CN111511964A - 镀覆覆膜的晶粒的微细化方法 - Google Patents

镀覆覆膜的晶粒的微细化方法 Download PDF

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Publication number
CN111511964A
CN111511964A CN201880080829.3A CN201880080829A CN111511964A CN 111511964 A CN111511964 A CN 111511964A CN 201880080829 A CN201880080829 A CN 201880080829A CN 111511964 A CN111511964 A CN 111511964A
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CN
China
Prior art keywords
plating
nanocarbon
plating film
crystal grains
film
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Pending
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CN201880080829.3A
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English (en)
Chinese (zh)
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高木幹晴
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Individual
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Individual
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Publication of CN111511964A publication Critical patent/CN111511964A/zh
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/615Microstructure of the layers, e.g. mixed structure
    • C25D5/617Crystalline layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN201880080829.3A 2017-12-15 2018-12-14 镀覆覆膜的晶粒的微细化方法 Pending CN111511964A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017240928A JP2021042397A (ja) 2017-12-15 2017-12-15 めっき皮膜の結晶粒の微細化方法
JP2017-240928 2017-12-15
PCT/JP2018/046031 WO2019117279A1 (ja) 2017-12-15 2018-12-14 めっき皮膜の結晶粒の微細化方法

Publications (1)

Publication Number Publication Date
CN111511964A true CN111511964A (zh) 2020-08-07

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Family Applications (1)

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CN201880080829.3A Pending CN111511964A (zh) 2017-12-15 2018-12-14 镀覆覆膜的晶粒的微细化方法

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US (1) US20210156044A1 (ja)
EP (1) EP3725921A4 (ja)
JP (1) JP2021042397A (ja)
CN (1) CN111511964A (ja)
WO (1) WO2019117279A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6916971B1 (ja) * 2020-09-15 2021-08-11 Dowaメタルテック株式会社 銀めっき材およびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3371020A (en) * 1964-12-14 1968-02-27 Union Carbide Corp Process for the electrodeposition of metals
WO2005106989A1 (ja) * 2004-04-30 2005-11-10 Toyo Kohan Co., Ltd. 電池容器用めっき鋼板、その電池容器用めっき鋼板を用いた電池容器およびその電池容器を用いた電池
CN102703943A (zh) * 2012-05-23 2012-10-03 江苏仪征金派内燃机配件有限公司 一种纳米复合表面活塞环的生产方法
JP2013185185A (ja) * 2012-03-07 2013-09-19 Shinshu Univ Ni−W合金/CNT複合めっき方法およびNi−W合金/CNT複合めっき液
CN103469264A (zh) * 2013-09-16 2013-12-25 中国电子科技集团公司第三十八研究所 电镀沉积制备纳米晶结构金锡合金镀层的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3913118B2 (ja) * 2002-06-13 2007-05-09 忠正 藤村 超微粒ダイヤモンド粒子を分散した金属薄膜層、該薄膜層を有する金属材料、及びそれらの製造方法
JPWO2005056885A1 (ja) * 2003-12-08 2007-07-05 東洋鋼鈑株式会社 電池容器用めっき鋼板、その電池容器用めっき鋼板を用いた電池容器、およびその電池容器を用いた電池
US7320832B2 (en) * 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
JP2008214667A (ja) 2007-02-28 2008-09-18 Shinshu Univ 亜鉛−ナノカーボン複合めっき物およびその製造方法
JP5435477B2 (ja) * 2010-01-22 2014-03-05 アイテック株式会社 ダイヤモンド微粒子を分散させた複合めっき液及びその製造方法
JP6536819B2 (ja) * 2015-12-03 2019-07-03 トヨタ自動車株式会社 銅皮膜の成膜方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3371020A (en) * 1964-12-14 1968-02-27 Union Carbide Corp Process for the electrodeposition of metals
WO2005106989A1 (ja) * 2004-04-30 2005-11-10 Toyo Kohan Co., Ltd. 電池容器用めっき鋼板、その電池容器用めっき鋼板を用いた電池容器およびその電池容器を用いた電池
JP2013185185A (ja) * 2012-03-07 2013-09-19 Shinshu Univ Ni−W合金/CNT複合めっき方法およびNi−W合金/CNT複合めっき液
CN102703943A (zh) * 2012-05-23 2012-10-03 江苏仪征金派内燃机配件有限公司 一种纳米复合表面活塞环的生产方法
CN103469264A (zh) * 2013-09-16 2013-12-25 中国电子科技集团公司第三十八研究所 电镀沉积制备纳米晶结构金锡合金镀层的方法

Also Published As

Publication number Publication date
WO2019117279A1 (ja) 2019-06-20
EP3725921A1 (en) 2020-10-21
US20210156044A1 (en) 2021-05-27
JP2021042397A (ja) 2021-03-18
EP3725921A4 (en) 2021-01-27

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