EP3725921A4 - Method for refining crystal grains in plating film - Google Patents

Method for refining crystal grains in plating film Download PDF

Info

Publication number
EP3725921A4
EP3725921A4 EP18887864.9A EP18887864A EP3725921A4 EP 3725921 A4 EP3725921 A4 EP 3725921A4 EP 18887864 A EP18887864 A EP 18887864A EP 3725921 A4 EP3725921 A4 EP 3725921A4
Authority
EP
European Patent Office
Prior art keywords
crystal grains
plating film
refining crystal
refining
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18887864.9A
Other languages
German (de)
French (fr)
Other versions
EP3725921A1 (en
Inventor
Mikiharu TAKAGI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP3725921A1 publication Critical patent/EP3725921A1/en
Publication of EP3725921A4 publication Critical patent/EP3725921A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP18887864.9A 2017-12-15 2018-12-14 Method for refining crystal grains in plating film Withdrawn EP3725921A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017240928A JP2021042397A (en) 2017-12-15 2017-12-15 Method of micronizing crystal grains in plating film
PCT/JP2018/046031 WO2019117279A1 (en) 2017-12-15 2018-12-14 Method for refining crystal grains in plating film

Publications (2)

Publication Number Publication Date
EP3725921A1 EP3725921A1 (en) 2020-10-21
EP3725921A4 true EP3725921A4 (en) 2021-01-27

Family

ID=66820367

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18887864.9A Withdrawn EP3725921A4 (en) 2017-12-15 2018-12-14 Method for refining crystal grains in plating film

Country Status (5)

Country Link
US (1) US20210156044A1 (en)
EP (1) EP3725921A4 (en)
JP (1) JP2021042397A (en)
CN (1) CN111511964A (en)
WO (1) WO2019117279A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040011433A1 (en) * 2002-06-13 2004-01-22 Shigeru Shiozaki Metal thin film dispersing a super-fine diamond particle, a metal material having the metal thin film, and a method for preparing the same
WO2005056885A1 (en) * 2003-12-08 2005-06-23 Toyo Kohan Co., Ltd. Metal-plated steel sheet for battery case, battery case using the plated steel sheet for battery case and battery using the battery case
WO2005106989A1 (en) * 2004-04-30 2005-11-10 Toyo Kohan Co., Ltd. Plated steel plate for battery container, battery container using the plated steel plate for battery container, and battery using the battery container
WO2011089933A1 (en) * 2010-01-22 2011-07-28 アイテック株式会社 Composite plating solution having diamond microparticles dispersed therein, and process for production thereof
US20120121923A1 (en) * 2004-12-17 2012-05-17 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to one of the substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3371020A (en) * 1964-12-14 1968-02-27 Union Carbide Corp Process for the electrodeposition of metals
JP2008214667A (en) 2007-02-28 2008-09-18 Shinshu Univ Zinc-nano carbon compound-plated object and method for manufacturing the same
JP5857339B2 (en) * 2012-03-07 2016-02-10 国立大学法人信州大学 Ni-W alloy / CNT composite plating method and Ni-W alloy / CNT composite plating solution
CN102703943B (en) * 2012-05-23 2016-04-13 江苏仪征金派内燃机配件有限公司 A kind of production method of nanocomposite surface piston ring
CN103469264B (en) * 2013-09-16 2015-10-21 中国电子科技集团公司第三十八研究所 Electroplating deposition prepares the method for nanocrystalline structure gold-tin alloy coating
JP6536819B2 (en) * 2015-12-03 2019-07-03 トヨタ自動車株式会社 Method of forming copper film

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040011433A1 (en) * 2002-06-13 2004-01-22 Shigeru Shiozaki Metal thin film dispersing a super-fine diamond particle, a metal material having the metal thin film, and a method for preparing the same
WO2005056885A1 (en) * 2003-12-08 2005-06-23 Toyo Kohan Co., Ltd. Metal-plated steel sheet for battery case, battery case using the plated steel sheet for battery case and battery using the battery case
WO2005106989A1 (en) * 2004-04-30 2005-11-10 Toyo Kohan Co., Ltd. Plated steel plate for battery container, battery container using the plated steel plate for battery container, and battery using the battery container
US20120121923A1 (en) * 2004-12-17 2012-05-17 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to one of the substrate
WO2011089933A1 (en) * 2010-01-22 2011-07-28 アイテック株式会社 Composite plating solution having diamond microparticles dispersed therein, and process for production thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019117279A1 *

Also Published As

Publication number Publication date
WO2019117279A1 (en) 2019-06-20
CN111511964A (en) 2020-08-07
US20210156044A1 (en) 2021-05-27
JP2021042397A (en) 2021-03-18
EP3725921A1 (en) 2020-10-21

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