CN216449790U

CN216449790U - QSFP optical module radiator suitable for low-height board card

Info

Publication number: CN216449790U
Application number: CN202121993262.4U
Authority: CN
Inventors: 袁国生
Original assignee: HANGZHOU ECI COMMUNICATION CO Ltd
Current assignee: HANGZHOU ECI COMMUNICATION CO Ltd
Priority date: 2021-08-24
Filing date: 2021-08-24
Publication date: 2022-05-06
Anticipated expiration: 2031-08-24

Abstract

The utility model discloses a QSFP optical module radiator suitable for a low-height board card, which comprises a main body part and a radiating fin part, wherein the main body part and the radiating fin part are formed by processing aluminum profiles, the main body part is provided with a boss, the radiating fin part is mainly distributed on the rear side and the left side and the right side of the main body part, and the radiating parts on the left side and the right side are provided with mounting holes. The utility model is suitable for some plug-in board cards with limited height.

Description

QSFP optical module radiator suitable for low-height board card

Technical Field

The utility model relates to the field of optical communication, in particular to a QSFP optical module radiator suitable for a low-height board card.

Background

The continuous expansion of the transmission capacity and the continuous improvement of the transmission rate of the communication network backbone line make the optical fiber communication become the main transmission means of the modern information network, and in the present optical communication network, such as Wide Area Network (WAN), Metropolitan Area Network (MAN), Local Area Network (LAN), the types of optical transceiver modules, which are one of the core optoelectronic devices, are increasing, the requirement is also higher, and the complexity is also developing at a remarkable speed. In order to provide sufficient I/O (input/output) bandwidth, many new access switches have been developed that can connect 2 or 4 port 100G ethernet.

The QSFP optical module plays an important role in the field of broadband communication networks as an important component in an active optical device. With the rapid increase of the information capacity of the optical network, the rate of the QSFP optical module is gradually increased, the heat flux density of the QSFP optical module is gradually increased, the heat dissipation performance of the module is also of great importance, and besides the improvement of the thermal design of the optical module, the QSFP optical module is also an essential means for externally connecting a heat sink to the optical module.

The aluminum extruded radiator is a type of radiator which is more adopted in the optical module heat dissipation at present, heat flow is conducted through the contact of the optical module shell and the surface of the radiator, and heat exchange is carried out between the aluminum extruded radiator and air through a certain number and density of radiating fins on the radiator, so that a good optical module heat dissipation effect is achieved. Such heat sinks require a heat sink having a certain height and thickness to maximize the performance of the heat sink by increasing the area in contact with the air. Because the optical communication transmission equipment is small in size, most of the optical communication transmission equipment adopts a plug-in board card design, and the height of the optical communication transmission equipment is limited, an optical module radiator suitable for a low-height board card is urgently needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the problems and provide an optical module radiator which can be mounted on a low-height board card, can ensure a good radiating effect and is convenient to process.

The utility model is realized by the following technical scheme:

the utility model discloses a QSFP optical module radiator applicable to a low-height board card.

As a further improvement, the main body part and the radiating fin part are integrally formed, the main body part is formed by milling the middle part of an aluminum profile, and the radiating fin part is formed by extrusion forming of the aluminum profile.

As a further improvement, the radiating fin part comprises a plurality of radiating fins which are consistent in height, identical in spacing and arranged in parallel.

As a further improvement, the heat sink portion of the present invention further includes a reinforcing rib perpendicularly connected to the heat sink fin.

As a further improvement, the reinforcing rib is provided with a mounting hole for mounting the radiator on a board card.

As a further improvement, the heat sink portion of the present invention is enclosed on three sides of the main body portion, including a left side, a right side, and a rear side.

As a further improvement, the reinforcing ribs are symmetrically distributed on the left side and the right side of the main body part.

The utility model has the following beneficial effects:

1. the main body part and the radiating fin part are integrally processed and formed by aluminum profiles, so that the structure is simple;

2. the boss of the main body part is formed by milling, so that the full close contact between a boss surface and the optical module shell is ensured, and the optical module shell is the outer surface of a heat source and is in contact with a radiator;

3. the radiating fin part can reach the maximum height allowed by the design of the board card on the premise of not influencing the plugging and unplugging of the board card, the thickness and the density of the radiating fin can be adjusted according to the heating power of the optical module, and the performance of the optical module is not influenced while the good radiating effect is ensured;

4. the radiating fins of the radiating fins downwards surround the two sides and the rear side of the QSFP cage due to space problems, so that the space at the top of the QSFP cage is not occupied, the phenomenon that a board card cannot be plugged and pulled is avoided, the space on the side surface of the QSFP cage is fully utilized, and the radiating area is increased; the overall height of the matched board cards is low, and the heat radiator cannot be used for radiating fins upwards like a conventional method.

5. The radiating fin part is provided with the reinforcing ribs, so that the strength of the radiator is improved, and the reinforcing ribs are provided with the mounting holes, so that the structure is simplified, and the installability of the radiator is ensured;

6. the technical scheme adopted by the utility model can fully utilize the space of the side surface of the QSFP optical module cage, avoids the limitation of the height of a board card, ensures the heat dissipation performance, and has the advantages of integrated molding and processing of aluminum profiles, accurate and flexible size, high structural reliability, low processing cost, convenient implementation, suitability for popularization and good commercial value.

Drawings

FIG. 1: the utility model has a structure as shown in the drawing I;

FIG. 2: the utility model has a structure schematic diagram II;

FIG. 3: the utility model is installed schematically;

1. a body portion; 2. a heat sink portion; 3. a boss; 4. reinforcing ribs; 5. mounting holes; 6. a QSFP cage; 7. left side; 8. the right side; 9. a rear side; 10. and (4) radiating fins.

Detailed Description

Embodiments of the utility model are described in further detail below with reference to the accompanying drawings:

the utility model discloses a QSFP optical module radiator suitable for a low-height board card, and particularly relates to a QSFP optical module radiator suitable for a plug-in board card with lower height. FIG. 1 is a first schematic structural diagram of the present invention; FIG. 2 is a second schematic structural view of the present invention; fig. 3 is a schematic view of the installation of the present invention.

The radiator comprises a main body part 1 and a radiating fin part 2 arranged on the left side 7, the right side 8 and the rear side 9 of the main body part 1, wherein a boss 3 with a smooth surface is arranged on the main body part 1, and the radiating fin part 2 comprises radiating fins 10. The body portion 1 and the heat sink portion 2 are integrally formed, i.e. made of a complete aluminum profile by milling, in this embodiment, an aluminum alloy. The main body part 1 is made of complete aluminum section and is formed by milling and cutting redundant materials at the middle part, and the radiating fin part 2 is made of aluminum section through extrusion forming; the radiating fin part 2 comprises a plurality of radiating fins 10 which are identical in height and distance and are arranged in parallel, and reinforcing ribs 4 which are vertically connected with the radiating fins 10, wherein the reinforcing ribs 4 are formed by reserving partial materials between adjacent radiating fins, the reinforcing ribs 4 are arranged in four positions in the embodiment, symmetrically distributed on the left side 7 and the right side 8 of the main body part 1, and mounting holes 5 are formed in the reinforcing ribs 4.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the core technical features of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The QSFP optical module radiator suitable for the low-height board card is characterized by comprising a main body part (1) and a radiating fin part (2) arranged on the periphery of the main body part (1), wherein a boss (3) is arranged on the main body part (1), and the radiating fin part (2) comprises radiating fins (10).

2. The QSFP optical module heat sink suitable for low-height boards as claimed in claim 1, wherein said main body portion (1) and said heat sink portion (2) are integrally formed, said main body portion (1) is formed by milling the middle part of an aluminum profile, and said heat sink portion (2) is formed by extrusion of an aluminum profile.

3. The QSFP optical module heatsink for low-height boards according to claim 1, wherein said heatsink portion (2) comprises a plurality of fins (10) having uniform height and spacing and arranged parallel to each other.

4. A QSFP optical module heatsink for low-height boards as claimed in claim 1, 2 or 3, wherein the heat sink portion (2) further comprises ribs (4) perpendicularly attached to the heat sink fins (10).

5. The QSFP optical module heat sink suitable for low-height boards as claimed in claim 4, wherein said reinforcing ribs (4) are provided with mounting holes (5).

6. The QSFP optical module heat sink for low-profile boards according to claim 5, wherein said heat sink portion (2) is wrapped around three sides of the body portion (1), including a left side (7), a right side (8) and a back side (9).

7. The QSFP optical module heat sink for low-height boards as claimed in claim 5 or 6, wherein said ribs (4) are symmetrically arranged on the left (7) and right (8) sides of the main body part (1).