CN111500065A - 一种高阻隔聚酰亚胺薄膜及其制备方法 - Google Patents

一种高阻隔聚酰亚胺薄膜及其制备方法 Download PDF

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CN111500065A
CN111500065A CN202010473198.0A CN202010473198A CN111500065A CN 111500065 A CN111500065 A CN 111500065A CN 202010473198 A CN202010473198 A CN 202010473198A CN 111500065 A CN111500065 A CN 111500065A
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金文斌
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Abstract

本发明公开了一种高阻隔聚酰亚胺薄膜,其原料包括:聚酰亚胺薄膜和改性蒙脱土,其中,改性蒙脱土的含量为3.6‑4.8wt%;聚酰亚胺薄膜的原料包括:二胺单体和二酐单体,其中,二胺单体为4,4’‑二氨基苯硫醚和刚性芳香族二胺,二酐单体为4,4’‑(六氟异丙烯)二酞酸酐和芳香族二酐。本发明还公开了上述高阻隔聚酰亚胺薄膜的制备方法,包括如下步骤:将改性蒙脱土均匀分散在有机溶剂中,加入二胺单体混匀得到混合溶液;向混合溶液中加入二酐单体,在惰性气体氛围中进行反应得到聚酰胺酸胶液;取聚酰胺酸胶液消泡后,涂覆于基板表面,亚胺化,自然冷却至室温,剥离得到高阻隔聚酰亚胺薄膜。本发明具有良好的阻隔性能。

Description

一种高阻隔聚酰亚胺薄膜及其制备方法
技术领域
本发明涉及聚酰亚胺薄膜技术领域,尤其涉及一种高阻隔聚酰亚胺薄膜及其制备方法。
背景技术
随着材料、器件结构和制备工艺的不断进步,电子器件的柔性化是必然的发展趋势。面板的柔性化首先要解决的就是柔性基底的问题。聚酰亚胺薄膜是柔性基底材料的首选。
电子器件对水、氧尤其敏感,故电子器件对水氧阻隔性能的要求较高。然而,由于聚酰亚胺薄膜的表面是天然疏松多孔的,其阻隔性能并不好,会影响光电子器件的性能和寿命。
发明内容
基于背景技术存在的技术问题,本发明提出了一种高阻隔聚酰亚胺薄膜及其制备方法,本发明具有良好的阻隔性能。
本发明提出的一种高阻隔聚酰亚胺薄膜,其原料包括:聚酰亚胺薄膜和改性蒙脱土,其中,改性蒙脱土的含量为3.6-4.8wt%;
聚酰亚胺薄膜的原料包括:二胺单体和二酐单体,其中,二胺单体为4,4’-二氨基苯硫醚和刚性芳香族二胺,二酐单体为4,4’-(六氟异丙烯)二酞酸酐和芳香族二酐。
优选地,刚性芳香族二胺为2,5-二氨基甲苯。
优选地,芳香族二酐为均苯四甲酸酐。
优选地,4,4’-二氨基苯硫醚、刚性芳香族二胺、4,4’-(六氟异丙烯)二酞酸酐、芳香族二酐的摩尔比为0.1-0.2:0.8-0.9:0.05-0.1:0.9-0.95。
优选地,在改性蒙脱土的制备过程中,将浓度为0.1-0.15g/ml十六烷基三甲基溴化铵水溶液加入钠基蒙脱土中,球磨90-120min,过滤取滤饼,水洗,烘干得到改性蒙脱土,其中,钠基蒙脱土和十六烷基三甲基溴化铵的重量比为1:1-1.5。
本发明还公开了上述高阻隔聚酰亚胺薄膜的制备方法,包括如下步骤:将改性蒙脱土均匀分散在有机溶剂中,加入二胺单体混匀得到混合溶液;向混合溶液中加入二酐单体,在惰性气体氛围中进行反应得到聚酰胺酸胶液;取聚酰胺酸胶液消泡后,涂覆于基板表面,亚胺化,自然冷却至室温,剥离得到高阻隔聚酰亚胺薄膜。
优选地,亚胺化的程序为:升温至75-85℃,保温1h;然后升温至110-130℃,保温0.5h;然后升温至230-250℃,保温0.5h;然后升温至330-350℃,保温0.5h。
优选地,反应温度为室温,反应时间为8-10h。
优选地,聚酰胺酸胶液的固含量为8-10%。
优选地,有机溶剂为N,N-二甲基乙酰胺。
有益效果:
本发明对蒙脱土进行改性,通过球磨使得十六烷基三甲基溴化铵插层进入蒙脱土中,增大蒙脱土的层间距离,提高蒙脱土在有机溶剂中分散性,然后与二胺单体、二酐单体均匀分散,进行溶液插层聚合得到聚酰胺酸,使得蒙脱土片层剥离分散在聚酰胺酸中,并通过合适的亚胺化工艺得到聚酰亚胺薄膜,从而大幅提高聚酰亚胺的阻隔性能;选用4,4’-二氨基苯硫醚、2,5-二氨基甲苯作为二胺单体,4,4’-(六氟异丙烯)二酞酸酐、均苯四甲酸酐作为二酐单体,在聚酰亚胺中引入适量的刚性结构,提高分子链的堆砌密度,提高薄膜的结晶度,从而进一步改善聚酰亚胺的阻隔性能;引入适量的氟元素提高其疏水型和耐高温性;在制备过程中,限定较低的聚酰胺酸胶液固含量,提高分子链在溶液中的流动性,利于薄膜有序区域的形成,进一步提高阻隔性能;选用合适的亚胺化程序,可以进一步提高薄膜的阻隔性能。
具体实施方式
下面,通过具体实施例对本发明的技术方案进行详细说明。
实施例1
一种高阻隔聚酰亚胺薄膜,其原料包括:聚酰亚胺薄膜和改性蒙脱土,其中,改性蒙脱土的含量为3.6wt%;
聚酰亚胺薄膜的原料包括:二胺单体和二酐单体,其中,二胺单体为4,4’-二氨基苯硫醚和2,5-二氨基甲苯,二酐单体为4,4’-(六氟异丙烯)二酞酸酐和均苯四甲酸酐,其中,4,4’-二氨基苯硫醚、2,5-二氨基甲苯、4,4’-(六氟异丙烯)二酞酸酐、均苯四甲酸酐的摩尔比为0.2:0.8:0.1:0.9;
在改性蒙脱土的制备过程中,将浓度为0.15g/ml十六烷基三甲基溴化铵水溶液加入钠基蒙脱土中,球磨90min,过滤取滤饼,水洗,烘干得到改性蒙脱土,其中,钠基蒙脱土和十六烷基三甲基溴化铵的重量比为1:1.5。
上述高阻隔聚酰亚胺薄膜的制备方法,包括如下步骤:将改性蒙脱土均匀分散在N,N-二甲基乙酰胺中,加入二胺单体混匀得到混合溶液;向混合溶液中加入二酐单体,在氮气氛围中,于室温反应8h得到固含量为10%的聚酰胺酸胶液;取聚酰胺酸胶液消泡后,涂覆于基板表面,亚胺化,自然冷却至室温,剥离得到高阻隔聚酰亚胺薄膜,其中,亚胺化的程序为:升温至75℃,保温1h;然后升温至110℃,保温0.5h;然后升温至230℃,保温0.5h;然后升温至330℃,保温0.5h。
实施例2
一种高阻隔聚酰亚胺薄膜,其原料包括:聚酰亚胺薄膜和改性蒙脱土,其中,改性蒙脱土的含量为4.8wt%;
聚酰亚胺薄膜的原料包括:二胺单体和二酐单体,其中,二胺单体为4,4’-二氨基苯硫醚和2,5-二氨基甲苯,二酐单体为4,4’-(六氟异丙烯)二酞酸酐和均苯四甲酸酐,其中,4,4’-二氨基苯硫醚、2,5-二氨基甲苯、4,4’-(六氟异丙烯)二酞酸酐、均苯四甲酸酐的摩尔比为0.1:0.9:0.05:0.95;
在改性蒙脱土的制备过程中,将浓度为0.1g/ml十六烷基三甲基溴化铵水溶液加入钠基蒙脱土中,球磨120min,过滤取滤饼,水洗,烘干得到改性蒙脱土,其中,钠基蒙脱土和十六烷基三甲基溴化铵的重量比为1:1。
上述高阻隔聚酰亚胺薄膜的制备方法,包括如下步骤:将改性蒙脱土均匀分散在N,N-二甲基乙酰胺中,加入二胺单体混匀得到混合溶液;向混合溶液中加入二酐单体,在氮气氛围中,于室温反应10h得到固含量为8%的聚酰胺酸胶液;取聚酰胺酸胶液消泡后,涂覆于基板表面,亚胺化,自然冷却至室温,剥离得到高阻隔聚酰亚胺薄膜,其中,亚胺化的程序为:升温至85℃,保温1h;然后升温至130℃,保温0.5h;然后升温至250℃,保温0.5h;然后升温至350℃,保温0.5h。
实施例3
一种高阻隔聚酰亚胺薄膜,其原料包括:聚酰亚胺薄膜和改性蒙脱土,其中,改性蒙脱土的含量为4.2wt%;
聚酰亚胺薄膜的原料包括:二胺单体和二酐单体,其中,二胺单体为4,4’-二氨基苯硫醚和2,5-二氨基甲苯,二酐单体为4,4’-(六氟异丙烯)二酞酸酐和均苯四甲酸酐,其中,4,4’-二氨基苯硫醚、2,5-二氨基甲苯、4,4’-(六氟异丙烯)二酞酸酐、均苯四甲酸酐的摩尔比为0.15:0.85:0.07:0.93;
在改性蒙脱土的制备过程中,将浓度为0.13g/ml十六烷基三甲基溴化铵水溶液加入钠基蒙脱土中,球磨100min,过滤取滤饼,水洗,烘干得到改性蒙脱土,其中,钠基蒙脱土和十六烷基三甲基溴化铵的重量比为1:1.3。
上述高阻隔聚酰亚胺薄膜的制备方法,包括如下步骤:将改性蒙脱土均匀分散在N,N-二甲基乙酰胺中,加入二胺单体混匀得到混合溶液;向混合溶液中加入二酐单体,在氮气氛围中,于室温反应9h得到固含量为9%的聚酰胺酸胶液;取聚酰胺酸胶液消泡后,涂覆于基板表面,亚胺化,自然冷却至室温,剥离得到高阻隔聚酰亚胺薄膜,其中,亚胺化的程序为:升温至80℃,保温1h;然后升温至120℃,保温0.5h;然后升温至240℃,保温0.5h;然后升温至340℃,保温0.5h。
对比例1
一种聚酰亚胺薄膜,不含改性蒙脱土,其他同实施例3。
取实施例1-3和对比例1的薄膜进行检测,其厚度相同,均为15μm,结果如下表所示:
检测项目 氧气透过率cm<sup>3</sup>/m<sup>2</sup>·day 水蒸气透过率g/m<sup>2</sup>·day
实施例1 2.08 0.92
实施例2 2.15 0.91
实施例3 1.90 0.85
对比例1 13.5 6.84
备注:氧气透过率参照ASTMD3985进行检测,水蒸气透过率参照ASTM F-1249进行检测。
由上表可以看出,本发明具有良好的阻隔性能。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。

Claims (10)

1.一种高阻隔聚酰亚胺薄膜,其特征在于,其原料包括:聚酰亚胺薄膜和改性蒙脱土,其中,改性蒙脱土的含量为3.6-4.8wt%;
聚酰亚胺薄膜的原料包括:二胺单体和二酐单体,其中,二胺单体为4,4’-二氨基苯硫醚和刚性芳香族二胺,二酐单体为4,4’-(六氟异丙烯)二酞酸酐和芳香族二酐。
2.根据权利要求1所述高阻隔聚酰亚胺薄膜,其特征在于,刚性芳香族二胺为2,5-二氨基甲苯。
3.根据权利要求1或2所述高阻隔聚酰亚胺薄膜,其特征在于,芳香族二酐为均苯四甲酸酐。
4.根据权利要求1-3任一项所述高阻隔聚酰亚胺薄膜,其特征在于,4,4’-二氨基苯硫醚、刚性芳香族二胺、4,4’-(六氟异丙烯)二酞酸酐、芳香族二酐的摩尔比为0.1-0.2:0.8-0.9:0.05-0.1:0.9-0.95。
5.根据权利要求1-4任一项所述高阻隔聚酰亚胺薄膜,其特征在于,在改性蒙脱土的制备过程中,将浓度为0.1-0.15g/ml十六烷基三甲基溴化铵水溶液加入钠基蒙脱土中,球磨90-120min,过滤取滤饼,水洗,烘干得到改性蒙脱土,其中,钠基蒙脱土和十六烷基三甲基溴化铵的重量比为1:1-1.5。
6.一种如权利要求1-5任一项所述高阻隔聚酰亚胺薄膜的制备方法,其特征在于,包括如下步骤:将改性蒙脱土均匀分散在有机溶剂中,加入二胺单体混匀得到混合溶液;向混合溶液中加入二酐单体,在惰性气体氛围中进行反应得到聚酰胺酸胶液;取聚酰胺酸胶液消泡后,涂覆于基板表面,亚胺化,自然冷却至室温,剥离得到高阻隔聚酰亚胺薄膜。
7.根据权利要求6所述高阻隔聚酰亚胺薄膜的制备方法,其特征在于,亚胺化的程序为:升温至75-85℃,保温1h;然后升温至110-130℃,保温0.5h;然后升温至230-250℃,保温0.5h;然后升温至330-350℃,保温0.5h。
8.根据权利要求6或7所述高阻隔聚酰亚胺薄膜的制备方法,其特征在于,反应温度为室温,反应时间为8-10h。
9.根据权利要求6-8任一项所述高阻隔聚酰亚胺薄膜的制备方法,其特征在于,聚酰胺酸胶液的固含量为8-10%。
10.根据权利要求6-9任一项所述高阻隔聚酰亚胺薄膜的制备方法,其特征在于,有机溶剂为N,N-二甲基乙酰胺。
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