine that Fig. 7 first embodiment of the invention provides.
Fig. 8 is after the dispensing needle head of the porous point glue die bond machine shown in Fig. 7 is put glue on LED support, the shape schematic diagram of glue point on LED support.
Fig. 9 is the cut-away view of the brilliant syringe needle of suction of a kind of porous point glue die bond machine of providing of first embodiment of the invention.
Figure 10 is the cut-away view after the brilliant syringe needle of suction that a kind of porous point glue die bond machine that first embodiment of the invention provides is inhaled brilliant process is drawn LED chip.
[embodiment]
In order to make purpose of the present invention, technical scheme and advantage are clearer, below in conjunction with drawings and Examples, the present invention are further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 4, a kind of main module structure schematic diagram with die bond machine 10 of a plurality of plastic holes provided for first embodiment of the invention, it comprises a control system (not label), some glue mechanical arms 108, one gets brilliant mechanical arm 109, one feeding mechanism (not label), one discharging mechanism (not label), feeding mechanism and discharging mechanism are installed in the cabinet (not shown), be placed with LED chip dish (not shown) on feeding mechanism, be placed with LED support dish (not shown) on discharging mechanism, and be installed on respectively point gum machine tool arm 108 and get the PR video identification device (not label) on brilliant mechanical arm 109, control system is controlled the miscellaneous part co-ordination.The LED chip dish enters from feeding mechanism, get after brilliant mechanical arm 109 is drawn the LED chip in the LED chip dish (subsequent figures is introduced label 105) LED support (subsequent figures the is introduced label 106) position of the appointment on the LED support dish that moves to point gum machine tool arm 108 belows, point gum machine tool arm 108 is put glue in this LED support simultaneously, getting brilliant mechanical arm 109 is placed on this chip on glue, after completing die bond, the LED chip dish is sent from discharging mechanism, completes this die bond process.
Refer to again Fig. 5-Figure 10, point gum machine tool arm 108 comprises a dispensing needle head 101, get brilliant mechanical arm 109 and comprise the brilliant syringe needle 102 of a suction, and this dispensing needle head 101 is arranged on point gum machine tool arm end, inhales brilliant syringe needle 102 and is arranged on and gets brilliant mechanical arm 109 ends.During the work of die bond machine, LED chip dish (not shown) enters from feeding mechanism, get brilliant mechanical arm 109 and move to the LED support dish (not shown) position of point gum machine tool arm 108 belows from chip disk is drawn LED chip 105, and LED chip 105 is placed in the package cavity 1061 of corresponding LED support 106.The PR video identification device be arranged on point gum machine tool arm 108 can be observed the position of LED chip 105 on chip disk, and makes to inhale the brilliant syringe needle 102 corresponding LED chip 105 of adjustment aligning automatically.Be arranged on the PR video identification device of getting on brilliant mechanical arm 108 and can observe the position of LED support 106 on the LED support dish, and make dispensing needle head 101 automatically adjust the corresponding LED support 106 of aligning.
Refer to Fig. 5, this dispensing needle head 101 is hollow needle-like, and it comprises a rectangle platform 1011, a tapering 1012, a needle body 1013, a shaft shoulder section 1014, a connector portions 1015 and a pin hole 1016.Tapering 1012, the needle body 1013, shaft shoulder section 1014 and connector portions 1015 are connected successively, pin hole 1016 is placed in this dispensing needle head 101 center, and connect connector portions 1015, shaft shoulder section 1014 and the needle body 1013, extend in tapering 1012, its end is provided with two plastic holes 10111; Rectangle platform 1011 is placed in the middle of the end face in tapering 1012.
The needle body 1013 is cylindric, and one end and shaft shoulder section 1014 join, and the other end and tapering 1012 join.
Refer to Fig. 5-Fig. 6, tapering 1012 is placed in the end of the needle body 1013, is a frustum of a cone, and large bottom face (not label) joins with the needle body 1013 ends, on small end bottom surface (not label), a rectangle platform 1011 is set, rectangle platform 1011 is rectangular structure, and it is consistent with LED chip 105 bottom shapes, two plastic holes 10111 are set in it, this plastic hole 10111 is circular hole, and aperture is identical, and it connects rectangle platform 1011, extend in tapering 1012, and be communicated with pin hole 1016.Spacing between this two plastic hole 10111 be rectangle platform 1011 width 3/4 (spacing between this two gum outlet should be greater than 1/2 of LED chip 105 bottom widths, be less than this width, the present embodiment get these LED chip 105 bottom widths 3/4), its glue point of pointing out 107 intersects, be " ∞ " shape
Refer to Fig. 9, this is inhaled brilliant syringe needle 102 and comprises a rectangle platform 1021, a tapering 1022, a shaft shoulder section 1023, a needle body 1025 and a pin hole 1026.It is an integral body that tapering 1022, shaft shoulder section 1023 and the needle body 1025 are connected successively, and pin hole 206 is placed in this and inhales brilliant syringe needle 102 center, and through-shaft shoulder 1023 and the needle body 1025, extends in tapering 1022; Rectangle platform 1021 is placed in the middle of the end face in tapering 1022.
The needle body 1025 is placed in this top of inhaling brilliant syringe needle 102, and it is cylindric, and top arranges chamfering 10251.
Shaft shoulder section divides at 1023 two ends with the needle body 1025 and tapering 1022 and is connected, its integral body is cylindric, and diameter is greater than the diameter of the needle body 1025 and tapering 1022 large ends, forming first and second shaft shoulder 10232,10231 with the needle body 1025 and 1022 joints, tapering, inhale the location of brilliant syringe needle 102 and fix for this, the face of cylinder of this shaft shoulder section 1023 is outwards given prominence to and is formed a reference column 10233 again, for this, inhales the location of brilliant syringe needle 102.
Tapering 1022 is placed in the end of shaft shoulder section 1023, is a frustum of a cone, and bottom face (not label) joins with shaft shoulder section 1023 ends greatly, on small end bottom surface (not label), a rectangle platform 1021 is set, and rectangle platform 1021 is rectangular structure.Two suction geodes 10211 are set in it, and inhaling geode 10211 is circular hole, connects rectangle platform 1021, extends in tapering 1022, and is communicated with pin hole 1026.
During installation, dispensing needle head 101 is placed in to the installation site of the point gum machine tool arm 108 of this porous point glue die bond machine 10, first and second shaft shoulder 10142,10141 by shaft shoulder section 1014 and reference column 10143 make this dispensing needle head 101 realize location and fixing.Then will inhale brilliant syringe needle 102 and be placed in the installation site of getting brilliant mechanical arm 109 of this porous point glue die bond machine 10, first and second shaft shoulder 10231,10232 by shaft shoulder section 1023 and reference column 10233 make this inhale brilliant syringe needle 102 and realize location and fixing.
Refer to Fig. 1-Fig. 2, traditional single hole point glue die bond machine, dispensing needle head 201 only has a plastic hole 20111, after interior some gluing point 207 of LED support 206, glue point 207 is roughly rounded, and LED chip 205 bottoms are rectangle, the contact-making surface of this glue point 207 itself and LED chip 205 bottoms is abundant not, and too much glue can overflow LED chip 205 bottoms.Refer to again Fig. 7-Fig. 8, the schematic diagram of 10 the glue processes of porous point glue die bond machine that provide for first embodiment of the invention, this dispensing needle head 101 has two plastic holes 10111, its glue point of pointing out 107 is two and intersects the circle merged, substantially be rectangle, can be substantially corresponding with the bottom of LED chip 105, LED chip 105 bottoms can fully be contacted with glue point 107, thereby LED chip 105 more precisely is firmly fixed in LED support 106.
Refer to Fig. 3, for traditional die bond machine is inhaled brilliant process schematic diagram, it is inhaled brilliant syringe needle 202 and only has to inhale a geode 20211 again.205 of LED chips are stressed at a point, and inclined to one side if inhale position, LED chip 205 may drop, if be subject to other external force to affect LED chip 205, also may rotate around this stress point.Refer to again Figure 10, for the porous point glue die bond machine 10 that first embodiment of the invention provides is inhaled the schematic diagram of brilliant process, this is inhaled brilliant syringe needle 102 and has two suction geodes 10211, and keep at a certain distance away, hold LED chip 105 by two suction geodes 10211 and can avoid this LED chip 105 getting crystalline substance, putting brilliant process generation skew or drop.
The contrast experiment
Two groups of experiments are set, and first group is used traditional single hole point glue die bond machine to carry out die bond; Second group of porous point glue die bond machine 10 that uses first embodiment of the invention to provide carries out die bond; Other conditions are identical, randomly draw the maximum thrust that ten products come off with thrust test machine test LED chip 105,205 respectively for every group, and the data that obtain are as following table:
| Experimental group | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | Average |
| First group | 141 | 138 | 129 | 133 | 136 | 131 | 133 | 135 | 128 | 136 | 134 |
| Second group | 130 | 134 | 140 | 139 | 146 | 144 | 143 | 139 | 141 | 138 | 139.4 |
As can be seen from the above experimental data, test the maximum thrust mean value recorded for second group and be greater than the maximum thrust mean value that first group of experiment records, as can be seen here, after adopting porous point glue die bond machine provided by the invention 10 die bonds, the bond strength between LED chip 105 and LED support 106 has improved really.
The present invention can also have the various deformation structure, dispensing needle head 101 can more than two plastic holes 10111, but a plurality of plastic holes 10111, the plurality of plastic hole 10111 is array and arranges, the shape of arranging that it is total is consistent with LED chip 105 bottom shapes, it is 107 rounded that the glue that the plurality of plastic hole 10111 is pointed out is put, wherein the spacing between adjacent two plastic holes 10111 should be to guarantee that being greater than glue puts 1/2 of 107 diameters, the diameter that is less than glue point 107 is as the criterion, its objective is and 2 adjacent glue points can be intersected and do not permeate a glue point, shape and LED chip 105 bottom shapes after the plurality of glue point 107 merges coincide to greatest extent, and after merging, the plurality of glue point 107 at least should cover the area of LED chip 105 bottoms 95%, inhaling brilliant syringe needle 102 also can be for a plurality of, and the plurality of suction geode 10211 is array arranges, and its general arrangement shape is corresponding with LED chip 105 top shape.
Porous point glue die bond machine 10 provided by the invention makes the glue point 107 of pointing out approach with LED chip 105 bottom shapes, glue covers the whole bottom of LED chip 105 substantially, the glue spill-out is few, so both strengthened the adhesion between LED chip 105 and LED support 106, avoid LED chip 105 skew or the bad generation come off to occur in the follow-up operation processes such as bonding wire, saved again the glue consumption; In addition, glue adopts Heat Conduction Material, and glue fully contacts with LED chip 105 bottoms, has also strengthened the heat dispersion of LED.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within principle of the present invention, be equal to and replace and within improvement etc. all should be included in protection scope of the present invention.
Claims (9)
1. a porous point glue die bond machine, it comprises some glue mechanical arms, point gum machine tool arm comprises a dispensing needle head, dispensing needle head is thin axle shape, centre has through hole, and the through hole end is provided with plastic hole, it is characterized in that: this dispensing needle head has at least two plastic holes, this at least two plastic hole is array arranges, and the shape of arranging that it is total is corresponding with the LED chip bottom shape.
2. porous point glue die bond machine as claimed in claim 1, it is characterized in that: this at least two plastic hole has identical aperture, and its glue point of pointing out is rounded, and wherein the spacing between adjacent two plastic holes should be greater than 1/2 of glue spot diameter, is less than the diameter of glue point.
3. porous point glue die bond machine as claimed in claim 2, it is characterized in that: the plastic hole of this dispensing needle head is two, the glue point that it is pointed out is " ∞ " shape.
4. porous point glue die bond machine as claimed in claim 2 is characterized in that: the glue point that this dispensing needle head is pointed out can at least cover the area of LED chip bottom 95%.
5. as the described porous point glue of claim 1-4 any one claim die bond machine, it is characterized in that: this dispensing needle head further comprises a shaft shoulder section, and the diameter of shaft shoulder section is greater than the diameter of two sections coupled shaft parts, and forms the shaft shoulder at two ends.
6. porous point glue die bond machine as claimed in claim 5, it is characterized in that: the periphery outwardly convex of this shaft shoulder section forms a reference column.
7. porous point glue die bond machine as claimed in claim 6, it is characterized in that: this porous point glue die bond machine further comprises gets brilliant mechanical arm, gets brilliant mechanical arm and comprises the brilliant syringe needle of a suction, inhales brilliant syringe needle and is thin axle shape, centre has through hole, and geode is inhaled in through hole end setting at least two.
8. porous point glue die bond machine as claimed in claim 7, it is characterized in that: this is inhaled brilliant syringe needle and further comprises a shaft shoulder section, and the diameter of shaft shoulder section is greater than the diameter of two sections shaft parts that are adjacent.
9. porous point glue die bond machine as claimed in claim 8, it is characterized in that: the periphery outwardly convex of this shaft shoulder section forms a reference column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101717050A CN103456845A (en) | 2012-05-29 | 2012-05-29 | Multi-hole glue-dispensing die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101717050A CN103456845A (en) | 2012-05-29 | 2012-05-29 | Multi-hole glue-dispensing die bonder |
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| CN103456845A true CN103456845A (en) | 2013-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101717050A Pending CN103456845A (en) | 2012-05-29 | 2012-05-29 | Multi-hole glue-dispensing die bonder |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110797280A (en) * | 2018-08-03 | 2020-02-14 | 深圳市玲涛光电科技有限公司 | LED lamp pearl production facility |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2246851Y (en) * | 1995-07-05 | 1997-02-05 | 新美化精机工厂股份有限公司 | Adhesion device of chip |
| US20050172891A1 (en) * | 2004-02-05 | 2005-08-11 | Shinsuke Suzuki | Dies bonding apparatus and dies bonding method |
| US20060081178A1 (en) * | 2004-10-20 | 2006-04-20 | Willey Alan D | Electrostatic spray nozzle with multiple outlets at varying lengths from target surface |
| CN101694860A (en) * | 2009-10-15 | 2010-04-14 | 苏州中泽光电科技有限公司 | Novel LED die bonding method |
| CN101775264A (en) * | 2009-12-24 | 2010-07-14 | 安徽泽润光电有限公司 | Chip fixing glue for LED (Light Emitting Diode) |
| CN102039248A (en) * | 2009-10-26 | 2011-05-04 | 鸿富锦精密工业（深圳）有限公司 | Glue dropping device |
| CN201922364U (en) * | 2010-09-30 | 2011-08-10 | 河南久大电子电器有限公司 | Chip-sucking tool with multiple sucking holes |
| CN201949990U (en) * | 2011-01-27 | 2011-08-31 | 杰群电子科技（东莞）有限公司 | Multi-hole dispensing device |
-
2012
- 2012-05-29 CN CN2012101717050A patent/CN103456845A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2246851Y (en) * | 1995-07-05 | 1997-02-05 | 新美化精机工厂股份有限公司 | Adhesion device of chip |
| US20050172891A1 (en) * | 2004-02-05 | 2005-08-11 | Shinsuke Suzuki | Dies bonding apparatus and dies bonding method |
| US20060081178A1 (en) * | 2004-10-20 | 2006-04-20 | Willey Alan D | Electrostatic spray nozzle with multiple outlets at varying lengths from target surface |
| CN101694860A (en) * | 2009-10-15 | 2010-04-14 | 苏州中泽光电科技有限公司 | Novel LED die bonding method |
| CN102039248A (en) * | 2009-10-26 | 2011-05-04 | 鸿富锦精密工业（深圳）有限公司 | Glue dropping device |
| CN101775264A (en) * | 2009-12-24 | 2010-07-14 | 安徽泽润光电有限公司 | Chip fixing glue for LED (Light Emitting Diode) |
| CN201922364U (en) * | 2010-09-30 | 2011-08-10 | 河南久大电子电器有限公司 | Chip-sucking tool with multiple sucking holes |
| CN201949990U (en) * | 2011-01-27 | 2011-08-31 | 杰群电子科技（东莞）有限公司 | Multi-hole dispensing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110797280A (en) * | 2018-08-03 | 2020-02-14 | 深圳市玲涛光电科技有限公司 | LED lamp pearl production facility |
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