JP2011044501A - Surface mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To minimize a decrease in production efficiency even when an electronic component which is deficient in suction force by a suction nozzle is produced, in the middle of mounting electronic components on a substrate through sequential operations of a plurality of suction nozzles. <P>SOLUTION: When respective operations from the suction of electronic components by the plurality of nozzles at suction positions to the mounting of the respective sucked electronic components moved to mounting positions are carried out at respective operation positions to which a mounting head is moved through sequential operations performed by the plurality of suction nozzles, suction states of the sucked electronic components are determined from values V of negative pressure in suction during the suction of the electronic components to carry out control to perform high-speed sequential operations in the case of a threshold V1 or more, at which a stable suction state is determined, to complete respective operations up to mounting through sequential operations slower in speed than the high-speed operations with respect to electronic components having been sucked without making all the heads suck the component in the case of the thresholds V1 to V2 at which an unstable suction state is determined, and to use an electronic component left in this scheduled sequential operations for the next sequential operations. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention is applied to the surface mounting device, particularly to determine whether or not handling is possible based on the vacuum level when the electronic component is sucked and held in the production operation, and to improve the production efficiency of the mounting substrate by the sequential operation. The present invention relates to a suitable surface mounting apparatus.

  In the surface mounting apparatus, after an electronic component is sucked at a predetermined suction position by a suction nozzle mounted on the mounting head, the head is moved XY, and the electronic component held by the suction nozzle is mounted on the substrate ( Mounting board).

  In order to perform this board production efficiently, it is important to move the movable part such as the mounting head at high speed. However, moving the mounting head at high speed means that the electronic components with insufficient suction holding force The electronic component falls or is displaced.

  In order to avoid such electronic component dropping and positional displacement, for example, in Patent Document 1, even when the suction force of a component by the suction nozzle is reduced, the component is mounted on the substrate with accurate positional accuracy. In order to achieve this, a technique is disclosed in which the moving speed of the mounting head is reduced below a predetermined speed when the component suction force by the suction nozzle is lower than the steady-state suction force.

JP 2007-242818 A

  However, in a surface mounting apparatus, a mounting head equipped with a plurality of nozzle heads is used, and electronic components are sequentially picked up by a plurality of suction nozzles attached to each nozzle head, and predetermined processing operations are performed for each component. In some cases, electronic components are mounted by a series of sequential operations that are sequentially mounted on a substrate after sequentially executing. In the case of such mounting, in the technology for reducing the moving speed of the mounting head when the component suction force is low as described above, if an electronic component with insufficient suction force is generated on the way, all subsequent sequential operations are performed at a low speed. There is a problem that the production efficiency is remarkably lowered.

  The present invention was made to solve the above-mentioned conventional problems, and when mounting an electronic component on a substrate by the sequential operation of a plurality of suction nozzles, even when an electronic component with insufficient suction force occurs on the way, It is an object of the present invention to provide a surface mount device capable of minimizing a decrease in production efficiency.

  The present invention moves a mounting head having a plurality of suction nozzles in the X and Y directions and moves each suction nozzle in the Z direction so that each operation from a suction position for sucking electronic components to a mounting position for mounting on a substrate is performed. In a surface mounting apparatus that performs a predetermined operation at a position, an electronic component is attracted to each of the plurality of suction nozzles at the suction position by a sequential operation performed by the plurality of suction nozzles at each operation position where the mounting head is moved. When performing each operation from moving to a mounting position to mounting each sucked electronic component, the suction state of the sucked electronic component is determined from the negative pressure value when sucking the electronic component However, if it is determined that the suction state is stable, high-speed sequential operation is performed. If it is determined that the suction state is unstable, all the heads are not picked up parts, For the parts, the operation until the mounting is completed by the sequential operation at a speed lower than the high speed, and the electronic parts remaining in the planned sequential operation are provided with a control means for performing control to change for the next sequential operation. The above-mentioned problem is solved.

  In the present invention, when the electronic component remaining in the sequential operation scheduled this time is changed for the next sequential operation, it may be reorganized with the electronic component scheduled for the next time.

  In the present invention, when it is determined from the negative pressure value at the time of suction that an electronic component cannot be sucked, the presence or absence of the electronic component at the nozzle tip is determined by a laser recognition device attached to the mounting head. You may do it.

  According to the present invention, when a plurality of suction nozzles are sequentially operated at high speed and the sucked electronic component is mounted on the substrate, the electronic component sucked by any suction nozzle is determined to be in an unstable suction state. In this case, the mounting of electronic parts that have already been attracted by sequential operation at a low speed is completed, and the other electronic parts are newly operated at a high speed, resulting in a decrease in production efficiency due to the occurrence of electronic parts that have insufficient adsorption power. Can be minimized.

The top view which shows the outline | summary of the surface mounting apparatus of one Embodiment which concerns on this invention The principal part front view which shows the nozzle head mounted in the mounting head with which the surface mounting apparatus of this embodiment is provided. Explanatory drawing which shows the judgment method of the presence or absence of parts by laser recognition Explanatory drawing which shows the concept of the threshold applied to this embodiment Explanatory drawing which shows the example of the electronic component mounted by the sequential operation of this embodiment Flowchart of the previous stage showing the operation of this embodiment The latter flowchart showing the operation of this embodiment Flow chart showing subroutine for presence / absence of parts Flow chart showing subroutine for specified action

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view showing an outline of a surface mounting apparatus according to an embodiment of the present invention.

  The surface mounting apparatus according to the present embodiment includes a transfer device 12 that carries a printed board (not shown) from the left side in the drawing and positions the printed board (fixed station) 10 at a fixed station (mounting position), and unloads the mounted board after mounting the components. (Lower in the figure) and a plurality of tape feeders 16 mounted on the exchange bases 14F and 14R respectively disposed on the rear side and a tray holder 18 holding a large component, and electronic components sucked from the suction position of these component feeders A mounting head 20 mounted on the substrate, an X-axis for moving the mounting head 20 in the substrate transport direction (X direction), and a direction orthogonal to the substrate transport direction (Y direction) integrally with the X-axis. And two YL axes, YR axes (hereinafter referred to as Y axes) that are opposed to each other.

  As shown in FIG. 2, four nozzle heads 22 are mounted on the mounting head 20 so as to be vertically movable along the vertical direction and rotated about the axis. Each replaceable suction nozzle 24 is mounted.

  Each nozzle head 22 is connected to a vacuum generator for generating a negative pressure for sucking an electronic component at the tip of the suction nozzle 24, and for detecting a negative pressure for each nozzle 24. Each pressure sensor is attached.

  Therefore, in this embodiment, the mounting head 20 is moved to the tape feeder 16 by the X axis and the Y axis, and is sequentially sucked by the four suction nozzles 24 from the suction position 16A, and then the mounting head 20 is moved onto the camera 26. Thus, it is possible to perform component recognition by the camera 26 for each nozzle.

  In the present embodiment, as shown schematically in FIG. 3, the mounting head 20 is also provided with a laser recognition device including a laser light emitting unit 28A and a light receiving unit 28B for detecting the presence or absence of components for each nozzle. Depending on whether or not light is received by the light receiving unit 28B when the laser is irradiated to half the thickness of the electronic component P sucked by the suction nozzle, (A) no component (B) for each nozzle 24 The presence of parts is recognized.

  In the present embodiment, each operation when producing a mounting substrate by performing the operations from the component suction to the substrate mounting by the sequential operation of the four suction nozzles 24 is performed by the control device 30 installed in the main body of the surface mounting device. To do.

  Before starting this production operation, the first threshold value V1 and the second threshold value V2 for determining the suction state when the electronic component as shown in FIG.

  Here, the first threshold value V1 is a negative pressure at which the electronic component is normally suctioned when the vacuum level is higher than this, and it is determined that high-speed movement is possible, and the second threshold value V2 is a vacuum level below this level. It is a negative pressure that is determined to be incapable of sucking electronic components. Therefore, between V1 and V2 means an instability determination region that can be handled if the sucked electronic component is low speed.

  The first and second threshold values V1 and V2 can be appropriately set from actual results, but in the present embodiment, for the sake of convenience, the following thresholds (1) and (2) are set.

V1 = (P ₁ −P ₀ ) × 0.3 + P ₁ (1)
V2 = P ₀ − (P ₁ −P ₀ ) × 0.3 (2)
Where P ₁ : Electronic component is in close contact with the nozzle tip and adsorbed (highest negative pressure)
P ₀ : No adsorption of electronic components, state where nozzle tip is opened (lowest negative pressure)

  After the above preparation is completed, a plurality of electronic components are sequentially operated by using the mounting head 20 on which the four nozzle heads 22 each having the suction nozzle 24 mounted thereon as shown in FIG. 2 are mounted. From adsorption to mounting.

  The sequential operation performed here is completed when a predetermined operation by each nozzle is performed at a specified operation position where the mounting head 20 is moved, and the same operation is sequentially performed for a plurality of nozzles at the same operation position. Thereafter, the component mounting method moves to the next operation position.

  Next, a specific example shown in FIG. 5 will be described with reference to the flowchart of FIG.

  In the specific example of FIG. 5, eight electronic components as shown by component mounting 1 to 8 in (A), and four nozzle heads (adsorption nozzles) sequentially as shown by heads 1 to 4 in (B). By operation, adsorption, recognition and mounting.

  In that case, the mounting head 20 is moved to the suction position 16A, and the electronic components (mounted components 1 to 4) of the first packet (currently scheduled) are sequentially suctioned by the suction nozzles of the heads 1 to 4, and the suction is completed. After that, the mounting head 20 is moved onto the camera 26, the components adsorbed on the heads 1 to 4 are sequentially recognized, and then moved onto the substrate at the mounting position. Install sequentially. After the above-described component mounting is completed, the electronic components (mounted components 5 to 8) of the next packet (scheduled for the next time) are similarly mounted sequentially. The above is the implementation by the normal sequential operation.

  In the present embodiment, the production operation (mounting) is started according to the flowchart of FIG. 6, and first, Max = 4 is set as the number of target nozzles, and the counter n is set to the initial value 0 (step 1).

  Next, No. The component suction operation by one nozzle is performed (step 2), and the vacuum value (pressure) V is read and acquired at the time of the component suction (step 3).

  At this time, it is determined whether or not the vacuum value V is equal to or higher than a predetermined second threshold vacuum level V2 (step 4), and it is determined whether component suction has been completed or component suction has failed.

  If the component suction has failed (Y in step 4), the suction operation is repeated until the component can be sucked again. At that time, the subroutine for the component presence / absence operation shown in FIG. 7 is executed (step 5).

  That is, when the vacuum value V is less than V2 (Y in Step 4), the nozzle 24 is moved to the laser position by the Z axis as shown in FIG. 3 (Step 51), and the component is adsorbed by the laser irradiation. It is confirmed whether there is (step 52).

  If the component is adsorbed despite being less than V2 (N in step 52), it is determined that handling of the component at this vacuum level is impossible, and the disposal position (box) 32 shown in FIG. (Step 53), the disposal operation is forcibly performed (step 54), and the component suction in step 2 is performed again. Thereby, it is possible to prevent the suction operation in step 2 from being erroneously performed while the parts are being sucked.

  When the component suction is completed (N in Step 4), the acquired vacuum pressure level is compared with the first threshold value V1 set in advance to determine whether the suction is normal or unstable. Determine (step 6).

  When the vacuum level is V2 or higher and V1 or lower (N in Step 6), order division is performed, Max = n + 1 is set, and head n + 1 is targeted for order division (Step 7). Change the moving speed of each head movement to a low speed (step 8) to minimize acceleration and deceleration during parts transportation as much as possible, so as to prevent parts falling and part adsorption deviation during transportation To.

  Next, in step 9, the counter n is incremented, and in step 10, the suction target head n is N when compared with Max. Therefore, in step 11, the counter n is reset to 0, and the heads up to n + 1 set in step 7 are set. As for, each operation after step 12 is performed at a low speed.

  On the other hand, when the normal pressure is stable when the vacuum pressure V acquired in step 3 is V1 or more (Y in step 6), the counter n is incremented in step 9, and the last head (nozzle) with Max = 4 By repeating the above steps 2 to 10 until the time is reached, the sequential adsorption by normal adsorption is completed (N in step 10), and the counter n is reset to the initial value (step 11).

  After the counter n is reset in step 11, the electronic component picked up by each head is subjected to the component recognition operation by the camera 26 in accordance with the subroutine shown in FIG.

  That is, the mounting head 20 is moved above the camera 26 that is the designated position, and the suction state of each suction component after the movement is determined by steps 62 to 64 that are substantially the same as steps 3 to 6 at the time of suction. If it is normal suction (Y in Step 6 and Step 64), it is at a preset high speed. On the other hand, even if Y is in Step 6, if it is in an unstable suction state (Step 64) N) Recognize parts as designated operations at low speeds where stable operation is possible.

  The operation by the subroutine of FIG. 8 is not only performed during the above component recognition operation (image unit movement completion), but also during a component mounting operation in step 19 (mounting position movement completion) described later or in a component discarding operation in step 20 It is also performed at the time (disposal position movement completion).

  In the component recognition operation, the component mounting operation, and the component discarding operation performed according to the flowchart of FIG. 8, all the component absence determinations (Y in step 63) are error processing as component dropping.

  If the recognition error does not occur (N in Step 13), and if a recognition error occurs (Y in Step 13), it is stored in the counter n. (Step 15), the counter n is incremented (Step 14). After repeating the above recognition operation up to the Max head (Y in Step 16), the counter n is reset again (Step 17).

  Next, it is determined whether or not a recognition error has occurred in the suction component for each head (step 18). If not, the mounting operation of step 19 is performed, and if it has occurred, the discarding operation of step 20 is performed. Each is executed according to the subroutine of FIG.

  After completing the component mounting operation in step 19, the vacuum pressure V is acquired again (step 21), and the vacuum level is determined (step 22).

  If the vacuum pressure V is higher than the component suction determination level (V2) (N in step 22), an error process is performed as a component take-away by determining that the component is sucked.

  On the other hand, if it is determined that there is no part (Y in step 22), a release check by laser recognition is performed in the same manner as in step 51 (step 23), and it is confirmed that there is no part (N in step 24). ), The counter n is incremented (step 25), and the processing of steps 18 to 25 is repeated until there is no sucked electronic component, thereby completing the execution (step 26).

  In the normal sequential suction operation using a plurality of nozzle heads, if the operation is slow because the suction state is unstable even with one head, the subsequent operations may all be slow, and the tact may be slowed.

  For example, in the example of FIG. 5B, when the suction state is determined to be normal by the component suction of the mounted component 1 by the head 1, and the suction state is determined to be unstable by the component suction of the mounted component 2 of the head 2. Then, the components 3 and 4 are picked up by the heads 3 and 4, the electronic components 1 to 4 are picked up by the heads 1 to 4, and the mounted components 1 are picked up by the heads 1 and 2. All the operations until 2 is mounted are low-speed operations, and then the mounting operations of the mounting components 3 and 4 adsorbed by the heads 3 and 4 are the original high-speed operations. As a result, the component suction operation twice, the component recognition operation four times, and the component mounting operation two times become low speed operations.

  However, in the present embodiment, by dividing the order (single suction, recognition, and mounting operations) into units in the step 7, the operation of maximizing the speed can be reduced, thereby reducing the tact loss. It can be minimized.

  More specifically, as shown in the figure, if the number of heads is four and four mounted parts can be picked up, the parts picking operation is four times, the parts recognition operation is four times, Although the processing is executed four times in the mounting operation, if there is a head in an unstable region (V2 <vacuum pressure V <V1), the loop is limited at that point. That is, in the example shown in FIG. 5C, the unstable region is generated by the component suction by the head 2, so that the order is divided when the head 2 is attracted by the component, and the component by the unadsorbed heads 3 and 4 is obtained. Without suctioning, the component recognition operation twice and the component mounting operation two times by the sucked heads 1 and 2 are executed at a low speed operation.

  Then, the remaining heads 3 and 4 that have not been picked up by the order division are sucked, recognized, and mounted on the remaining tower parts 3 and 4. That is, if the suction state is determined to be normal by the parts 3 and 4 being picked up by the heads 3 and 4, the component picking operation is performed twice, the component recognition operation is performed twice, and the component mounting operation is performed twice. High speed operation.

  Further, the order division is not limited to immediately after picking up the component where the unstable region has occurred, and the picking of the component may be stopped before the electronic component is picked up by all the heads. In other words, if the parts to the head 4 are not picked up, the parts picked up by the head 3 that has not been picked up after that are divided into orders, and the parts picked up by the heads 1 to 3 are sequentially recognized and mounted. The effect of the invention is achieved.

  Therefore, in this embodiment, compared with FIG. 5B in which the order is not divided, there is an effect that the low speed operation is reduced by two component suction operations and two component recognition operations, thereby improving the tact.

  As described above, when order division is performed with the head 2 in which an unstable region is found, if it is simply divided, the method of “order division 1” shown in FIG. 5C is used. When there are 8 points, only the two points of the mounted parts 3 and 4 corresponding to the heads 3 and 4 are picked up, recognized and mounted on the order of the remaining four of the four heads. The remaining heads 1 and 2 are empty moves that are not used for parts conveyance. Therefore, here, “order division 2” indicated by (D) is adopted, and the tower parts 3 and 4 are sucked, recognized and mounted on the heads 3 and 4, and the tower parts 5 and 6 are sucked on the remaining heads 1 and 2. By recognizing and assigning them to be mounted, the remaining mounted parts are built in one order ahead of time, so that the Max heads (4) can be moved as little as possible and divided again. Re-scheduling (reorganization) for efficient use is performed even if a problem occurs.

  According to the embodiment described above in detail, the following effects can be obtained.

(1) When producing substrates in sequential operation, it is judged whether to pick up continuously, or to divide to the next cycle according to the vacuum level when electronic parts are picked up, and minimize tact loss due to handling. To.

(2) By identifying whether or not handling is possible based on the vacuum level at the time of suction, mounting displacement and component dropping can be effectively prevented.

DESCRIPTION OF SYMBOLS 10 ... Fixed station 12 ... Conveyance apparatus 14 ... Exchange stand 16 ... Tape feeder 18 ... Tray holder 20 ... Mounting head 22 ... Nozzle head 24 ... Adsorption nozzle 26 ... Camera 28A ... Laser light emission part 28B ... Laser light reception part 30 ... Control apparatus

Claims (3)

The mounting head having a plurality of suction nozzles is moved in the XY direction, and each suction nozzle is moved in the Z direction, so that a predetermined position is determined at each operation position from the suction position for sucking electronic components to the mounting position for mounting on the substrate. In surface mount equipment that operates,
At each operation position where the mounting head is moved, a plurality of suction nozzles are used to sequentially suck the electronic components to each of the plurality of suction nozzles at the suction position, and then move to the mounting position to pick up each of the sucked electrons. When performing each operation until the parts are mounted,
Determine the adsorption state of the adsorbed electronic component from the negative pressure value when adsorbing the electronic component,
If it is determined that the suction state is stable, perform high-speed sequential operation.
If it is determined that the suction state is unstable, without performing component suction on all the heads, for each electronic component that has already been suctioned, each operation up to mounting is completed by sequential operation at a speed lower than the high speed,
A surface mounting apparatus characterized by comprising control means for performing control to change electronic components remaining in a sequential operation scheduled this time for the next sequential operation.   2. The surface mounting apparatus according to claim 1, wherein the electronic component remaining in the sequential operation scheduled this time is reorganized with the electronic component scheduled for the next time when the electronic component is changed for the next sequential operation.   When it is determined from the negative pressure value at the time of suction that an electronic component cannot be sucked, the presence or absence of the electronic component at the tip of the nozzle is determined by a laser recognition device attached to the mounting head. Item 2. The surface mounting apparatus according to Item 1.

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