CN108963059A - It is a kind of to prevent LED conducting resinl in the structure welded or loosened in - Google Patents
It is a kind of to prevent LED conducting resinl in the structure welded or loosened in Download PDFInfo
- Publication number
- CN108963059A CN108963059A CN201811024050.8A CN201811024050A CN108963059A CN 108963059 A CN108963059 A CN 108963059A CN 201811024050 A CN201811024050 A CN 201811024050A CN 108963059 A CN108963059 A CN 108963059A
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- China
- Prior art keywords
- conducting resinl
- conducting wire
- conducting
- led
- cup
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The present invention disclose it is a kind of prevent LED conducting resinl from welding or the structure that loosens in, be related to LED manufacturing field, which is characterized in that including bracket bowl, bottom of a cup conducting wire, conducting resinl, LED wafer, conducting wire and packaging plastic.Current many producers are to prevent the substrate in silver layer from influencing LED use because of oxidation, anti- silver-colored oxidant will be increased on the silver layer of crystal bonding area plate surface by existing electroplating technology, but die bond when anti-silver oxidant can not volatilize completely before LED is produced, this, which mutually generates the chemical substance caused in conducting resinl with anti-silver-colored oxidant, reacts, in subsequent high-temperature process or daily use process, LED wafer the problem of can not working on can occur due to conducting resinl loosens and leaves crystal bonding area plate.To solve the above problems, the present invention increases the medium that can connect the two and conduction between conducting resinl and crystal bonding area plate, even if conducting resinl allows LED wafer to be mutually disengaged with crystal bonding area plate because bonding force lacks, the problems for dead lamp of opening a way will not be generated.
Description
Technical field
The present invention is LED manufacturing field, and in particular to a kind of to prevent LED conducting resinl in the knot for welding or loosening in
Structure.
Background technique
Light emitting diode (LIGHT EMITING DIODE, abbreviation LED), is a kind of semiconducting solid luminescent device, it is
Using solid semiconductor chip as luminescent material, when both ends add forward voltage, the minority in semiconductor is shut off sub and most
Sub- generation of shutting off is compound, releases superfluous energy and photon is caused to emit, and directly issues red, orange, yellow, green, green, blue, purple
Light.The advantages that for LED light source due to having high energy conservation, the service life is long, is conducive to environmental protection, keeps the application surface of LED more and more extensive, environmental protection
The advantage of energy conservation makes LED be considered as one of primary illumination light source of 21 century.
Because of the reasons such as environmental protection and cost limitation, existing LED support its silver layer in plating in the manufacturing process of LED
Dosage, which gradually decreases, promotes it to thin down, and uses to prevent the substrate in silver layer from influencing LED because of oxidation, existing electricity
Anti- silver-colored oxidant can be increased in coating technology on the silver layer of crystal bonding area plate surface, but anti-silver-colored oxidant can be not complete before LED is produced
Die bond when full volatilization, this, which mutually generates the chemical substance caused in conducting resinl with anti-silver-colored oxidant, reacts, the result is that making conduction
The bonding force of glue lacks, and in subsequent high-temperature process or in daily use process, LED wafer can be left because conducting resinl loosens
Crystal bonding area plate and there is the problem of can not working on, this for production be cost problem, be quality problems for user.
Summary of the invention
The present invention is to solve the above-mentioned problems, it is therefore an objective to be achieved: one kind prevents LED conducting resinl from welding or using
In the structure that loosens, which is characterized in that it is described including bracket bowl, bottom of a cup conducting wire, conducting resinl, LED wafer, conducting wire, packaging plastic
Bracket bowl is fixedly provided with crystal bonding area plate；The conducting resinl is arranged on the plate of crystal bonding area；Bottom of a cup conducting wire one end is welded on
On the plate of crystal bonding area, one end is placed in inside conducting resinl；The bottom of the LED wafer is seated in conducting resinl；Conducting wire one end weldering
It connects in the top of LED wafer, one end is welded on the plate of crystal bonding area；The packaging plastic using designated shape mold depanning after to branch
Frame bowl is packaged.
Preferably, the LED wafer is fixed on the plate of crystal bonding area by the bonding force of conducting resinl.
Preferably, the conducting wire and bottom of a cup conducting wire can be silver, copper, gold, aluminium, brass, iron wire, zinc, lead, mercury or other conductions
Composite material be made.
Preferably, the bottom of a cup conducting wire and conducting wire are a circuit, and bottom of a cup conducting wire and conducting resinl are a circuit.
Preferably, the bracket bowl needs to first pass through the process and roasting procedure of plating silver layer before welding bottom of a cup conducting wire.
Preferably, die bond process is just carried out after the bottom of a cup conducting wire is in merging conducting resinl, and is also needed after the completion of die bond
It is toasted to whole, makes to bond completely between conducting resinl and bottom of a cup conducting wire and LED wafer.
Preferably, the conducting resinl is required on the plate of crystal bonding area using visual identifying system point of use plastic pin by bonder
In the range of dispensing, then by bonder suction nozzle draw LED wafer carry out die bond operation.
Preferably, it can extend to outside bracket bowl, and fold downward twice, with padded at left and right sides of the crystal bonding area plate
The height of bracket bowl.
Preferably, the crystal bonding area plate is by multiple independent zones board groups at the conducting wire independent zones plate to be welded and fixed
It cannot be same independent zones plate with conducting resinl.
Preferably, the conducting resinl and bottom of a cup conducting wire are fixed on the plate of same independent zones.
The invention has the following advantages:
(1) bracket bowl will be toasted first before the first step welds bottom of a cup conducting wire, keep anti-silver-colored oxidant most under the high temperature conditions
May volatilization, avoid when subsequent addition conducting resinl its internal chemical substance from mutually generating with anti-silver oxidant and react, to subtract
The problem of few conducting resinl bonding force premature loss, occurs.
(2) present invention is coped with conducting resinl disengaging crystal bonding area plate by setting energy conductive bottom of a cup conducting wire and conducting wire and caused
The problem of LED wafer can not work, even with LED wafer conducting resinl departing from crystal bonding area plate, but still have bottom of a cup conducting wire
It is formed into a loop with conducting wire, to ensure that LED wafer can work normally.
(3) conducting wire of the invention or bottom of a cup conducting wire can be silver, copper, gold, aluminium, brass, iron wire, zinc, lead, mercury or other conductions
Composite material be made, corresponding material can be chosen according to actual requirement and cost of manufacture and be produced, it is ensured that reach corresponding
While effect, without departing from cost.
(4) present invention effectively solves the problems, such as dead lamp of opening a way when disqualification rate and use when production, because in welding cup
Roasting procedure is had been subjected to before bottom conducting wire and point conducting resinl to reduce influence of the anti-silver-colored oxidant to conducting resinl, also because of two circuit
Design ensures LED wafer in service life even if because that can continue being detached from crystal bonding area plate while reduction finished product does over again quantity
Its work.
Detailed description of the invention
The present invention will be further explained below with reference to the attached drawings and specific examples.
Fig. 1 is explosive view of the invention.
Fig. 2 is top view of the invention.
Fig. 3 is front elevational view of the invention.
The partial enlarged view that Fig. 4 selects for institute's frame in Fig. 3.
Fig. 5 is the schematic diagram that the present invention is applied on direct insertion LED.
Specific embodiment
In order to make the technical means, creative features, achievement of purpose and effectiveness of the invention easy to understand, below with reference to tool
Body embodiment, the present invention is further explained.
Referring to Fig.1, present embodiment uses following technical scheme: one kind prevents LED conducting resinl from welding or using
In the structure that loosens, which is characterized in that including bracket bowl (1), bottom of a cup conducting wire (2), conducting resinl (3), LED wafer (4), conducting wire
(5), packaging plastic (6), the bracket bowl (1) are fixedly provided with crystal bonding area plate；The conducting resinl (3) is arranged in crystal bonding area plate
On；Described bottom of a cup conducting wire (2) one end is welded on the plate of crystal bonding area, and it is internal that one end is placed in conducting resinl (3)；The LED wafer (4)
Bottom is seated in conducting resinl (3)；Described conducting wire (5) one end is welded on the top of LED wafer (4), and one end is welded on crystal bonding area
On plate；The packaging plastic (6) using designated shape mold depanning after bracket bowl (1) is packaged.
Wherein, the LED wafer (4) is fixed on the plate of crystal bonding area by the bonding force of conducting resinl (3).
Wherein, the conducting wire (5) and bottom of a cup conducting wire (2) can be silver, copper, gold, aluminium, brass, iron wire, zinc, lead, mercury or other
Conductive composite material is made.
Wherein, the bottom of a cup conducting wire (2) and conducting wire (5) are a circuit, and bottom of a cup conducting wire (2) and conducting resinl (3) are one
Circuit.
Wherein, the bracket bowl (1) needs to first pass through the process and Roaster of plating silver layer before welding bottom of a cup conducting wire (2)
Sequence.
Wherein, die bond process is just carried out after the bottom of a cup conducting wire (2) is in merging conducting resinl (3), and after the completion of die bond also
It needs to be toasted to whole, makes to bond completely between conducting resinl (3) and bottom of a cup conducting wire (2) and LED wafer (4).
Wherein, the conducting resinl (3) is wanted on the plate of crystal bonding area by bonder using visual identifying system point of use plastic pin
Dispensing in the range of asking, then LED wafer (4) are drawn by the suction nozzle of bonder and carry out die bond operation.
Wherein, bracket bowl (1) can be extended to outside at left and right sides of the crystal bonding area plate, and folded downward twice, with pad
The height of high trestle bowl (1).
Wherein, the crystal bonding area plate is by multiple independent zones board groups at conducting wire (5) the independent zones plate to be welded and fixed
It cannot be same independent zones plate with conducting resinl (2).
Wherein, the conducting resinl (2) and bottom of a cup conducting wire (2) are fixed on the plate of same independent zones.
This specific embodiment is reference with Fig. 1 to Fig. 4.
Present invention manufacture can be broadly divided into six steps:
One, first bracket bowl is toasted for the first time before welding bottom of a cup conducting wire and point conducting resinl；
Two, it completes after toasting for the first time, the crystal bonding area plate in bracket bowl welds a bottom of a cup conducting wire, only welds the bottom of a cup conducting wire
Wherein one end；
Three, point in the range for using visual identifying system control point plastic pin required on the plate of crystal bonding area after bottom of a cup conducting wire has been welded
Glue, the position of conducting resinl are located at the other end of the welded bottom of a cup conducting wire of previous step, then draw LED crystalline substance by the suction nozzle of bonder again
Piece carries out die bond operation；
Four, after die bond operation is completed, welding sequence just is carried out to conducting wire, conducting wire one end is welded on above LED wafer, one end weldering
It connects on the plate of crystal bonding area；
Five, entire bracket is toasted again, the bottom of a cup conducting wire and chip for keeping conducting resinl internal with it bond completely；
Six, packaging plastic is using being packaged bracket bowl after the mold depanning of designated shape.
Product of the present invention in addition to can apply to SMD, moreover it is possible to suitable for direct insertion LED product, direct insertion LED product
Manufacture with it is above-mentioned essentially identical, with specific reference to Fig. 5:
One, bonding wire, by the second bottom of a cup conducting wire 12, wherein one end is welded on direct insertion bracket 11；
Two, dispensing uses visual identifying system control point plastic pin on direct insertion bracket 11 after having welded the second bottom of a cup conducting wire 12
Dispensing in required range, the position of the second conducting resinl 13 are located at the other end that previous step welds the second bottom of a cup conducting wire 12；
Three, die bond draws the second LED wafer 14 by the suction nozzle of bonder and is placed into progress die bond operation on the second conducting resinl 13；
Four, it toasts, product integrally carries out baking-curing；
Five, bonding wire carries out welding sequence to the second conducting wire 15, and 15 one end of the second conducting wire is welded on the top of the second LED wafer 14,
The other end is welded on direct insertion bracket 11, to generate a connected loop；
Six, sealing, according to required shape using the mold of designated shape to 16 depanning of the second packaging plastic, to direct insertion after depanning
Bracket 11 is packaged.
The second bottom of a cup conducting wire 12, the second conducting resinl 13, second mentioned in the manufacturing step of above-mentioned direct insertion LED product
LED wafer 14, the second conducting wire 15 and the second packaging plastic 16 and bottom of a cup conducting wire 2 of the invention, conducting resinl 3, LED wafer 4, conducting wire 5,
The specification of packaging plastic 6 is identical.Wherein direct insertion bracket 11 is made of two independent racks.
Bracket bowl of the present invention will be toasted first before the first step welds bottom of a cup conducting wire, and anti-silver-colored oxidant is made to exist
It volatilizees as far as possible under hot conditions, its internal chemical substance when subsequent addition conducting resinl is avoided mutually to generate with anti-silver-colored oxidant
Reaction, thus the problem of reducing conducting resinl bonding force premature loss generation.
It is caused in addition, the present invention copes with conducting resinl disengaging crystal bonding area plate by setting energy conductive bottom of a cup conducting wire and conducting wire
The problem of making LED wafer that can not work, even if LED wafer is within the scope of normal service life, because electric current can not be formed
Circuit and cannot shine, so LED wafer be specifically one end of bottom of a cup conducting wire is welded on the crystal bonding area plate of bracket bowl, separately
One end just carries out die bond process after being placed in conducting resinl, and in the top welding lead of LED wafer after die bond process, and
The other end of conducting wire be equally welded on the plate of crystal bonding area (due to crystal bonding area plate be by multiple independent zones board groups at, it has to be noted here that
Conducting wire be not welded on to independent zones plate locating for conducting resinl, bottom of a cup conducting wire, not so LED wafer energization will not shine), then
Bracket bowl is toasted again, is bonded completely between conducting resinl and bottom of a cup conducting wire and LED wafer with reaching, accordingly even when band
There is the conducting resinl of LED wafer departing from crystal bonding area plate, but still have bottom of a cup conducting wire and conducting wire forming circuit, to ensure LED wafer
It can work normally.
The present invention effectively solves the problems, such as dead lamp of opening a way when disqualification rate and use when production, because leading in welding bottom of a cup
Roasting procedure is had been subjected to before line and point conducting resinl to reduce influence of the anti-silver-colored oxidant to conducting resinl, also because of two circuit design
Ensure LED wafer in service life even if because its work can be continued being detached from crystal bonding area plate while reduction finished product does over again quantity
Make.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel only illustrate this described in the specification of above-described embodiment it should be appreciated that the present invention is not limited to the above embodiments
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (10)
1. a kind of prevent LED conducting resinl in the structure welded or loosened in, which is characterized in that including bracket bowl (1), cup
Bottom conducting wire (2), conducting resinl (3), LED wafer (4), conducting wire (5), packaging plastic (6), the bracket bowl (1) are fixedly provided with solid
Crystalline region plate；The conducting resinl (3) is arranged on the plate of crystal bonding area；Described bottom of a cup conducting wire (2) one end is welded on the plate of crystal bonding area, one end
It is internal to be placed in conducting resinl (3)；The bottom of the LED wafer (4) is seated in conducting resinl (3)；Described conducting wire (5) one end is welded on
The top of LED wafer (4), one end are welded on the plate of crystal bonding area；It is right after the mold depanning of designated shape that the packaging plastic (6) uses
Bracket bowl (1) is packaged.
A kind of prevent LED conducting resinl from welding or the structure that loosens in, feature exist 2. according to claim 1
In the LED wafer (4) is fixed on the plate of crystal bonding area by the bonding force of conducting resinl (3).
A kind of prevent LED conducting resinl from welding or the structure that loosens in, feature exist 3. according to claim 1
In the conducting wire (5) and bottom of a cup conducting wire (2) can be the compound of silver, copper, gold, aluminium, brass, iron wire, zinc, lead, mercury or other conductions
Material is made.
A kind of prevent LED conducting resinl from welding or the structure that loosens in, feature exist 4. according to claim 1
In the bottom of a cup conducting wire (2) and conducting wire (5) are a circuit, and bottom of a cup conducting wire (2) and conducting resinl (3) are a circuit.
A kind of prevent LED conducting resinl from welding or the structure that loosens in, feature exist 5. according to claim 1
In the bracket bowl (1) needs to first pass through the process and roasting procedure of plating silver layer before welding bottom of a cup conducting wire (2).
A kind of prevent LED conducting resinl from welding or the structure that loosens in, feature exist 6. according to claim 1
In the bottom of a cup conducting wire (2) just carries out die bond process after merging conducting resinl (3) is interior, and also needs after the completion of die bond to entirety
It is toasted, makes to bond completely between conducting resinl (3) and bottom of a cup conducting wire (2) and LED wafer (4).
A kind of prevent LED conducting resinl from welding or the structure that loosens in, feature exist 7. according to claim 6
In the conducting resinl (3) is by bonder using in visual identifying system point of use plastic pin range required on the plate of crystal bonding area
Dispensing, then LED wafer (4) are drawn by the suction nozzle of bonder and carry out die bond operation.
A kind of prevent LED conducting resinl from welding or the structure that loosens in, feature exist 8. according to claim 1
In the crystal bonding area plate left and right sides can extend to bracket bowl (1) outside, and fold downward twice, with padded bracket bowl
(1) height.
A kind of prevent LED conducting resinl from welding or the structure that loosens in, feature exist 9. according to claim 1
In the crystal bonding area plate is by multiple independent zones board groups at conducting wire (5) the independent zones plate to be welded and fixed cannot be with conduction
Glue (2) is same independent zones plate.
A kind of prevent LED conducting resinl from welding or the structure that loosens in, feature exist 10. according to claim 9
In the conducting resinl (2) and bottom of a cup conducting wire (2) are fixed on the plate of same independent zones.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811024050.8A CN108963059A (en) | 2018-09-04 | 2018-09-04 | It is a kind of to prevent LED conducting resinl in the structure welded or loosened in |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811024050.8A CN108963059A (en) | 2018-09-04 | 2018-09-04 | It is a kind of to prevent LED conducting resinl in the structure welded or loosened in |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108963059A true CN108963059A (en) | 2018-12-07 |
Family
ID=64475897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811024050.8A Pending CN108963059A (en) | 2018-09-04 | 2018-09-04 | It is a kind of to prevent LED conducting resinl in the structure welded or loosened in |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108963059A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224055A (en) * | 2019-06-28 | 2019-09-10 | 深圳光台实业有限公司 | A kind of encapsulating structure and packaging technology of paster type light emitting type |
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| CN201025620Y (en) * | 2007-04-05 | 2008-02-20 | 亿光电子工业股份有限公司 | Thin type LED device |
| US20120098006A1 (en) * | 2010-10-22 | 2012-04-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light emitting diode package with photoresist reflector and method of manufacturing |
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| CN110224055A (en) * | 2019-06-28 | 2019-09-10 | 深圳光台实业有限公司 | A kind of encapsulating structure and packaging technology of paster type light emitting type |
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