CN111370377B - Inward-retracting type heat dissipation device - Google Patents
Inward-retracting type heat dissipation device Download PDFInfo
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- CN111370377B CN111370377B CN202010110093.9A CN202010110093A CN111370377B CN 111370377 B CN111370377 B CN 111370377B CN 202010110093 A CN202010110093 A CN 202010110093A CN 111370377 B CN111370377 B CN 111370377B
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- plate body
- plate
- outer frame
- inner ear
- frame
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 37
- 210000003027 ear inner Anatomy 0.000 claims abstract description 33
- 210000000883 ear external Anatomy 0.000 claims description 12
- 238000000926 separation method Methods 0.000 claims description 9
- 230000000903 blocking effect Effects 0.000 claims description 5
- 239000004519 grease Substances 0.000 abstract description 12
- 238000009434 installation Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an inward-shrinkage heat dissipation device, and relates to the technical field of computer hardware equipment. The device comprises a mounting rack, wherein the mounting rack comprises an outer frame, and cooling fins are arranged in the outer frame. The radiating fin comprises a plate body, and fins and bosses are arranged on the upper side face and the lower side face of the plate body respectively. And the lower side surface of the boss is coated with heat dissipation paste. The utility model discloses a plate body, including frame, plate body, spring, inner ear plate, press pole, inner ear plate, the left and right both sides of frame are provided with respectively on to the inboard inner ear plate of buckling, the plate body on the fixed press rod that is provided with, just press the press rod pass inner ear plate and extend to the top of inner ear plate, press the pole on the cover be equipped with and be used for hindering the spring of plate body downstream. The front and back sides of the plate body are respectively provided with an elastic clamping plate, the elastic clamping plate is provided with a first positioning bulge, and the outer frame is provided with a second positioning bulge matched with the first positioning bulge. The device can effectively avoid the mistake in installation and the transportation to cut the piece and rub, can have the excessive problem of effectively avoiding the thermal grease simultaneously.
Description
Technical Field
The invention relates to the technical field of computer hardware equipment, in particular to a retraction type heat dissipation device capable of preventing heat dissipation paste from being scratched by mistake.
Background
With the popularization of electronic products and the development of various data clouds, the application range of servers and personal computers is wider and wider. As is known, a CPU is a core of a server, and as the integration level and the operating frequency of the CPU are improved, the power consumption is increased, so that the CPU generates a large amount of heat, which causes a heat dissipation problem, and the requirements for heat sinks are also improved.
In practical application, the heat dissipation paste smeared at the bottom of the existing radiator is very easy to scrape and rub in the installation and transportation processes, so that the heat dissipation paste is unevenly smeared and cannot be tightly attached to a CPU (central processing unit), the heat dissipation capability is reduced, and the heat dissipation effect is influenced.
In addition, because the existing heat sink needs to be attached to the CPU in the mounting process and then is pressed, the extrusion may also cause the overflow of the heat dissipation paste, which may cause adhesion with peripheral devices to cause electrical conduction or other defects.
Disclosure of Invention
Aiming at the problems, the invention provides the inward-shrinkage type heat dissipation device which adopts an inward-shrinkage type structure, can effectively avoid mistaken scratching in the installation and transportation processes, and can effectively avoid the problem of overflow of heat dissipation paste.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the inward-contraction type heat dissipation device comprises a mounting rack, wherein the mounting rack comprises a square outer frame, and heat dissipation fins are arranged in the square outer frame;
the radiating fin comprises a plate body, fins are arranged on the upper side face of the plate body, a boss is arranged on the lower side face of the plate body, and the boss, the plate body and the outer frame form a circle of groove surrounding the boss;
the lower side surface of the boss is coated with heat dissipation paste;
inner ear plates bent inwards are respectively arranged on the left side and the right side of the outer frame, pressing rods are respectively and fixedly arranged at the left end and the right end of the plate body, the pressing rods penetrate through the inner ear plates and extend to the upper parts of the inner ear plates, and springs for preventing the plate body from moving downwards are sleeved on the pressing rods;
elastic clamping plates are respectively arranged on the front side and the rear side of the plate body, a first positioning bulge is arranged on the outer side surface of each elastic clamping plate, and a second positioning bulge matched with the first positioning bulge is arranged on the inner side surface of the outer frame;
at least two outer ear plates are arranged on the outer side surface of the outer frame.
Further, be provided with the location separation blade on the medial surface of frame, work as the plate body compress tightly on the location separation blade on, first location arch just cross the protruding compress tightly of second location arch on, and this moment, the downside of boss is located the inside of frame.
Further, when the plate body is pressed on the positioning baffle, the distance between the lower side surface of the boss and the lower end surface of the outer frame is 2-3 mm.
Furthermore, four side faces of the outer frame are provided with positioning blocking pieces, and the four positioning blocking pieces are sequentially connected in an end-to-end mode to form a square structure.
Further, when the spring is in a free state, the lower bottom surface of the boss coated with the heat dissipation paste is located above the positioning blocking piece.
Furthermore, be located on the medial surface of frame the below of interior otic placode is provided with the gusset, and the downside of the interior otic placode after just buckling compresses tightly on the up end of gusset, the plate body on be provided with and be used for dodging the third breach of gusset, the lower extreme of gusset with the location separation blade even as an organic whole.
Furthermore, the inner side surface of the outer frame is provided with a rib plate below the inner ear plate, the lower side surface of the bent inner ear plate is pressed on the upper end surface of the rib plate, and the plate body is provided with a third notch for avoiding the rib plate.
Furthermore, a plurality of auxiliary fins extending obliquely upwards are arranged on two sides of each fin respectively, and the fins and the auxiliary fins form a fishbone-shaped structure together.
Furthermore, two external ear plates are arranged on the outer side surface of the outer frame, and the two external ear plates are arranged diagonally.
Furthermore, the cross sections of the first positioning bulge and the second positioning bulge are semicircular.
The invention has the beneficial effects that:
1. the device adopts an inward-shrinkage structure, and one surface coated with the heat dissipation paste before installation is inwards shrunk into the heat dissipation frame, so that the mistaken scratching in the installation and transportation processes can be effectively avoided.
2. Because have certain distance between the downside of location separation blade and the downside of the frame of mounting bracket, like this, when the fin is in lower limit position, can form the round recess in heat abstractor's bottom surface, and the thermal grease is located the inside of round recess, when pressing the fin in the installation, the thermal grease can get into in the round recess in the outside under the squeezing action, and can not be extruded the outside of the frame of mounting bracket, avoid arousing electrically conductive or other harmfulness with the adhesion of peripheral device.
3. The auxiliary fins are arranged on the two sides of the fins respectively, so that the heat dissipation area is increased, and the heat dissipation effect is improved.
4. Through set up the gusset between frame and location separation blade, just the gusset be located interior otic placode department, when interior otic placode is in the state of buckling, the downside of interior otic placode (to being in the interior otic placode under the state of buckling) compresses tightly on the up end of gusset, like this, has realized the assembly of fin and mounting bracket on the one hand, and on the other hand has guaranteed the rigidity of otic placode department in the mounting bracket, avoids when pushing down the fin, interior otic placode takes place elastic deformation because the rigidity is not enough.
5. Through set up the elastic splint respectively in the preceding, back both sides of fin to fix a position between fin and the mounting bracket through setting up the protruding realization fin of location on elastic splint and the mounting bracket frame, simple to operate fixes a position reliably, also can be convenient dismantle.
Drawings
Fig. 1 is a schematic perspective view of a heat dissipation device in a retracted state;
FIG. 2 is an enlarged schematic view of portion A of FIG. 1;
FIG. 3 is a front view of the heat sink in a retracted state;
FIG. 4 is a sectional view A-A of FIG. 3;
FIG. 5 is an enlarged schematic view of portion B of FIG. 4;
FIG. 6 is an enlarged schematic view of a portion C of FIG. 4;
FIG. 7 is a top view of the heat sink in a retracted state;
FIG. 8 is a cross-sectional view taken along line B-B of FIG. 7;
FIG. 9 is a first schematic view of the internal structure of the heat dissipation device with the heat dissipation plate at the lower limit position;
FIG. 10 is a second schematic view of the internal structure of the heat dissipation device with the heat dissipation plate at the lower limit position;
FIG. 11 is an enlarged view of portion D of FIG. 10;
FIG. 12 is a perspective view of the heat sink with the heat sink in a lower limit position;
FIG. 13 is a perspective view of the mounting bracket;
FIG. 14 is an enlarged view of section E of FIG. 13;
FIG. 15 is an intermediate state view of the mounting bracket during assembly;
FIG. 16 is a first perspective view of the heat sink;
FIG. 17 is an enlarged view of portion F of FIG. 16;
fig. 18 is an enlarged schematic view of portion G of fig. 16;
fig. 19 is a schematic perspective view of a second heat sink.
In the figure: 1-mounting frame, 111-front side plate, 112-rear side plate, 113-left side plate, 114-right side plate, 12-outer ear plate, 13-second notch, 131-inner ear plate, 14-second positioning bulge, 15-positioning baffle, 16-rib plate, 2-heat radiating fin, 21-plate body, 211-boss, 22-fin, 221-auxiliary fin, 23-elastic clamping plate, 231-first positioning bulge, 24-first notch, 25-third notch, 26-bulge, 3-spring, 4-pressing screw and 5-groove.
Detailed Description
For convenience of description, a coordinate system is now defined as shown in fig. 1.
As shown in fig. 1, the retractable heat sink includes a mounting frame 1 and a heat sink 2 disposed in the mounting frame 1.
As shown in fig. 13, the mounting bracket 1 includes a square outer frame formed by sequentially connecting a front plate 111, a left plate 113, a rear plate 112 and a right plate 114 in an end-to-end manner, and the heat sink 2 is disposed in the outer frame. Be provided with two at least outer otic placodes 12 on the lateral surface of frame, just the downside of outer otic placode 12 with the lower terminal surface parallel and level of frame.
Preferably, two external ear plates 12 are arranged on the outer side surface of the outer frame, and the two external ear plates 12 are arranged diagonally. In a specific embodiment, the two external ear plates 12 are respectively disposed on the front and rear sides of the outer frame, the external ear plate 12 on the front side is disposed at the left end of the front side plate 111, and the external ear plate 12 on the rear side is disposed at the right end of the rear side plate 112.
As shown in fig. 16 and 19, the heat sink 2 includes a plate body 21, a plurality of fins 22 are disposed on an upper side of the plate body 21, a square boss 211 extending downward is disposed in a middle of a lower side of the plate body 21, and a side of the boss 211 is parallel to a side of the plate body 21. The lower side of the boss 211 is coated with a thermal grease (not shown). As shown in fig. 12, the boss 211, the plate body 21 and the outer frame together form a ring of grooves 5 surrounding the boss 211.
Preferably, as shown in fig. 4 and 8, the length of the plate body 21 is equal to the internal length of the outer frame, and the width of the plate body 21 is equal to the internal width of the outer frame, that is, the front, rear, left and right side surfaces of the plate body 21 are respectively attached to the inner side surfaces of the outer frame.
As shown in fig. 8 and 13, the left side plate 113 and the right side plate 114 of the outer frame are respectively provided with inner ear plates 131 bent inward, and the inner ear plates 131 are located above the plate body 21 of the heat sink 2. The left end and the right end of the plate body 21 are respectively and fixedly provided with a pressing rod, the pressing rod penetrates through the inner ear plate 131 and extends to the upper part of the inner ear plate 131, and a through hole for accommodating the pressing rod is formed in the inner ear plate 131. The pressing rod is sleeved with a spring 3 which is used for blocking the plate body 21 from moving downwards and is positioned above the inner ear plate 131.
As a specific embodiment, as shown in fig. 2 and 8, the pressing rod is a pressing screw 4, the lower end of the pressing screw 4 is fixedly connected with the plate 21 by a threaded connection, the upper end of the spring 3 abuts against the head of the pressing screw 4, and the lower end of the spring 3 abuts against the upper side surface of the inner ear plate 131.
Here, the pressing screw 4 functions as a guide bar, and the heat sink 2 can slide up and down in the outer frame under the guide of the pressing screw 4.
As shown in fig. 16 and 18, the plate body 21 is provided with elastic clamping plates 23 extending upward at the front and rear sides thereof, and first positioning protrusions 231 having a semicircular cross section are provided on the outer side surfaces (the inner side is the side where the two elastic clamping plates 23 are opposed to each other) of the elastic clamping plates 23. Preferably, the length of the first positioning protrusion 231 in the left-right direction is equal to the width of the elastic clamping plate 23. As shown in fig. 13, the inner side surfaces of the front side plate 111 and the rear side plate 112 of the outer frame are provided with second positioning protrusions 14 having semicircular cross sections corresponding to the first positioning protrusions 231, and as shown in fig. 16, the front and rear sides of the plate body 21 are respectively provided with first notches 24 for avoiding the second positioning protrusions 14. As shown in fig. 4 and 5, when the spring 3 is in a free state, the first positioning protrusion 231 is located above the second positioning protrusion 14. As shown in fig. 9 and 10, when the heat sink 2 is at the lower limit position, the upper end of the elastic clamp 23 protrudes from the upper end surface of the outer frame.
Preferably, the front side and the rear side of the plate body 21 are both provided with two elastic clamping plates 23, and four elastic clamping plates 23 are arranged in a matrix of two rows and two columns.
Here, the inner ear plate 131 is initially extended upward in a vertical direction as shown in fig. 15, and then is manually bent to obtain a structure as shown in fig. 13. The assembly process is that the heat sink 2 is first put into the outer frame of the mounting frame 1, and then the inner ear plate 131 is bent inward to make the inner ear plate 131 horizontal. Then, the spring 3 is sleeved on the pressing screw 4, the lower end of the pressing screw 4 extends to the lower side of the inner ear plate 131 through the through hole on the inner ear plate 131, and then the pressing screw 4 is tightened to fixedly connect the lower end of the pressing screw 4 with the plate body 21 of the heat sink 2.
When the heat dissipation device is installed, firstly, the mounting frame 1 is fixed on the installation position of the main board in the state that the heat dissipation fins 2 are retracted, the outer ear plates 12 are fixedly connected with the main board through the locking pieces, then the pressing screws 4 are pressed downwards, the springs 3 are compressed, the heat dissipation fins 2 move downwards along with the pressing screws 4 until the first positioning protrusions 231 on the elastic clamping plates 23 cross the second positioning protrusions 14 on the inner side walls of the outer frame, and then the pressing screws 4 are loosened. At this time, the heat sink 2 is moved upward by the restoring force of the spring 3 until the first positioning projection 231 is pressed against the second positioning projection 14 as shown in fig. 10 and 11. In the process of pressing the pressing screw 4, the thermal grease on the boss 211 of the heat sink 2 contacts with the main board, and the excessive thermal grease is pressed to the outer side of the boss 211, but because the lower end face of the outer frame of the mounting bracket 1 is pressed on the main board, even if the thermal grease coated on the lower side face of the boss 211 overflows, the thermal grease cannot overflow to the outer part of the outer frame, and only exists in the circle of groove 5 formed by the outer frame, the boss 211 and the board body 21.
As shown in fig. 13, the inner side surfaces of the front side plate 111, the rear side plate 112, the left side plate 113, and the right side plate 114 are provided with positioning flaps 15 extending inward, respectively, and the inward extension dimension of the positioning flaps 15 is equal to or less than the dimension of the plate bodies 21 located on both sides of the boss 211. As shown in fig. 10, when the plate body 21 is pressed against the positioning baffle 15, the first positioning protrusion 231 is just pressed against the second positioning protrusion 14 beyond the second positioning protrusion 14. As shown in fig. 9, when the plate body 21 is pressed against the positioning baffle 15, the lower side surface of the boss 211 is located inside the outer frame. Preferably, the distance M between the lower side surface of the boss 211 and the lower end surface of the outer frame is 2-3 mm.
Here, the purpose of setting up positioning baffle 15 is, avoid pressing down too hard when pressing screw 4, cause the downside of boss 211 directly to contact with the mainboard, the thermal grease on the downside of boss 211 can all be extruded to slot 5 in this moment, though stop pressing the back, fin 2 can certain distance of rebound under the effect of spring 3, but also can't suck the thermal grease back, there will always be the space between boss 211 and the mainboard, can't guarantee to be full of the thermal grease, can't guarantee the radiating effect.
Preferably, as shown in fig. 13, four positioning baffles 15 on the outer frame are connected end to end in sequence to form a square structure.
Preferably, as shown in fig. 6, when the spring 3 is in a free state, the lower bottom surface of the boss 211 coated with the thermal grease is located above the positioning baffle 15.
Further, in order to reduce the height of the whole device, as shown in fig. 12 and 13, the left side plate 113 and the right side plate 114 of the outer frame are respectively provided with a second notch 13, and the inner ear plate 131 is provided on the lower side of the second notch 13.
Furthermore, as shown in fig. 14, two rib plates 16 extending inward are disposed on the inner side surfaces of the left side plate 113 and the right side plate 114 below the inner ear plate 131, and the lower side surfaces of the bent inner ear plates 131 are pressed against the upper end surfaces of the rib plates 16. As shown in fig. 17, a third notch 25 for avoiding the rib plate 16 is provided on the plate body 21.
Preferably, in order to improve the structural strength, as shown in fig. 17, the lower end of the rib plate 16 is integrally connected to the positioning baffle 15.
Further, in order to increase the screwing length and ensure the connection reliability, as shown in fig. 17, a circular protruding portion 26 is provided on the plate body 21, and an internal thread matched with the screw is provided on an inner side surface of the protruding portion 26.
Further, in order to improve the heat dissipation effect, as shown in fig. 8 and 9, a plurality of auxiliary fins 221 extending obliquely upward are respectively disposed on two sides of the fin 22, and the fin 22 and the auxiliary fins 221 together form a fishbone structure. Therefore, the heat dissipation area can be increased, and the heat dissipation effect is improved.
In this embodiment, two auxiliary fins 221 extending obliquely upward are respectively disposed on two sides of the fin 22.
Claims (10)
1. The utility model provides an interior formula heat abstractor which characterized in that: the heat dissipation device comprises a mounting rack, wherein the mounting rack comprises a square outer frame, and a heat dissipation fin is arranged in the square outer frame;
the radiating fin comprises a plate body, fins are arranged on the upper side face of the plate body, a boss is arranged on the lower side face of the plate body, and the boss, the plate body and the outer frame form a circle of groove surrounding the boss;
the lower side surface of the boss is coated with heat dissipation paste;
inner ear plates bent inwards are respectively arranged on the left side and the right side of the outer frame, pressing rods are respectively and fixedly arranged at the left end and the right end of the plate body, the pressing rods penetrate through the inner ear plates and extend to the upper parts of the inner ear plates, springs used for preventing the plate body from moving downwards are sleeved on the pressing rods, and the lower side surfaces of the bosses are retracted into the mounting frame under the action of the springs;
elastic clamping plates are respectively arranged on the front side and the rear side of the plate body, a first positioning bulge is arranged on the outer side surface of each elastic clamping plate, and a second positioning bulge matched with the first positioning bulge is arranged on the inner side surface of the outer frame;
at least two outer ear plates are arranged on the outer side surface of the outer frame.
2. The retractable heat sink device as claimed in claim 1, wherein: be provided with the location separation blade on the medial surface of frame, work as the plate body compress tightly on the location separation blade when, first location arch just cross the protruding compress tightly of second location arch on, and this moment, the downside of boss is located the inside of frame.
3. The retractable heat sink device as claimed in claim 2, wherein: when the plate body is pressed on the positioning baffle, the distance from the lower side surface of the boss to the lower end surface of the outer frame is 2-3 mm.
4. The retractable heat sink device as claimed in claim 2, wherein: all be provided with the location separation blade on four sides of frame, and four location separation blades end to end in proper order and formed a square structure.
5. The retractable heat sink device as claimed in claim 2, wherein: when the spring is in a free state, the lower bottom surface of the boss coated with the heat dissipation paste is positioned above the positioning blocking piece.
6. The retractable heat sink device as claimed in claim 2, wherein: the utility model discloses a positioning baffle piece, including frame, inner ear plate, plate body, be located on the medial surface of frame be provided with the gusset in the below of inner ear plate, and the downside of the inner ear plate after just buckling compresses tightly on the up end of gusset, the plate body on be provided with and be used for dodging the third breach of gusset, the lower extreme of gusset with positioning baffle piece even as an organic whole.
7. The retractable heat sink device as claimed in claim 1, wherein: the inner side face of the outer frame is provided with a rib plate below the inner ear plate, the lower side face of the bent inner ear plate is pressed on the upper end face of the rib plate, and the plate body is provided with a third notch for avoiding the rib plate.
8. The retractable heat sink device as claimed in claim 1, wherein: the fin is characterized in that a plurality of auxiliary fins extending upwards in an inclined mode are arranged on two sides of the fin respectively, and the fin and the auxiliary fins form a fishbone-shaped structure together.
9. The retractable heat sink device as claimed in claim 1, wherein: two external ear plates are arranged on the outer side surface of the outer frame, and the two external ear plates are arranged diagonally.
10. The retractable heat sink device as claimed in claim 1, wherein: the cross sections of the first positioning bulge and the second positioning bulge are semicircular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010110093.9A CN111370377B (en) | 2020-02-23 | 2020-02-23 | Inward-retracting type heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010110093.9A CN111370377B (en) | 2020-02-23 | 2020-02-23 | Inward-retracting type heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111370377A CN111370377A (en) | 2020-07-03 |
| CN111370377B true CN111370377B (en) | 2021-10-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010110093.9A Active CN111370377B (en) | 2020-02-23 | 2020-02-23 | Inward-retracting type heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111370377B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040005808A1 (en) * | 2002-07-08 | 2004-01-08 | Walkup William B. | Electrical connector assembly having retention module |
| US20050109488A1 (en) * | 2003-11-21 | 2005-05-26 | Jack Wang | Fastening structure of heat sink |
| CN205353928U (en) * | 2016-02-04 | 2016-06-29 | 浪潮电子信息产业股份有限公司 | Prevent excessive CPU of thermal grease and fin |
| CN107333449A (en) * | 2017-08-08 | 2017-11-07 | 爱美达（上海）热能系统有限公司 | Fastening system for mounting radiator |
-
2020
- 2020-02-23 CN CN202010110093.9A patent/CN111370377B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040005808A1 (en) * | 2002-07-08 | 2004-01-08 | Walkup William B. | Electrical connector assembly having retention module |
| US20050109488A1 (en) * | 2003-11-21 | 2005-05-26 | Jack Wang | Fastening structure of heat sink |
| CN205353928U (en) * | 2016-02-04 | 2016-06-29 | 浪潮电子信息产业股份有限公司 | Prevent excessive CPU of thermal grease and fin |
| CN107333449A (en) * | 2017-08-08 | 2017-11-07 | 爱美达（上海）热能系统有限公司 | Fastening system for mounting radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111370377A (en) | 2020-07-03 |
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