CN111498429A - 清洁片及带清洁功能的输送构件 - Google Patents
清洁片及带清洁功能的输送构件 Download PDFInfo
- Publication number
- CN111498429A CN111498429A CN202010074360.1A CN202010074360A CN111498429A CN 111498429 A CN111498429 A CN 111498429A CN 202010074360 A CN202010074360 A CN 202010074360A CN 111498429 A CN111498429 A CN 111498429A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- layer
- cleaning sheet
- conveying member
- cleaning layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 205
- 230000004580 weight loss Effects 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 105
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 24
- 238000012545 processing Methods 0.000 abstract description 19
- 235000012431 wafers Nutrition 0.000 description 31
- 238000000034 method Methods 0.000 description 25
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- 238000011156 evaluation Methods 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
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- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
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- 229910052757 nitrogen Inorganic materials 0.000 description 2
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- 229920000058 polyacrylate Polymers 0.000 description 2
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- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
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- 238000000197 pyrolysis Methods 0.000 description 2
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- 238000004611 spectroscopical analysis Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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- 239000013464 silicone adhesive Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G45/00—Lubricating, cleaning, or clearing devices
- B65G45/10—Cleaning devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-014551 | 2019-01-30 | ||
JP2019014551A JP7270397B2 (ja) | 2019-01-30 | 2019-01-30 | クリーニングシートおよびクリーニング機能付搬送部材 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111498429A true CN111498429A (zh) | 2020-08-07 |
Family
ID=71865823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010074360.1A Pending CN111498429A (zh) | 2019-01-30 | 2020-01-22 | 清洁片及带清洁功能的输送构件 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7270397B2 (ja) |
KR (1) | KR20200094668A (ja) |
CN (1) | CN111498429A (ja) |
TW (1) | TW202041288A (ja) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0752019A (ja) * | 1993-08-10 | 1995-02-28 | Fuji Photo Film Co Ltd | 研磨テープを用いた清浄方法 |
JP2003115521A (ja) * | 2001-10-05 | 2003-04-18 | Nitto Denko Corp | クリーニングシ―ト、及びこれを用いたクリーニング方法 |
TW200415720A (en) * | 2002-11-25 | 2004-08-16 | Nitto Denko Corp | Cleaning sheet and method of cleaning substrate processing equipment |
CN1577757A (zh) * | 2003-06-26 | 2005-02-09 | 日东电工株式会社 | 清洁部件和清洁方法 |
CN1589980A (zh) * | 2003-04-14 | 2005-03-09 | 日东电工株式会社 | 清洁片、具有清洁功能的承载元件和基片处理设备的清洁方法 |
CN1778830A (zh) * | 2004-10-19 | 2006-05-31 | 日东电工株式会社 | 基片处理设备的清洁基片及其优选的耐热性树脂 |
US20060141258A1 (en) * | 2004-10-19 | 2006-06-29 | Nitto Denko Corporation | Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor |
JP2007216092A (ja) * | 2006-02-14 | 2007-08-30 | Nitto Denko Corp | クリーニング機能付搬送部材および基板処理装置のクリーニング方法 |
CN102413951A (zh) * | 2009-04-30 | 2012-04-11 | 日东电工株式会社 | 清洁片、带清洁功能的搬送构件、基板处理装置的清洁方法及基板处理装置 |
JP2012193470A (ja) * | 2011-03-16 | 2012-10-11 | Teijin Techno Products Ltd | 定着装置のクリーニングシート |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10154686A (ja) | 1996-11-22 | 1998-06-09 | Toshiba Corp | 半導体基板処理装置のクリーニング方法 |
JPH1187458A (ja) | 1997-09-16 | 1999-03-30 | Hitachi Ltd | 異物除去機能付き半導体製造装置 |
JP2005222609A (ja) * | 2004-02-05 | 2005-08-18 | Fuji Photo Film Co Ltd | クリーニングテープ |
JP2006019616A (ja) * | 2004-07-05 | 2006-01-19 | Nitto Denko Corp | クリーニング機能付き搬送部材および基板処理装置のクリーニング方法 |
JP2006099923A (ja) * | 2004-09-30 | 2006-04-13 | Fuji Photo Film Co Ltd | クリーニングテープ |
JP2006099920A (ja) * | 2004-09-30 | 2006-04-13 | Fuji Photo Film Co Ltd | 磁気抵抗効果型ヘッド用クリーニングテープ |
JP2006107598A (ja) * | 2004-10-04 | 2006-04-20 | Fuji Photo Film Co Ltd | クリーニングテープ |
JP2007307521A (ja) | 2006-05-22 | 2007-11-29 | Nitto Denko Corp | クリーニングシート、クリーニング機能付搬送部材、および基板処理装置のクリーニング方法 |
JP2007311699A (ja) * | 2006-05-22 | 2007-11-29 | Nitto Denko Corp | クリーニングシートの製造方法、クリーニング機能付搬送部材の製造方法、および基板処理装置のクリーニング方法 |
JP2010094983A (ja) * | 2008-09-16 | 2010-04-30 | Toyobo Co Ltd | 積層ポリイミドフィルム |
JP2010212489A (ja) * | 2009-03-11 | 2010-09-24 | Fujifilm Corp | 組成物 |
JP2011105926A (ja) * | 2009-10-23 | 2011-06-02 | Toyobo Co Ltd | ポリイミド前駆体及びポリイミド前駆体溶液 |
-
2019
- 2019-01-30 JP JP2019014551A patent/JP7270397B2/ja active Active
-
2020
- 2020-01-13 TW TW109101076A patent/TW202041288A/zh unknown
- 2020-01-22 KR KR1020200008391A patent/KR20200094668A/ko active Search and Examination
- 2020-01-22 CN CN202010074360.1A patent/CN111498429A/zh active Pending
Patent Citations (11)
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JPH0752019A (ja) * | 1993-08-10 | 1995-02-28 | Fuji Photo Film Co Ltd | 研磨テープを用いた清浄方法 |
JP2003115521A (ja) * | 2001-10-05 | 2003-04-18 | Nitto Denko Corp | クリーニングシ―ト、及びこれを用いたクリーニング方法 |
TW200415720A (en) * | 2002-11-25 | 2004-08-16 | Nitto Denko Corp | Cleaning sheet and method of cleaning substrate processing equipment |
CN1589980A (zh) * | 2003-04-14 | 2005-03-09 | 日东电工株式会社 | 清洁片、具有清洁功能的承载元件和基片处理设备的清洁方法 |
CN101402091A (zh) * | 2003-04-14 | 2009-04-08 | 日东电工株式会社 | 清洁片、具有清洁功能的承载元件和基片处理设备的清洁方法 |
CN1577757A (zh) * | 2003-06-26 | 2005-02-09 | 日东电工株式会社 | 清洁部件和清洁方法 |
CN1778830A (zh) * | 2004-10-19 | 2006-05-31 | 日东电工株式会社 | 基片处理设备的清洁基片及其优选的耐热性树脂 |
US20060141258A1 (en) * | 2004-10-19 | 2006-06-29 | Nitto Denko Corporation | Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor |
JP2007216092A (ja) * | 2006-02-14 | 2007-08-30 | Nitto Denko Corp | クリーニング機能付搬送部材および基板処理装置のクリーニング方法 |
CN102413951A (zh) * | 2009-04-30 | 2012-04-11 | 日东电工株式会社 | 清洁片、带清洁功能的搬送构件、基板处理装置的清洁方法及基板处理装置 |
JP2012193470A (ja) * | 2011-03-16 | 2012-10-11 | Teijin Techno Products Ltd | 定着装置のクリーニングシート |
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Title |
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《化工百科全书》编辑部编, 化学工业出版社 * |
《化工百科全书》编辑部编: "《化工百科全书 第12卷 木材和林产化学品—前列腺素 mu-gian》", 30 November 1996 * |
Also Published As
Publication number | Publication date |
---|---|
KR20200094668A (ko) | 2020-08-07 |
JP2020121271A (ja) | 2020-08-13 |
JP7270397B2 (ja) | 2023-05-10 |
TW202041288A (zh) | 2020-11-16 |
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