CN211528765U

CN211528765U - Heat radiation structure, network equipment and cage

Info

Publication number: CN211528765U
Application number: CN201921666190.5U
Authority: CN
Inventors: 邹天华; 冯锦松; 袁步平; 许继业; 黄向骥
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2020-09-18
Anticipated expiration: 2029-09-30

Abstract

The application provides a heat radiation structure, network equipment and cage, this heat radiation structure includes: the cage is provided with a bottom wall used for being matched with the circuit board, and the cage is provided with one or more slots used for accommodating a device to be cooled along the direction far away from the bottom wall, and the bottom wall of the cage is provided with a first hollow structure; the radiator is used for running through the first hollow structure, so that when the slot is inserted into the device to be cooled, the radiator is abutted to the device to be cooled, and the heat of the device to be cooled is led out, so that the radiator can be directly in direct contact with the device to be cooled, and the heat of the device to be cooled is conveniently led out and dissipated quickly.

Description

Heat radiation structure, network equipment and cage

Technical Field

The application relates to a heat radiation structure, network equipment and a cage.

Background

When modern network equipment is used for data transmission, electronic devices used for exchanging data are easy to generate heat, and heat is not easy to dissipate.

For example, network devices such as routers and switches often use optical fibers to transmit data with external devices. In general, an optical cage is fixed on a PCB (Printed circuit board) of a network device, and an optical module (i.e., an electronic device) connected with an optical fiber is inserted into an optical module slot of the optical cage to be matched with a connector in the optical cage, so as to implement optical fiber communication between the network device and an external device.

With the enhancement of the processing capability of the network device, more optical modules need to be configured for communication with external devices, the arrangement density of the optical modules is increased, the optical modules need to be arranged in multiple layers, and the power of a single optical module is increased, so that the optical modules close to the PCB, especially the part of the optical module close to the PCB, accumulate a large amount of heat and cannot be dissipated in time, and the working performance of the optical modules is affected.

SUMMERY OF THE UTILITY MODEL

The application provides a heat radiation structure and network equipment for improve the radiating efficiency of optical module in the optical cage, and, a cage for reduce electron device's electromagnetism leaks.

In a first aspect, a heat dissipation structure is provided, where the heat dissipation structure is applied to a network device, the network device includes a circuit board, the circuit board has one or more second hollow structures, and the optical module is easy to heat and the heat is not easy to dissipate when waiting for a heat dissipation device to cooperate with the network device for data transmission. Firstly, in order to fix a device to be radiated, the radiating structure comprises a cage, the cage is provided with a bottom wall used for being matched with a circuit board, the cage is provided with one or more slots used for accommodating the device to be radiated along the direction far away from the bottom wall, and when data transmission is carried out between the cage and network equipment, the device to be radiated is inserted into the slots so as to fix the device to be radiated; in order to discharge the heat in waiting the heat dissipation device in time, the diapire of cage has first hollow out construction, when assembling with the circuit board, this first hollow out construction sets up with the second hollow out construction on the circuit board relatively, and this heat radiation structure still includes the radiator, when this heat radiation structure installs in the circuit board, the radiator runs through first hollow out construction and second hollow out construction, in order when inserting in the slot and waiting the heat dissipation device, the radiator with wait that the direct butt of heat dissipation device, conveniently will wait that the heat of heat dissipation device derives fast and the loss, ensure the working property of waiting the heat dissipation device.

The heat sink may have a plurality of forms, for example, the heat sink may be an integral structure, such as a heat sink directly serving as a heat sink and contacting with a device to be cooled, or the heat sink includes a heat conducting portion and a heat dissipating portion corresponding to each other, the heat conducting portion is connected to the heat dissipating portion, wherein the heat conducting portion is used for penetrating through the first hollow structure to abut against the device to be cooled, and the heat conducting portion dissipates heat from the device to be cooled and then transfers the heat to the heat dissipating portion. Wherein, the heat dissipation part can have the radiating fin or the liquid cooling pipe of being connected with the heat conduction part to utilize the mode of forced air cooling or liquid cooling to lose the heat of heat conduction part.

In a specific implementation mode, the cage includes two-layer slot at least, among the prior art, the slot of top layer can directly give off through modes such as air-cooled or liquid cooling owing to not having sheltering from of circuit board, and the slot that is located the bottom is owing to having sheltering from of circuit board, and the heat that wherein treats the heat dissipation device production is difficult to the effluvium and falls, through adopting the heat radiation structure that this application provided, the radiator is direct with treating the heat dissipation device butt in the slot of bottom to treat the heat dissipation device's heat discharge in the slot of bottom.

When the heat dissipation structure is implemented specifically, if the heat sink and the device to be dissipated are easy to shake, the good contact between the heat sink and the device to be dissipated cannot be guaranteed, and therefore the heat dissipation structure further comprises a locking assembly which is used for fixing the heat sink and the device to be dissipated, which is abutted against the heat sink, relatively so as to ensure that the heat sink and the device to be dissipated are in good contact.

The latch assembly may take a variety of forms, for example, in one embodiment, the latch assembly includes a first body portion and a first resilient member, the first body portion being located on a side of the heat sink facing away from the cage; the first elastic piece is arranged on one side, away from the radiator, of the first main body part to be in contact with the blocking body, away from one side of the first main body part, of the first elastic piece, wherein when the slot of the bottom layer is inserted into the device to be cooled, the first elastic piece is in an energy storage state, so that the radiator compresses the device to be cooled in the corresponding bottom slot, and when the slot of the bottom layer is not inserted into the device to be cooled, the first elastic piece is in an energy release state.

In another specific embodiment, the locking assembly comprises a second main body part positioned on the side of the heat radiator facing away from the corresponding cage, the second main body part is fixed relative to the corresponding cage, and a second elastic element is arranged between the second main body part and the corresponding heat radiator; when the slot at the bottom layer is inserted into the device to be cooled, the second elastic piece is in an energy storage state, so that the radiator compresses the device to be cooled in the corresponding slot at the bottom layer, the radiator is ensured to be in good contact with the device to be cooled, heat in the device to be cooled is conveniently led out, and when the slot at the bottom layer is not inserted into the device to be cooled, the first elastic piece is in an energy release state. In order to secure the second body portion relative to the corresponding cage, various forms may be employed, for example, the latch assembly further includes at least one pair of securing portions connected to the second body portion; each pair of fixing parts comprises two oppositely arranged fixing parts, and the radiator is positioned between the two oppositely arranged fixing parts; the side edges of the first hollow structures corresponding to the fixing parts are provided with edge folding structures extending perpendicular to the bottom wall, and each fixing part is detachably connected with the corresponding edge folding structure one by one.

The device to be cooled can be various electronic devices, such as an optical module and a USB interface, and in a specific embodiment, the device to be cooled is an optical module, the slot is an optical module slot, and the cage is an optical cage.

When concrete implementation, in each cage, the cage still includes the cage body, the diapire forms the slot that is located the bottom with the cooperation of cage body, the one end of diapire has the reed, the reed has bending structure, the bottom of cage body has the spread groove that corresponds with the reed, the reed cooperates in the spread groove that corresponds along the planar orientation plug-in type in bottom surface place of diapire, the reed is by the lateral wall extrusion deformation of spread groove, the restoring force that the reed replied to natural state makes the reed extrude the spread groove inside wall, thereby, produce great frictional force between reed and the spread groove inside wall, the diapire more inseparable with the cooperation of cage body, reduce electromagnetic leakage.

When concrete implementation, cage body bottom has the inserted block, and the diapire has the jack, and the inserted block cooperates in the jack that corresponds, and the inserted block is buckled and is set up in order to with the diapire joint. So that when concrete preparation cage, earlier with the reed transversely insert the spread groove after, make the inserted block vertically insert the jack again, bend the inserted block afterwards, carry on spacingly to the diapire from three-dimensional angle.

After the optical module is inserted into the optical module slot, one end of the optical module, which is far away from the socket of the optical module slot, is connected with the connector, and electromagnetic leakage at the joint of the optical module and the connector is serious, so that in a specific implementation scheme, the reed is positioned at one end of the bottom wall, which is far away from the socket of the bottom slot, and electromagnetic leakage in the optical cage can be relieved to a large extent.

In a second aspect, a network device is provided, which includes a circuit board and one or more heat dissipation structures according to the above technical solutions, wherein each cage is matched with the circuit board through a bottom wall, the circuit board has one or more second hollow structures, and each first hollow structure is arranged opposite to one second hollow structure; in each group of mutually corresponding radiator, second hollow out construction and first hollow out construction, the radiator runs through second hollow out construction and first hollow out construction with the cage that corresponds in be located the slot of bottom in the inserted device butt of treating the heat dissipation to, the radiator of being convenient for can with the bottom slot in treat heat dissipation device direct contact, thereby, treat the heat derivation and the loss of heat in the heat dissipation device fast in the bottom slot, ensure to treat heat dissipation device working property.

In a specific embodiment, when the locking assembly includes the first main body portion and the first elastic member, the network device further includes a blocking body, the blocking body is located on a side of the first main body portion, which is away from the heat sink, and the first elastic member is disposed between the first main body portion and the blocking body, so that when the device to be cooled is inserted into the bottom slot, the first main body portion and the blocking body squeeze the first elastic member, and the restoring force of the first elastic member causes the heat sink to compress the device to be cooled, thereby ensuring that the heat sink and the device to be cooled are in good contact, and thus good heat dissipation is achieved.

In a specific embodiment, the inner side surface of the second hollow structure is covered with a first wave absorbing material layer to absorb at least a part of electromagnetic waves in the optical cage, so that electromagnetic leakage is reduced.

In another specific embodiment, a second wave-absorbing material layer is filled between the heat sink and the side of the circuit board away from the cage to further absorb electromagnetic waves radiated from the light cage, thereby reducing electromagnetic leakage.

In a third aspect, there is provided a cage having a bottom wall for cooperating with a circuit board, the cage having one or more slots for receiving electronic devices in a direction away from the bottom wall; the cage comprises a cage body, a bottom wall and the cage body are matched to form a slot positioned at the bottom layer, one end of the bottom wall is provided with a reed, the reed is provided with a bending structure, the bottom end of the cage body is provided with a connecting groove corresponding to the reed, and the reed can be matched in the corresponding connecting groove in a pluggable manner along the direction of the plane where the bottom surface of the bottom wall is positioned; the reed is by the lateral wall extrusion deformation of spread groove, and the restoring force that the reed replied to natural state makes reed extrusion spread groove inside wall to, produce great frictional force between reed and the spread groove inside wall, the diapire is inseparabler with the cooperation of cage body, reduces the electromagnetism and reveals.

In a specific embodiment, the bottom end of the cage body is provided with an insertion block, the bottom wall is provided with an insertion hole, the insertion block is matched in the corresponding insertion hole, and the insertion block is bent to be clamped with the bottom wall, so that when the cage is specifically manufactured, the reed is transversely inserted into the connecting groove, then the insertion block is longitudinally inserted into the insertion hole, and then the insertion block is bent to limit the bottom wall from a three-dimensional angle.

In the above-described embodiment of the third aspect, the cage is an optical cage, the electronic device is an optical module, and the optical module is susceptible to electromagnetic leakage during data transmission.

In the above embodiment, the circuit board may be a PCB.

Drawings

Fig. 1 is an exemplary schematic diagram of a mating of an optical cage and a PCB in a network device according to an embodiment of the present application;

FIG. 2 is a partial schematic structural view of the light cage 300A of FIG. 1 mated with a PCB;

FIG. 3a shows a schematic structural view of an optical cage 300A of FIG. 1;

FIG. 3b shows a close-up view of the portion C of FIG. 3 a;

FIG. 3c shows a schematic view of the mating arrangement of the spring plate and the coupling slot of FIG. 3 b;

FIG. 4 illustrates an exemplary schematic view of a heat sink engaged with a corresponding locking assembly;

FIG. 5 shows a schematic view of the heat sink of FIG. 4 when mated with a corresponding PCB and light cage;

FIG. 6 shows a schematic view after a press plate is mounted on the bottom surface of the PCB of FIG. 5;

FIG. 7 illustrates an exemplary schematic view of another heat sink engaged with a corresponding locking assembly;

FIG. 8 shows a schematic structural view of one of the light cages 300B of FIG. 1;

FIG. 9 is a partial schematic structural view showing the light cage 300B of FIG. 1 mated with a PCB;

fig. 10 shows a schematic view of the heat sink of fig. 7 when mated with the PCB and the optical cage of fig. 9.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.

In order to better understand the network device provided in the embodiments of the present application, an application scenario of the network device is first described: when some electronic devices (such as an optical module, a USB interface and the like) are matched with network equipment, the electronic devices are easy to generate heat and the heat is not easy to dissipate; by taking the configuration example of the optical module and the network device, as the performance of the network device is improved, each network device can communicate with more external devices, the arrangement density of the optical modules on the PCB is increased, and the power of a single optical module is also increased, so that the optical module close to the PCB, especially the part of the optical module close to the PCB, accumulates a large amount of heat and cannot be discharged in time, and the working performance of the optical module is affected.

In order to solve the above problem, embodiments of the present application provide a network device, which includes, but is not limited to, a switch and a router.

Fig. 1 shows an exemplary schematic diagram of a cooperation between an optical cage and a PCB in a network device according to an embodiment of the present application, in fig. 1, a plurality of (in some cases, only one) second hollow structures 101 are disposed at intervals along one edge (only for example, or multiple edges) of the PCB100, and an optical cage (such as an optical cage 300A and an optical cage 300B) is disposed at each position of the second hollow structures 101 on a top side (one side in a Z direction) of the PCB 100; fig. 3a shows a schematic structural diagram of the optical cage 300A in fig. 1, please refer to fig. 3a, the optical cage 300A includes a bottom wall 310, an interlayer 350 and a top wall 320 sequentially arranged along a Z direction at intervals, a side wall 330 and a side wall 340 are respectively formed on two opposite sides of the interlayer, wherein the bottom wall 310 has a first hollow structure 311 for being arranged opposite to the second hollow structure 101; illustratively, the lengths of the top wall 320, the side wall 330 and the side wall 340 are the same, and the lengths of the interlayer 350 and the top wall 320 are shorter, and the interlayer 350 and the top wall 320 are formed at one end in the negative direction of the X direction of the side wall 330 and the side wall 340, and the one end in the X direction of the side wall 330 and the side wall 340 is formed with a mounting wall 360 disposed flush with the bottom wall 310; wherein, bottom wall 310, side wall 330, side wall 340 and interlayer 350 enclose optical module socket 301, top wall 320, side wall 330, side wall 340 and interlayer 350 enclose optical module socket 302, and mounting wall 360, side wall 330, side wall 340 and top wall 320 enclose a connector mounting slot (for placing a connector, which is coupled with a communication circuit on a PCB); in fig. 3a, the mounting wall 360 is exemplarily and fixedly connected (may also be detachably connected) with the edges in the negative Z-direction of the

side walls

330 and 340, respectively, and the bottom surface (the side surface in the negative Z-direction) of the mounting wall 360 has a plurality of pins 361 (i.e., Pin pins) for being inserted on the PCB100 to fix the mounting wall 360 with the PCB 100; fig. 3b is a partial enlarged view of a portion C in fig. 3a, fig. 3C is a schematic view showing a structure of the spring plate and the connecting groove in fig. 3b, referring to fig. 3a, fig. 3b and fig. 3C, in fig. 3a, one end of the mounting wall 360 close to the bottom wall 310 is provided with a connecting groove 362 (see fig. 3b) opening toward the bottom wall 310, one end of the bottom wall 310 close to the mounting wall 360 is provided with a spring plate 312 (see fig. 3b), the spring plate 312 is inserted into the corresponding connecting groove 362 along the X direction, referring to fig. 3C, the spring plate 312 has a bending structure fluctuating along the Z direction, when the spring plate 312 is inserted into the connecting groove 362 along the X direction, the bending structure of the spring plate 312 is pressed by two inner walls of the connecting groove 362 opposite to each other along the Z direction along the straight line direction, the spring plate 312 is made of a material having a certain elasticity such as copper, therefore, the spring 312 will expand along the linear direction of the Z direction due to its own restoring force and press the two inner walls of the connection groove 362 facing each other along the Z direction, so that a large friction force is generated between the spring 312 and the two inner walls of the connection groove 362 facing each other along the Z direction, thereby ensuring the tight connection between the bottom wall 310 and the mounting wall 360, the area corresponding to the connection groove 362 and the spring 312 is just the area where the optical module and the connector in the optical module slot 301 are connected, where the electromagnetic leakage is serious, and the electromagnetic leakage problem is relieved to some extent by the tight fit of the spring 312 and the connection groove 362, while the bottom end (the end in the negative direction of the Z direction) of the side wall 330 has the pin 342 and the plug 341 extending along the negative direction of the Z direction, similarly, the bottom end of the side wall 340 has the pin 332 and the plug 331, and the bottom wall 310 has the pin 342, the plug 341 for connecting with the pin 342, the, The insertion block 341, the pin 332 and the insertion block 331 are engaged with each other, when the bottom wall 310 is mounted, the spring plate 312 is inserted into the connecting slot 362 along the X direction, and then one end of the bottom wall 310 (i.e. one end in the negative direction of the X direction) far away from the mounting wall 360 is moved along the Z direction, so that the bottom wall 310 is pressed against the bottom edges of the side walls 330 and 340, at this time, the pin 342, the insertion block 341, the pin 332 and the insertion block 331 respectively enter the corresponding insertion holes on the bottom wall 310, the edge of the bottom wall 310 is bent to be attached to the side walls 330 and 340, and the insertion block 341 and the insertion block 331 are bent to prevent the insertion block 341 and the insertion block 331 from being pulled out from the corresponding insertion holes of the bottom wall 310, while the pin 342 and the pin 332 are used for being inserted into the PCB100 to further fix the optical cage 300A to the PCB100, at this time, the spring plate 312 prevents the bottom wall 310 from moving along the Y direction and the Z direction, and, the insertion blocks 341 and 331 prevent the bottom wall 310 from moving in the X direction, the Y direction, and the Z direction, and achieve the fitting installation of the bottom wall 310 with the side wall 330, the side wall 340, and the installation wall 360; it should be understood that, instead of the connecting slot 362 being provided on the mounting wall 360, a similar structure can be provided at the bottom end (one end in the negative direction of the Z direction) of the side wall 330 or the side wall 340, and the spring leaf is provided at the end of the bottom wall 310 corresponding to the side wall 330 or the side wall 340, so as to realize a similar connection manner to the spring leaf 312 and the connecting slot 362 in fig. 3a, i.e. as long as the spring leaf can be inserted and fitted into the connecting slot along a direction parallel to the plane of the bottom surface of the bottom wall 310; in fig. 3a, the structure of the optical cage 300A other than the bottom wall 310 (e.g., the side wall 330, the side wall 340, the mounting wall 360, the top wall 320, the interlayer 350, etc.) is referred to as an optical cage body, the bottom wall 310 may be connected to the bottom end (one end in the negative direction of the Z direction) of the optical cage body in other manners besides the above manner, for example, the bottom wall 310 may be connected to the side wall 330, the side wall 340, and the mounting wall 360 in a detachable manner such as a snap-fit connection or a bolt connection, or a fixed connection manner such as a rivet connection or a welding connection, respectively, and in order to reduce electromagnetic leakage in the electromagnetic optical module slot 301 and the optical module slot 302, the bottom wall 310 and the optical cage body are made of a material having electromagnetic shielding performance, such as copper.

It should be noted that fig. 1 is only for explaining the positional relationship between the optical cage 300A, the optical cage 300B and the PCB100, and does not show one optical cage at each second hollow structure 101, in a specific implementation, one optical cage is correspondingly configured at each second hollow structure 101, or the optical cage may be configured at only a part of the second hollow structures 101 according to actual situations. Moreover, in fig. 1, the optical cage 300A only includes two layers of optical module slots (i.e., an optical module slot 301 and an optical module slot 302) arranged along the Z direction, and in specific implementation, each optical cage 300A may further include one layer or more than three layers of optical module slots arranged along the Z direction.

Fig. 2 shows a structural diagram of a set (exemplarily, 3) of the optical cages 300A in fig. 1, which is matched with the PCB100, in fig. 2, each optical cage 300A is attached to the top surface of the PCB100 through the bottom surface of the bottom wall 310, and the first hollow-out structure 311 on the bottom wall 310 is disposed opposite to the second hollow-out structure 101 on the PCB 100.

Fig. 4 shows a schematic structural diagram of a heat sink 400A and a locking assembly 500A for cooperating with an optical cage 300A, please refer to fig. 4, where the heat sink 400A includes a heat conducting portion 401A and a heat dissipating portion 402A connected to one end of the heat conducting portion 401A in the negative direction in the Z direction, the heat dissipating portion 402A has a plurality of heat dissipating fins, and illustratively, the heat conducting portion 401A and the heat dissipating portion 402A are made of copper, aluminum, steel, alloy, and the like with good heat transfer coefficients; the locking assembly 500A includes a first sheet-shaped body 501A, and the first body 501A is detachably fitted (e.g., clamped or bolted, or otherwise fixedly connected) to the bottom surface of the heat dissipating portion 402A to prevent the first body 501A from sliding relative to the heat dissipating portion 402A along a plane perpendicular to the Z direction, and an arched elastic piece 502A is attached to the bottom surface (one surface in the negative direction of the Z direction) of the first body 501A.

Fig. 5 shows a schematic diagram when the heat sink 400A shown in fig. 4 is mated with the PCB100 and the optical cage 300A shown in fig. 2, referring to fig. 5, each optical module slot is inserted with an optical module, for example, an optical module 601 is inserted into the bottom optical module slot 301, and an optical module 602 is inserted into the top optical module slot 302, wherein the optical module 601 is connected with an optical fiber 601, the optical module 602 is connected with an optical fiber 702, and the optical module 601 and the optical module 602 are both plug-in mated with a connector in a connector mounting slot of the optical cage 300A along the X direction; referring to fig. 2, 4 and 5, a heat conducting portion 401A of the heat sink 400A in fig. 4 sequentially penetrates through the second hollow structure 101 and the first hollow structure 311 in fig. 2 along the Z direction, and finally enters the bottom optical module slot 301, a top surface (i.e., an end surface of one end in the Z direction) of the heat conducting portion 401A abuts against a bottom surface (an end surface of one end in the negative direction of the Z direction) of the bottom optical module 601, and heat accumulated by the optical module 601 in the bottom optical module slot 301 is conducted to the heat dissipating portion 402A by the heat conducting portion 401A and dissipated to the air through the heat dissipating fins. In some embodiments, the heat conducting portion and the heat dissipating portion may also be integrally formed, such as a heat sink.

Fig. 6 shows a schematic diagram after a pressing plate is installed on the bottom surface of the PCB in fig. 5, as shown in fig. 6, a protection plate 200 covers a portion of the bottom surface (one surface in the negative direction of the Z direction) of the PCB100 where the second hollow structure 101 is not formed, the protection plate 200 is relatively fixed to the PCB100 by means of bolt connection or the like to provide physical protection to the PCB100, the edge of the protection plate 200 is connected to the pressing plate 220, the pressing plate 200 is disposed opposite to the edge of the PCB100 where the second hollow structure 101 is formed, the arched elastic piece 502A abuts against the pressing plate 220, when the optical module 601 is not inserted into the optical module slot 301, the arched elastic piece 502A is in a natural arched state (i.e., an energy release state), and when the optical module 601 is inserted into the optical module slot 301, the optical module 601 presses the heat sink 400A in the negative direction of the Z direction, so that the first body portion 501A and the pressing plate 220 press, the arched elastic piece 502A is in an energy storage state, and the restoring force of the arched elastic piece 502A tending to restore the natural state generates a pressing force along the Z direction on the first main body portion 501A, so that the heat conducting portion 401A can always press the optical module 601, elastic insertion and extraction of the optical module 601 are achieved, and reliable connection of the optical module 601 and the connector is guaranteed.

It should be noted that the arched elastic piece 502A may also have other structures, such as a first elastic member, such as a coil spring, a disc spring, or a rubber pad, which extends and contracts along the Z direction, as long as it can provide the first main body 501A with a pressing force along the Z direction; the pressing plate 220 may also be replaced by other blocking bodies, for example, the arched elastic piece 502A directly abuts against the housing structure of the network device located in the Z direction negative direction of the arched elastic piece 502A, or the protection plate 210 directly extends to the position opposite to the second hollow structure 101, and the arched elastic piece 502A abuts against the protection plate 210, or the arched elastic piece 502A abuts against one side located in the Z direction negative direction of the arched elastic piece 502A and abuts against other structures relatively fixed to the PCB 100.

With continued reference to fig. 2, 3a and 4, the second hollow-out structure 101 and the first hollow-out structure 311 are both rectangular hole-shaped structures, and the two have the same or similar size, the cross section of the heat conducting portion 401A is also rectangular, and the cross section size of the heat conducting portion 401A is slightly smaller than the corresponding size (such as length and width) of the second hollow-out structure 101 and the first hollow-out structure 311, so as to ensure that the heat conducting portion 401A is well matched with the second hollow-out structure 101 and the first hollow-out structure 311, prevent the heat conducting portion 401A from having a large gap with the inner side wall of the second hollow-out structure 101 or the inner side wall of the first hollow-out structure 311, and reduce electromagnetic leakage in the optical cage 300A, in addition to that the second hollow-out structure 101, the first hollow-out structure 311, and the cross section of the heat conducting portion 401A may be another shape than rectangular, such as circular shape, circular shape, An ellipse, a parallelogram, etc., which can also achieve the above-mentioned effect of reducing electromagnetic leakage; in addition, the inner side surface of the second hollow structure 101 is covered with a first wave absorbing material layer to absorb electromagnetic waves leaking from the bottom layer optical module slot 301, and in some cases, the first wave absorbing material layer fills a gap between the inner side surface of the second hollow structure 101 and the heat conducting portion 401A, so that electromagnetic leakage is further reduced.

In some cases, an orthographic projection of the heat dissipation portion 402A on a plane of the bottom surface (a surface in a negative direction of the Z direction) of the PCB100 at least partially overlaps with the bottom surface of the PCB100, for example, when an area of an orthographic projection of a bottom surface of the heat dissipation portion 402A on a plane of the bottom surface of the PCB100 is larger than an area of an orthographic projection of the second hollow structure 101 on the bottom surface of the PCB100, a second wave-absorbing material layer is filled between the heat dissipation portion 402A and the PCB100 to further absorb electromagnetic waves leaked from the first hollow structure 311 by the light-absorbing cage 300A, so that the electromagnetic leakage of the light cage 300 meets an industrial standard.

Fig. 7 shows a schematic structural diagram of a heat sink 400B and a locking assembly 500B for cooperating with an optical cage 300B, please refer to fig. 7, in which the heat sink 400B includes a heat conducting portion 401B and a heat dissipating portion 402B connected to one end of the heat conducting portion 401B in the negative direction of the Z direction, the heat dissipating portion 402B has a plurality of heat dissipating fins, and the heat conducting portion 401B and the heat dissipating portion 402B are made of copper, aluminum, steel, alloy, and the like with good heat transfer coefficients, for example; the locking assembly 500B includes a second main body 501B in a sheet shape, the second main body 501B is detachably fitted (e.g. snapped or bolted, or otherwise fixedly connected) to the bottom surface (one surface in the negative direction of the Z direction) of the heat dissipation portion 402B, and the second main body 501B is connected to two pairs (only exemplarily, 1 or more pairs of fixing portions 503B), two fixing portions 503B of each pair of fixing portions 503B are respectively arranged on two opposite sides of the heat dissipation portion 402B, the middle portion of the second main body 501B has an elastic flap 502B bent in the Z direction, when specifically manufacturing, a U-shaped slit is cut along the second main body 501B, and the elastic flap 502B surrounded by the U-shaped slit is bent in the negative Z direction, the elastic flap 502B abuts against the heat dissipation portion 402B, when the heat dissipation portion 402B is subjected to a force in the Z direction, the elastic flap 502B is pressed to a position flush or nearly flush with the other portion of the second body portion 501B, so that the elastic flap 502B is in a charged state, and the restoring force of the elastic flap 502B provides the pressing force of the heat dissipating portion 402B in the Z direction.

Fig. 8 shows a schematic structural view of the optical cage 300B in fig. 1. referring to fig. 8, the optical cage 300B is different from the optical cage 300 shown in fig. 3a in that folding structures 312 extending in the negative direction of the Z direction are disposed along two opposite sides of the second hollow structure 101.

Fig. 9 shows a schematic view of a partial structure of the optical cage 300B in fig. 1, which is matched with the PCB100, the optical cage 300B is matched with the top surface of the PCB100 through the bottom wall 310, the first hollow-out structure 311 is disposed opposite to the second hollow-out structure 101 corresponding to the PCB, and the flange structure 312 extends along the inner side surface of the first hollow-out structure 311.

Fig. 10 shows a schematic structural diagram when the heat sink 400B in fig. 7 is mated with the PCB100 and the optical cage 300B in fig. 9, please refer to fig. 7, 9 and 10, the heat conducting portion 401B sequentially penetrates through the second hollow structure 101 and the first hollow structure 311 along the Z direction, the top surface (one end surface in the Z direction) of the heat conducting portion 401B abuts against the bottom surface (one end surface in the negative direction of the Z direction) of the optical module 601 in the optical module slot 301 of the bottom layer, and each fixing portion 503B is detachably connected (e.g. clamped) with the corresponding edge-folding structure 312, specifically, the inner side surface of the edge-folding structure 312 has a card slot, and the outer side surface of the fixing portion 503B has a card block mated with the card slot, at this time, the relative fixing of the second main body portion 501B and the optical cage 300B is achieved, when the optical module 601 is inserted into the optical module slot 301, the negative direction of the optical module 601 presses, therefore, the elastic flap 502B is squeezed and accumulates elastic potential energy, the restoring force of the elastic flap 502B causes the heat conducting portion 401B to always press the optical module 601, so as to ensure the stable fit between the optical module and the optical module slot 301, and when the optical module 601 is pulled out from the optical module slot 301, the elastic flap 502B restores the energy release state, i.e. the elastic insertion and extraction of the optical module 601 is realized.

The elastic flap 502B may be replaced by another elastic structure, as long as the heat dissipation portion 402B and the second main body portion 501B are elastically fitted in the Z direction, for example, a coil spring, a disc spring, or a rubber block is placed between the second main body portion 501B and the heat dissipation portion 402B, and the coil spring, the disc spring, or the rubber block can elastically expand and contract in the Z direction. Besides, the fixing portion 503B is clamped with the corresponding edge-folding structure 312, the fixing portion 503B can be directly detachably connected with the bottom wall 310, such as clamped connection or bolt connection, as long as the second main body portion 501B is detachably connected with the optical cage 300B and is relatively fixed.

In addition, the heat dissipating portion 402A of the heat sink 400A in fig. 4 and the heat dissipating portion 402B of the heat sink 400B in fig. 7 both adopt fin structures to facilitate air cooling, and besides, a liquid cooling heat pipe may be used to take away heat in the heat conducting portion 402A and the heat conducting portion 402B, for example, a liquid cooling copper pipe is used to conduct away heat of the heat conducting portion 402A and the heat conducting portion 402B.

In addition, in addition to the locking assembly 500A in fig. 4 for abutting the heat conduction portion 401A of the heat sink 400A against the optical module 601 and the locking assembly 500B in fig. 7 for abutting the heat conduction portion 401B of the heat sink 400B against the optical module 601, other locking assemblies may be used as long as the heat sink 400B can be pressed against the optical module 601 in the bottom layer optical module slot 301.

In addition, the optical module may be replaced by another device to be cooled (i.e., an electronic device) including a USB interface, and accordingly, the optical cage may be replaced by another similar cage cooperating with the device to be cooled, where the optical cage body may adopt another similar cage body, and the optical module slot is replaced by another similar slot cooperating with the device to be cooled. Moreover, the PCB is only an exemplary form, and may be other forms of circuit boards existing in the field, and the details are not described herein.

An embodiment of the present application further provides a heat dissipation structure, taking fig. 1 to 10 as an example, the heat dissipation structure includes: a cage having a bottom wall for mating with a circuit board (e.g., PCB100 in fig. 1), the cage having one or more slots (e.g., optical module slot 301 and optical module slot 302) for receiving devices to be heat dissipated (e.g., optical module 601 and optical module 602) in a direction away from the bottom wall, the bottom wall (e.g., bottom wall 310) of the cage having a first hollowed-out structure (e.g., first hollowed-out structure 310); the heat sink (such as the heat sink 400A and the heat sink 400B) is configured to penetrate through the first hollow structure, so that when the device to be cooled is inserted into the slot, the heat sink abuts against the device to be cooled. The components and the components with the same names in the embodiments of the network device have the same structures and matching manners, and are not described herein again. Through set up first hollow out construction on the diapire of cage, the radiator runs through first hollow out construction and treats the heat dissipation device butt, is convenient for directly will treat the heat derivation in the heat dissipation device.

Embodiments of the present application further provide a cage, which is exemplified in fig. 3a to 3c, the cage having a bottom wall (e.g., bottom wall 310) for cooperating with a circuit board (e.g., PCB100 in fig. 1), and the cage having one or more slots (e.g., optical module slot 301 and optical module slot 302) for accommodating electronic devices (e.g., optical module 601 and optical module 602) in a direction away from the bottom wall; the cage comprises a cage body (such as an optical cage body), a bottom wall is matched with the cage body to form a slot (namely an optical module slot 301) positioned at the bottom layer, one end of the bottom wall is provided with a reed (such as a reed 312) which has a bending structure, the bottom end of the cage body is provided with a connecting slot (such as a connecting slot 362) corresponding to the reed, and the reed can be matched in the corresponding connecting slot in a pluggable manner along the direction of the plane of the bottom surface of the bottom wall; the reed is by the lateral wall extrusion deformation of spread groove, and the restoring force that the reed replied to natural state makes reed extrusion spread groove inside wall to, produce great frictional force between reed and the spread groove inside wall, the diapire is inseparabler with the cooperation of cage body, reduces the electromagnetism and reveals. The components and the components with the same names in the embodiments of the network device have the same structures and matching manners, and are not described herein again.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat dissipation structure, comprising:

the cage is provided with a bottom wall used for being matched with the circuit board, the cage is provided with one or more slots used for accommodating a device to be cooled along the direction far away from the bottom wall, and the bottom wall of the cage is provided with a first hollow structure;

the radiator is used for penetrating through the first hollow structure, so that when the to-be-radiated device is inserted into the slot, the radiator is abutted to the to-be-radiated device, and the heat of the to-be-radiated device is led out.

2. The heat dissipation structure of claim 1, wherein the heat sink comprises a heat conduction portion and a heat dissipation portion corresponding to each other, wherein the heat conduction portion is configured to penetrate through the first hollow structure to abut against the device to be dissipated.

3. The heat dissipating structure of claim 2, wherein the heat dissipating part has a heat dissipating fin connected to a heat conducting part or a liquid-cooled heat dissipating pipe.

4. The heat dissipating structure of claim 1, wherein the cage comprises at least two layers of the slots.

5. The heat dissipating structure of claim 4, further comprising a locking assembly for relatively securing the heat sink and the device to be dissipated abutting the heat sink.

6. The heat dissipating structure of claim 5, wherein the latch assembly comprises a first body portion and a first resilient member, the first body portion being located on a side of the heat sink facing away from the cage;

the first elastic piece is arranged on one side, deviating from the radiator, of the first main body part to be in contact with the blocking body, deviating from one side of the first main body part, of the first elastic piece, wherein when the bottom slot is inserted into a device to be cooled, the first elastic piece is in an energy storage state, so that the radiator compresses the device to be cooled in the corresponding bottom slot, and when the bottom slot is not inserted into the device to be cooled, the first elastic piece is in an energy release state.

7. The heat dissipating structure of claim 6, wherein the latch assembly includes a second body portion located on a side of the heat sink facing away from the corresponding cage, the second body portion being relatively fixed to the corresponding cage, and a second resilient member being provided between the second body portion and the corresponding heat sink;

when the slot of the bottom layer is inserted into the device to be cooled, the second elastic piece is in an energy storage state, so that the radiator compresses the device to be cooled in the corresponding slot of the bottom layer, and when the slot of the bottom layer is not inserted into the device to be cooled, the first elastic piece is in an energy release state.

8. The heat dissipating structure of claim 7, wherein the locking assembly further comprises at least one pair of securing portions connected to the second body portion;

each pair of fixing parts comprises two oppositely arranged fixing parts, and the radiator is positioned between the two oppositely arranged fixing parts;

the side edges of the first hollow structures corresponding to the fixing parts are provided with folded edge structures perpendicular to the bottom wall, and the fixing parts are detachably connected with the corresponding folded edge structures one by one.

9. The heat dissipating structure of claim 2, wherein the cage comprises at least two layers of the slots.

10. The heat dissipating structure of claim 9, further comprising a locking assembly for securing the heat sink and the device to be dissipated abutting the heat sink relative to each other.

11. The heat dissipating structure of claim 10, wherein the latch assembly comprises a first body portion and a first resilient member, the first body portion being located on a side of the heat sink facing away from the cage;

12. The heat dissipating structure of claim 11, wherein the latch assembly includes a second body portion located on a side of the heat sink facing away from the corresponding cage, the second body portion being relatively fixed to the corresponding cage, the second body portion and the corresponding heat sink having a second resilient member therebetween;

13. The heat dissipating structure of claim 12, wherein the locking assembly further comprises at least one pair of securing portions connected to the second body portion;

14. The heat dissipating structure of claim 3, wherein the cage comprises at least two layers of the slots.

15. The heat dissipating structure of claim 14, further comprising a locking assembly for securing the heat sink and the device to be dissipated abutting the heat sink relative to each other.

16. The heat dissipating structure of claim 15, wherein the latch assembly comprises a first body portion and a first resilient member, the first body portion being located on a side of the heat sink facing away from the cage;

17. The heat dissipating structure of claim 16, wherein the latch assembly includes a second body portion located on a side of the heat sink facing away from the corresponding cage, the second body portion being relatively fixed to the corresponding cage, the second body portion and the corresponding heat sink having a second resilient member therebetween;

18. The heat dissipating structure of claim 17, wherein the locking assembly further comprises at least one pair of securing portions connected to the second body portion;

19. The heat dissipating structure of claim 1, further comprising a locking assembly for relatively securing the heat sink and the device to be dissipated abutting the heat sink.

20. The heat dissipating structure of claim 19, wherein the latch assembly comprises a first body portion and a first resilient member, the first body portion being located on a side of the heat sink facing away from the cage;

21. The heat dissipating structure of claim 20, wherein the latch assembly includes a second body portion located on a side of the heat sink facing away from the corresponding cage, the second body portion being relatively fixed to the corresponding cage, the second body portion and the corresponding heat sink having a second resilient member therebetween;

22. The heat dissipating structure of claim 21, wherein the locking assembly further comprises at least one pair of securing portions connected to the second body portion;

23. The heat dissipating structure of claim 2, further comprising a locking assembly for relatively securing the heat sink and the device to be dissipated abutting the heat sink.

24. The heat dissipating structure of claim 23, wherein the latch assembly comprises a first body portion and a first resilient member, the first body portion being located on a side of the heat sink facing away from the cage;

25. The heat dissipating structure of claim 24, wherein the latch assembly includes a second body portion located on a side of the heat sink facing away from the corresponding cage, the second body portion being relatively fixed to the corresponding cage, the second body portion and the corresponding heat sink having a second resilient member therebetween;

26. The heat dissipating structure of claim 25, wherein the locking assembly further comprises at least one pair of securing portions connected to the second body portion;

27. The heat dissipating structure of claim 3, further comprising a locking assembly for relatively securing the heat sink and the device to be dissipated abutting the heat sink.

28. The heat dissipating structure of claim 27, wherein the latch assembly comprises a first body portion and a first resilient member, the first body portion being located on a side of the heat sink facing away from the cage;

29. The heat dissipating structure of claim 28, wherein the latch assembly includes a second body portion located on a side of the heat sink facing away from the corresponding cage, the second body portion being relatively fixed to the corresponding cage, the second body portion and the corresponding heat sink having a second resilient member therebetween;

30. The heat dissipating structure of claim 29, wherein the locking assembly further comprises at least one pair of securing portions connected to the second body portion;

31. The heat dissipating structure of any one of claims 1 to 30, wherein the device to be dissipated is an optical module, the slot is an optical module slot, and the cage is an optical cage.

32. The heat dissipating structure of claim 31, wherein each cage further comprises a cage body, the bottom wall and the cage body cooperate to form a slot at a bottom, one end of the bottom wall has a spring plate, the spring plate has a bent structure, a bottom end of the cage body has a connecting slot corresponding to the spring plate, and the spring plate can be inserted and fitted into the corresponding connecting slot along a direction of a plane of a bottom surface of the bottom wall.

33. The heat dissipating structure of claim 32, wherein the bottom end of the cage body has an insert, the bottom wall has an insertion hole, the insert fits into the corresponding insertion hole, and the insert is bent to engage with the bottom wall.

34. The heat dissipating structure of claim 33, wherein the spring is located at an end of the bottom wall distal from the socket of the bottom layer.

35. A network device comprising a circuit board and one or more heat dissipation structures as recited in any one of claims 1-34, wherein,

each cage is matched with the circuit board through a bottom wall, one or more second hollow structures are arranged on the circuit board, and each first hollow structure and one second hollow structure are arranged oppositely;

and in each group of mutually corresponding radiators, second hollow structures and first hollow structures, the radiators penetrate through the second hollow structures and the first hollow structures to be abutted with the devices to be radiated, which are inserted into the slots at the bottom layer in the corresponding cage.

36. The network device of claim 35, wherein when the heat dissipation structure comprises a locking assembly, and the locking assembly comprises a first main body portion and a first elastic member, the network device further comprises a blocking body, the blocking body is located on a side of the first main body portion facing away from the heat sink, and the first elastic member is disposed between the first main body portion and the blocking body.

37. The network device according to claim 35 or 36, wherein the inner side of the second openwork structure is covered with a first wave-absorbing material layer.

38. The network device of claim 37, wherein a second layer of absorbing material is filled between the heat sink and a side of the circuit board facing away from the cage.

39. A cage having a bottom wall for mating with a circuit board, the cage having one or more slots for receiving electronic devices in a direction away from the bottom wall;

the cage comprises a cage body, the bottom wall and the cage body are matched to form a slot located at the bottom layer, one end of the bottom wall is provided with a reed, the reed is provided with a bending structure, the bottom end of the cage body is provided with a connecting groove corresponding to the reed, and the reed can be matched with the corresponding connecting groove in a pluggable mode along the direction of the plane where the bottom surface of the bottom wall is located.

40. The cage of claim 39, wherein the bottom end of the cage body has a plug, the bottom wall has a receptacle, the plug fits into the corresponding receptacle, and the plug is bent to snap fit with the bottom wall.

41. The cage of claim 40, wherein the leaf spring is located at an end of the bottom wall distal from the socket of the bottom layer.

42. The cage of any one of claims 39 to 41, wherein the cage is an optical cage and the electronic device is an optical module.