CN111538215A - Laser exposure processing device and implementation method thereof - Google Patents
Laser exposure processing device and implementation method thereof Download PDFInfo
- Publication number
- CN111538215A CN111538215A CN202010428207.4A CN202010428207A CN111538215A CN 111538215 A CN111538215 A CN 111538215A CN 202010428207 A CN202010428207 A CN 202010428207A CN 111538215 A CN111538215 A CN 111538215A
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- Prior art keywords
- machine
- plate
- cleaning
- exposure
- manipulator
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2057—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using an addressed light valve, e.g. a liquid crystal device
Abstract
The invention discloses a laser exposure processing device and an implementation method thereof, which are characterized in that: the device comprises a detection sensor, a plate placing machine, a transplanting machine, an LDI exposure host machine, a cleaning machine, a plate turnover machine and a plate collecting machine; the plate placing machine is sequentially connected with a cleaning machine, an LDI exposure host machine, a transplanting machine, a plate turnover machine, a cleaning machine, an LDI exposure host machine, a transplanting machine and a plate collecting machine; and a detection sensor is arranged between each two devices. Utilize high performance semiconductor laser and DMD lens, replace the film instrument in kind with image electronic data file, carry out the photopolymerisation through laser direct imaging technique to the dry film with the graphic circuit in the file, form the size macromolecular structure that is insoluble in dilute alkali solution, and adopt the resolution ability and the life of LDI light source to be higher than the LED lamp source, LDI exposure machine improves 25.3% than traditional exposure machine production efficiency, whole disability rate descends 0.4%, the one-time qualification rate improves 4%, three mainly scrap because of the exposure leads to obviously reduces, obtain effective control.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the field of laser exposure, in particular to a processing device for laser exposure and an implementation method thereof.
[ background of the invention ]
The traditional pattern transfer uses a parallel light source to irradiate a film negative film for imaging, and the line width/line width of the minimum resolution is 3/3 mils, but the traditional pattern transfer cannot be produced in mass. The processing capability of the prior art can not completely meet the increasing precision requirement of products, and a series of quality problems are generated in the manufacturing process; such as: garbage, copper scraps, copper slag, broken films and the like carried on the board are stuck in the film effective graphic units to cause poor positioning short circuit; the film expansion and contraction causes the deviation of the graph; the film scratches cause line chipping, poor open/short circuits, and the like.
[ summary of the invention ]
In order to solve the above problems, a laser exposure processing device and a method for implementing the same are provided;
a processing device for laser exposure is characterized in that: the automatic plate-placing and transplanting machine comprises a detection sensor, a plate-placing machine, a transplanting machine, an LDI exposure host machine, a cleaning machine, a plate-turning machine and a plate-receiving machine;
the plate placing machine is sequentially connected with a cleaning machine, an LDI exposure host machine, a transplanting machine, a plate turnover machine, a cleaning machine, an LDI exposure host machine, a transplanting machine and a plate collecting machine;
and a detection sensor is arranged between each two devices.
Furthermore, the moving manipulator arranged in the plate placing machine and the plate collecting machine is a vacuum manipulator, an operation panel (202) and a conveyor belt are also arranged, an emergency stop button is arranged, and the vacuum manipulator spans between the operation panel and the conveyor belt; the operation panel of the plate placing machine is arranged on the left side of the conveying belt, the operation panel of the plate collecting machine is arranged on the right side of the conveying belt, and the vacuum manipulator is provided with a brushless motor.
Further, the panel turnover machine includes upset manipulator and is equipped with the scram button, wherein the upset manipulator be vacuum suction upset manipulator.
Furthermore, the cleaning machine consists of a conveyor belt, an air nozzle and a high-pressure fan, wherein the air nozzle is arranged on the conveyor belt and is connected with the high-pressure fan.
Further, LDI exposure machine comprises operating panel and exposure room, operating panel set up in the exposure room, the exposure room is equipped with 6 groups of laser heads and is a word arrangement, every group laser head formation of image regional width is 8 cm.
Further, the laser head is composed of a semiconductor laser and a DMD lens.
The transplanter further comprises a three-axis manipulator, the three-axis manipulator is a vacuum three-axis manipulator, and the vacuum suction device is fixedly connected with a hand of the vacuum three-axis manipulator; the vacuum part below the three-axis manipulator is connected with the horizontal guide rail in a sliding mode, and the vacuum suction device comprises a motor and a grabbing detection sensor.
An implementation method of a processing device for laser exposure is characterized in that: the method comprises the following steps:
feeding → cleaning A plate → processing A face → turning plate → cleaning B plate face → processing B face → blanking
The feeding in the step is to place the raw materials on an operation panel of a plate placing machine, suck the raw materials by a vacuum manipulator of the plate placing machine, place the raw materials on a conveying belt of the plate placing machine, and convey the raw materials forwards into a cleaning machine;
the cleaning of the surface of the plate A in the step A is to discharge a high-pressure air pressure cleaning raw material from an air nozzle of a cleaning machine;
the step A of processing is that a transplanter transfers the raw materials into a control panel; processing the surface A of the raw material by a laser head in an exposure chamber, and moving the raw material to a plate turnover machine by a transplanting machine;
the turning plate is used for turning the raw materials by a plate turning machine;
the cleaning plate surface in the step B is a cleaning raw material with high pressure and air pressure discharged by an air nozzle of a cleaning machine;
the step B of processing is that a transplanter transfers the raw materials into a control panel; processing the surface A of the raw material by a laser head in an exposure chamber, and moving the raw material to a board receiving machine by a transplanter;
and in the step of blanking, a vacuum manipulator of the plate placing machine sucks the plate and places the plate on an operation panel of the plate placing machine, and the plate placing machine is processed.
According to the invention, a high-performance semiconductor laser and a DMD lens are utilized, an excellent optical system is matched, an image electronic data file is used for replacing a real object film tool, a graphic circuit in the file is subjected to photosensitive polymerization on a dry film through a laser direct imaging technology to form a body type macromolecular structure insoluble in a dilute alkali solution, the resolution capability and the service life of an LDI light source are higher than those of an LED light source, the production efficiency of the LDI exposure machine is improved by 25.3% compared with those of a traditional exposure machine, the integral rejection rate is reduced by 0.4%, the one-time qualification rate is improved by 4%, the three items of scrap caused by exposure are obviously reduced, and effective control is obtained;
[ description of the drawings ]
FIG. 1 is an overall structural view of the present invention;
FIG. 2 is a view showing the construction of a laser head according to the present invention;
FIG. 3 is a view showing the structure of an exposure machine according to the present invention;
FIG. 4 is a schematic flow diagram of the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
A processing device for laser exposure is characterized in that: the automatic plate-placing and transplanting machine comprises a detection sensor, a plate-placing machine, a transplanting machine, an LDI exposure host machine, a cleaning machine, a plate-turning machine and a plate-receiving machine;
the plate placing machine is sequentially connected with a cleaning machine, an LDI exposure host machine, a transplanting machine, a plate turnover machine, a cleaning machine, an LDI exposure host machine, a transplanting machine and a plate collecting machine;
and a detection sensor is arranged between each device.
The mobile manipulator arranged in the plate placing machine and the plate collecting machine is a vacuum manipulator, and is also provided with an operation panel (202), a conveyor belt and an emergency stop button, and the vacuum manipulator is arranged between the operation panel and the conveyor belt in a spanning mode; the operation panel of the plate placing machine is arranged on the left side of the conveying belt, the operation panel of the plate collecting machine is arranged on the right side of the conveying belt, and the vacuum manipulator is provided with a brushless motor.
The panel turnover machine comprises a turnover manipulator and an emergency stop button, wherein the turnover manipulator is a vacuum suction turnover manipulator.
The cleaning machine consists of a conveyor belt, an air nozzle and a high-pressure fan, wherein the conveyor belt is provided with the air nozzle, and the air nozzle is connected with the high-pressure fan.
The LDI exposure machine comprises operating panel and exposure room, operating panel set up in the exposure room, the exposure room is equipped with 6 groups of laser heads and is a word arrangement, every group laser head image area width is 8 cm.
Wherein the laser head consists of a semiconductor laser and a DMD lens.
The transplanter comprises a three-axis manipulator, the three-axis manipulator is a vacuum three-axis manipulator, and the vacuum suction device is fixedly connected with a hand of the vacuum three-axis manipulator; the vacuum is connected with the horizontal guide rail in a sliding mode below the three-axis manipulator, and the vacuum suction device comprises a motor and a grabbing detection sensor.
The implementation method of the processing device for laser exposure comprises the following steps:
feeding → cleaning A plate → processing A face → turning plate → cleaning B plate face → processing B face → blanking
The feeding in the step is to place the raw materials on an operation panel of a plate placing machine, suck the raw materials by a vacuum manipulator of the plate placing machine, place the raw materials on a conveying belt of the plate placing machine, and convey the raw materials forwards into a cleaning machine;
the cleaning of the surface of the plate A in the step A is to discharge a high-pressure air pressure cleaning raw material from an air nozzle of a cleaning machine;
the step A of processing is that a transplanter transfers the raw materials into a control panel; processing the surface A of the raw material by a laser head in an exposure chamber, and moving the raw material to a plate turnover machine by a transplanting machine;
the turning plate is used for turning the raw materials by a plate turning machine;
the cleaning plate surface in the step B is a cleaning raw material with high pressure and air pressure discharged by an air nozzle of a cleaning machine;
the step B of processing is that a transplanter transfers the raw materials into a control panel; processing the surface A of the raw material by a laser head in an exposure chamber, and moving the raw material to a board receiving machine by a transplanter;
and in the step of blanking, a vacuum manipulator of the plate placing machine sucks the plate and places the plate on an operation panel of the plate placing machine, and the plate placing machine is processed.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. A processing device for laser exposure is characterized in that: the device comprises a detection sensor, a plate placing machine, a transplanting machine, an LDI exposure host machine, a cleaning machine, a plate turnover machine and a plate collecting machine;
the plate placing machine is sequentially connected with a cleaning machine, an LDI exposure host machine, a transplanting machine, a plate turnover machine, a cleaning machine, an LDI exposure host machine, a transplanting machine and a plate collecting machine;
and a detection sensor is arranged between each two devices.
2. The apparatus of claim 1, wherein: the mobile manipulator arranged in the plate placing machine and the plate collecting machine is a vacuum manipulator, and is also provided with an operation panel and a conveyor belt, and is also provided with an emergency stop button, and the vacuum manipulator is arranged between the operation panel and the conveyor belt in a spanning manner; the operation panel of the plate placing machine is arranged on the left side of the conveying belt, the operation panel of the plate collecting machine is arranged on the right side of the conveying belt, and the vacuum manipulator is provided with a brushless motor.
3. The apparatus of claim 1, wherein: the panel turnover machine comprises a turnover manipulator and an emergency stop button, wherein the turnover manipulator is a vacuum suction turnover manipulator.
4. The apparatus of claim 1, wherein: the cleaning machine consists of a conveyor belt, an air nozzle and a high-pressure fan, wherein the conveyor belt is provided with the air nozzle, and the air nozzle is connected with the high-pressure fan.
5. The apparatus of claim 1, wherein: LDI exposure machine comprises operating panel and exposure chamber, operating panel set up in the exposure chamber, the exposure chamber is equipped with 6 groups of laser heads and is a word arrangement, every group laser head image area width is 8 cm.
6. The apparatus of claim 5, wherein: the laser head consists of a semiconductor laser and a DMD lens.
7. The apparatus of claim 1, wherein: the transplanter comprises a three-axis manipulator, the three-axis manipulator is a vacuum three-axis manipulator, and the vacuum suction device is fixedly connected with the hand part of the vacuum three-axis manipulator; the vacuum part below the three-axis manipulator is connected with the horizontal guide rail in a sliding mode, and the vacuum suction device comprises a motor and a grabbing detection sensor.
8. An implementation method of a processing device for laser exposure is characterized in that: the method comprises the following steps:
feeding → cleaning A plate → processing A face → turning plate → cleaning B plate face → processing B face → blanking
The feeding in the step is to place the raw materials on an operation panel of a plate placing machine, suck the raw materials by a vacuum manipulator of the plate placing machine, place the raw materials on a conveying belt of the plate placing machine, and convey the raw materials forwards to the cleaning machine;
the cleaning of the surface of the plate A in the step A is to discharge a high-pressure air pressure cleaning raw material from an air nozzle of a cleaning machine;
the step A of processing is that a transplanter transfers the raw materials into a control panel; processing the surface A of the raw material by a laser head in an exposure chamber, and moving the raw material to a plate turnover machine by a transplanting machine;
the turning plate is used for turning the raw materials by a plate turning machine;
the cleaning plate surface in the step B is a cleaning raw material with high pressure and air pressure discharged by an air nozzle of a cleaning machine;
the step B of processing is that a transplanter transfers the raw materials into a control panel; processing the surface A of the raw material by a laser head in an exposure chamber, and moving the raw material to a board receiving machine by a transplanter;
and in the step of blanking, a vacuum manipulator of the plate placing machine sucks the plate and places the plate on an operation panel of the plate placing machine, and the plate placing machine is processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010428207.4A CN111538215A (en) | 2020-05-20 | 2020-05-20 | Laser exposure processing device and implementation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010428207.4A CN111538215A (en) | 2020-05-20 | 2020-05-20 | Laser exposure processing device and implementation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111538215A true CN111538215A (en) | 2020-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010428207.4A Pending CN111538215A (en) | 2020-05-20 | 2020-05-20 | Laser exposure processing device and implementation method thereof |
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| Country | Link |
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| CN (1) | CN111538215A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206345437U (en) * | 2016-08-31 | 2017-07-21 | 苏州市铂汉塑胶五金有限公司 | A kind of automatic transplanter |
| CN108062008A (en) * | 2016-11-07 | 2018-05-22 | 俞庆平 | A kind of laser direct-writing exposure machine without stepping axis |
| CN108323028A (en) * | 2018-01-30 | 2018-07-24 | 江西景旺精密电路有限公司 | A kind of PCB finished products cleaning integrated production line and integration operation method |
| CN208044297U (en) * | 2018-04-25 | 2018-11-02 | 东莞市威力固电路板设备有限公司 | A kind of dual stage face LDI automatic connectings |
| CN211928380U (en) * | 2020-05-20 | 2020-11-13 | 领跃电子科技（珠海）有限公司 | Laser exposure processing device |
-
2020
- 2020-05-20 CN CN202010428207.4A patent/CN111538215A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206345437U (en) * | 2016-08-31 | 2017-07-21 | 苏州市铂汉塑胶五金有限公司 | A kind of automatic transplanter |
| CN108062008A (en) * | 2016-11-07 | 2018-05-22 | 俞庆平 | A kind of laser direct-writing exposure machine without stepping axis |
| CN108323028A (en) * | 2018-01-30 | 2018-07-24 | 江西景旺精密电路有限公司 | A kind of PCB finished products cleaning integrated production line and integration operation method |
| CN208044297U (en) * | 2018-04-25 | 2018-11-02 | 东莞市威力固电路板设备有限公司 | A kind of dual stage face LDI automatic connectings |
| CN211928380U (en) * | 2020-05-20 | 2020-11-13 | 领跃电子科技（珠海）有限公司 | Laser exposure processing device |
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