CN111527583B - 等离子体处理设备和方法 - Google Patents
等离子体处理设备和方法 Download PDFInfo
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- CN111527583B CN111527583B CN201880084092.2A CN201880084092A CN111527583B CN 111527583 B CN111527583 B CN 111527583B CN 201880084092 A CN201880084092 A CN 201880084092A CN 111527583 B CN111527583 B CN 111527583B
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- 230000008569 process Effects 0.000 claims abstract description 184
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- 238000002347 injection Methods 0.000 claims description 20
- 239000007924 injection Substances 0.000 claims description 20
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 14
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Plasma Technology (AREA)
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Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762610573P | 2017-12-27 | 2017-12-27 | |
US62/610,573 | 2017-12-27 | ||
PCT/US2018/065391 WO2019133272A1 (en) | 2017-12-27 | 2018-12-13 | Plasma processing apparatus and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111527583A CN111527583A (zh) | 2020-08-11 |
CN111527583B true CN111527583B (zh) | 2023-10-20 |
Family
ID=66950641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201880084092.2A Active CN111527583B (zh) | 2017-12-27 | 2018-12-13 | 等离子体处理设备和方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20190198301A1 (zh) |
JP (1) | JP2021509525A (zh) |
KR (1) | KR20200072557A (zh) |
CN (1) | CN111527583B (zh) |
SG (1) | SG11202005088WA (zh) |
TW (1) | TWI733070B (zh) |
WO (1) | WO2019133272A1 (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11189464B2 (en) | 2019-07-17 | 2021-11-30 | Beijing E-town Semiconductor Technology Co., Ltd. | Variable mode plasma chamber utilizing tunable plasma potential |
US11276560B2 (en) | 2019-08-30 | 2022-03-15 | Mattson Technology, Inc. | Spacer etching process |
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