WO2024055750A1

WO2024055750A1 - Communication device

Info

Publication number: WO2024055750A1
Application number: PCT/CN2023/108721
Authority: WO
Inventors: 周洪家; 孙平
Original assignee: 北京星网锐捷网络技术有限公司
Priority date: 2022-09-14
Filing date: 2023-07-21
Publication date: 2024-03-21
Also published as: CN115443039A

Abstract

The present application discloses a communication device comprising an optical module, a chute assembly, and a circuit board, wherein the optical module is inserted and connected to the chute assembly, the chute assembly is mounted to the circuit board, and an opening of the chute assembly faces an edge of the circuit board; and the optical module comprises a body and a finned heat sink, and the finned heat sink is mounted to the body. The chute assembly is capable of accommodating the optical module.

Description

communication device

Cross-references to related applications

This application claims priority to the Chinese patent application filed with the China Patent Office on September 14, 2022, with the application number 202211113120.3 and the application title "A communication device", the entire content of which is incorporated into this application by reference.

Technical field

The present application relates to the field of communication technology, and in particular to a communication device.

Background technique

In current communication equipment, optical modules need to be installed in optical cages. A light cage is a metal container with one end open. The heat sink is usually installed outside the light cage, and the heat generated by the optical module is conducted to the heat sink through the light cage for heat dissipation. In this heat dissipation mode, the heat of the optical module needs to be dissipated after multi-stage transfer, and the heat dissipation effect is poor.

Contents of the invention

Each exemplary embodiment of the present application provides a communication device.

A communication device provided by an embodiment of the present application includes:

circuit board,

a chute assembly, the chute assembly is installed on the circuit board, and the opening of the chute assembly faces the edge of the circuit board; and

An optical module is inserted into and connected to the chute assembly. The optical module includes: a body; and a fin heat sink, the fin heat sink is installed on the body.

In communication equipment using an optical cage, the optical module is installed inside the optical cage, and the heat sink is usually installed outside the optical cage. The heat generated by the optical module is conducted to the radiator through the optical cage for heat dissipation, and the heat dissipation effect is poor. In the embodiment of this application, the chute assembly replaces the optical cage and is used to accommodate the optical mode. The fin heat sink can be directly connected to the main body of the optical module to dissipate heat for the main body and achieve better heat dissipation effect.

In one embodiment, the above-mentioned fin heat sink includes a plurality of fins. The plurality of fins are arranged along a first direction and are parallel to each other. The first direction is perpendicular to the insertion direction of the optical module. Two adjacent fins arranged along the first direction A first air channel is formed between the two fins.

In one embodiment, the fin radiator is provided with a second air channel along the first direction, and the second air channel is perpendicular to the first air channel.

In one embodiment, the above-mentioned communication device further includes a housing panel. The housing panel is arranged on the edge of the circuit board and is perpendicular to the circuit board. The housing panel has a socket, and the optical module passes through the socket and is inserted into the chute assembly.

In one embodiment, the fins include a plurality of first heat dissipation fins, the plurality of first heat dissipation fins are arranged along the first direction and are parallel to each other, and the first heat dissipation fins are located at one end of the body close to the housing panel.

In one embodiment, a side of the first heat dissipation fin away from the body has a groove. When the optical module is inserted into and connected to the chute assembly, the groove corresponds to the socket of the housing panel.

In one embodiment, the above-mentioned communication device further includes a shielding reed. The shielding reed is installed in the groove. When the optical module is inserted into and connected to the chute assembly, the shielding reed comes into contact with the socket.

In one embodiment, the above-mentioned first heat dissipation fin includes a first end and a second end located on both sides of the groove, the first end is located on the side of the housing panel facing the outside of the communication device, and the second end is located on the side of the housing panel facing the outside of the communication device. One side inside the communication device.

In one embodiment, the above-mentioned fin heat sink further includes a fixing part, the first end is connected to the fixing part, the fixing part has a side wall facing the first end, and the side wall has a curvature and is a concave surface.

In one embodiment, the length of the first heat dissipation fin is greater than the length of other heat dissipation fins among the plurality of fins.

In one embodiment, there are multiple optical modules, the number of chute assemblies is equal to the number of optical modules, and the plurality of optical modules are arranged along the first direction.

In one embodiment, the above-mentioned chute assembly may include a guide rail. A first engaging portion is provided on the guide rail. A second engaging portion is provided on the side wall of the optical module facing the guide rail. The first engaging portion is engaged with the second engaging portion. Snap-on part.

In one embodiment, the chute assembly may further include a guard plate, which is disposed on the guide rail away from the light. The module enters one end of the rail, with the guard plate perpendicular to the rail and parallel to the circuit board.

In one embodiment, the guide rail is provided with a folding edge, and the side wall of the optical module facing the guide rail is provided with a guide groove, and the folding edge corresponds to the guide groove.

Description of drawings

Figure 1 is a schematic structural diagram of a communication device in an embodiment of the present application.

Figure 2 is a schematic structural diagram of the chute assembly in one embodiment of the present application.

Figure 3 is a schematic structural diagram of an optical module in an embodiment of the present application.

Figure 4 is an assembly diagram of an optical module, a protective plate, and a housing panel in another embodiment of the present application.

Figure 5 is a schematic structural diagram of a communication device in an embodiment of the present application.

Reference signs:
10-Optical module; 20-Chute assembly; 30-Circuit board; 11-Body; 12-Fin heat sink; M-Insertion direction of optical module; 21-Guide rail; 22-First clamping part; 13-No. Two clamping parts; A-guide rail entrance; 211-folding edge; 14-guide groove; 23-guard plate; 121-fins; 40-first air duct; 50-second air duct; N-first direction; 100-case panel; 101-socket; 120-first heat dissipation fin; 122-groove; 60-shielding reed; 123-first end; 124-second end; 125-fixed part; 1251-fixed part side walls.

Detailed ways

In order to solve the problem of poor heat dissipation of optical modules in communication equipment. An embodiment of the present application provides a communication device. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and examples.

In this application, the use of ordinal terms such as "first," "second," etc., to modify elements does not imply any priority, order, or order of one element with respect to another element or the performance of the actions in the method. Chronologically. Unless specifically stated otherwise, such ordinal numbers are used only as labels to distinguish one element having a particular name from another element having the same name (other than the ordinal number).

Where "includes,""has," and "includes" are used in this application, unless an explicit limiting term is used, such as "only,""consistingof," etc., another may also be added. part. remove Unless otherwise mentioned, terms in the singular may include the plural and shall not be construed as having a number of only one.

Unless otherwise defined in context, the term "connected" herein may refer to one element being directly connected to another element, or one element being connected to another element through an intermediary.

Unless otherwise defined in the context, the expression "the optical module is inserted into and connected to the chute assembly" in this article means that the optical module is inserted into the chute assembly and reaches the installation position.

Figure 1 is a schematic structural diagram of a communication device in an embodiment of the present application. As shown in FIG. 1 , a communication device provided by an embodiment of the present application includes an optical module 10 , a chute assembly 20 and a circuit board 30 . The above-mentioned optical module 10 is inserted into and connected to the chute assembly 20 , and the chute assembly 20 is installed on the circuit board 30 . The opening of the chute assembly 20 faces the edge of the circuit board 30 . The optical module 10 includes a body 11 and a fin heat sink 12. The fin heat sink 12 is installed on the body 11. The insertion direction M of the optical module 10 is parallel to the circuit board 30 .

In communication equipment using an optical cage, the optical module is installed inside the optical cage, and the heat sink is usually installed outside the optical cage. The heat generated by the optical module is conducted to the radiator through the optical cage for heat dissipation, and the heat dissipation effect is poor. In the embodiment of the present application, the chute assembly 20 replaces the optical cage and is used to accommodate the optical module 10. The fin heat sink 12 can be directly connected to the main body 11 of the optical module to dissipate heat for the main body 11, and the heat dissipation effect is better.

In an optional embodiment, the above-mentioned fin heat sink 12 can be installed on the side of the body 11 away from the circuit board 30 , or on the side of the body facing the circuit board (not shown in the figure), or on Fin heat sinks are installed on both the side of the body away from the circuit board and the side facing the circuit board. When installing a fin heat sink on the side of the body facing the circuit board, holes need to be made at the positions corresponding to the circuit board and the fin heat sink for ventilation. Figure 1 only shows an embodiment in which the fin heat sink is installed on the side of the body away from the circuit board. Several installation positions of the above-mentioned fin radiator can be selected according to the heat dissipation needs, and there are no specific restrictions in this application.

Figure 2 is a schematic structural diagram of the chute assembly in one embodiment of the present application. Please refer to FIGS. 1 and 2 . In an optional embodiment, the chute assembly 20 may include two guide rails 21 arranged in parallel. The opposite sides of the guide rails 21 have a first engaging portion 22 , and the optical module 10 is installed on the between the two guide rails 21, and light The side wall of the module 10 facing the guide rail 21 has a second clamping portion 13 . The first engaging part 22 is engaged with the second engaging part 13 . Specifically, the optical module 10 can slide along the two parallel guide rails 21 , and the guide rails 21 guide the optical module 10 . While the optical module 10 is sliding along the guide rail 21, the second engaging portion 13 gradually approaches the first engaging portion 22 on the guide rail 21. When the first engaging portion 22 is engaged with the second engaging portion 13, the optical module When the module 10 reaches the installation position and cannot continue to slide, the installation of the optical module 10 is completed. It should be noted that the first clamping portion 22 can be provided on only one of the two guide rails 21 . Correspondingly, the first clamping portion 22 can be provided only on the guide rail 21 (the guide rail 21 provided with the first clamping portion 22 ) of the optical module 10 . ) is provided with a second engaging portion 13 on one side wall of the guide rail 21; a first engaging portion 22 can also be provided on both guide rails 21. Correspondingly, the optical module 10 is provided with a first engaging portion 13 toward the guide rail 21 ( Second clamping parts 13 are provided on both side walls of the guide rail 21) of 22.

In an optional embodiment, the first engaging part 22 may be a buckle, and the second engaging part 13 may be a engaging groove. The buckle snaps into the card slot.

In another embodiment, the first clamping part 22 may also be a slot, and the second clamping part 13 may also be a buckle. The buckle snaps into the card slot.

Please continue to refer to Figure 2. In an optional embodiment, the buckle may be a spring piece. One end of the elastic piece close to the guide rail entrance A (the end through which the optical module enters) is connected to the guide rail 21, and the other end of the elastic piece away from the guide rail entrance A is tilted toward the optical module, so that the optical module remains in contact with the elastic piece during the sliding process along the guide rail 21. When the card slot reaches the position of the elastic piece, the elastic piece springs up, extends into the card slot and is engaged with the card slot.

In another optional embodiment, the above-mentioned buckles may also be protrusions on the side walls of the guide rail. When the card slot reaches the position of the protrusion, the protrusion is engaged with the card slot. Of course, the above-mentioned protrusions can also be provided on the optical module and the card slot is provided on the guide rail, which can also realize the locking connection between the optical module and the guide rail.

Please continue to refer to Figures 1 and 2. In an optional embodiment, the top of the guide rail 21 may have a flange 211. The side wall of the optical module 10 may be provided with guide grooves 14 . During the sliding process of the optical module 10 in the chute assembly 20 , the flange 211 slides in the guide groove 14 . The flange 211 can not only play a guiding role, but also prevent the optical module 10 from moving in a vertical direction perpendicular to the circuit board 30 . Improve the reliability of communication equipment.

In an optional embodiment, the above-mentioned folding edge can also be arranged in the middle or lower part of the guide rail facing the light. side of the module. Guide grooves can be provided on the side walls of the optical module. When the optical module slides in the chute assembly, the folded edge slides in the guide groove. The position of the above-mentioned folding edge can be selected according to needs, and is not specifically limited in this application.

Please continue to refer to FIGS. 1 and 2 . In an optional embodiment, the chute assembly 20 may further include a guard plate 23 . The guard plate 23 is perpendicular to the guide rail 21 and parallel to the circuit board 30 . When the optical module 10 is inserted into and connected to the chute assembly 20 , the shield 23 may be located above the body 11 . Specifically, the above-mentioned guard plate 23 is provided at an end of the guide rail 21 away from the optical module entering the chute assembly 20 . After the above-mentioned optical module 10 reaches the installation position, the main body 11 can be located below the protective plate 23 . The above-mentioned protective plate is used to carry a shielding component, which is in physical contact with the body and is used to implement electromagnetic compatibility shielding of communication equipment.

In an optional embodiment, the above-mentioned protective plate can also be located below the body. The specific position of the guard plate on the guide rail can be set according to structural needs, so that the shielding component carried by the guard plate can achieve physical contact with the body. This application does not impose specific restrictions.

In an optional embodiment, the above-mentioned guide rail and guard plate can be an integrated structure, which reduces the number of parts, simplifies assembly, and improves assembly efficiency.

Figure 3 is a schematic structural diagram of an optical module in an embodiment of the present application. As shown in FIG. 3 , in an optional embodiment, the above-mentioned fin heat sink 12 may include a plurality of fins 121 . The fins 121 are arranged along the first direction N and are parallel to each other. The first direction N is perpendicular to the insertion direction M of the optical module. A first air channel 40 is formed between two adjacent fins arranged along the first direction N. The extending direction of the above-mentioned first air duct 40 is consistent with the insertion direction M of the optical module, which can make the air flow in the insertion direction M of the optical module and improve the heat dissipation efficiency of the equipment.

In an optional embodiment, the plurality of fins 121 can also be arranged along the insertion direction M of the optical module, and a second air channel 50 is formed between two adjacent fins arranged along the insertion direction M of the optical module. The air duct 50 is perpendicular to the above-mentioned first air duct 40 . The second air channel 50 can flow air in the first direction N, thereby improving the heat dissipation efficiency of the device.

In some of the above embodiments, multiple heat dissipation fins 121 are arranged in an array, and mutually perpendicular first air ducts 40 and second air ducts 50 are formed between the fins, which is beneficial to improving air flow inside the communication equipment. Moreover, since there is no obstruction by the light cage, the air inside the communication equipment flows smoothly, and the communication equipment dissipates heat efficiently. good.

In an optional embodiment, the above communication device includes a housing (not shown in the figure). The optical module 10, the chute assembly 20 and the circuit board 30 are arranged in the housing. The side wall of the above-mentioned housing has ventilation holes, and external air can enter the interior of the housing through the ventilation holes to achieve air flow. Specifically, the above-mentioned ventilation holes may be located on the extension line of the above-mentioned first air duct and the second air duct to make air circulation smoother.

FIG. 4 is an assembly diagram of an optical module, a protective plate, and a housing panel in an embodiment of the present application. FIG. 5 is a schematic structural diagram of a communication device in an embodiment of the present application. Please refer to FIG. 3 , FIG. 4 and FIG. 5 . In an optional embodiment, the above-mentioned communication device may further include a housing panel 100 . The housing panel 100 is disposed on the edge of the circuit board 30 and perpendicular to the circuit board 30 . The housing panel 100 has a socket 101, and the optical module 10 passes through the socket 101 and is inserted into the chute assembly 20. The fins 121 include a plurality of first heat dissipation fins 120. The plurality of first heat dissipation fins 120 are arranged along a first direction N and are parallel to each other. The first direction N is perpendicular to the insertion direction M of the optical module. The first heat dissipation fin 120 is located at an end of the body 11 close to the housing panel 100 . The first heat dissipation fin 120 has a groove 122 on the side away from the body 11 . When the optical module 10 is inserted into and connected to the chute assembly 20 , the groove 122 corresponds to the position of the socket 101 of the housing panel 100 . Specifically, the above-mentioned fin heat sink 12 has a plurality of fins 121 arranged in an array. The first row of fins 121 at the end of the fin heat sink 12 close to the housing panel 100 is the first heat dissipation fin 120 . The first heat dissipation fin 120 is longer than the other fins 121 . A groove 122 is provided on the top of the first heat dissipation fin 120 at a position corresponding to the opening of the housing panel 100 . Wind can pass through the first air channel 40 between the first heat dissipation fins 120 and the groove 122 on the top of the first heat dissipation fin 120 . Entering the inside of the device, the groove 122 enlarges the air inlet, increases the amount of air entering the device from the outside to the inside, and improves the heat dissipation efficiency of the device.

Please continue to refer to FIG. 4 and FIG. 5 . In an optional embodiment, the above-mentioned communication device further includes a shielding reed 60 , and the shielding reed 60 can be installed in the above-mentioned groove 122 . When the optical module 10 is inserted into and connected to the chute assembly 20 , the shielding spring 60 contacts the edge of the socket 101 . The shielding spring 60 is installed in the above-mentioned groove 122, which can reduce space occupation.

In an optional embodiment, shielding reeds are provided on the upper, lower, left and right walls of the optical module, and the shielding reeds on all four sides are in contact with the edges of the socket to achieve electromagnetic compatibility (EMC) shielding of the communication equipment.

Please continue to refer to FIG. 4 . In an optional embodiment, the first heat dissipation fin 120 includes a first end 123 and a second end 124 located on both sides of the groove 122 . The first end 123 is located on the housing panel 100 toward the communication side. On the side outside the device, the second end 124 is located on the side of the housing panel 100 facing the inside of the communication device, and the height of both ends (the first end 123 and the second end 124) of the first heat dissipation fin 120 is greater than the middle groove 122 The height of the part. The first heat dissipation fins 120 extend toward the outside of the housing panel 100 , and the air inlet of the first air duct 40 is located outside the communication device. As a result, the contact area between the fin radiator 12 and the external air is increased, and at the same time, wind with a lower temperature outside the device can be introduced into the device, thereby improving the heat dissipation efficiency of the communication device.

In an optional embodiment, the above-mentioned first heat dissipation fin may also include only the first end 123 . The first end 123 is located on the side of the housing panel facing the outside of the communication device. Specifically, the height of the first end is greater than the height of the groove bottom of the groove 122 . The groove 122 has only one side wall connected with the first end 123, and the bottom wall of the groove extends toward the inside of the communication device.

Please refer to FIG. 3 and FIG. 4 . In an optional embodiment, the above-mentioned fin heat sink 12 may further include a fixing part 125 . The first end 123 of the first heat dissipation fin 120 is connected to the fixing part 125 . The fixing part has a fixing part side wall 1251 facing the first end 123. The fixing part side wall 1251 has a curvature and is a concave surface. Specifically, the above-mentioned fixing portion 125 is located at one end of the first heat dissipation fin 120 facing the outside of the communication device, and this position is the air inlet of the first air duct 40 . The fixed portion side wall 1251 of the fixed portion 125 facing the first heat dissipation fin 120 is concave, which reduces the resistance when the wind enters the communication equipment from the first air duct 40, thereby increasing the air inlet volume and thereby improving the heat dissipation efficiency.

In an optional embodiment, the number of the above-mentioned optical modules may be multiple, and the number of chute assemblies and optical modules is equal to that of the optical modules. The plurality of optical modules (together with the chute assembly accommodating the optical modules) are arranged along a first direction, and the first direction is perpendicular to the insertion direction of the optical modules. The above-mentioned optical modules are arranged in a higher density. When the communication equipment is running at high speed, the optical modules consume a large amount of power and dissipate a high amount of heat. In the embodiment of the present application, the chute assembly is provided so that the fin heat sink in the optical module can directly contact the body, so that the optical module can be better dissipated. In addition, there are multiple air channels on the fin heat sink, which can further improve the air cooling effect of the optical module.

In the description of this application, it should be noted that the terms "upper", "lower", "left", "right", etc. indicate The orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation or be configured in a specific orientation. and operation, and therefore cannot be construed as a limitation on this application.

Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. In this way, if these modifications and variations of the present application fall within the scope of the claims of the present application and equivalent technologies, the present application is also intended to include these modifications and variations.

Claims

A communications device including:

circuit board,

a chute assembly, the chute assembly is installed on the circuit board, and the opening of the chute assembly faces the edge of the circuit board; and

Optical module, the optical module is inserted into and connected to the chute assembly, the optical module includes:

ontology; and

Fin radiator, the fin radiator is installed on the body.
The communication device according to claim 1, wherein the fin heat sink includes a plurality of fins, the plurality of fins are arranged along a first direction and are parallel to each other, and the first direction is perpendicular to the optical module. In the insertion direction, a first air channel is formed between two adjacent fins arranged along the first direction.
The communication device according to claim 2, wherein the fin heat sink is provided with a second air channel along the first direction, and the second air channel is perpendicular to the first air channel.
The communication device according to claim 2, wherein the communication device further includes a housing panel, the housing panel is disposed at an edge of the circuit board and perpendicular to the circuit board, and the housing panel has a socket. , the optical module passes through the socket and is inserted into the chute assembly.
The communication device according to claim 4, wherein the fins include a plurality of first heat dissipation fins, the plurality of first heat dissipation fins are arranged along the first direction and are parallel to each other, and the first heat dissipation fins The fins are located at one end of the body close to the housing panel.
The communication device according to claim 5, wherein a side of the first heat dissipation fin away from the body has a groove, and when the optical module is inserted into and connected to the chute assembly, the groove Corresponds to the socket on the housing panel.
The communication device according to claim 6, wherein the communication device further includes a shielding reed, the shielding reed is installed in the groove, and when the optical module is inserted into and connected to the chute assembly, The shielding spring is in contact with the socket.
The communication device of claim 6, wherein the first heat dissipation fin includes a first end and a second end located on both sides of the groove, the first end being located on the housing panel toward the The second end is located on the side of the housing panel facing the inside of the communication equipment.
The communication device according to claim 8, wherein the fin heat sink further includes a fixing part, the first end is connected to the fixing part, and the fixing part has a side wall facing the first end, The side walls are curved and concave.
The communication device of claim 4, wherein a length of the first heat dissipation fin is greater than a length of other heat dissipation fins of the plurality of fins.
The communication device according to any one of claims 2 to 10, wherein the number of said optical modules is multiple, the number of said chute assemblies is equal to that of said optical modules, and a plurality of said optical modules are arranged along said Arrange in the first direction.
The communication device according to any one of claims 1 to 10, wherein the chute assembly includes a guide rail, a first clamping portion is provided on the guide rail, and the optical module faces a side wall of the guide rail. A second clamping part is provided, and the first clamping part is clamped with the second clamping part.
The communication device according to claim 9, wherein the chute assembly further includes a guard plate, the guard plate is disposed at an end of the guide rail away from the optical module and entering the guide rail, and the guard plate is perpendicular to the guide rail. The guide rail is parallel to the circuit board.
The communication device according to claim 9, wherein a folding edge is provided on the guide rail, a guide groove is provided on a side wall of the optical module facing the guide rail, and the folding edge corresponds to the guide groove.