CN219642164U - Screwless laser circuit mainboard mounting structure - Google Patents
Screwless laser circuit mainboard mounting structure Download PDFInfo
- Publication number
- CN219642164U CN219642164U CN202320242574.4U CN202320242574U CN219642164U CN 219642164 U CN219642164 U CN 219642164U CN 202320242574 U CN202320242574 U CN 202320242574U CN 219642164 U CN219642164 U CN 219642164U
- Authority
- CN
- China
- Prior art keywords
- sleeve plate
- protective sleeve
- laser circuit
- holes
- screwless
- Prior art date
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- 230000001681 protective effect Effects 0.000 claims abstract description 43
- 238000009434 installation Methods 0.000 claims description 28
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 230000003139 buffering effect Effects 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Semiconductor Lasers (AREA)
Abstract
The utility model provides a screwless laser circuit main board mounting structure, which relates to the technical field of laser circuit main board mounting, and comprises a mounting base, wherein a protective sleeve plate is arranged on one side of the top surface of the mounting base, a movable sleeve plate is arranged on one side of the top surface of the mounting base, limit cover plates are arranged on two sides of the top surfaces of the movable sleeve plate and the protective sleeve plate, heat conducting through holes are formed in the surfaces of the protective sleeve plate, heat radiating through holes are formed in the side parts of the protective sleeve plate, the heat conducting through holes and the heat radiating through holes are mutually communicated in the protective sleeve plate, when the laser circuit main board generates heat between the protective sleeve plate and the movable sleeve plate, the heat can be transferred to the heat radiating through holes, and the mode can radiate the bottom surface of the laser circuit main board.
Description
Technical Field
The utility model relates to the technical field of laser circuit motherboard installation, in particular to a screwless laser circuit motherboard installation structure.
Background
The main board is also called a motherboard, is installed in a computer main box and is one of the most basic and important components of a computer, plays a role in importance in the whole computer system, the manufacturing quality of the main board determines the stability of a hardware system, the main board is closely related to a CPU, each time the major upgrading of the CPU inevitably leads to the updating of the main board, the main board is the core of the computer hardware system and is also a printed circuit board with the largest area in the main box, the main function of the main board is to transmit various electronic signals, part of chips are also responsible for primarily processing some peripheral data, all the components in the computer main are connected through the main board, and the control of a system memory, a storage device and other I/O devices in the normal operation of the computer must be completed through the main board.
The existing laser circuit motherboard mounting structure has the following problems when in use:
1. when the traditional laser circuit main board is used, because the power consumption of the laser circuit is large, the laser circuit main board can generate more heat when being used for a long time, the traditional main board mounting structure has poor heat dissipation capability, and the situation of large heat productivity cannot be effectively treated.
2. Most of the existing main board mounting structures adopt a fixed mounting mode, so that the main board is damaged easily when being impacted by the outside, and the main board is difficult to detach and mount conveniently.
Disclosure of Invention
The utility model aims to solve the defects of poor heat dissipation and difficult disassembly of a laser circuit main board in the prior art, and provides a screwless laser circuit main board mounting structure.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a screwless laser circuit mainboard mounting structure, includes the installation base, the top surface one side of installation base is provided with the protection sleeve board, the top surface of installation base is located one side of protection sleeve board and is provided with the removal sleeve board, the top surface both sides of removal sleeve board and protection sleeve board are provided with spacing apron, the heat conduction through-hole has been seted up to the surface of protection sleeve board, the heat dissipation through-hole has been seted up to the lateral part of protection sleeve board, one side of protection sleeve board is provided with the installation connecting rod, the lateral part of installation connecting rod is provided with clamping spring, one side that the protection sleeve board was kept away from to the clamping spring is provided with stop nut.
Preferably, the inner sides of the protective sleeve plate and the movable sleeve plate are provided with buffering side bars, and the buffering side bars are of U-shaped structures.
Preferably, the installation connecting rod is fixedly connected with the protective sleeve plate, and the installation connecting rod is in sliding connection with the movable sleeve plate.
Preferably, an installation slot hole matched with the clamping spring and the limit nut is formed in the movable sleeve plate, and a through hole matched with the installation connecting rod is formed in one side, close to the protective sleeve plate, of the movable sleeve plate.
Preferably, a limiting slide bar is arranged between the movable sleeve plate and the mounting base, and the limiting slide bar is in sliding connection with the movable sleeve plate.
Preferably, the heat conducting through hole is vertically formed in the protective sleeve plate, and the heat radiating through hole is horizontally formed in the protective sleeve plate.
Preferably, the heat conducting through holes and the heat radiating through holes are communicated with each other in the protective sleeve plate, and the heat radiating through holes penetrate through two sides of the protective sleeve plate.
Preferably, the heat conducting through holes and the heat radiating through holes are formed in the inner portion of the protective sleeve plate in a linear array equidistant mode.
Advantageous effects
According to the utility model, the heat conducting through hole and the heat radiating through hole are arranged in the protective sleeve plate, and are mutually communicated in the protective sleeve plate, when the laser circuit main board generates heat between the protective sleeve plate and the movable sleeve plate, the heat can be transferred to the heat radiating through hole through the heat conducting through hole, and the heat can be transferred to the outer side of the protective sleeve plate for radiating through the heat radiating through hole.
According to the utility model, the buffer side bars are arranged on the inner sides of the protective sleeve plate and the movable sleeve plate, the side parts of the laser circuit main board can be protected through the buffer side bars, so that the influence of external impact on the laser circuit main board is reduced, the elastic connection between the protective sleeve plate and the movable sleeve plate can be realized through the mounting connecting rod and the clamping spring, and the laser circuit main board can be quickly replaced and mounted through pulling the movable sleeve plate outwards.
Drawings
FIG. 1 is a schematic diagram of the main structure of the present utility model;
FIG. 2 is a schematic view of the internal structure of the heat conducting via and the heat dissipating via of the present utility model;
FIG. 3 is a schematic view of the internal structure of the mounting slot of the present utility model;
fig. 4 is a schematic diagram of the main structure at a in fig. 3.
Legend description:
1. a mounting base; 2. a protective sleeve plate; 3. moving the sleeve plate; 4. a limit cover plate; 5. a heat conduction through hole; 6. a heat dissipation through hole; 7. a mounting slot; 8. a limit slide bar; 9. buffering side bars; 10. installing a connecting rod; 11. a clamping spring; 12. and (5) limiting the nut.
Detailed Description
In order that the manner in which the above recited features, objects and advantages of the present utility model are obtained, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. Based on the examples in the embodiments, those skilled in the art can obtain other examples without making any inventive effort, which fall within the scope of the utility model.
Specific embodiments of the present utility model are described below with reference to the accompanying drawings.
First embodiment:
referring to fig. 1-4, a screwless laser circuit mainboard mounting structure, including installation base 1, the top surface one side of installation base 1 is provided with protection sleeve plate 2, the top surface of installation base 1 is located one side of protection sleeve plate 2 and is provided with removal sleeve plate 3, the top surface both sides of removal sleeve plate 3 and protection sleeve plate 2 are provided with spacing apron 4, heat conduction through-hole 5 has been seted up on the surface of protection sleeve plate 2, heat dissipation through-hole 6 has been seted up to the lateral part of protection sleeve plate 2, one side of protection sleeve plate 2 is provided with installation connecting rod 10, the lateral part of installation connecting rod 10 is provided with clamping spring 11, one side that clamping spring 11 kept away from protection sleeve plate 2 is provided with stop nut 12.
The heat conducting through holes 5 and the heat radiating through holes 6 are mutually communicated in the protective sleeve plate 2, the heat radiating through holes 6 penetrate through two sides of the protective sleeve plate 2, and the heat conducting through holes 5 and the heat radiating through holes 6 are arranged in the protective sleeve plate 2 in a linear array equidistant mode.
The inside at the protection sleeve plate 2 is provided with heat conduction through-hole 5 and heat dissipation through-hole 6, and heat conduction through-hole 5 and heat dissipation through-hole 6 switch on each other in the inside of protection sleeve plate 2, when laser circuit mainboard produces heat between protection sleeve plate 2 and removal sleeve plate 3, can be with heat transfer to heat dissipation through-hole 6 through heat conduction through-hole 5 to dispel the heat with heat transfer to the outside of protection sleeve plate 2 through heat dissipation through-hole 6, this kind of mode can dispel the heat to laser circuit mainboard's bottom surface, has better heat dissipation ability than traditional mainboard mounting structure.
Specific embodiment II:
referring to fig. 1-4, the installation connecting rod 10 is fixedly connected with the protection sleeve plate 2, the installation connecting rod 10 is in sliding connection with the movable sleeve plate 3, an installation slot 7 matched with the clamping spring 11 and the limit nut 12 is formed in the movable sleeve plate 3, a through hole matched with the installation connecting rod 10 is formed in one side, close to the protection sleeve plate 2, of the movable sleeve plate 3, the limit nut 12 is in threaded connection with the installation connecting rod 10, and one end of the installation connecting rod 10 is provided with threads.
The movable sleeve plate 3 and the mounting base 1 are provided with a limiting slide bar 8, the limiting slide bar 8 is in sliding connection with the movable sleeve plate 3, the heat conduction through hole 5 is vertically formed in the protective sleeve plate 2, the heat dissipation through hole 6 is horizontally formed in the protective sleeve plate 2, the protective sleeve plate 2 and the inner side of the movable sleeve plate 3 are provided with buffering side bars 9, and the buffering side bars 9 are of U-shaped structures.
In the utility model, the buffer side bars 9 are arranged on the inner sides of the protective sleeve plate 2 and the movable sleeve plate 3, the side parts of the laser circuit main board can be protected through the buffer side bars 9, the influence of external impact on the laser circuit main board can be reduced, the elastic connection between the protective sleeve plate 2 and the movable sleeve plate 3 can be realized through the mounting connecting rod 10 and the clamping spring 11, and the laser circuit main board can be quickly replaced and mounted by pulling the movable sleeve plate 3 outwards.
To sum up:
1. the inside of the protective sleeve plate 2 is provided with the heat conducting through hole 5 and the heat radiating through hole 6, the heat conducting through hole 5 and the heat radiating through hole 6 are mutually communicated in the protective sleeve plate 2, when the laser circuit main board generates heat between the protective sleeve plate 2 and the movable sleeve plate 3, the heat can be transferred to the heat radiating through hole 6 through the heat conducting through hole 5, and the heat can be transferred to the outer side of the protective sleeve plate 2 for radiating through the heat radiating through hole 6;
2. the inner sides of the protective sleeve plate 2 and the movable sleeve plate 3 are provided with the buffer side bars 9, the side parts of the laser circuit main board can be protected through the buffer side bars 9, so that the influence of external impact on the laser circuit main board is reduced, the elastic connection between the protective sleeve plate 2 and the movable sleeve plate 3 can be realized through the mounting connecting rod 10 and the clamping spring 11, and the laser circuit main board can be quickly replaced and mounted by pulling the movable sleeve plate 3 outwards.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a screwless laser circuit mainboard mounting structure, includes mounting base (1), its characterized in that: the utility model discloses a protection cover plate, including installation base (1), protection cover plate (2), clamping spring (11) are provided with limiting nut (12) in one side of keeping away from protection cover plate (2), top surface one side of installation base (1) is provided with protection cover plate (3), one side of top surface both sides of removal cover plate (3) and protection cover plate (2) are provided with limiting cover plate (4), heat conduction through-hole (5) have been seted up on the surface of protection cover plate (2), heat dissipation through-hole (6) have been seted up to the lateral part of protection cover plate (2), one side of protection cover plate (2) is provided with installation connecting rod (10), the lateral part of installation connecting rod (10) is provided with clamping spring (11).
2. The screwless laser circuit motherboard mounting structure of claim 1, wherein: the inner sides of the protective sleeve plate (2) and the movable sleeve plate (3) are provided with buffering side strips (9), and the buffering side strips (9) are of U-shaped structures.
3. The screwless laser circuit motherboard mounting structure of claim 1, wherein: the installation connecting rod (10) is fixedly connected with the protective sleeve plate (2), and the installation connecting rod (10) is in sliding connection with the movable sleeve plate (3).
4. The screwless laser circuit motherboard mounting structure of claim 1, wherein: the movable sleeve plate (3) is internally provided with a mounting slot hole (7) matched with the clamping spring (11) and the limit nut (12), and one side of the movable sleeve plate (3) close to the protective sleeve plate (2) is provided with a through hole matched with the mounting connecting rod (10).
5. The screwless laser circuit motherboard mounting structure of claim 1, wherein: a limiting slide bar (8) is arranged between the movable sleeve plate (3) and the mounting base (1), and the limiting slide bar (8) is in sliding connection with the movable sleeve plate (3).
6. The screwless laser circuit motherboard mounting structure of claim 1, wherein: the heat conduction through holes (5) are vertically formed in the protective sleeve plate (2), and the heat dissipation through holes (6) are horizontally formed in the protective sleeve plate (2).
7. The screwless laser circuit motherboard mounting structure of claim 1, wherein: the heat conduction through holes (5) and the heat dissipation through holes (6) are communicated with each other in the protective sleeve plate (2), and the heat dissipation through holes (6) penetrate through two sides of the protective sleeve plate (2).
8. The screwless laser circuit motherboard mounting structure of claim 1, wherein: the heat conducting through holes (5) and the heat radiating through holes (6) are formed in the protective sleeve plate (2) in a linear array equidistant mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320242574.4U CN219642164U (en) | 2023-02-14 | 2023-02-14 | Screwless laser circuit mainboard mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320242574.4U CN219642164U (en) | 2023-02-14 | 2023-02-14 | Screwless laser circuit mainboard mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219642164U true CN219642164U (en) | 2023-09-05 |
Family
ID=87820262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320242574.4U Active CN219642164U (en) | 2023-02-14 | 2023-02-14 | Screwless laser circuit mainboard mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219642164U (en) |
-
2023
- 2023-02-14 CN CN202320242574.4U patent/CN219642164U/en active Active
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