CN213517845U - Heat sink and camera using the heat sink - Google Patents
Heat sink and camera using the heat sink Download PDFInfo
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- CN213517845U CN213517845U CN202022660589.1U CN202022660589U CN213517845U CN 213517845 U CN213517845 U CN 213517845U CN 202022660589 U CN202022660589 U CN 202022660589U CN 213517845 U CN213517845 U CN 213517845U
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- heat sink
- circuit board
- radiating
- heat
- groove
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Abstract
The utility model provides a radiating fin which is used for radiating heat of a circuit board; the circuit board comprises a setting plane and a first convex part; the setting plane is used for connecting the electrical component, and the first convex part is arranged on the setting plane. The radiating fin comprises a radiating fin body and a first radiating groove; wherein the radiating fin body is connected with the setting plane; the first radiating grooves are formed in the radiating fin body and correspond to the first protruding portions in position, the circuit board is connected with the radiating fins, and the first protruding portions are contained in the first radiating grooves, so that the radiating area of the radiating fins is increased, the radiating efficiency is improved, and the radiating effect of the circuit board is improved. The utility model discloses a fin is through installing on the circuit board, and the fin sets up different regions according to the co-altitude of chip on the circuit board, has promoted the contact surface of fin with the circuit board to the radiating effect of fin has been promoted.
Description
Technical Field
The utility model relates to a camera field, in particular to fin and use camera of this structure.
Background
The digital camera is a product integrating optics, machinery and electronics, converts optical images into electronic data by using an electronic sensor, and has the characteristics of digital access mode, interactive processing with a computer, real-time shooting and the like.
In the conventional camera manufacturing process, the circuit board is directly connected with the flat-plate type radiating fin for heat dissipation, so that the heat dissipation effect is poor, and the working performance of the circuit board is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a radiating fin, it sets up different regions according to the not co-altitude of chip on the circuit board through the radiating fin to there is structural design reasonable inadequately, the poor problem of radiating effect in many of the radiating fin of solving among the prior art.
In order to solve the technical problem, the utility model adopts the technical scheme that: a heat sink is used for dissipating heat of a circuit board; the circuit board includes:
the setting plane is used for connecting electrical components; and
a first convex portion provided on the setting plane;
the heat sink includes:
the radiating fin body is connected with the setting plane; and
the first radiating groove is formed in the radiating fin body and corresponds to the first protruding portion in position, the circuit board is connected with the radiating fin, and the first protruding portion is contained in the first radiating groove. The heat dissipation area of the heat dissipation fins is increased, and the heat dissipation efficiency is improved
In this embodiment, the circuit board further includes a first groove, and the first groove is used for avoiding other electrical components;
the radiating fin also comprises a second convex part arranged on the radiating fin body, the position of the second convex part is opposite to the position of the first groove,
when the circuit board is connected with the heat sink, the second convex part is arranged inside the first groove. The contact area between the radiating fins and the circuit board is increased, and the radiating effect of the circuit board is improved.
In this embodiment, the circuit board further includes a second groove provided on the setting plane, an
A third protrusion disposed within the second groove;
the heat sink further includes:
a fourth convex portion provided on the side of the heat sink body close to the circuit board, an
The first through hole penetrates through the fourth convex part and corresponds to the third convex part in position;
the circuit board is connected with the radiating fin, the second groove is attached to the fourth convex portion, the fourth convex portion is contained in the second groove, and the third convex portion penetrates through the first through hole. The radiating fin body is the recess through circuit board four sides, under the bellied circumstances in the middle of, designs second convex part laminating recess, and the arch in the middle of the first through-hole is dodged, and structural design is novel, makes things convenient for production and processing, and the practicality is strong, and has promoted the radiating effect of circuit board.
In this embodiment, be provided with a plurality of breachs of dodging on the fin body, dodge the breach and be used for dodging other spare parts in the camera, save the occupation volume of fin, be convenient for the installation of fin.
In this embodiment, the heat sink body is provided with a positioning hole, and the positioning hole on the heat sink body is matched with the fastener on the circuit board, so that the heat sink can be conveniently installed.
In this embodiment, the heat sink body includes:
the first connecting part is connected with one side of the circuit board; and
the second connecting portion is arranged on one side of the first connecting portion in a bending mode, and the second connecting portion is used for conducting heat of the radiating fin body towards the side edge, so that the radiating effect of the radiating fin is improved.
In this embodiment, the second connecting portion includes
The first connecting piece is bent at one end of the first connecting part and used for leading out heat of the first connecting part;
the second connecting sheet is bent and arranged at the other end of the first connecting sheet and is jointed with the shell,
the second connecting piece comprises a second mounting hole, the second connecting piece is connected with the shell through a second mounting hole matched with the fastener, and the heat dissipation effect of the heat dissipation piece is improved.
In this embodiment, the bending part of fin is provided with the strengthening rib, has promoted the intensity of fin bending part.
In this embodiment, the heat sink body is formed by stamping a plurality of heat dissipation grooves.
The utility model also provides a camera, it includes the camera body, and as above the fin, wherein the fin sets up this internal, be used for this internal circuit board heat dissipation of camera.
The utility model discloses compare in prior art, its beneficial effect is: the utility model discloses a fin is through installing on the circuit board, and the fin sets up different regions according to the co-altitude of chip on the circuit board, has promoted the contact surface of fin with the circuit board to the radiating effect of fin has been promoted.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding drawings of some embodiments of the present invention.
Fig. 1 is a schematic view of a first embodiment of the heat sink of the present invention.
Fig. 2 is a perspective view of a first embodiment of the heat sink of the present invention.
Fig. 3 is a perspective view of a second embodiment of the heat sink of the present invention.
Fig. 4 is a schematic partial sectional structure view of a second embodiment of the heat sink of the present invention.
Fig. 5 is a schematic structural diagram of a third embodiment of the heat sink of the present invention in a use state.
Fig. 6 is a perspective view of a third embodiment of the heat sink of the present invention.
Reference numerals: first embodiment of the heat sink: the heat sink 11, the heat sink body 111, the first heat sink 112, the circuit board 12, and the setting plane 121; the second embodiment: the heat sink 21, the heat sink body 211, the second protrusion 212, the circuit board 22, and the first groove 221; third embodiment: the heat sink 31, the heat sink body 311, the fourth protrusion 312, the first through hole 313, the first connection portion 314, the second connection portion 315, the first connection piece 3151, the second connection piece 3152, the relief notch 316, the positioning hole 317, the circuit board 32, the setting plane 321, the second groove 322, and the third protrusion 323.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
In the drawings, elements having similar structures are denoted by the same reference numerals.
The terms "first," "second," and the like in the terms of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, nor should they be construed as limiting in any way.
Referring to fig. 1 and fig. 2, wherein fig. 1 is a schematic view of a using structure of a first embodiment of the heat sink of the present invention, and fig. 2 is a perspective view of the first embodiment of the heat sink of the present invention.
The present invention provides a preferred embodiment of a heat sink which can solve the above technical problems.
The utility model provides a preferred embodiment of fin does: a heat sink for dissipating heat from a circuit board 12; the circuit board 12 includes a setting plane 121 and a first convex portion; the setting plane 121 is used for connecting an electrical component, and the first protrusion is disposed on the setting plane 121.
The heat sink 11 includes a heat sink body 111 and a first heat sink; wherein the heat sink body 111 is connected with the setting plane 121; the first heat dissipation groove 112 is disposed on the heat dissipation plate body 111 and corresponds to the first protrusion, the circuit board is connected to the heat dissipation plate 11, and the first protrusion is accommodated in the first heat dissipation groove 112, so that the heat dissipation area of the heat dissipation plate 11 is increased, the heat dissipation efficiency is improved, and the heat dissipation effect of the circuit board 12 is improved.
With reference to fig. 3 and 4, fig. 3 is a perspective view of a second embodiment of the heat sink of the present invention, and fig. 4 is a schematic partial sectional structure view of the second embodiment of the heat sink of the present invention. The second embodiment of the heat sink body 311 of this embodiment is as follows:
the circuit board 22 in this embodiment includes a setting plane and a first groove 221, and the first groove 221 is used for avoiding other electrical components. The heat sink 21 in this embodiment further includes a second protrusion 212 provided on the heat sink body 211, the second protrusion 212 being located opposite to the first groove 221.
When the circuit board 22 is connected to the heat sink 21, the second protrusion 212 is disposed inside the first groove 221. The contact area between the heat sink 21 and the circuit board 22 is increased, and the heat dissipation effect of the circuit board 22 is improved.
With reference to fig. 5 and 6, fig. 5 is a schematic structural diagram of a use state of a third embodiment of the heat sink of the present invention, and fig. 6 is a perspective view of the third embodiment of the heat sink of the present invention. The third embodiment of the heat sink of this example is as follows:
the circuit board 32 in this embodiment includes a setting plane 321, a second recess 322, and a third protrusion 323, the second recess 322 being disposed on the setting plane 321, and the third protrusion 323 being disposed in the second recess 322. The heat sink 31 in this embodiment further includes a fourth convex portion 312 and a first through hole 313. The fourth protrusion 312 is disposed on the side of the heat sink body 311 close to the circuit board 32, the first through hole 313 penetrates through the fourth protrusion 312, and the position of the first through hole 313 corresponds to the position of the third protrusion 323.
The circuit board 32 is connected to the heat sink 31, the second recess 322 is attached to the fourth protrusion 312, the fourth protrusion 312 is received in the second recess 322, and the third protrusion 323 penetrates the first through hole 313.
The structure of the heat sink 31 in the present embodiment is explained in detail as follows:
in this embodiment, the heat sink body 311 is provided with a plurality of avoiding notches 316, and the avoiding notches 316 are used for avoiding other parts in the camera, so that the occupied volume of the heat sink 31 is reduced, and the heat sink 31 is convenient to mount.
The heat sink body 311 in this embodiment is provided with positioning holes 317, and the positioning holes 317 on the heat sink body 311 are adapted to the fasteners on the circuit board 32.
Further, the heat sink body 311 in the present embodiment includes a first connection portion 314 and a second connection portion 315; wherein the first connecting portion 314 is connected to the circuit board 32; the second connection portion 315 is bent at one side of the first connection portion 314, and the second connection portion 315 is used for conducting heat of the heat sink body 311 to the side.
Further, the second connection portion 315 includes a first connection piece 3151 and a second connection piece 3152, the first connection piece 3151 is bent at one end of the first connection portion 314, and is used for extracting heat of the first connection portion 314; the second connecting piece 3152 is bent at the other end of the first connecting piece 3151, the second connecting piece 3152 is attached to the housing, the second connecting piece 3152 comprises a second mounting hole, and the second connecting piece 3152 is connected with the housing through a fastener matched with the second mounting hole, so that the heat dissipation effect of the heat dissipation fin 31 is improved.
The bending part of the radiating fin 31 is provided with the reinforcing ribs, so that the strength of the bending part of the radiating fin 31 is improved.
In this embodiment, the heat sink body 311 is formed by stamping a plurality of heat dissipation grooves, which is convenient for production and processing.
The heat sink body 311 in this embodiment is the recess through circuit board 32 four sides, under the bellied condition in the middle of, designs second convex part laminating recess, and the arch in the middle of the first through-hole dodges, and structural design is novel, makes things convenient for production and processing, and the practicality is strong, and has promoted circuit board 32's radiating effect.
The utility model also provides a camera, it includes the camera body to and as above any embodiment explains, the fin of the comprehensive explanation of above three embodiment, wherein the fin setting is internal at the camera body for this internal circuit board heat dissipation of camera. The heat sink in this embodiment includes a first connection portion and a second connection portion; the first connecting part is connected with the circuit board; the second connecting portion is arranged on one side of the first connecting portion in a bending mode and used for conducting heat of the radiating fin body to the side edge.
Furthermore, the second connecting part comprises a first connecting sheet and a second connecting sheet, and the first connecting sheet is arranged at one end of the first connecting part in a bending mode and used for leading out heat of the first connecting part; the second connecting piece is bent and arranged at the other end of the first connecting piece, the second connecting piece is attached to the shell of the camera body and comprises a second mounting hole, and the second connecting piece is connected with the shell through a second mounting hole matched with a fastener, so that the heat dissipation effect of the heat dissipation piece is improved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so that the scope of the present invention shall be determined by the scope of the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022660589.1U CN213517845U (en) | 2020-11-17 | 2020-11-17 | Heat sink and camera using the heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022660589.1U CN213517845U (en) | 2020-11-17 | 2020-11-17 | Heat sink and camera using the heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213517845U true CN213517845U (en) | 2021-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022660589.1U Active CN213517845U (en) | 2020-11-17 | 2020-11-17 | Heat sink and camera using the heat sink |
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| CN (1) | CN213517845U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115096189A (en) * | 2022-07-11 | 2022-09-23 | 深圳市泽峰光电科技有限公司 | High-efficient heat dissipation formula log measuring apparatu |
-
2020
- 2020-11-17 CN CN202022660589.1U patent/CN213517845U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115096189A (en) * | 2022-07-11 | 2022-09-23 | 深圳市泽峰光电科技有限公司 | High-efficient heat dissipation formula log measuring apparatu |
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