JP5892389B2 - 研磨パッド及び研磨方法 - Google Patents
研磨パッド及び研磨方法 Download PDFInfo
- Publication number
- JP5892389B2 JP5892389B2 JP2013071895A JP2013071895A JP5892389B2 JP 5892389 B2 JP5892389 B2 JP 5892389B2 JP 2013071895 A JP2013071895 A JP 2013071895A JP 2013071895 A JP2013071895 A JP 2013071895A JP 5892389 B2 JP5892389 B2 JP 5892389B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing pad
- annular groove
- annular grooves
- circle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title claims description 320
- 238000000034 method Methods 0.000 title claims description 12
- 239000002002 slurry Substances 0.000 claims description 48
- 230000003750 conditioning effect Effects 0.000 claims description 9
- 238000011144 upstream manufacturing Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 230000007704 transition Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000001143 conditioned effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
9 研磨面
19 環状溝
Claims (6)
- 円形の研磨面を備え、中心部が円形にくり抜かれたドーナツ状の研磨パッドであって、 当該研磨面に形成された複数の環状溝を備え、
各々の環状溝は、真円を描き、且つ円形の研磨面の周と接するように配置され、
前記研磨面をなす円の半径をR、前記くり抜かれた中心部の円の半径をr、および前記環状溝の直径をXとした場合、R−r≦X≦Rの関係が成り立つことを特徴とする研磨パッド。 - 円形の研磨面を備える研磨パッドであって、
当該研磨面に形成された複数の環状溝を備え、
各々の環状溝は、真円を描き、且つ円形の研磨面の周と接するように配置され、
前記研磨面をなす円の半径をR、および前記環状溝の直径をXとした場合、X≦Rの関係が成り立ち、
前記環状溝が、隣接する環状溝と接するか又は交差していることを特徴とする研磨パッド。 - 前記複数の環状溝は、同一の直径を有しており、
前記複数の環状溝の中心は、それぞれ、研磨面をなす円と同心の円の円周上に配置され、且つ研磨面をなす円よりも直径が短い円の周上に配置されている、請求項1又は2に記載の研磨パッド。 - 前記複数の環状溝のうちの一つの環状溝は、前記複数の環状溝のうちの他の環状溝と、前記研磨面をなす円の直径に対して線対称になるように配置されている、請求項1乃至3の何れか1項に記載の研磨パッド。
- 前記複数の環状溝は、3個乃至16個の環状溝を有する、請求項1乃至4の何れか1項に記載の研磨パッド。
- 請求項1乃至5の何れか1項に記載の研磨パッドを用いた被研磨物の研磨方法であって、
前記研磨パッドを研磨装置に装着する工程と、
前記研磨パッドの表面をドレッサによってコンディショニングする工程と、
研磨スラリーを研磨装置から前記研磨パッドの研磨面に供給する工程と、
前記研磨パッドを被研磨物に押し当て、所定方向に回転させる工程と、
および、前記回転工程に引き続いて前記研磨パッドを前記回転方向とは逆方向に回転させる逆回転工程とを備えることを特徴とする研磨方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013071895A JP5892389B2 (ja) | 2013-03-29 | 2013-03-29 | 研磨パッド及び研磨方法 |
PCT/JP2014/057349 WO2014156840A1 (ja) | 2013-03-29 | 2014-03-18 | 研磨パッド及び研磨方法 |
TW103111358A TW201446415A (zh) | 2013-03-29 | 2014-03-27 | 研磨墊以及研磨方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013071895A JP5892389B2 (ja) | 2013-03-29 | 2013-03-29 | 研磨パッド及び研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014195838A JP2014195838A (ja) | 2014-10-16 |
JP5892389B2 true JP5892389B2 (ja) | 2016-03-23 |
Family
ID=51623820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013071895A Active JP5892389B2 (ja) | 2013-03-29 | 2013-03-29 | 研磨パッド及び研磨方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5892389B2 (ja) |
TW (1) | TW201446415A (ja) |
WO (1) | WO2014156840A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111526945B (zh) * | 2018-01-03 | 2022-05-06 | 尹壬奎 | 磨式研磨机 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4037367A (en) * | 1975-12-22 | 1977-07-26 | Kruse James A | Grinding tool |
JP3612599B2 (ja) * | 1994-09-01 | 2005-01-19 | 株式会社ルネサステクノロジ | 研磨方法およびその装置 |
JP2002200555A (ja) * | 2000-12-28 | 2002-07-16 | Ebara Corp | 研磨工具および該研磨工具を具備したポリッシング装置 |
US7377840B2 (en) * | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
JP2008168430A (ja) * | 2008-01-21 | 2008-07-24 | Nitta Haas Inc | 研磨部材 |
-
2013
- 2013-03-29 JP JP2013071895A patent/JP5892389B2/ja active Active
-
2014
- 2014-03-18 WO PCT/JP2014/057349 patent/WO2014156840A1/ja active Application Filing
- 2014-03-27 TW TW103111358A patent/TW201446415A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014195838A (ja) | 2014-10-16 |
WO2014156840A1 (ja) | 2014-10-02 |
TW201446415A (zh) | 2014-12-16 |
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