CN111500980B - 蒸镀掩模以及蒸镀掩模的制造方法 - Google Patents

蒸镀掩模以及蒸镀掩模的制造方法 Download PDF

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Publication number
CN111500980B
CN111500980B CN202010440398.6A CN202010440398A CN111500980B CN 111500980 B CN111500980 B CN 111500980B CN 202010440398 A CN202010440398 A CN 202010440398A CN 111500980 B CN111500980 B CN 111500980B
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China
Prior art keywords
vapor deposition
deposition mask
point
metal plate
dimension
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CN202010440398.6A
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English (en)
Chinese (zh)
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CN111500980A (zh
Inventor
池永知加雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority claimed from JP2017238092A external-priority patent/JP6376483B2/ja
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of CN111500980A publication Critical patent/CN111500980A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN202010440398.6A 2017-01-10 2018-01-08 蒸镀掩模以及蒸镀掩模的制造方法 Active CN111500980B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017002157 2017-01-10
JP2017-002157 2017-01-10
JP2017238092A JP6376483B2 (ja) 2017-01-10 2017-12-12 蒸着マスクの製造方法、蒸着マスク装置の製造方法および蒸着マスクの良否判定方法
JP2017-238092 2017-12-12
CN201810014059.4A CN108286034B (zh) 2017-01-10 2018-01-08 蒸镀掩模、蒸镀掩模装置的制造方法以及蒸镀掩模的制造方法

Related Parent Applications (1)

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CN201810014059.4A Division CN108286034B (zh) 2017-01-10 2018-01-08 蒸镀掩模、蒸镀掩模装置的制造方法以及蒸镀掩模的制造方法

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CN111500980A CN111500980A (zh) 2020-08-07
CN111500980B true CN111500980B (zh) 2022-08-19

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CN202010440398.6A Active CN111500980B (zh) 2017-01-10 2018-01-08 蒸镀掩模以及蒸镀掩模的制造方法

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Country Status (3)

Country Link
KR (1) KR102333411B1 (ko)
CN (2) CN108286034B (ko)
WO (1) WO2018131474A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102520811B1 (ko) * 2018-07-09 2023-04-12 다이니폰 인사츠 가부시키가이샤 증착 마스크의 양부 판정 방법, 증착 마스크의 제조 방법, 증착 마스크 장치의 제조 방법, 증착 마스크의 선정 방법 및 증착 마스크
WO2020065749A1 (ja) * 2018-09-26 2020-04-02 シャープ株式会社 マスクシート、マスクシートの製造方法、および蒸着マスクの製造方法
JP7454988B2 (ja) * 2020-04-01 2024-03-25 株式会社ジャパンディスプレイ 蒸着マスクの製造装置および製造方法
CN113206138B (zh) * 2021-04-30 2024-04-12 武汉天马微电子有限公司 一种有机发光显示面板及装置、精密掩膜版及其制备方法

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JP2001234385A (ja) 2000-02-24 2001-08-31 Tohoku Pioneer Corp メタルマスク及びその製造方法
US6729927B2 (en) * 2002-08-01 2004-05-04 Eastman Kodak Company Method and apparatus for making a shadow mask array
JP4173722B2 (ja) * 2002-11-29 2008-10-29 三星エスディアイ株式会社 蒸着マスク、これを利用した有機ｅｌ素子の製造方法及び有機ｅｌ素子
JP5262226B2 (ja) * 2007-08-24 2013-08-14 大日本印刷株式会社 蒸着マスクおよび蒸着マスクの製造方法
US20090311427A1 (en) * 2008-06-13 2009-12-17 Advantech Global, Ltd Mask Dimensional Adjustment and Positioning System and Method
KR101182439B1 (ko) * 2010-01-11 2012-09-12 삼성디스플레이 주식회사 박막 증착용 마스크 프레임 조립체 및 이를 이용한 유기 발광 표시장치의 제조방법
CN102129164B (zh) * 2010-01-15 2012-08-22 中芯国际集成电路制造(上海)有限公司 掩膜版缺陷的判断方法及判断系统
JP5486951B2 (ja) * 2010-02-12 2014-05-07 株式会社アルバック 蒸着マスク、蒸着装置、薄膜形成方法
JP2011089203A (ja) * 2010-10-25 2011-05-06 Ulvac Kyushu Corp 真空成膜装置及び成膜方法
CN102411260B (zh) * 2011-11-28 2014-07-16 上海华力微电子有限公司 掩膜板缺陷检测方法
JP5382257B1 (ja) * 2013-01-10 2014-01-08 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP5382259B1 (ja) * 2013-01-10 2014-01-08 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP5455099B1 (ja) * 2013-09-13 2014-03-26 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
JP5516816B1 (ja) 2013-10-15 2014-06-11 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
CN103995433B (zh) * 2014-05-14 2017-10-17 京东方科技集团股份有限公司 掩模板及基板标记制作方法
JP6365137B2 (ja) * 2014-09-03 2018-08-01 大日本印刷株式会社 蒸着マスクの寸法測定方法、蒸着マスクの張力付与装置および蒸着マスクの寸法測定装置
JP6341039B2 (ja) * 2014-09-29 2018-06-13 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP6459040B2 (ja) 2014-12-10 2019-01-30 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
CN104561893B (zh) * 2014-12-25 2018-02-23 信利（惠州）智能显示有限公司 掩膜板制造方法
JP6376483B2 (ja) * 2017-01-10 2018-08-22 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク装置の製造方法および蒸着マスクの良否判定方法

Also Published As

Publication number Publication date
CN108286034B (zh) 2020-06-02
KR102333411B1 (ko) 2021-12-02
CN108286034A (zh) 2018-07-17
CN111500980A (zh) 2020-08-07
KR20200123868A (ko) 2020-10-30
WO2018131474A1 (ja) 2018-07-19

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