CN111531464A - 研磨头及研磨设备 - Google Patents
研磨头及研磨设备 Download PDFInfo
- Publication number
- CN111531464A CN111531464A CN202010382859.9A CN202010382859A CN111531464A CN 111531464 A CN111531464 A CN 111531464A CN 202010382859 A CN202010382859 A CN 202010382859A CN 111531464 A CN111531464 A CN 111531464A
- Authority
- CN
- China
- Prior art keywords
- grinding
- polishing
- adsorption
- head
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010382859.9A CN111531464B (zh) | 2020-05-08 | 2020-05-08 | 研磨头及研磨设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010382859.9A CN111531464B (zh) | 2020-05-08 | 2020-05-08 | 研磨头及研磨设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111531464A true CN111531464A (zh) | 2020-08-14 |
CN111531464B CN111531464B (zh) | 2022-04-08 |
Family
ID=71971759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010382859.9A Active CN111531464B (zh) | 2020-05-08 | 2020-05-08 | 研磨头及研磨设备 |
Country Status (1)
Country | Link |
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CN (1) | CN111531464B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112677033A (zh) * | 2020-12-03 | 2021-04-20 | 上海新昇半导体科技有限公司 | 一种抛光头、化学机械抛光装置和方法 |
CN115042021A (zh) * | 2022-05-19 | 2022-09-13 | 江苏富乐德石英科技有限公司 | 一种超声波石英研磨装置及研磨工艺 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM390199U (en) * | 2010-04-14 | 2010-10-11 | Shih-Fa Chen | Wafer grinding ring structure |
KR20110097357A (ko) * | 2010-02-25 | 2011-08-31 | 주식회사 윌비에스엔티 | 화학적 기계 연마 장치의 리테이너 링 제조 방법과 화학적 기계 연마 장치의 리테이너 링 |
CN202592202U (zh) * | 2012-05-09 | 2012-12-12 | 中芯国际集成电路制造(上海)有限公司 | 带有研磨液供应功能的研磨头及研磨装置 |
CN203887679U (zh) * | 2014-05-23 | 2014-10-22 | 中芯国际集成电路制造(北京)有限公司 | 研磨头及研磨装置 |
CN203887683U (zh) * | 2014-06-19 | 2014-10-22 | 中芯国际集成电路制造(北京)有限公司 | 研磨头及研磨装置 |
CN105983901A (zh) * | 2015-03-19 | 2016-10-05 | 应用材料公司 | 用于减少晶片缺陷的保持环 |
CN206277261U (zh) * | 2016-12-16 | 2017-06-27 | 中芯国际集成电路制造(北京)有限公司 | 研磨组件 |
KR20170073284A (ko) * | 2015-12-18 | 2017-06-28 | 주식회사 케이씨텍 | 화학 기계적 연마 시스템의 기판 로딩 장치 및 그 제어방법 |
CN108161711A (zh) * | 2017-12-28 | 2018-06-15 | 德淮半导体有限公司 | 晶圆研磨装置及研磨头 |
CN209425232U (zh) * | 2018-12-19 | 2019-09-24 | 吴庚平 | 一种新型保持环及装有该保持环的化学机械抛光机 |
CN209579181U (zh) * | 2018-10-12 | 2019-11-05 | 德淮半导体有限公司 | 研磨环结构以及研磨头 |
TWM588037U (zh) * | 2019-09-24 | 2019-12-21 | 楷豐科技股份有限公司 | 化學機械研磨環及其撓性環 |
-
2020
- 2020-05-08 CN CN202010382859.9A patent/CN111531464B/zh active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110097357A (ko) * | 2010-02-25 | 2011-08-31 | 주식회사 윌비에스엔티 | 화학적 기계 연마 장치의 리테이너 링 제조 방법과 화학적 기계 연마 장치의 리테이너 링 |
TWM390199U (en) * | 2010-04-14 | 2010-10-11 | Shih-Fa Chen | Wafer grinding ring structure |
CN202592202U (zh) * | 2012-05-09 | 2012-12-12 | 中芯国际集成电路制造(上海)有限公司 | 带有研磨液供应功能的研磨头及研磨装置 |
CN203887679U (zh) * | 2014-05-23 | 2014-10-22 | 中芯国际集成电路制造(北京)有限公司 | 研磨头及研磨装置 |
CN203887683U (zh) * | 2014-06-19 | 2014-10-22 | 中芯国际集成电路制造(北京)有限公司 | 研磨头及研磨装置 |
CN105983901A (zh) * | 2015-03-19 | 2016-10-05 | 应用材料公司 | 用于减少晶片缺陷的保持环 |
KR20170073284A (ko) * | 2015-12-18 | 2017-06-28 | 주식회사 케이씨텍 | 화학 기계적 연마 시스템의 기판 로딩 장치 및 그 제어방법 |
CN206277261U (zh) * | 2016-12-16 | 2017-06-27 | 中芯国际集成电路制造(北京)有限公司 | 研磨组件 |
CN108161711A (zh) * | 2017-12-28 | 2018-06-15 | 德淮半导体有限公司 | 晶圆研磨装置及研磨头 |
CN209579181U (zh) * | 2018-10-12 | 2019-11-05 | 德淮半导体有限公司 | 研磨环结构以及研磨头 |
CN209425232U (zh) * | 2018-12-19 | 2019-09-24 | 吴庚平 | 一种新型保持环及装有该保持环的化学机械抛光机 |
TWM588037U (zh) * | 2019-09-24 | 2019-12-21 | 楷豐科技股份有限公司 | 化學機械研磨環及其撓性環 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112677033A (zh) * | 2020-12-03 | 2021-04-20 | 上海新昇半导体科技有限公司 | 一种抛光头、化学机械抛光装置和方法 |
CN112677033B (zh) * | 2020-12-03 | 2021-12-17 | 上海新昇半导体科技有限公司 | 一种抛光头、化学机械抛光装置和方法 |
CN115042021A (zh) * | 2022-05-19 | 2022-09-13 | 江苏富乐德石英科技有限公司 | 一种超声波石英研磨装置及研磨工艺 |
Also Published As
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CN111531464B (zh) | 2022-04-08 |
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PB01 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211102 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |