CN115443039A

CN115443039A - Communication equipment

Info

Publication number: CN115443039A
Application number: CN202211113120.3A
Authority: CN
Inventors: 周洪家; 孙平
Original assignee: Beijing Star Net Ruijie Networks Co Ltd
Current assignee: Beijing Star Net Ruijie Networks Co Ltd
Priority date: 2022-09-14
Filing date: 2022-09-14
Publication date: 2022-12-06
Also published as: WO2024055750A1

Abstract

The communication equipment comprises an optical module, a chute assembly and a circuit board, wherein the optical module is inserted in the chute assembly, the chute assembly is arranged on the circuit board, and an opening of the chute assembly faces to the edge of the circuit board; the optical module comprises a body and a fin radiator, and the fin radiator is installed on the body. The sliding chute assembly can accommodate the optical module. The light cage in the prior art has been replaced to the spout subassembly, makes the headspace of optical module great. The fin radiator can be directly connected with the body of the optical module, so that the body radiates heat, and the heat radiation efficiency is high. The condition of poor heat dissipation caused by the multi-stage transmission heating heat dissipation mode of the optical module in the prior art is reduced. And, the spout subassembly simple structure, the manufacturing cost is lower than the light cage.

Description

Communication equipment

Technical Field

The present application relates to the field of communications devices, and in particular, to a communications device.

Background

In current optical communication devices, the optical module needs to be mounted in an optical cage. The light cage is a metal container with an opening at one end. The heat sink is usually installed outside the optical cage, and heat generated by the optical module needs to be conducted to the heat sink for heat dissipation after multi-stage transmission. The heat dissipation effect of the heat dissipation mode is poor. When the optical module keeps high power consumption operation, the heat cannot be dissipated in time, so that the optical module is overheated and damaged.

Disclosure of Invention

The application provides a communication device for solve the problem of poor heat dissipation of an optical module in the communication device.

The embodiment of the application provides a communication device which comprises an optical module, a chute assembly and a circuit board, wherein the optical module is inserted in the chute assembly, the chute assembly is installed on the circuit board, and an opening of the chute assembly faces to the edge of the circuit board; the optical module comprises a body and a fin radiator, and the fin radiator is installed on the body.

In the above embodiments, the chute assembly can accommodate the optical module. The light cage in the prior art has been replaced to the spout subassembly, makes the headspace of optical module great. The fin radiator can be directly connected with the body of the optical module, and has high radiating efficiency for the body to radiate heat. The condition of poor heat dissipation caused by the multi-stage transmission heating heat dissipation mode of the optical module in the prior art is reduced. And, the spout subassembly simple structure, the manufacturing cost is lower than the light cage.

In another embodiment, the finned heat sink includes a plurality of fins arranged in a first direction and parallel to each other, the first direction is perpendicular to the insertion direction of the optical module, and a first air duct is formed between two adjacent fins arranged in the first direction.

In another embodiment, the plurality of fins are arranged along the insertion direction of the optical module, a second air duct is formed between two adjacent fins arranged along the insertion direction of the optical module, and the second air duct is perpendicular to the first air duct.

In another embodiment, the communication device further includes a housing panel disposed at an edge of the circuit board and perpendicular to the circuit board, the housing panel having a socket through which the optical module passes and is inserted into the slider assembly; the fins comprise first radiating fins, the first radiating fins are arranged in a first direction and are parallel to each other, the first radiating fins are located at one end, close to the shell panel, of the body, grooves are formed in one side, away from the body, of each first radiating fin, and when the optical module is connected to the sliding groove assembly in an inserting mode, the grooves correspond to the shell panel in position.

In another embodiment, the communication device further includes a shielding spring, the shielding spring is mounted in the groove, and when the optical module is plugged into the sliding chute assembly, the shielding spring is in contact connection with the socket.

In another embodiment, the first heat dissipation fin includes a first end and a second end, the first end and the second end are located on two sides of the groove, the first end is located on one side of the housing panel facing the outside of the communication device, and the second end is located on one side of the housing panel facing the inside of the communication device.

In another embodiment, the finned heat sink further includes a fixing portion, the first end is connected to the fixing portion, the fixing portion has a sidewall facing the first end, and the sidewall has a curvature and is a concave surface.

In another embodiment, the number of the optical modules is multiple, the number of the chute assemblies is equal to that of the optical modules, and the optical modules and the chute assemblies are arranged along a first direction, wherein the first direction is perpendicular to the insertion direction of the optical modules.

In another embodiment, the sliding groove assembly may include two guide rails, one side of each of the two guide rails opposite to each other has a first clamping portion, the optical module is installed between the two guide rails, a side wall of the optical module facing the guide rails has a second clamping portion, and the first clamping portion is clamped in the second clamping portion.

In another embodiment, the chute assembly may further comprise a shield. The backplate sets up in the guide rail and keeps away from the one end that optical module got into the guide rail, and the backplate is perpendicular to the guide rail and is on a parallel with the circuit board.

Drawings

Fig. 1 is a schematic structural diagram of a communication device in an embodiment of the present application;

FIG. 2 is a schematic view of a chute assembly according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a light module in an embodiment of the present application;

FIG. 4 is an assembly view of a light module, a bezel, and a housing panel in another embodiment of the present application;

fig. 5 is a schematic structural diagram of a communication device in an embodiment of the present application.

Reference numerals:

10-an optical module; 20-a chute assembly; 30-a circuit board; 11-a body; 12-a finned heat sink; m-the insertion direction of the optical module; 21-a guide rail; 22-a first snap-in portion; 13-a second clamping part; a-a guide rail entrance; 211-flanging; 14-a guide groove; 23-a guard plate; 121-fins; 40-a first air duct; 50-a second air duct; n-a first direction; 100-a housing panel; 101-a socket; 120-a first heat sink fin; 122-a groove; 60-a shielding reed; 123-a first end; 124-a second end; 125-a stationary part; 1251-stationary part side wall.

Detailed Description

The problem of poor heat dissipation of the optical module in the communication equipment is solved. An embodiment of the present application provides a communication device. To make the objects, technical solutions and advantages of the present application more clear, the present application is further described in detail below by referring to the embodiments in the accompanying drawings.

Fig. 1 is a schematic structural diagram of a communication device in an embodiment of the present application. As shown in fig. 1, an embodiment of the present application provides a communication device including an optical module 10, a chute assembly 20, and a circuit board 30. The optical module 10 is inserted into the chute assembly 20, and the chute assembly 20 is mounted on the circuit board 30. The opening of the chute assembly 20 is toward the edge of the circuit board 30. The optical module 10 includes a body 11 and a fin heat sink 12, and the fin heat sink 12 is attached to the body 11. The insertion direction M of the optical module 10 is parallel to the circuit board 30.

In the above embodiments, the chute assembly 20 can accommodate the optical module 10. The chute assembly 20 replaces the light cage of the prior art, making the head space of the light module 10 larger. The fin radiator 12 can be directly connected with the body 11 of the optical module to radiate heat for the body 11, and the radiating efficiency is high. The condition of poor heat dissipation caused by the multi-stage transmission heating heat dissipation mode of the optical module in the prior art is reduced. Also, the chute assembly 20 is simple in structure and is manufactured at a lower cost than the light cage.

In alternative embodiments, the finned heat sink 12 may be mounted on the side of the body 11 facing away from the circuit board 30, on the side of the body facing the circuit board (not shown), or on both the side of the body facing away from the circuit board and the side facing the circuit board. When the fin radiator is installed on one side of the body facing the circuit board, holes need to be formed in the position, corresponding to the fin radiator, of the circuit board for ventilation. Only the embodiment in which the finned heat sink is mounted to the side of the body facing away from the circuit board is shown in fig. 1. Several mounting positions of the fin radiator can be selected according to heat dissipation requirements, and the application is not particularly limited.

FIG. 2 is a schematic view of a chute assembly according to one embodiment of the present application. Referring to fig. 1 and fig. 2, in an alternative embodiment, the chute assembly 20 may include two guide rails 21 arranged in parallel, one side of the guide rail 21 opposite to the first clamping portion 22 is provided with a first clamping portion 22, the optical module 10 is installed between the two guide rails 21, and a side wall of the optical module 10 facing the guide rail 21 is provided with a second clamping portion 13. The first engaging portion 22 engages with the second engaging portion 13. Specifically, the optical module 10 is slidable along the two parallel guide rails 21, and the guide rails 21 guide the optical module 10. In the process that the optical module 10 slides along the guide rail 21, the second clamping portion 13 gradually approaches the first clamping portion 22 on the guide rail 21, and until the first clamping portion 22 is clamped in the second clamping portion 13, the optical module 10 reaches the installation position and cannot slide continuously, so that the optical module 10 is installed.

In an alternative embodiment, the first fastening portion 22 may be a buckle, and the second fastening portion 13 may be a card slot. The buckle is clamped in the clamping groove.

In another embodiment, the first engaging portion 22 may be a slot, and the second engaging portion may be a buckle. The buckle is clamped in the clamping groove.

Referring to fig. 2, in an alternative embodiment, the clip may be an elastic sheet. One end of the elastic sheet close to the guide rail inlet A (the end where the optical module enters) is connected with the guide rail 21, and the other end of the elastic sheet far away from the guide rail inlet A inclines towards the optical module. So that the optical module keeps in contact with the spring plate during the sliding process along the guide rail 21. When the clamping groove reaches the position of the elastic sheet, the elastic sheet is bounced to extend into and be clamped in the clamping groove.

In another alternative embodiment, the above-mentioned buckle can also be a projection on the side wall of the guide rail. When the clamping groove reaches the position of the protrusion, the protrusion is clamped in the clamping groove. Of course, the protrusion may be disposed on the optical module, and the slot may be disposed on the guide rail, which can also achieve the engagement between the optical module and the guide rail.

With continued reference to fig. 1 and 2, in an alternative embodiment, the top of the rail 21 may have a flange 211. The side walls of the light module 10 may be provided with guide grooves 14. During the sliding of the light module 10 in the chute assembly 20, the folded edge 211 slides in the guide groove 14. The folded edge 211 not only can play a guiding role, but also can prevent the optical module 10 from moving in a vertical direction perpendicular to the circuit board 30. The reliability of the communication device is improved.

In an alternative embodiment, the flange may be disposed on a side of the middle or lower portion of the guide rail facing the optical module. The side wall of the optical module may be provided with a guide groove. And in the sliding process of the sliding chute assembly, the folded edge is positioned in the guide groove to slide. The position that above-mentioned hem set up can be selected as required, and this application does not do specific restriction.

With continued reference to fig. 1 and 2, in an alternative embodiment, the chute assembly 20 may further include a protection plate 23, and the protection plate 23 is perpendicular to the guide rail 21 and parallel to the circuit board 30. When the optical module 10 is plugged into the chute assembly 20, the protection plate 23 may be located above the body 11. Specifically, the guard plate 23 is disposed at an end of the guide rail 21 away from the optical module entering the chute assembly 20. When the optical module 10 reaches the mounting position, the main body 11 may be positioned below the protector 23. The guard plate is used for bearing the shielding assembly and overlapping with the body, and electromagnetic compatibility shielding of the communication equipment is achieved.

In an alternative embodiment, the guard plate may also be located below the body. The concrete position of backplate on the guide rail can set up according to the structure needs, and the shielding subassembly that can make the backplate bear can all with the body realization overlap joint, and this application does not do specific restriction.

In an optional embodiment, the guide rail and the guard plate can be of an integrated structure, so that the number of parts is reduced, the assembly is simple, and the assembly efficiency is improved.

Fig. 3 is a schematic structural diagram of an optical module in an embodiment of the present application. In an alternative embodiment, as shown in FIG. 3, the finned heat sink 12 may include a plurality of fins 121. The fins 121 are arranged in parallel along a first direction N, the first direction N is perpendicular to the insertion direction M of the optical module, and a first air duct 40 is formed between two adjacent fins arranged along the first direction N. The extending direction of the first air duct 40 is the same as the inserting direction M of the optical module, so that the air in the inserting direction M of the optical module can flow, and the heat dissipation efficiency of the device can be improved.

In an alternative embodiment, the plurality of fins 121 may also be arranged along the insertion direction M of the optical module, a second air duct 50 is formed between two adjacent fins arranged along the insertion direction M of the optical module, and the second air duct 50 is perpendicular to the first air duct 40. The second air duct 50 enables air in the first direction N to flow, thereby improving heat dissipation efficiency of the apparatus.

In some embodiments, the plurality of heat dissipation fins 121 are arranged in an array, and a first air duct 40 and a second air duct 50 perpendicular to each other are formed between the fins, which is beneficial to improving the air fluidity inside the communication device. And do not have the blocking of light cage, the inside air flow of communications facilities is more smooth and easy, makes communications facilities heat dissipation good.

In an alternative embodiment, the communication device includes a housing (not shown). The optical module 10, the chute assembly 20 and the circuit board 30 are disposed in the housing. The side wall of the shell is provided with a vent hole, and outside air can enter the shell through the vent hole to flow. Specifically, the vent holes can be positioned on the extension lines of the first air duct and the second air duct, so that air circulation is smooth.

Fig. 4 is an assembly view of an optical module, a cover plate, and a housing panel according to another embodiment of the present disclosure, and fig. 5 is a schematic structural diagram of a communication device according to an embodiment of the present disclosure. Referring to fig. 4 and 5, in an alternative embodiment, the communication device may further include a housing panel 100, the housing panel 100 is disposed at an edge of the circuit board 30 and perpendicular to the circuit board 30, the housing panel 100 has a socket 101, and the optical module 10 passes through the socket 101 and is inserted into the chute assembly 20. The fins 121 include a plurality of first heat dissipation fins 120, and the plurality of first heat dissipation fins 120 are arranged in parallel along a first direction N, where the first direction N is perpendicular to the insertion direction M of the optical module. The first heat dissipating fin 120 is located at one end of the body 11 near the housing panel 100. The first heat dissipation fin 120 has a groove 122 on a side away from the body 11, and when the optical module 10 is plugged into the chute assembly 20, the groove 122 corresponds to the socket of the housing panel 100. Specifically, the fin heat sink 12 includes a plurality of fins 121 arranged in an array. The first row of fins 121 at the end of the finned heat sink 12 near the housing panel 100 is the first heat dissipating fins 120. The first heat dissipating fins 120 are longer than the other fins 121. The top of the first heat dissipation fin 120 is provided with a groove 122 at a position corresponding to the opening of the housing panel 100, air can enter the device from the first air duct 40 between the first heat dissipation fins 120 and the groove 122 at the top of the first heat dissipation fin 120, the groove 122 enlarges the air inlet, increases the air inlet amount of the device from the outside to the inside, and improves the heat dissipation efficiency of the device.

With continued reference to fig. 4 and 5, in an alternative embodiment, the communication device further includes a shielding spring 60, and the shielding spring 60 can be mounted in the groove 122. When the optical module 10 is plugged into the chute assembly 20, the shielding spring 60 is in contact connection with the edge of the socket 101. The shielding reed 60 is installed in the groove 122, so that the occupied space can be reduced, the air inlet volume can be increased, and the heat dissipation effect is good.

It should be noted that, the shielding reeds are arranged on the upper, lower, left and right wall surfaces of the optical module, and the shielding reeds on the four surfaces are all in contact connection with the edge of the jack, so as to realize electromagnetic Compatibility (EMC) shielding of the communication device.

Referring to fig. 4, in an alternative embodiment, the first heat dissipating fin 120 includes a first end 123 and a second end 124 located at two sides of the groove 122. The first end 123 is located on the side of the body panel 100 facing the exterior of the communication device and the second end 124 is located on the interior of the communication device. Specifically, the first heat dissipating fins 120 are sheet-shaped, and the grooves 122 are located at the middle position of the top edge of the first heat dissipating fins 120. That is, the heights of both ends (the first end 123 and the second end 124) of the first heat dissipating fin 120 are greater than the height of the middle groove 122. The first end 123 is located outside the body panel 100 and the second end 124 is located inside the body panel 100. A part of the optical module is located outside the housing panel 100, and the first heat dissipation fin 120 extends to the outside of the housing panel 100, so that the air inlet of the first air duct 40 is located outside the communication device. The contact area between the fin radiator 12 and the outside air is increased, and simultaneously, the wind with lower outside temperature can be introduced into the equipment, so that the radiating efficiency is improved.

In an alternative embodiment, the first heat dissipation fin may only include the first end. The first end is located on a side of the housing panel facing an exterior of the communication device. Specifically, the height of the first end is greater than the height of the groove bottom of the groove. The groove is only provided with one side wall connected with the first end, and the bottom wall of the groove extends towards the inside of the communication equipment, so that the first end and the groove are in a step shape.

Referring to fig. 3 and 4, in an alternative embodiment, the finned heat sink 12 may further include a fixing portion 125, the first end 123 of the first heat dissipating fin 120 is connected to the fixing portion 125, the fixing portion has a fixing portion sidewall 1251 facing the first end 123, and the fixing portion sidewall 1251 has a curvature and is concave. Specifically, the fixing portion 125 is located at an end of the first heat dissipating fin 120 facing the outside of the communication device, and the position is an air inlet of the first air duct 40. The fixing portion 125 has a concave side wall 1251 facing the first heat dissipating fin 120, so that the resistance of the air entering the communication device from the first air duct 40 is small, thereby increasing the air intake and further increasing the heat dissipating efficiency.

In an alternative embodiment, the number of the optical modules may be multiple, and the number of the chute assemblies is equal to that of the optical modules. The plurality of optical modules and the chute assemblies are arranged along a first direction, and the first direction is perpendicular to the insertion direction of the optical modules. The optical module is arranged at high density, so that the power consumption is high and the heat dissipation is high during high-speed operation. Above-mentioned fin radiator is direct and body contact, and the radiating effect is better. The finned radiator is provided with a plurality of air channels, and the air cooling effect of the optical module can be improved.

In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus should not be construed as limiting the present application.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. The communication equipment is characterized by comprising an optical module, a chute assembly and a circuit board, wherein the optical module is inserted into the chute assembly, the chute assembly is mounted on the circuit board, and an opening of the chute assembly faces to the edge of the circuit board; the optical module comprises a body and a finned radiator, wherein the finned radiator is installed on the body.

2. The communication apparatus according to claim 1, wherein the finned heat sink comprises a plurality of fins arranged in a first direction and parallel to each other, the first direction is perpendicular to an insertion direction of the optical module, and a first air channel is formed between two adjacent fins arranged in the first direction.

3. The communication apparatus according to claim 2, wherein a plurality of the fins are arranged along an insertion direction of the optical module, and a second air duct is formed between two adjacent fins arranged along the insertion direction of the optical module, the second air duct being perpendicular to the first air duct.

4. The communication device of claim 2, further comprising a housing panel disposed at an edge of the circuit board and perpendicular to the circuit board, the housing panel having a socket through which the optical module passes and is inserted into the chute assembly;

the fins comprise first radiating fins, the first radiating fins are arranged in the first direction and are parallel to each other, the first radiating fins are located at one end, close to the shell panel, of the body, grooves are formed in the edges of one sides, away from the body, of the first radiating fins, and when the optical module is connected to the sliding groove assembly in an inserted mode, the grooves correspond to the shell panel in position.

5. The communication device of claim 4, further comprising a shielding spring, wherein the shielding spring is mounted in the groove, and when the optical module is plugged into the sliding groove assembly, the shielding spring is in contact connection with an edge of the socket.

6. The communication device of claim 4, wherein the first heat sink fin comprises a first end and a second end on two sides of the groove, the first end being located on a side of the housing panel facing an exterior of the communication device, the second end being located on a side of the housing panel facing an interior of the communication device.

7. The communication device of claim 6, wherein the finned heat sink further comprises a fixed portion, the first end being connected to the fixed portion, the fixed portion having a sidewall facing the first end, the sidewall having an arc and being concave.

8. The communication apparatus according to any one of claims 1 to 7, wherein the number of the optical modules is plural, the number of the chute assemblies is equal to the number of the optical modules, and the plural optical modules and the chute assemblies are arranged in a first direction perpendicular to an insertion direction of the optical modules.

9. The communication device according to any one of claims 1 to 7, wherein the chute assembly includes two guide rails, a first engaging portion is provided on an opposite side of the two guide rails, the optical module is mounted between the two guide rails, a second engaging portion is provided on a side wall of the optical module facing the guide rails, and the first engaging portion is engaged with the second engaging portion.

10. The communication device of claim 9, wherein the chute assembly further comprises a guard plate disposed at an end of the rail distal from the light module into the rail, the guard plate being perpendicular to the rail and parallel to the circuit board.